1362536 100年.12月28日修正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及顯示領域，尤其係一種模組化之半導體固態 光源模塊及半導體固態光源模組。 【先前技術】 [0002] 傳統之顯示看板多採用冷陰極螢光燈作為光源，而且大 都採用燈箱之結構。燈箱中設置至少一個冷陰極螢光燈 作為光源。冷陰極螢光燈主要利用燈管兩端之冷陰極電 極產生電場，使管内離子高速撞擊電極並使電極產生二1362536 100. December 28th revised replacement page VI. Description of the Invention: [Technical Field] [0001] The present invention relates to the field of display, and more particularly to a modular semiconductor solid-state light source module and a semiconductor solid-state light source module. [Prior Art] [0002] Conventional display panels use cold cathode fluorescent lamps as light sources, and most of them use a light box structure. At least one cold cathode fluorescent lamp is disposed in the light box as a light source. The cold cathode fluorescent lamp mainly uses the cold cathode electrode at both ends of the lamp tube to generate an electric field, so that the ions in the tube hit the electrode at high speed and the electrode generates two.
次電子，燈管内之水銀分子受二次電子撞擊後激發輻射 I 出紫外線，紫外線激發塗佈于於管壁上之螢光層，螢光 層將紫外線轉換為可見光。惟，冷陰極螢光燈因為工作 原理導致其體積較大，又，因為水銀蒸氣之存在，容易 對環境造成污染。 [0003] 發光二極體（light emitting diode, LED)由於具 有輝度高、壽命長、無水銀等優點，近年來廣泛應用於 照明設備、液晶顯示裝置（1 iquid crystal di splay, φ LCD)之背光模組中，一種新型LED可參見Daniel A. Steigerwald等人於文獻IEEE Journal on Selected Topics in Quantum Electronics, Vo 1. 8，No.2， March/April 2002 中之Illumination With Solid State Lighting Technology— 文。惟，該種背光模 組係將大量發光二極體以較高密度設置於一塊電路板上 形成發光二極體陣列，因為不同顯示面板需要不同尺寸 之背光模組，因此，需要設計不同之發光二極體陣列。 096151108 表單编號A0101 第4頁/共24頁 1003486317-0 1362536 100年.12月28日梭正替換頁 當發光二極體陣列中少量發光二極體損壞時，需要更新 整塊發光二極體陣列，因此增加了 LCD之製造成本。 【發明内容】 [0004] 有鑒於此，提供一種模組化之半導體固態光源模塊及模 組實為必要。 [0005] 一種半導體固態光源模塊，其包括一個電路板、至少一 個半導體固態光源和至少一個導光板，該至少一個半導 體固態光源設置於該電路板上，該至少一個導光板耦合 於該半導體固態光源之出光面上，該電路板側面具有連 接端，該連接端為凸起或凹槽，該凸起或凹槽用於將該 電路板與其他半導體固態光源模塊之電路板拼接相連。 [0006] 一種半導體固態光源模組，其包括至少兩個半導體固態 光源模塊，該半導體固態光源模塊包括一個電路板、至 少一個半導體固態光源和至少一個導光板，該至少一個 半導體固態光源設置於該電路板上，該至少一個導光板 耦合於該至少一個半導體固態光源之出光面上，該電路 板側面具有連接端，該至少兩個半導體固態光源模塊藉 由該電路板拼接相連。 [0007] 與先前技術相比，該半導體固態光源模塊被模組化，複 數個相同之半導體固態光源模塊可拼接於一起形成大面 積之顯示裝置，由於半導體固態光源模組是藉由拼接之 機械方式連接，因此，組裝方便；當某一半導體固態光 源模塊損壞時，拆下即可替換，因此維修方便，節省成 本。 096151108 表單編號A0101 第5頁/共24頁 1003486317-0 1362536 100年12月28日梭正替換頁 【實施方式】 [0008] 如圖1、圖2及圖3所示，其為本發明第一實施例提供之一 種半導體固態光源模組10，如發光二極體模組。該半導 體固態光源模組1 0包括多個結構相同冬半導體固態光源 模塊14 ’多個半導體固態光源模塊μ之間為並聯關係， 本實施例中，半導體固態光源模塊14為三個。 [0009] 每個半導體固態光源模塊14包括一個電路板13、三個設 置在電路板13上之半導體固態光源18和一個導光板16， 導光板16設置於半導體固態光源18之出光面上。 [0010] 電路板13具有電源介面131、第一凸起132、第二凸起 133、及分別與第一凸起132、第二凸起133相對之第一 凹槽134和第二凹槽135。電源介面131用於接通電源， 電路板13之第一凸起132***相鄰電路板13之第一凹槽 134中，電路板13之第一凹槽134收容相鄰電路板13之第 一凸起132;電路板13之第二凸起133***相鄰電路板13 之第二凹槽134中，第二凹槽135收容相鄰電路板13之第 二凸起133。 [0011] 每個半導體固態光源模塊14之三個半導體固態光源丨8串 聯連接，半導體固態光源18具有一個正極181和一個負極 182。一外部控制單元1〇〇設置在三個電路板丨3的外部， 其可與電路板13之電源介面131相連，電源介面131提供 電能使其工作。三個串聯連接關係之第一個半導體固態 光源18之正極181與外部控制單元1〇〇相連，最末半導體 固態光源18之負極182形成連接部183，連接部183與電 源介面131相連以使半導體固態光源18與電路板丨3電性連 096151108 表單編號A0101 第6頁/共24頁 1003486317-0 1362536 [0012] [0013]In the secondary electron, the mercury molecules in the lamp are excited by the secondary electrons to emit radiation. The ultraviolet rays excite the fluorescent layer coated on the tube wall, and the fluorescent layer converts the ultraviolet light into visible light. However, cold cathode fluorescent lamps are bulky due to the working principle, and because of the presence of mercury vapor, it is easy to cause environmental pollution. [0003] Light-emitting diodes (LEDs) have been widely used in backlights of lighting equipment and liquid crystal display devices (1 iquid crystal di splay, φ LCD) due to their advantages of high luminance, long life, and anhydrous silver. Among the modules, a new type of LED can be found in Daniel A. Steigerwald et al., IEEE Journal on Selected Topics in Quantum Electronics, Vo 1.8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology. However, the backlight module has a plurality of light-emitting diodes disposed on a circuit board at a relatively high density to form a light-emitting diode array. Since different display panels require backlight modules of different sizes, it is necessary to design different light-emitting diodes. Diode array. 096151108 Form No. A0101 Page 4 of 24 1003486317-0 1362536 100. December 28th Shuttle Replacement Page When a small number of light-emitting diodes in the LED array are damaged, it is necessary to update the entire LED. The array thus increases the manufacturing cost of the LCD. SUMMARY OF THE INVENTION [0004] In view of the above, it is indeed necessary to provide a modular semiconductor solid state light source module and module. [0005] A semiconductor solid-state light source module comprising a circuit board, at least one semiconductor solid-state light source, and at least one light guide plate, the at least one semiconductor solid-state light source is disposed on the circuit board, and the at least one light guide plate is coupled to the semiconductor solid-state light source On the light-emitting surface, the side of the circuit board has a connecting end, and the connecting end is a protrusion or a groove for connecting the circuit board to the circuit board of the other semiconductor solid-state light source module. [0006] A semiconductor solid-state light source module comprising at least two semiconductor solid-state light source modules, the semiconductor solid-state light source module comprising a circuit board, at least one semiconductor solid-state light source, and at least one light guide plate, wherein the at least one semiconductor solid-state light source is disposed on the The at least one light guide plate is coupled to the light-emitting surface of the at least one semiconductor solid-state light source, and the side of the circuit board has a connection end, and the at least two semiconductor solid-state light source modules are connected by the circuit board. [0007] Compared with the prior art, the semiconductor solid-state light source module is modularized, and a plurality of the same semiconductor solid-state light source modules can be spliced together to form a large-area display device, since the semiconductor solid-state light source module is a machine by splicing The method is connected, therefore, the assembly is convenient; when a semiconductor solid-state light source module is damaged, it can be replaced by being removed, so that the maintenance is convenient and the cost is saved. 096151108 Form No. A0101 Page 5 / Total 24 Page 1003486317-0 1362536 December 28, 100 Shuttle Replacement Page [Embodiment] [0008] As shown in FIG. 1, FIG. 2 and FIG. 3, it is the first of the present invention. The embodiment provides a semiconductor solid state light source module 10, such as a light emitting diode module. The semiconductor solid-state light source module 10 includes a plurality of structurally identical winter semiconductor solid-state light source modules 14 ′. The plurality of semiconductor solid-state light source modules μ are in parallel relationship. In the embodiment, the semiconductor solid-state light source modules 14 are three. Each semiconductor solid-state light source module 14 includes a circuit board 13, three semiconductor solid-state light sources 18 disposed on the circuit board 13, and a light guide plate 16 disposed on the light-emitting surface of the semiconductor solid-state light source 18. The circuit board 13 has a power supply interface 131, a first protrusion 132, a second protrusion 133, and a first groove 134 and a second groove 135 opposite to the first protrusion 132 and the second protrusion 133, respectively. . The power interface 131 is used to turn on the power. The first protrusion 132 of the circuit board 13 is inserted into the first recess 134 of the adjacent circuit board 13. The first recess 134 of the circuit board 13 receives the first of the adjacent circuit boards 13. The protrusion 132 is inserted into the second recess 134 of the adjacent circuit board 13, and the second recess 135 receives the second protrusion 133 of the adjacent circuit board 13. [0011] Three semiconductor solid-state light sources 丨8 of each semiconductor solid-state light source module 14 are connected in series, and the semiconductor solid-state light source 18 has a positive electrode 181 and a negative electrode 182. An external control unit 1 is disposed externally of the three circuit boards 丨3, which is connectable to the power interface 131 of the circuit board 13, and the power supply interface 131 provides electrical energy for operation. The positive electrode 181 of the first semiconductor solid-state light source 18 in three series connection relationship is connected to the external control unit 1A, the negative electrode 182 of the last semiconductor solid-state light source 18 forms a connection portion 183, and the connection portion 183 is connected to the power supply interface 131 to make the semiconductor The solid state light source 18 is electrically connected to the circuit board 096 3 096151108. Form No. A0101 Page 6 / Total 24 pages 1003486317-0 1362536 [0013]
[0014] 096151108 100年.12月28日核正替Θ頁 接。 當然，外部控制單元100亦可以與外部電源（圖未示）相 連，由外部電源提供電能使其工作。另外，每一個半導 體固態光源模塊14之電路板13上均可以設置一個外部控 制單元100，由電源介面131提供電能使其工作。[0014] 096151108 100 years. December 28th, the nuclear replacement page. Of course, the external control unit 100 can also be connected to an external power source (not shown), and the external power source supplies power to operate. In addition, an external control unit 100 can be disposed on the circuit board 13 of each of the semiconductor solid-state light source modules 14 to be powered by the power supply interface 131 to operate.
I 當外部控制單元100輸出控制訊號給半導體固態光源模塊 14時，接收到控制訊號之半導體固態光源模塊14工作（ 點亮'熄滅或閃爍等），設置於上面之導光板16便會呈 現相應之工作狀態；當外部控制單元100輸出不同控制訊 號給同一個半導體固態光源模塊14時，半導體固態光源 模塊14呈現不同之工作狀態；當外部控制單元100同時輸 出控制訊號給三個半導體固態光源模塊14時，三個半導 體固態光源模塊14按照相應之控制訊號工作。因此，該 半導體固態光源模組10可選擇性使任意半導體固態光源 模塊14工作，或者不同之半導體固態光源模塊14具有不 同之工作狀態，從而可使得半導體固態光源模組10呈現 動態視覺顯示。 由於半導體固態光源模塊14之結構已被模組化，單個之 半導體固態光源模塊14可實現顯示功能，通過第一凸起 132、第二凸起133、第一凹槽134和第二凹槽135之連接 可使複數個半導體固態光源模塊14相連實現大面積化。 由於通過凸起、凹槽之連接方式相連，故，半導體固態 光源模塊14之組裝、拆卸方便。當某一半導體固態光源 模塊14損壞時，只需要將其從半導體固態光源模組10上 拔下，換上新的半導體固態光源模塊14即可，不需要重 表單編號Α0101 第7頁/共24頁 1003486317-0 1362536 [0015] [0016] [0017] [0018] [0019] [0020] 096151108 pO年12月28日修正替換百 新設計半導體固態光源模組10，從而使得維修方便，節 省成本。 當然，每一個半導體固態光源18上可設置一個導光板16 ，半導體固態光源模組10之半導體固態光源模塊丨4之數 目、串聯連接之半導體固態光源18之數目可根據實際需 要做適當調整，並不限於本實施例之數目。 如圖4及圖5所示’其為本發明第二實施例提供之半導體 固態光源模組20。該半導體固態光源模組2〇包括三個結 .構相同之半導體固態光源模塊2 4。 _ 每一個半導體固態光源模塊24均包括一個電路板23、三 個5又置於電路板23上之半導體固態光源18和三個導光板 26，每個半導體固態光源18對應一個導光板26。 電路板23之外部形狀與電路板13之外部形狀相同，包括 電源介面231、第一凸起、第二凸起、第一凹槽和第二凹 槽（圖未示）》 每一個半導體固態光源模塊24之三個半導體固態光源18 ^ 並聯連接$置於電路板23上，三個半導體固態光源18之 正極181分別與外部控制單元1〇〇相連，半導體固態光源 18之負極182相連形成連接部183，連接部183與電源介 面231電性相連…外部控制單元1Q{)設置在$個電路板 23的外部，由電源介面231提供電能使其工作。 當外部控制單元100輸出控制訊號時，與該控制訊號相連 之半導體固態光源18χ作，設置於其上之導光⑽呈現 出相應之工作狀態。由於半導體轉光賴為並聯連接 表單編號Α0101 第8頁/共24頁 1003486317-0 1362536 100年.12月28日修正替換頁 關係，故，藉由外部控制單元100輸出之控制訊號，可選 擇性地使任意一個、二個或三個半導體固態光源18工作 [0021] 當然，也可於半導體固態光源模塊24上設置一個導光板 26，即三個半導體固態光源18共用一個導光板26。 [0022] 如圖6及圖7，其為本發明第三實施例提供之半導體固態 光源模組30。該半導體固態光源模組30包括三個結構相 同之半導體固態光源模塊34。 [0023] 每個半導體固態光源模塊34均包括一個電路板33、三個 並聯連接之半導體固態光源18、三個導光板36以及三個 控制晶片38，每個半導體固態光源18對應一個導光板36 〇 [0024] 電路板33之外部形狀與電路板13之外部形狀相同，包括 電源介面331、第一凸起、第二凸起、第一凹槽和第二凹 槽（圖未示）。 [0025] 控制晶片38設置在電路板33上，並由電源介面331提供電 能使其工作。每一個控制晶片38均包括一個訊號輸入端 381和一個訊號輸出端382，訊號輸入端381分別連接一 個外部控制單元100，訊號輸出端382連接半導體固態光 源18之正極181，每一個半導體固態光源模塊34之中之三 個半導體固態光源18之負極182相連形成連接部183，連 接部183與電源介面331電性相連。 [0026] 控制晶片38之輸入端381接收到外部控制單元100輸出之 控制訊號時，輸出端382於控制訊號之控制下輸出工作訊 096151108 表單编號A0101 第9頁/共24頁 1003486317-0 1362536 100年12月28日修正替換頁 號給半導體固態光源18，接收到卫作訊號之半導體固態 光源18於$工作訊號之仙下具有相應之工作狀態；當 有複數個控制訊號輪人給複數個控制 晶片38時’每個控 制曰曰片38均輪出工作訊號，複數個半導體固態光源18於 工作訊號控制下工作於相應之狀態下》因此，該半導體 固@光源模_可只有-個半導體固態光源18工作，也 可同時讓複數個半導體輯光源18工作，該複數個半導 體固態光源18可具有相同或不同之X作狀態。 [0027] 當然’也可於每個半導體固態光源模塊34上設置一個導 光板36或者於半導體固態光源模組3〇上設置一個導光板 獨 36 ° [0028] 如圖8及圖9所示，其為本發明第四實施例提供之半導體 固態光源模組40。該半導體固態光源模組40包括三個半 導體固態光源模塊44。 [0029] 半導體固態光源模塊44包括電路板43、半導體固態光源 18和控制晶片48 ’其與圖7之區別為：每個半導體固態光 源模塊44之三個控制晶片38整合為一個控制晶片48，三 · 個半導體固態光源模塊44共用一値導光板46。 [0030] 電路板43之外部形狀與電路板13之外部形狀相同包括 電源介面43卜第-凸起、第二*起、第一凹槽和第二凹 槽（圖未示）。 控制晶片48設置在電路板43上，並由電路板43的電源介 面431提供電能使其工作。三個半導體固態光源18之正;極 181分別與一個控制晶片48相連，負極182相連形成連接 096151108 表單編號A0101 第10頁/共24頁 1003486317-0 [0031] 1.362536 100年.12月28日梭正替換頁 部183，該三個控制晶片48分別與外部控制單元100相連 。外部控制單元100並不設置在任意一個電路板43上，但 由電源介面431提供電能使其工作。 [0032] 當控制晶片48之一、之二或者之三接收到外部控制單元 10 0輸出之控制訊號時，控制晶片48於該控制訊號之控制 下輸出工作訊號給半導體固態光源18，接收到工作訊號 之半導體固態光源18工作，不同之工作訊號使得半導體 固態光源18具有不同之工作狀態；相同之工作訊號輸出 給不同之半導體固態光源18可使不同之半導體固態光源 18具有相同之工作狀態；不同之工作訊號輸出給接收不 同之半導體固態光源18可使不同之半導體固態光源18具 有不同之工作狀態，從而使得導光板46具有各種各樣之 顯示畫面。 [0033] 當然，也可於每個半導體固態·光源模塊44上設置一個導 光板46，即每個半導體固態光源模塊44對應一個導光板 46，或者每個半導體固態光源18上設置一個導光板46。 [0034] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0035] 圖1係本發明第一實施例半導體固態光源模組之示意圖。 [0036] 圖2係圖1中電路板結構示意圖。 096151108 表單编號A0101 第11頁/共24頁 1003486317-0 1362536 100年12月28日俊正替換頁 [0037] 圖3係圖1中半導體固態光源連接方式之示意圖。 [0038] 圖4係本發明第二實施例半導體固態光源模组之示意圖。 [0039] 圖5係圖4中半導體固態光源連接方式之示意圖。 [0040] 圖6係本發明第三實施例半導體固態光源模組之示意圖。 [0041] 圖7係圖6中半導體固態光源連接方式之示意圖。 [0042] 圖8係本發明第四實施例半導體固態光源模組之示意圖。 [0043] 圖9係圖8中半導體固態光源連接方式之示意圖。 【主要元件符號說明】 [0044] 半導體固 態光源模組： 10， 20 ， 30 ’ 40 [0045] 電路板： 13，23 ，33 ，43 [0046] 半導體固 態光源模塊： 14， 24 ， 34 ’ ,44 [0047] 導光板： 16，26 ，36 ，46 [0048] 半導體固 態光源 ：18 [0049] 控制晶片 :38， 48 [0050] 外部控制單元： 100 [0051] 電源介面 ：131 丨231 ，331 ，431 [0052] 第一 Λ起 ：132 [0053] 第二凸起 ：133 [0054] 第一凹槽 ：134 [0055] 第二凹槽 ：135 表單编號A0101 第12頁/共24頁 096151108 1003486317-0 100年12月28日核正替换頁 1362536 [0056] 正極：181 [0057] 負極：182 [0058] 連接部：183 [0059] 輸入端：381 [0060] 輸出端：382When the external control unit 100 outputs a control signal to the semiconductor solid-state light source module 14, the semiconductor solid-state light source module 14 that receives the control signal operates (lights off or blinks, etc.), and the light guide plate 16 disposed thereon is presented accordingly. Working state; when the external control unit 100 outputs different control signals to the same semiconductor solid-state light source module 14, the semiconductor solid-state light source module 14 exhibits different working states; when the external control unit 100 simultaneously outputs control signals to the three semiconductor solid-state light source modules 14 The three semiconductor solid state light source modules 14 operate in accordance with corresponding control signals. Therefore, the semiconductor solid-state light source module 10 can selectively operate any of the semiconductor solid-state light source modules 14 or different semiconductor solid-state light source modules 14 to have different working states, thereby enabling the semiconductor solid-state light source module 10 to exhibit a dynamic visual display. Since the structure of the semiconductor solid-state light source module 14 has been modularized, the single semiconductor solid-state light source module 14 can perform a display function through the first protrusion 132, the second protrusion 133, the first groove 