TWI367336B - Probe station and method of testing wafers using the same - Google Patents
Probe station and method of testing wafers using the sameInfo
- Publication number
- TWI367336B TWI367336B TW096149847A TW96149847A TWI367336B TW I367336 B TWI367336 B TW I367336B TW 096149847 A TW096149847 A TW 096149847A TW 96149847 A TW96149847 A TW 96149847A TW I367336 B TWI367336 B TW I367336B
- Authority
- TW
- Taiwan
- Prior art keywords
- same
- probe station
- testing wafers
- wafers
- testing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060134678A KR100847577B1 (en) | 2006-12-27 | 2006-12-27 | Probe tester for wafer |
KR1020060137790A KR100878211B1 (en) | 2006-12-29 | 2006-12-29 | Probe station, and testing method of wafer using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200837370A TW200837370A (en) | 2008-09-16 |
TWI367336B true TWI367336B (en) | 2012-07-01 |
Family
ID=39562685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096149847A TWI367336B (en) | 2006-12-27 | 2007-12-25 | Probe station and method of testing wafers using the same |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI367336B (en) |
WO (1) | WO2008078939A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101541538B1 (en) * | 2008-12-19 | 2015-08-04 | 세메스 주식회사 | Unit for transferring a wafer and probe station including the same |
JP7267507B2 (en) * | 2019-12-13 | 2023-05-01 | シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド | Chip detection device, chip detection system and control method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3169900B2 (en) * | 1998-07-28 | 2001-05-28 | 日本電気アイシーマイコンシステム株式会社 | Prober |
JP2000077488A (en) * | 1998-08-31 | 2000-03-14 | Nec Kyushu Ltd | Probe device |
JP4498829B2 (en) * | 2003-10-30 | 2010-07-07 | 東京エレクトロン株式会社 | Card holder |
-
2007
- 2007-12-24 WO PCT/KR2007/006777 patent/WO2008078939A1/en active Application Filing
- 2007-12-25 TW TW096149847A patent/TWI367336B/en active
Also Published As
Publication number | Publication date |
---|---|
TW200837370A (en) | 2008-09-16 |
WO2008078939A1 (en) | 2008-07-03 |
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