TWI367336B - Probe station and method of testing wafers using the same - Google Patents

Probe station and method of testing wafers using the same

Info

Publication number
TWI367336B
TWI367336B TW096149847A TW96149847A TWI367336B TW I367336 B TWI367336 B TW I367336B TW 096149847 A TW096149847 A TW 096149847A TW 96149847 A TW96149847 A TW 96149847A TW I367336 B TWI367336 B TW I367336B
Authority
TW
Taiwan
Prior art keywords
same
probe station
testing wafers
wafers
testing
Prior art date
Application number
TW096149847A
Other languages
Chinese (zh)
Other versions
TW200837370A (en
Inventor
Su Hyun Choi
Meang Kwon Kim
Jeon Ho Jin
Ki Uk Choi
Original Assignee
Secron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060134678A external-priority patent/KR100847577B1/en
Priority claimed from KR1020060137790A external-priority patent/KR100878211B1/en
Application filed by Secron Co Ltd filed Critical Secron Co Ltd
Publication of TW200837370A publication Critical patent/TW200837370A/en
Application granted granted Critical
Publication of TWI367336B publication Critical patent/TWI367336B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW096149847A 2006-12-27 2007-12-25 Probe station and method of testing wafers using the same TWI367336B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060134678A KR100847577B1 (en) 2006-12-27 2006-12-27 Probe tester for wafer
KR1020060137790A KR100878211B1 (en) 2006-12-29 2006-12-29 Probe station, and testing method of wafer using the same

Publications (2)

Publication Number Publication Date
TW200837370A TW200837370A (en) 2008-09-16
TWI367336B true TWI367336B (en) 2012-07-01

Family

ID=39562685

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096149847A TWI367336B (en) 2006-12-27 2007-12-25 Probe station and method of testing wafers using the same

Country Status (2)

Country Link
TW (1) TWI367336B (en)
WO (1) WO2008078939A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101541538B1 (en) * 2008-12-19 2015-08-04 세메스 주식회사 Unit for transferring a wafer and probe station including the same
JP7267507B2 (en) * 2019-12-13 2023-05-01 シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド Chip detection device, chip detection system and control method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3169900B2 (en) * 1998-07-28 2001-05-28 日本電気アイシーマイコンシステム株式会社 Prober
JP2000077488A (en) * 1998-08-31 2000-03-14 Nec Kyushu Ltd Probe device
JP4498829B2 (en) * 2003-10-30 2010-07-07 東京エレクトロン株式会社 Card holder

Also Published As

Publication number Publication date
TW200837370A (en) 2008-09-16
WO2008078939A1 (en) 2008-07-03

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