TWI367705B - Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same - Google Patents

Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same

Info

Publication number
TWI367705B
TWI367705B TW097150754A TW97150754A TWI367705B TW I367705 B TWI367705 B TW I367705B TW 097150754 A TW097150754 A TW 097150754A TW 97150754 A TW97150754 A TW 97150754A TW I367705 B TWI367705 B TW I367705B
Authority
TW
Taiwan
Prior art keywords
same
preparing
circuit board
printed circuit
copper foil
Prior art date
Application number
TW097150754A
Other languages
English (en)
Other versions
TW200938026A (en
Inventor
Jong-Ho Ryu
Chang-Yol Yang
Joung-Ah Kang
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Publication of TW200938026A publication Critical patent/TW200938026A/zh
Application granted granted Critical
Publication of TWI367705B publication Critical patent/TWI367705B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Laminated Bodies (AREA)
TW097150754A 2007-12-28 2008-12-25 Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same TWI367705B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070140522A KR101351928B1 (ko) 2007-12-28 2007-12-28 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한프린트 배선 기판

Publications (2)

Publication Number Publication Date
TW200938026A TW200938026A (en) 2009-09-01
TWI367705B true TWI367705B (en) 2012-07-01

Family

ID=40824869

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097150754A TWI367705B (en) 2007-12-28 2008-12-25 Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same

Country Status (5)

Country Link
US (1) US8530749B2 (zh)
KR (1) KR101351928B1 (zh)
CN (1) CN101909871B (zh)
TW (1) TWI367705B (zh)
WO (1) WO2009084839A2 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130188324A1 (en) * 2010-09-29 2013-07-25 Posco Method for Manufacturing a Flexible Electronic Device Using a Roll-Shaped Motherboard, Flexible Electronic Device, and Flexible Substrate
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
CN102231411B (zh) * 2011-07-11 2012-09-19 中国科学院深圳先进技术研究院 薄膜型太阳能电池表面自对准电极的制造方法
KR101372519B1 (ko) * 2012-01-11 2014-03-11 일진머티리얼즈 주식회사 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한 프린트 배선 기판
JP5481577B1 (ja) * 2012-09-11 2014-04-23 Ｊｘ日鉱日石金属株式会社 キャリア付き銅箔
US9859056B2 (en) * 2014-09-30 2018-01-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
WO2016093109A1 (ja) * 2014-12-08 2016-06-16 三井金属鉱業株式会社 プリント配線板の製造方法
JP6640567B2 (ja) * 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101944784B1 (ko) * 2017-01-16 2019-02-08 일진머티리얼즈 주식회사 캐리어박 부착 극박동박
KR101881287B1 (ko) 2017-01-16 2018-07-27 일진머티리얼즈 주식회사 캐리어박 부착 극박동박
KR101944783B1 (ko) * 2017-01-16 2019-04-18 일진머티리얼즈 주식회사 캐리어박 부착 극박동박
JP2021014623A (ja) * 2019-07-12 2021-02-12 パナソニックＩｐマネジメント株式会社 金属基材付薄膜金属箔、金属張透明基材材料、透視型電極用積層板、及び透視型電極素材
KR102137068B1 (ko) * 2019-11-27 2020-07-23 와이엠티 주식회사 캐리어박 부착 금속박, 이의 제조방법 및 이를 포함하는 적층체
CN113881980B (zh) * 2021-11-12 2023-06-06 山东金宝电子有限公司 一种剥离层处理液及可剥离的附载体超薄铜箔的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW420729B (en) * 1996-02-12 2001-02-01 Gould Electronics Inc A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath
JP4672907B2 (ja) 2001-06-04 2011-04-20 Ｊｘ日鉱日石金属株式会社 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP4283497B2 (ja) 2002-06-21 2009-06-24 日本電解株式会社 プリント配線板の製造方法
JP2004169181A (ja) 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP2004161840A (ja) 2002-11-12 2004-06-10 Toray Ind Inc ポリエステルフィルム
JP3977790B2 (ja) 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
JP4217786B2 (ja) 2004-03-12 2009-02-04 古河電気工業株式会社 キャリア付き極薄銅箔、およびキャリア付き極薄銅箔を用いた配線板
JP2005260058A (ja) 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板
JP2006312265A (ja) 2005-05-09 2006-11-16 Furukawa Circuit Foil Kk キャリア付き極薄銅箔および該極薄銅箔を用いたプリント配線板、多層プリント配線板
JP4904933B2 (ja) * 2005-09-27 2012-03-28 日立電線株式会社 ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔
CN1984527B (zh) * 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4934409B2 (ja) 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
CN100567572C (zh) * 2006-11-28 2009-12-09 山东金宝电子股份有限公司 电解铜箔的灰色表面处理工艺
CN101074484A (zh) * 2007-03-29 2007-11-21 上海大学 印制电路板用压延铜箔表面处理的方法

Also Published As

Publication number Publication date
CN101909871A (zh) 2010-12-08
WO2009084839A2 (en) 2009-07-09
WO2009084839A3 (en) 2009-08-20
KR101351928B1 (ko) 2014-01-21
US8530749B2 (en) 2013-09-10
CN101909871B (zh) 2014-08-06
TW200938026A (en) 2009-09-01
US20100282500A1 (en) 2010-11-11
KR20090072423A (ko) 2009-07-02

Similar Documents

Publication Publication Date Title
TWI367705B (en) Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
GB2453083B (en) Printed circuit boards
EP2624671A4 (en) COPPER FOIL FOR FITTED PCB, METHOD FOR MAKING THIS COPPER FILM, RESIN COVER FOR FITTED PCB AND FITTED PCB
EP2216427A4 (en) COPPER FILM FOR PRINTED SWITCHING AND COPPER COVERED LAMINATE
EP2424337A4 (en) SUBSTRATE FOR PRINTED CARD, PRINTED CARD, AND METHODS OF MANUFACTURING THE SAME
HK1221481A1 (zh) 熱固性粘接組合物、熱固性粘接片材、其製造方法及增强柔性印刷布線板
EP1895024A4 (en) COPPER FOIL FOR PCB
TWI365685B (en) Method for manufacturing printed wiring board
PL2198478T3 (pl) Układ antenowy, sposób wytwarzania układu antenowego i płytka obwodu drukowanego do stosowania w układzie antenowym
EP2224794A4 (en) FITTED LADDER PLATE, METHOD FOR THE PRODUCTION THEREOF AND RADIO FREQUENCY DEVICE THEREFOR
EP2071907A4 (en) FLEXORIGID PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE FLEXORIGID PRINTED CIRCUIT BOARD
EP2280594A4 (en) PCB AND METHOD FOR THE PRODUCTION THEREOF
HK1149124A1 (zh) 用於印刷電路板的互連組合件
HK1135556A1 (en) Printed wiring board and method for manufacturing the same
EP2519092A4 (en) METHOD FOR BLINKING A PRINTED CIRCUIT BOARD AND ASSOCIATED PRINTED CIRCUIT BOARD
GB2466151C2 (en) Heating system for a double-ovensized oscillator on a single printed circuit board
EP2461659A4 (en) FITTED PCB, MULTILAYER BUILT-UP PCB AND MANUFACTURING PROCESS THEREFOR
EP2479298A4 (en) COPPER ALLOY SHEET, FLEXIBLE PRINTED CIRCUIT BOARD OBTAINED USING THE SAME, AND METHOD FOR MANUFACTURING THE COPPER ALLOY SHEET
TWI368231B (en) Conductive paste, and method for producing printed wiring board by using the same
EP2502956A4 (en) PRE-IMPREGNATED, LAMINATE, LAMINATE METALLIC FILM-VENEER, CIRCUIT BOARD, AND PRINTED CIRCUIT FOR LED MOUNTING
TWI351245B (en) Method for manufacturing rigid-flexible printed circuit board
EP2223580A4 (en) PANELLING METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
GB0815096D0 (en) Printed circuit boards
GB0808869D0 (en) Printed circuit board including anti-countefeiting means
EP1949774A4 (en) METHOD FOR CONNECTING PRINTED CIRCUIT BOARDS