TWI360666B

TWI360666B -

Info

Publication number: TWI360666B
Application number: TW96143213A
Authority: TW
Original assignee: Bright Led Electronics Corp
Priority date: 2007-11-15
Filing date: 2007-11-15
Publication date: 2012-03-21
Also published as: TW200921148A

Description

1360666 九、發明說明：【發明所屬之技術領域】本發明是有關於一種透鏡及具有該透鏡的光源裝置，特別是指一種可使發光二極體發出的光線在一出光面之光強度分佈均勻的透鏡以及具有該透鏡的光源裝置。【先前技術】習知的直下式背光模組是以冷陰極螢光燈（c〇ld1360666 IX. Description of the Invention: [Technical Field] The present invention relates to a lens and a light source device having the same, and more particularly to a light intensity distribution of a light emitted from a light emitting diode on a light exiting surface a lens and a light source device having the lens. [Prior Art] A conventional direct type backlight module is a cold cathode fluorescent lamp (c〇ld)

CathodeCathode

Fluorescent Lamp，CCFL)作為光源，然而，由於冷陰極螢光燈需佔據較多體積、較為耗電且含有水銀而不環保，所以改以體積小、發光效率高且壽命長的發光二極體作為光源已成為趨勢。但疋，因為發光二極體發光時如同一點光源參閱圖工，也就是在與出光面之法線夾〇度的方向上的光強度最大，愈偏離法線的方向上的光強度遞減，因此，在出光面上會明顯看到一光點而無法提供光強度分佈均勻的照明。【發明内容】本發明之目的，是在提供一種可使發光半導體元件發出的光線在一出光面之光強度分佈均勻的透鏡。本發明之另一目的，是在提供一種在一出光面的光強度分佈均勻之具有透鏡的光源裝置。於是，本發明透鏡用於接收一發光半導體元件所發出的光線，該透鏡包含一底面、一頂面，以及一侧面。底面面對該發光半導體元件以接收光線。頂面相反於該底面，該頂面包括一使穿過該底面且入射該頂面的部分Fluorescent Lamp (CCFL) is used as a light source. However, since the cold cathode fluorescent lamp needs to occupy a large volume, consumes a large amount of electricity, and contains mercury, it is not environmentally friendly, so it is replaced by a light-emitting diode having a small volume, high luminous efficiency, and long life. Light sources have become a trend. But, er, because the light-emitting diode emits light as a point of light source, that is, the light intensity in the direction of the normality with the normal of the light-emitting surface is the largest, and the light intensity in the direction deviating from the normal is decreasing. A spot of light is clearly visible on the illuminating surface and it is impossible to provide illumination with uniform light intensity distribution. SUMMARY OF THE INVENTION An object of the present invention is to provide a lens which can make a light intensity distribution of a light emitted from a light-emitting semiconductor element uniform on a light-emitting surface. Another object of the present invention is to provide a light source device having a lens having a uniform light intensity distribution on a light exiting surface. Thus, the lens of the present invention is for receiving light emitted by a light-emitting semiconductor element, the lens comprising a bottom surface, a top surface, and a side surface. The bottom surface faces the light emitting semiconductor element to receive light. The top surface is opposite to the bottom surface, and the top surface includes a portion that passes through the bottom surface and is incident on the top surface

5 1360666 光線偏折而不朝該頂面之正上方行進的不平整表面結構。側面由該頂面周緣往該底面周緣延伸，則穿過該底面且入射該側面的光線射出該透鏡；該透鏡外形由該頂面及該側面交界處往該底面方向逐漸增大，且該透鏡上部戴面的投影是落在該透鏡下部截面的範圍内。於是’本發明具有透鏡的光源裝置包含一基座、一發光半導體元件，以及一透鏡ό5 1360666 An uneven surface structure in which the light deflects without moving directly above the top surface. The side surface extends from the periphery of the top surface to the periphery of the bottom surface, and the light passing through the bottom surface and incident on the side surface emits the lens; the lens shape is gradually increased from the boundary between the top surface and the side surface toward the bottom surface, and the lens The projection of the upper wear surface falls within the range of the lower cross section of the lens. Thus, the light source device having the lens of the present invention comprises a susceptor, a light-emitting semiconductor component, and a lens ό

發光半導體元件設於該基座上。透鏡設於該基座上，用於接收該發光半導體元件所發出的光線，該透鏡包含一底面 '一頂面，以及一側面。底面面對該發光半導體元件以接收光線。頂面相反於該底面，該頂面包括一使穿過該底面且入射該頂面的部分光線偏折而不帛該頂面之正上方行進的不平整表面結構。側面由該頂面周緣往該底面周緣延伸，則穿過該底面且入射該側面的光線射出該透鏡；該透鏡外形由該頂面及該側A light emitting semiconductor element is disposed on the susceptor. The lens is disposed on the base for receiving light emitted by the light emitting semiconductor component, the lens comprising a bottom surface and a top surface. The bottom surface faces the light emitting semiconductor element to receive light. The top surface is opposite the bottom surface, and the top surface includes an uneven surface structure that deflects a portion of the light passing through the bottom surface and incident on the top surface without traveling directly above the top surface. The side surface extends from the periphery of the top surface to the periphery of the bottom surface, and light passing through the bottom surface and incident on the side surface exits the lens; the lens shape is defined by the top surface and the side

