TWI368302B - Surface structure of package substrate and method of manufacturing the same - Google Patents

Surface structure of package substrate and method of manufacturing the same

Info

Publication number
TWI368302B
TWI368302B TW095134540A TW95134540A TWI368302B TW I368302 B TWI368302 B TW I368302B TW 095134540 A TW095134540 A TW 095134540A TW 95134540 A TW95134540 A TW 95134540A TW I368302 B TWI368302 B TW I368302B
Authority
TW
Taiwan
Prior art keywords
manufacturing
same
package substrate
surface structure
package
Prior art date
Application number
TW095134540A
Other languages
Chinese (zh)
Other versions
TW200816428A (en
Inventor
Wei Hung Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW095134540A priority Critical patent/TWI368302B/en
Publication of TW200816428A publication Critical patent/TW200816428A/en
Application granted granted Critical
Publication of TWI368302B publication Critical patent/TWI368302B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
TW095134540A 2006-09-19 2006-09-19 Surface structure of package substrate and method of manufacturing the same TWI368302B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095134540A TWI368302B (en) 2006-09-19 2006-09-19 Surface structure of package substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095134540A TWI368302B (en) 2006-09-19 2006-09-19 Surface structure of package substrate and method of manufacturing the same

Publications (2)

Publication Number Publication Date
TW200816428A TW200816428A (en) 2008-04-01
TWI368302B true TWI368302B (en) 2012-07-11

Family

ID=44769096

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134540A TWI368302B (en) 2006-09-19 2006-09-19 Surface structure of package substrate and method of manufacturing the same

Country Status (1)

Country Link
TW (1) TWI368302B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9583451B2 (en) 2015-06-19 2017-02-28 International Business Machines Corporation Conductive pillar shaped for solder confinement
CN111755409A (en) * 2019-03-27 2020-10-09 恒劲科技股份有限公司 Semiconductor package substrate and manufacturing method thereof, and electronic package and manufacturing method thereof
TWI762777B (en) * 2019-03-27 2022-05-01 恆勁科技股份有限公司 Semiconductor package substrate and manufacturing method thereof and electronic package and manufacturing method thereof
TWI694566B (en) * 2019-06-06 2020-05-21 恆勁科技股份有限公司 Semiconductor package carrier board and manufacturing method thereof and electronic package

Also Published As

Publication number Publication date
TW200816428A (en) 2008-04-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees