TWI371845B - Chip stacked assembly - Google Patents

Chip stacked assembly

Info

Publication number
TWI371845B
TWI371845B TW097106704A TW97106704A TWI371845B TW I371845 B TWI371845 B TW I371845B TW 097106704 A TW097106704 A TW 097106704A TW 97106704 A TW97106704 A TW 97106704A TW I371845 B TWI371845 B TW I371845B
Authority
TW
Taiwan
Prior art keywords
stacked assembly
chip stacked
chip
assembly
stacked
Prior art date
Application number
TW097106704A
Other languages
Chinese (zh)
Other versions
TW200937606A (en
Inventor
ming yao Chen
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW097106704A priority Critical patent/TWI371845B/en
Publication of TW200937606A publication Critical patent/TW200937606A/en
Application granted granted Critical
Publication of TWI371845B publication Critical patent/TWI371845B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
TW097106704A 2008-02-26 2008-02-26 Chip stacked assembly TWI371845B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097106704A TWI371845B (en) 2008-02-26 2008-02-26 Chip stacked assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097106704A TWI371845B (en) 2008-02-26 2008-02-26 Chip stacked assembly

Publications (2)

Publication Number Publication Date
TW200937606A TW200937606A (en) 2009-09-01
TWI371845B true TWI371845B (en) 2012-09-01

Family

ID=44867096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097106704A TWI371845B (en) 2008-02-26 2008-02-26 Chip stacked assembly

Country Status (1)

Country Link
TW (1) TWI371845B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570421B2 (en) 2013-11-14 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9570421B2 (en) 2013-11-14 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
US9929109B2 (en) 2013-11-14 2018-03-27 Taiwan Semiconductor Manufacturing Co., Ltd. Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure
US10510684B2 (en) 2013-11-14 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Three dimensional integrated circuit (3DIC) with support structures
US11424194B2 (en) 2013-11-14 2022-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Three dimensional integrated circuit (3DIC) with support structures

Also Published As

Publication number Publication date
TW200937606A (en) 2009-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees