TWI368292B - - Google Patents

Info

Publication number
TWI368292B
TWI368292B TW096140927A TW96140927A TWI368292B TW I368292 B TWI368292 B TW I368292B TW 096140927 A TW096140927 A TW 096140927A TW 96140927 A TW96140927 A TW 96140927A TW I368292 B TWI368292 B TW I368292B
Authority
TW
Taiwan
Application number
TW096140927A
Other languages
Chinese (zh)
Other versions
TW200832604A (en
Inventor
Yukio Toyoda
Hiroshi Yagi
Original Assignee
Tomoegawa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Co Ltd filed Critical Tomoegawa Co Ltd
Publication of TW200832604A publication Critical patent/TW200832604A/en
Application granted granted Critical
Publication of TWI368292B publication Critical patent/TWI368292B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW96140927A 2006-10-31 2007-10-31 Electrostatic chuck device TW200832604A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006295035 2006-10-31
JP2007273691 2007-10-22

Publications (2)

Publication Number Publication Date
TW200832604A TW200832604A (en) 2008-08-01
TWI368292B true TWI368292B (en) 2012-07-11

Family

ID=39344275

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96140927A TW200832604A (en) 2006-10-31 2007-10-31 Electrostatic chuck device

Country Status (3)

Country Link
JP (1) JP5054022B2 (en)
TW (1) TW200832604A (en)
WO (1) WO2008053934A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5193886B2 (en) * 2009-01-14 2013-05-08 株式会社巴川製紙所 Electrostatic chuck device repair method and repair device, and electrostatic chuck device
WO2012166256A1 (en) * 2011-06-02 2012-12-06 Applied Materials, Inc. Electrostatic chuck aln dielectric repair
WO2014129625A1 (en) * 2013-02-25 2014-08-28 京セラ株式会社 Sample holding tool
US9740111B2 (en) * 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10622239B2 (en) * 2015-03-31 2020-04-14 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP6572788B2 (en) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 Electrostatic chuck device
JP7038497B2 (en) * 2017-07-07 2022-03-18 東京エレクトロン株式会社 Manufacturing method of electrostatic chuck
KR102097501B1 (en) * 2018-05-04 2020-04-09 (주)아폴로테크 A electrostatic chuck comprising a protecting coating layer
TWI813840B (en) * 2018-12-27 2023-09-01 日商巴川製紙所股份有限公司 Electrostatic chuck device
JP7401266B2 (en) * 2018-12-27 2023-12-19 東京エレクトロン株式会社 Substrate mounting table and substrate processing equipment
JP7355512B2 (en) * 2019-03-28 2023-10-03 株式会社巴川製紙所 Masking material for thermal spraying, manufacturing method of electrostatic chuck device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
JPH07335732A (en) * 1994-06-14 1995-12-22 Tokyo Electron Ltd Electrostatic chuck, plasma treatment equipment using electrostatic chuck and its manufacture
JP3457477B2 (en) * 1995-09-06 2003-10-20 日本碍子株式会社 Electrostatic chuck

Also Published As

Publication number Publication date
WO2008053934A1 (en) 2008-05-08
TW200832604A (en) 2008-08-01
JPWO2008053934A1 (en) 2010-02-25
JP5054022B2 (en) 2012-10-24

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