TWI366880B - Detecting materials on wafer and repair system and method thereof - Google Patents
Detecting materials on wafer and repair system and method thereofInfo
- Publication number
- TWI366880B TWI366880B TW097114390A TW97114390A TWI366880B TW I366880 B TWI366880 B TW I366880B TW 097114390 A TW097114390 A TW 097114390A TW 97114390 A TW97114390 A TW 97114390A TW I366880 B TWI366880 B TW I366880B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- repair system
- detecting materials
- detecting
- materials
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070040355A KR100863140B1 (ko) | 2007-04-25 | 2007-04-25 | 반도체 웨이퍼의 이물 검사 및 리페어 시스템과 그 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200843015A TW200843015A (en) | 2008-11-01 |
TWI366880B true TWI366880B (en) | 2012-06-21 |
Family
ID=39925831
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097114390A TWI366880B (en) | 2007-04-25 | 2008-04-18 | Detecting materials on wafer and repair system and method thereof |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100029019A1 (zh) |
JP (1) | JP2010522441A (zh) |
KR (1) | KR100863140B1 (zh) |
CN (1) | CN101657893B (zh) |
TW (1) | TWI366880B (zh) |
WO (1) | WO2008133418A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI745144B (zh) * | 2020-10-30 | 2021-11-01 | 致茂電子股份有限公司 | 用於檢測晶圓吸盤殘留異物之線掃描光學檢測系統 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9355919B2 (en) | 2010-08-24 | 2016-05-31 | Nanda Technologies Gmbh | Methods and systems for inspecting bonded wafers |
TWI425183B (zh) * | 2010-12-03 | 2014-02-01 | Hon Tech Inc | Immediate inspection of electronic components transfer device |
CN103018650B (zh) * | 2012-12-04 | 2016-05-25 | 无锡圆方半导体测试有限公司 | 一种晶圆检测*** |
CN106842650B (zh) * | 2017-04-10 | 2019-06-07 | 京东方科技集团股份有限公司 | 显示基板异物的处理装置、显示基板异物的处理方法 |
CN108417516B (zh) * | 2018-04-23 | 2020-08-11 | 上海华虹宏力半导体制造有限公司 | 晶圆背面异物的检测***及其检测方法 |
CN108486538B (zh) * | 2018-04-27 | 2021-06-15 | 深圳市正和忠信股份有限公司 | 智能镀膜方法及*** |
CN112207634A (zh) * | 2019-07-11 | 2021-01-12 | 联芯集成电路制造(厦门)有限公司 | 在线检测抛光垫下方气泡的方法 |
CN110673319B (zh) * | 2019-09-29 | 2021-04-09 | 江苏才道精密仪器有限公司 | 一种可自动调光源的显微镜激光修复***及装置 |
JP7353190B2 (ja) * | 2020-01-10 | 2023-09-29 | 東京エレクトロン株式会社 | 載置台における異物の検出方法、及び、検出装置 |
CN112504099A (zh) * | 2020-12-03 | 2021-03-16 | 信和光能(安徽)有限公司 | 一种平面玻璃生产用表面凸起检测装置 |
CN112485272B (zh) * | 2020-12-14 | 2021-11-09 | 紫创(南京)科技有限公司 | 半导体检测装置及检测方法 |
KR20240064293A (ko) | 2022-11-04 | 2024-05-13 | 최진용 | 웨이퍼 내부의 결함 검사장치 및 웨이퍼 내부의 결함 검사방법 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4131472A (en) * | 1976-09-15 | 1978-12-26 | Align-Rite Corporation | Method for increasing the yield of batch processed microcircuit semiconductor devices |
JPS61279131A (ja) * | 1985-06-05 | 1986-12-09 | Toshiba Corp | 半導体ウエハの欠陥除去装置 |
JP3070745B2 (ja) * | 1989-05-22 | 2000-07-31 | 株式会社日立製作所 | 欠陥検査方法及びその装置並びにそれを用いた半導体の製造方法 |
JP2663955B2 (ja) * | 1991-03-19 | 1997-10-15 | 富士通株式会社 | 半導体製造用インラインパーティクル検出装置及び半導体製造装置 |
KR100191089B1 (en) * | 1994-06-02 | 1999-06-15 | Mitsubishi Electric Corp | Method of detecting the position and the content of fine foreign matter on substrates and analyzers used therefor |
JPH08210985A (ja) * | 1995-02-01 | 1996-08-20 | Sony Corp | 膜中粒子の検出方法および検出装置 |
EP0979398B1 (en) * | 1996-06-04 | 2012-01-04 | KLA-Tencor Corporation | Optical scanning system for surface inspection |
JP2996193B2 (ja) * | 1997-01-17 | 1999-12-27 | 日本電気株式会社 | ウェハ検査方法および装置 |
US6292260B1 (en) * | 1997-07-03 | 2001-09-18 | Isoa, Inc. | System and method of optically inspecting surface structures on an object |
KR100374762B1 (ko) * | 1998-07-28 | 2003-03-04 | 히다치 덴시 엔지니어링 가부시키 가이샤 | 결함 검사 장치 및 그 방법 |
JP2002057143A (ja) * | 2000-08-07 | 2002-02-22 | Hitachi Ltd | 浮遊異物検出装置 |
US6583871B1 (en) * | 2001-07-23 | 2003-06-24 | Advanced Micro Devices, Inc. | System and method to measure closed area defects |
US7236847B2 (en) * | 2002-01-16 | 2007-06-26 | Kla-Tencor Technologies Corp. | Systems and methods for closed loop defect reduction |
JP2004158476A (ja) * | 2002-11-01 | 2004-06-03 | Sony Corp | 微細構造を有する部材の欠陥除去方法 |
JP2005274173A (ja) * | 2004-03-23 | 2005-10-06 | Japan Science & Technology Agency | ウエハー基板、液晶ディスプレイ用透明ガラス等の被検査物の表面上の異物・表面検査方法およびその装置 |
-
2007
- 2007-04-25 KR KR1020070040355A patent/KR100863140B1/ko not_active IP Right Cessation
-
2008
- 2008-04-17 JP JP2010500843A patent/JP2010522441A/ja active Pending
- 2008-04-17 WO PCT/KR2008/002161 patent/WO2008133418A1/en active Application Filing
- 2008-04-17 CN CN2008800098483A patent/CN101657893B/zh not_active Expired - Fee Related
- 2008-04-18 TW TW097114390A patent/TWI366880B/zh not_active IP Right Cessation
-
2009
- 2009-08-26 US US12/548,114 patent/US20100029019A1/en not_active Abandoned
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI745144B (zh) * | 2020-10-30 | 2021-11-01 | 致茂電子股份有限公司 | 用於檢測晶圓吸盤殘留異物之線掃描光學檢測系統 |
Also Published As
Publication number | Publication date |
---|---|
CN101657893B (zh) | 2011-11-30 |
CN101657893A (zh) | 2010-02-24 |
TW200843015A (en) | 2008-11-01 |
JP2010522441A (ja) | 2010-07-01 |
US20100029019A1 (en) | 2010-02-04 |
KR100863140B1 (ko) | 2008-10-14 |
WO2008133418A1 (en) | 2008-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |