TWI368757B - Device for floating a substrate - Google Patents

Device for floating a substrate

Info

Publication number
TWI368757B
TWI368757B TW093111647A TW93111647A TWI368757B TW I368757 B TWI368757 B TW I368757B TW 093111647 A TW093111647 A TW 093111647A TW 93111647 A TW93111647 A TW 93111647A TW I368757 B TWI368757 B TW I368757B
Authority
TW
Taiwan
Prior art keywords
floating
substrate
Prior art date
Application number
TW093111647A
Other languages
Chinese (zh)
Other versions
TW200500635A (en
Inventor
Okahira Hiroyuki
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200500635A publication Critical patent/TW200500635A/en
Application granted granted Critical
Publication of TWI368757B publication Critical patent/TWI368757B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW093111647A 2003-04-30 2004-04-26 Device for floating a substrate TWI368757B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003125701 2003-04-30

Publications (2)

Publication Number Publication Date
TW200500635A TW200500635A (en) 2005-01-01
TWI368757B true TWI368757B (en) 2012-07-21

Family

ID=33410239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111647A TWI368757B (en) 2003-04-30 2004-04-26 Device for floating a substrate

Country Status (5)

Country Link
JP (1) JP4418428B2 (en)
KR (1) KR101053770B1 (en)
CN (2) CN1697768B (en)
TW (1) TWI368757B (en)
WO (1) WO2004096679A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268447B2 (en) * 2003-05-14 2009-05-27 Ｈｏｙａ株式会社 Substrate holder, substrate processing apparatus, substrate inspection apparatus, and methods of use thereof
JP4754885B2 (en) * 2004-11-30 2011-08-24 株式会社ダイヘン Substrate transfer device
JP4809612B2 (en) * 2005-02-10 2011-11-09 パナソニック株式会社 Substrate transfer method
JP4895518B2 (en) * 2005-03-22 2012-03-14 オリンパス株式会社 Substrate holding device and substrate holding method
CN101253113B (en) 2005-09-02 2012-10-17 平田机工株式会社 Work loading/unloading system and conveyance device
CN101273448B (en) * 2005-09-29 2010-05-12 平田机工株式会社 Workpiece storage device
JP2007250871A (en) * 2006-03-16 2007-09-27 Olympus Corp Substrate transport apparatus
JP2007281285A (en) * 2006-04-10 2007-10-25 Olympus Corp Substrate transport apparatus
JP5084356B2 (en) * 2007-06-11 2012-11-28 Ｎｓｋテクノロジー株式会社 Substrate transport mechanism for exposure apparatus and substrate position adjusting method using the same
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
CN102148176B (en) * 2010-02-09 2013-02-06 北京北方微电子基地设备工艺研究中心有限责任公司 Lifting device and semiconductor device processing equipment with same
JP2010251769A (en) * 2010-05-24 2010-11-04 Olympus Corp Substrate holding device and method of holding substrate
CN103182695B (en) * 2011-12-29 2015-07-01 财团法人金属工业研究发展中心 Assembling device of reconfigurable toolroom machine
KR102000430B1 (en) * 2012-04-03 2019-07-15 가부시키가이샤 니콘 Pattern forming device
CN102717314A (en) * 2012-06-29 2012-10-10 苏州晟成新能源科技有限公司 Trimmer
KR101613121B1 (en) 2014-03-18 2016-04-18 주식회사 에스에프에이 Pattern printer
JP6032234B2 (en) * 2014-03-19 2016-11-24 信越半導体株式会社 Work holding device
US10381256B2 (en) * 2015-03-12 2019-08-13 Kla-Tencor Corporation Apparatus and method for chucking warped wafers
CN106960810A (en) * 2016-01-11 2017-07-18 锡宬国际有限公司 Wafer bearing device
KR101717680B1 (en) * 2016-07-19 2017-03-20 디앤에이 주식회사 Transfer lifter module
KR101865274B1 (en) * 2016-08-31 2018-06-07 씨디에스(주) Device for floating substrate using sloped structure
JP6842948B2 (en) * 2017-02-24 2021-03-17 リンテック株式会社 Positioning device and positioning method
JP7134039B2 (en) * 2018-09-14 2022-09-09 東京エレクトロン株式会社 Substrate mounting mechanism, deposition apparatus, and deposition method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514034U (en) * 1991-08-05 1993-02-23 横河電機株式会社 Wafer transfer device
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
JP2002181714A (en) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd Thin plate inspection device
JP2003040422A (en) * 2001-07-27 2003-02-13 Toyota Industries Corp Object levitation conveyer
JP2003063643A (en) * 2001-08-30 2003-03-05 Nippon Sekkei Kogyo:Kk Thin plate conveying system and apparatus

Also Published As

Publication number Publication date
CN102152966B (en) 2013-03-27
JPWO2004096679A1 (en) 2006-07-13
KR20060015414A (en) 2006-02-17
JP4418428B2 (en) 2010-02-17
CN1697768A (en) 2005-11-16
CN102152966A (en) 2011-08-17
CN1697768B (en) 2011-03-30
KR101053770B1 (en) 2011-08-02
TW200500635A (en) 2005-01-01
WO2004096679A1 (en) 2004-11-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees