TWI368302B - Surface structure of package substrate and method of manufacturing the same - Google Patents
Surface structure of package substrate and method of manufacturing the sameInfo
- Publication number
- TWI368302B TWI368302B TW095134540A TW95134540A TWI368302B TW I368302 B TWI368302 B TW I368302B TW 095134540 A TW095134540 A TW 095134540A TW 95134540 A TW95134540 A TW 95134540A TW I368302 B TWI368302 B TW I368302B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- same
- package substrate
- surface structure
- package
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095134540A TWI368302B (en) | 2006-09-19 | 2006-09-19 | Surface structure of package substrate and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095134540A TWI368302B (en) | 2006-09-19 | 2006-09-19 | Surface structure of package substrate and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200816428A TW200816428A (en) | 2008-04-01 |
TWI368302B true TWI368302B (en) | 2012-07-11 |
Family
ID=44769096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095134540A TWI368302B (en) | 2006-09-19 | 2006-09-19 | Surface structure of package substrate and method of manufacturing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI368302B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9583451B2 (en) | 2015-06-19 | 2017-02-28 | International Business Machines Corporation | Conductive pillar shaped for solder confinement |
CN111755409A (en) * | 2019-03-27 | 2020-10-09 | 恒劲科技股份有限公司 | Semiconductor package substrate and manufacturing method thereof, and electronic package and manufacturing method thereof |
TWI762777B (en) * | 2019-03-27 | 2022-05-01 | 恆勁科技股份有限公司 | Semiconductor package substrate and manufacturing method thereof and electronic package and manufacturing method thereof |
TWI694566B (en) * | 2019-06-06 | 2020-05-21 | 恆勁科技股份有限公司 | Semiconductor package carrier board and manufacturing method thereof and electronic package |
-
2006
- 2006-09-19 TW TW095134540A patent/TWI368302B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200816428A (en) | 2008-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |