TWI367705B - Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same - Google Patents
Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the sameInfo
- Publication number
- TWI367705B TWI367705B TW097150754A TW97150754A TWI367705B TW I367705 B TWI367705 B TW I367705B TW 097150754 A TW097150754 A TW 097150754A TW 97150754 A TW97150754 A TW 97150754A TW I367705 B TWI367705 B TW I367705B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- preparing
- circuit board
- printed circuit
- copper foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12778—Alternative base metals from diverse categories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070140522A KR101351928B1 (ko) | 2007-12-28 | 2007-12-28 | 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한프린트 배선 기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200938026A TW200938026A (en) | 2009-09-01 |
TWI367705B true TWI367705B (en) | 2012-07-01 |
Family
ID=40824869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097150754A TWI367705B (en) | 2007-12-28 | 2008-12-25 | Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US8530749B2 (zh) |
KR (1) | KR101351928B1 (zh) |
CN (1) | CN101909871B (zh) |
TW (1) | TWI367705B (zh) |
WO (1) | WO2009084839A2 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130188324A1 (en) * | 2010-09-29 | 2013-07-25 | Posco | Method for Manufacturing a Flexible Electronic Device Using a Roll-Shaped Motherboard, Flexible Electronic Device, and Flexible Substrate |
CN102452197B (zh) | 2010-10-21 | 2014-08-20 | 财团法人工业技术研究院 | 附载箔铜箔及其制造方法 |
CN102231411B (zh) * | 2011-07-11 | 2012-09-19 | 中国科学院深圳先进技术研究院 | 薄膜型太阳能电池表面自对准电极的制造方法 |
KR101372519B1 (ko) * | 2012-01-11 | 2014-03-11 | 일진머티리얼즈 주식회사 | 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한 프린트 배선 기판 |
JP5481577B1 (ja) * | 2012-09-11 | 2014-04-23 | Jx日鉱日石金属株式会社 | キャリア付き銅箔 |
US9859056B2 (en) * | 2014-09-30 | 2018-01-02 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
WO2016093109A1 (ja) * | 2014-12-08 | 2016-06-16 | 三井金属鉱業株式会社 | プリント配線板の製造方法 |
JP6640567B2 (ja) * | 2015-01-16 | 2020-02-05 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法 |
KR101944784B1 (ko) * | 2017-01-16 | 2019-02-08 | 일진머티리얼즈 주식회사 | 캐리어박 부착 극박동박 |
KR101881287B1 (ko) | 2017-01-16 | 2018-07-27 | 일진머티리얼즈 주식회사 | 캐리어박 부착 극박동박 |
KR101944783B1 (ko) * | 2017-01-16 | 2019-04-18 | 일진머티리얼즈 주식회사 | 캐리어박 부착 극박동박 |
JP2021014623A (ja) * | 2019-07-12 | 2021-02-12 | パナソニックIpマネジメント株式会社 | 金属基材付薄膜金属箔、金属張透明基材材料、透視型電極用積層板、及び透視型電極素材 |
KR102137068B1 (ko) * | 2019-11-27 | 2020-07-23 | 와이엠티 주식회사 | 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체 |
CN113881980B (zh) * | 2021-11-12 | 2023-06-06 | 山东金宝电子有限公司 | 一种剥离层处理液及可剥离的附载体超薄铜箔的制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW420729B (en) * | 1996-02-12 | 2001-02-01 | Gould Electronics Inc | A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath |
JP4672907B2 (ja) | 2001-06-04 | 2011-04-20 | Jx日鉱日石金属株式会社 | 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板 |
JP4283497B2 (ja) | 2002-06-21 | 2009-06-24 | 日本電解株式会社 | プリント配線板の製造方法 |
JP2004169181A (ja) | 2002-10-31 | 2004-06-17 | Furukawa Techno Research Kk | キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板 |
JP2004161840A (ja) | 2002-11-12 | 2004-06-10 | Toray Ind Inc | ポリエステルフィルム |
JP3977790B2 (ja) | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
JP4217786B2 (ja) | 2004-03-12 | 2009-02-04 | 古河電気工業株式会社 | キャリア付き極薄銅箔、およびキャリア付き極薄銅箔を用いた配線板 |
JP2005260058A (ja) | 2004-03-12 | 2005-09-22 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板 |
JP2006312265A (ja) | 2005-05-09 | 2006-11-16 | Furukawa Circuit Foil Kk | キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板 |
JP4904933B2 (ja) * | 2005-09-27 | 2012-03-28 | 日立電線株式会社 | ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔 |
CN1984527B (zh) * | 2005-12-15 | 2010-12-01 | 古河电气工业株式会社 | 带载体的极薄铜箔及印刷电路基板 |
JP4927503B2 (ja) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
JP4934409B2 (ja) | 2005-12-15 | 2012-05-16 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
CN100567572C (zh) * | 2006-11-28 | 2009-12-09 | 山东金宝电子股份有限公司 | 电解铜箔的灰色表面处理工艺 |
CN101074484A (zh) * | 2007-03-29 | 2007-11-21 | 上海大学 | 印制电路板用压延铜箔表面处理的方法 |
-
2007
- 2007-12-28 KR KR1020070140522A patent/KR101351928B1/ko active IP Right Grant
-
2008
- 2008-12-23 WO PCT/KR2008/007600 patent/WO2009084839A2/en active Application Filing
- 2008-12-23 US US12/810,511 patent/US8530749B2/en active Active
- 2008-12-23 CN CN200880123120.3A patent/CN101909871B/zh active Active
- 2008-12-25 TW TW097150754A patent/TWI367705B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN101909871A (zh) | 2010-12-08 |
WO2009084839A2 (en) | 2009-07-09 |
WO2009084839A3 (en) | 2009-08-20 |
KR101351928B1 (ko) | 2014-01-21 |
US8530749B2 (en) | 2013-09-10 |
CN101909871B (zh) | 2014-08-06 |
TW200938026A (en) | 2009-09-01 |
US20100282500A1 (en) | 2010-11-11 |
KR20090072423A (ko) | 2009-07-02 |
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