TWI372582B - System having electrostatic discharge protection structure and method for manufacturing the same - Google Patents

System having electrostatic discharge protection structure and method for manufacturing the same

Info

Publication number
TWI372582B
TWI372582B TW096139250A TW96139250A TWI372582B TW I372582 B TWI372582 B TW I372582B TW 096139250 A TW096139250 A TW 096139250A TW 96139250 A TW96139250 A TW 96139250A TW I372582 B TWI372582 B TW I372582B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
electrostatic discharge
protection structure
discharge protection
Prior art date
Application number
TW096139250A
Other languages
English (en)
Other versions
TW200824503A (en
Inventor
Yi Fan Shih
Chun Yen Liu
Kuo Bin Hsu
Chang Ho Tseng
Shih Chang Chang
Original Assignee
Chimei Innolux Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chimei Innolux Corp filed Critical Chimei Innolux Corp
Publication of TW200824503A publication Critical patent/TW200824503A/zh
Application granted granted Critical
Publication of TWI372582B publication Critical patent/TWI372582B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
TW096139250A 2006-11-20 2007-10-19 System having electrostatic discharge protection structure and method for manufacturing the same TWI372582B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/561,593 US7456432B2 (en) 2006-11-20 2006-11-20 System having electrostatic discharge protection structure and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200824503A TW200824503A (en) 2008-06-01
TWI372582B true TWI372582B (en) 2012-09-11

Family

ID=39416690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139250A TWI372582B (en) 2006-11-20 2007-10-19 System having electrostatic discharge protection structure and method for manufacturing the same

Country Status (3)

Country Link
US (1) US7456432B2 (zh)
CN (1) CN101188899B (zh)
TW (1) TWI372582B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100889553B1 (ko) * 2007-07-23 2009-03-23 주식회사 동부하이텍 시스템 인 패키지 및 그 제조 방법
WO2010029859A1 (en) * 2008-09-12 2010-03-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
TWI391737B (zh) * 2009-09-03 2013-04-01 Au Optronics Corp 主動元件陣列母基板及其製作方法
CN101697052B (zh) * 2009-09-18 2011-08-10 友达光电股份有限公司 主动元件阵列母基板及其制作方法
CN101765289B (zh) * 2009-12-30 2012-09-26 友达光电股份有限公司 静电放电防护结构及使用其的显示装置
CN102622114B (zh) * 2011-01-28 2015-03-25 华映科技(集团)股份有限公司 一种触控面板的感应装置
TWI493685B (zh) 2012-02-10 2015-07-21 E Ink Holdings Inc 主動陣列基板上之靜電防護結構
JP2013205504A (ja) * 2012-03-27 2013-10-07 Japan Display Inc 液晶表示装置
JP2014026199A (ja) * 2012-07-30 2014-02-06 Japan Display Inc 液晶表示装置
CN102854643B (zh) * 2012-09-04 2015-11-25 深圳市华星光电技术有限公司 一种液晶显示面板及其制造方法
CN103022052B (zh) * 2012-12-14 2015-04-08 京东方科技集团股份有限公司 一种阵列基板及显示装置
CN103441119B (zh) * 2013-07-05 2016-03-30 京东方科技集团股份有限公司 一种制造esd器件的方法、esd器件和显示面板
KR102089074B1 (ko) * 2013-11-07 2020-03-13 엘지디스플레이 주식회사 표시패널용 어레이 기판 및 그 제조방법
KR102317600B1 (ko) * 2014-07-21 2021-10-27 삼성디스플레이 주식회사 표시 장치
KR102381283B1 (ko) * 2015-07-24 2022-03-31 삼성디스플레이 주식회사 표시 장치
CN204964955U (zh) * 2015-07-28 2016-01-13 合肥鑫晟光电科技有限公司 电连接结构、阵列基板和显示装置
CN108878443B (zh) * 2017-05-12 2020-06-09 京东方科技集团股份有限公司 显示面板、显示面板的制造方法和显示面板的绑定方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5532853A (en) * 1993-03-04 1996-07-02 Samsung Electronics Co., Ltd. Reparable display device matrix for repairing the electrical connection of a bonding pad to its associated signal line
US6680578B2 (en) * 2001-09-19 2004-01-20 Osram Opto Semiconductors, Gmbh Organic light emitting diode light source
KR101108782B1 (ko) * 2004-07-30 2012-02-24 엘지디스플레이 주식회사 액정 표시 장치 및 그 제조 방법

Also Published As

Publication number Publication date
US7456432B2 (en) 2008-11-25
US20080117558A1 (en) 2008-05-22
TW200824503A (en) 2008-06-01
CN101188899A (zh) 2008-05-28
CN101188899B (zh) 2011-12-07

Similar Documents

Publication Publication Date Title
TWI372582B (en) System having electrostatic discharge protection structure and method for manufacturing the same
EP1937213A4 (en) SYSTEMS AND METHODS FOR MANUFACTURING LIPOSOMES
EP2074150A4 (en) DISCHARGE SYSTEMS AND METHOD FOR THEIR USE
TWI319253B (en) Protecting circuits and methods from electrostatic discharge
IL178221A0 (en) Active protection method and system
EP2095285A4 (en) SYSTEM AND METHOD OF MANUFACTURE
EP2446447A4 (en) ELECTROSTATIC DISCHARGE DEVICE AND METHOD FOR THE PRODUCTION THEREOF
EG26317A (en) Well service methods and systems
PT2040845T (pt) Disposição de filtro de ar e respetivo método de fabrico
EP2195540A4 (en) COMPRESSOR PROTECTION SYSTEM AND METHOD
EP2096648A4 (en) CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME
ZA200901525B (en) Discharge systems and methods of using the same
EP1977506A4 (en) SYSTEMS AND METHODS FOR OVERCURRENT PROTECTION
EP2119487A4 (en) HONEYCOMB STRUCTURE AND MANUFACTURING METHOD THEREOF
EP2003729A4 (en) ANTENNA ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
EP1861899A4 (en) OVERVOLTAGE PROTECTION SYSTEM
EP2038820A4 (en) SYSTEMS AND METHODS OF APPLICATIONS RELATING TO INTERNATIONAL CUSTOMS RETURNS
TWI367695B (en) Integrated circuit and electrostatic discharge protection circuit
EP2070032A4 (en) EVENT INQUIRY SYSTEM AND METHOD
TWI346807B (en) Electrostatic discharge protection structure and method for manufacturing an electrostatic discharge protection device thereof
ZA200805315B (en) Cage-type surge arrester and method for producing the same
EP2043120A4 (en) KEYBOARD COVER AND METHOD OF MANUFACTURING THE SAME
EP2029812A4 (en) BRIDGE CUSTOMER PROCEDURE FOR THE PRODUCTION OF THE BRIDGE
EP2024854A4 (en) METHOD AND SYSTEM FOR USER-ESTABLISHED APPLICATION USE
EP2190083A4 (en) COMPONENT FOR PROTECTION AGAINST STATIC ELECTRICITY AND METHOD FOR PRODUCING THE COMPONENT FOR PROTECTION AGAINST STATIC ELECTRICITY