134, and the second groove 135. The connection allows a plurality of semiconductor solid-state light source modules 14 to be connected to achieve a large area. Since the connection of the bumps and the grooves is connected, the semiconductor solid-state light source module 14 is easy to assemble and disassemble. When a certain semiconductor solid-state light source module 14 is damaged, it only needs to be unplugged from the semiconductor solid-state light source module 10, and replaced with a new semiconductor solid-state light source module 14, which does not require a heavy form number Α0101 Page 7 of 24 [0016] [0020] [0020] [0020] 096151108 On December 28, pO, the replacement of the new design semiconductor solid-state light source module 10 was modified, thereby facilitating maintenance and saving cost. Of course, each of the semiconductor solid-state light sources 18 can be provided with a light guide plate 16, the number of semiconductor solid-state light source modules 丨4 of the semiconductor solid-state light source module 10, and the number of semiconductor solid-state light sources 18 connected in series can be appropriately adjusted according to actual needs, and It is not limited to the number of the embodiment. As shown in FIG. 4 and FIG. 5, it is a semiconductor solid-state light source module 20 according to a second embodiment of the present invention. The semiconductor solid-state light source module 2 includes three semiconductor solid-state light source modules 24 having the same structure. Each of the semiconductor solid state light source modules 24 includes a circuit board 23, three semiconductor solid state light sources 18 placed on the circuit board 23, and three light guide plates 26, one for each of the semiconductor solid state light sources 18. The outer shape of the circuit board 23 is the same as the outer shape of the circuit board 13, and includes a power supply interface 231, a first protrusion, a second protrusion, a first groove, and a second groove (not shown). The three semiconductor solid-state light sources 18 of the module 24 are placed in parallel on the circuit board 23, and the positive electrodes 181 of the three semiconductor solid-state light sources 18 are respectively connected to the external control unit 1A, and the negative electrodes 182 of the semiconductor solid-state light source 18 are connected to form a connection portion. 183. The connecting portion 183 is electrically connected to the power interface 231. The external control unit 1Q{) is disposed outside the circuit board 23, and the power supply interface 231 supplies power to operate. When the external control unit 100 outputs the control signal, the semiconductor solid-state light source 18 connected to the control signal is turned on, and the light guide (10) disposed thereon exhibits a corresponding operational state. Since the semiconductor light-converting is connected in parallel, the form number is Α0101. Page 8/24 pages 1003486317-0 1362536 100. On December 28, the replacement page relationship is corrected. Therefore, the control signal outputted by the external control unit 100 can be selectively selected. Any one, two or three semiconductor solid-state light sources 18 are operated [0021] Of course, a light guide plate 26 may be disposed on the semiconductor solid-state light source module 24, that is, three semiconductor solid-state light sources 18 share one light guide plate 26. 6 and FIG. 7, a semiconductor solid-state light source module 30 according to a third embodiment of the present invention. The semiconductor solid state light source module 30 includes three semiconductor solid state light source modules 34 of identical construction. Each semiconductor solid-state light source module 34 includes a circuit board 33, three semiconductor solid-state light sources 18 connected in parallel, three light guide plates 36, and three control wafers 38, each of which corresponds to a light guide plate 36. [0024] The outer shape of the circuit board 33 is the same as the outer shape of the circuit board 13, and includes a power supply interface 331, a first protrusion, a second protrusion, a first groove, and a second groove (not shown). [0025] Control wafer 38 is disposed on circuit board 33 and is powered by power supply interface 331 to operate. Each of the control chips 38 includes a signal input terminal 381 and a signal output terminal 382. The signal input terminal 381 is respectively connected to an external control unit 100. The signal output terminal 382 is connected to the positive electrode 181 of the semiconductor solid-state light source 18, and each semiconductor solid-state light source module. The negative electrodes 182 of the three semiconductor solid-state light sources 18 are connected to form a connecting portion 183, and the connecting portion 183 is electrically connected to the power supply interface 331. When the input terminal 381 of the control chip 38 receives the control signal output by the external control unit 100, the output terminal 382 outputs the operation signal under the control of the control signal. 096151108 Form No. A0101 Page 9 / Total 24 Page 1003486317-0 1362536 On December 28, 100, the replacement page number was corrected for the semiconductor solid-state light source 18. The semiconductor solid-state light source 18 receiving the satellite signal has a corresponding working state under the work signal; when there are multiple control signals, the number of people is given to the plurality of control signals. When controlling the chip 38, 'each control chip 38 rotates the working signal, and the plurality of semiconductor solid-state light sources 18 operate under the control of the working signal. Therefore, the semiconductor solid-state mode can have only one semiconductor. The solid state light source 18 operates, and at the same time, a plurality of semiconductor series light sources 18 can be operated. The plurality of semiconductor solid state light sources 18 can have the same or different X states. [0027] Of course, a light guide plate 36 may be disposed on each of the semiconductor solid-state light source modules 34 or a light guide plate may be disposed on the semiconductor solid-state light source module 3A. [0028] As shown in FIGS. 8 and 9, It is a semiconductor solid-state light source module 40 provided by the fourth embodiment of the present invention. The semiconductor solid state light source module 40 includes three semiconductor solid state light source modules 44. [0029] The semiconductor solid state light source module 44 includes a circuit board 43, a semiconductor solid state light source 18, and a control wafer 48' which differs from FIG. 7 in that three control wafers 38 of each semiconductor solid state light source module 44 are integrated into one control wafer 48, The three semiconductor solid state light source modules 44 share a single light guide plate 46. The outer shape of the circuit board 43 is the same as the outer shape of the circuit board 13. The power supply interface 43 includes a first projection, a second projection, a first recess, and a second recess (not shown). Control chip 48 is disposed on circuit board 43 and is powered by power supply interface 431 of circuit board 43 for operation. The three semiconductor solid-state light sources 18 are positive; the poles 181 are respectively connected to a control wafer 48, and the negative electrodes 182 are connected to form a connection 096151108. Form No. A0101 Page 10 / Total 24 pages 1003486317-0 [0031] 1.362536 100 years. December 28th shuttle The page portion 183 is being replaced, and the three control wafers 48 are respectively connected to the external control unit 100. The external control unit 100 is not disposed on any one of the boards 43, but is powered by the power supply interface 431 to operate. [0032] When one, two or three of the control wafers 48 receive the control signal output by the external control unit 10, the control chip 48 outputs a working signal to the semiconductor solid-state light source 18 under the control of the control signal to receive the work. The semiconductor solid-state light source 18 of the signal operates, and the different working signals cause the semiconductor solid-state light source 18 to have different operating states; the same working signal is output to the different semiconductor solid-state light sources 18 to enable the different semiconductor solid-state light sources 18 to have the same working state; The output of the working signal to the receiving semiconductor solid state light source 18 allows the different semiconductor solid state light sources 18 to have different operating states, thereby providing the light guide panel 46 with a variety of display screens. [0033] Of course, one light guide plate 46 may be disposed on each semiconductor solid-state light source module 44, that is, each semiconductor solid-state light source module 44 corresponds to one light guide plate 46, or one light guide plate 46 is disposed on each semiconductor solid-state light source 18. . [0034] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0035] FIG. 1 is a schematic view showing a semiconductor solid-state light source module according to a first embodiment of the present invention. 2 is a schematic structural view of a circuit board in FIG. 1. 096151108 Form No. A0101 Page 11 of 24 1003486317-0 1362536 December 28th, 100th Edition Replacement Page [0037] FIG. 3 is a schematic diagram of the connection mode of the semiconductor solid-state light source of FIG. 4 is a schematic diagram of a semiconductor solid-state light source module according to a second embodiment of the present invention. 5 is a schematic diagram of a connection mode of a semiconductor solid-state light source in FIG. 4. 6 is a schematic diagram of a semiconductor solid-state light source module according to a third embodiment of the present invention. 7 is a schematic diagram showing a connection manner of a semiconductor solid-state light source in FIG. 6. 8 is a schematic view of a semiconductor solid-state light source module according to a fourth embodiment of the present invention. 9 is a schematic diagram of a connection mode of a semiconductor solid-state light source in FIG. 8. [Main component symbol description] [0044] Semiconductor solid-state light source module: 10, 20, 30 '40 [0045] Circuit board: 13,23,33,43 [0046] Semiconductor solid-state light source module: 14, 24, 34 ' 44 [0047] Light guide plate: 16, 26, 36, 46 [0048] Semiconductor solid state light source: 18 [0049] Control wafer: 38, 48 [0050] External control unit: 100 [0051] Power interface: 131 丨231,331 431 [0052] First pick up: 132 [0053] Second bump: 133 [0054] First groove: 134 [0055] Second groove: 135 Form No. A0101 Page 12 of 24 096151108 1003486317-0 December 28, 100 nuclear replacement page 1362536 [0056] Positive electrode: 181 [0057] Negative electrode: 182 [0058] Connection: 183 [0059] Input: 381 [0060] Output: 382
秦 096151108 表單編號A0101 第13頁/共24頁 1003486317-0Qin 096151108 Form No. A0101 Page 13 of 24 1003486317-0