=界處往該底面方向逐漸增大，且該透鏡上部截面的投影是落在該透鏡下部截面的範圍内。 :發明的一個較佳實施例中，透鏡的頂面包括多數個續=:整表面結構的凸面段，該等凸面段呈階梯狀連軸於，列成同心圓；而且’定義一通過該透鏡的中心概呈 /轴的縱向斷面中，該頂面可為凹陷的碗形等等/D 1的弧形、似開σ狀或底部呈尖錐狀透鏡的底面與出光面平本發明的一個較佳實施例申本發明之功效在於透鏡的頂自包括一不平整表面結構 ’則當發光半導體元件發出的光線穿過底面且入射頂面時，部分光線被不平整表面結構偏折而不朝頂面之正上方行進’所以’在與出光面之法線夾〇度的方向上的光強度會降低而非最大’使在大角度之出光方向上的光強度增加，因此，在出光面上可獲得光強度分佈均勻的光場。【實施方式】有關本發明之前述及其他技術内容、特點與功效，在以下配合參考圖式之一個較佳實施例的詳細說明令將可清楚的呈現。參閱圖2、圖3及圖4，本發明的較佳實施例揭示一個具有透鏡4的光源裝置2〇〇，該光源裝置2〇〇包含一基座2 、一發光半導體元件3，以及一透鏡4。定義一垂直通過透鏡的中〜軸19，發光半導體元件3與透鏡4皆對稱或接近對稱於中心軸19。基座2為一般習知的封裝發光半導體元件所用的基座，可以是塑膠包覆金屬支架、直立式支架、平面式支架或疋食人魚支架，當然不以此為限。發光半導體元件3設於土座2上，並經固晶打線封裝，由於此為在此技術領域具有通常知識者所知悉之技術，故不贅述。在本實施例中，發光半導體元件3為發光二極體（led)。透鏡4亦設於基座2上且封閉發光半導體元件3，用於接收發光半導體元件3所發出的光線，透鏡4可為一般透光的熱塑型尚分子材料射出成型，例如：$甲基丙烯酸甲曰（PMMA)、$ &酸|旨（pC)，4為可透光的_型塑谬灌膠而成，例如：環氧樹脂（epoxy)或矽膠（siHc〇ne)等也可以疋透光的破璃以模具成型；折射率介於12〜18尤佳。透鏡4包含一底面41、一頂面42，以及一側面&底面41與基座2頂面接觸且面對發光半導體元件3以接收光線。頂面42相反於底面4卜並包括多數個形成一不平整表面結構421的凸面段422’該等凸面段422呈階梯狀連續延伸且排列成同心圓。側面43由頂面42周緣往底面41周緣延伸而為-曲面，透鏡4外形由頂面42及側面43交界處往底面41方向逐漸增大，亦即側面43到中心軸19的距離是由上而下漸增，且魏4上部截面的投影是落在透鏡4 下部截面的範圍内。頂面42概呈—越趨中央越往下凹陷的凹陷面。在本實施例中，於該透鏡4沿該中心軸19的縱向斷面中，該頂面42凹陷概呈ν形，但實際上並不以此為限，在其他的實施態樣中，如圖12所示，在沿中心軸19的縱向斷面中，頂面42’也可以是凹陷概呈開口朝上的弧形，或如圖13所示，頂面42”也可以凹陷概呈喇叭開口狀，或如圖14所不，頂面42”，也可以凹陷概呈底部呈尖錐狀的碗形。本實施例中，中心軸19通過ν形凹陷的中央，且底面 41平打於一由頂面42周緣所形成的出光面423,出光面 423垂直於中心軸19。本實施例透鏡4的具體尺寸如下所述，但並不以此為限’透鏡4的底面41與出光面423平行，且頂、底面42、均為圓形，了頁面42周緣的直徑D2等於3〇4贿底面，的直LD1等於4.97mm，透鏡4的高度Η等於i.5mm 面43為半技等於i %咖之球面的一部份凸面段 22之上下端間的距離M等於⑽随，凸面段似之兩相鄰上端間的距離等於…。呈V字型面之頂面42的其中一斜面與水平的出光面423間之夹角A可以等於例如3·79度 ,7·49度、U.16度等任意角度。但上述之透鏡4的尺寸（直徑、高度、凸面段422之上下端間的距離、…）並不以此為限’畲改變透鏡4的規格時，可依需求改變光強度分佈的均勻度；或是當基座2或發光半導體元件3的尺寸改變時抑或選用的發光半導體元件3不同時，可依據本發明對透鏡4的尺寸做調整以得到肖勾的光強度分佈。 /當發光半導體元件3發出的光線穿過透鏡4的底面41 後，部分光線人射透鏡4的頂面42，另—部分的光線則入射透鏡4的側面43而射出透鏡4 ;目為頂面42有不平整的表面結構42卜所以人射頂面42的光線_有—部分會被偏折而不朝頂面42之正上方行進，因此，參閱圖2及圖5，在與令心轴19平行的方向上（亦即與出光面423的法線之夾角0等於G度的方向上）的光強度會變小，光強度會隨著出光方向與法線之夾角Θ的增加而增加，一直到出光角度（夾角Θ)大約等於正、負45度時的光強度才是最大然後光強度便隨著出光角度（夾角的增加而遞減。參閱圖6,當改由極座標圖來看光強度分佈時，就可看出在出光面423上的光強度分佈是大致均勻的。在本實施例中，出光角度（夾 y)大約等於正、負45度時的光強度最大，但並不以此為〜在下文中’參閱圖2、圖7及圖8,並依據前述的構件來說明本實施例具有透鏡4的光源裝置綱的製造方法。首先進行步驟6卜將發光半導體元件3安裝至基座2 上，其中包括固晶打線等動作。接著進行步驟62,提供—模具7，模具7包含_心面不平整的頂壁71、-自頂壁71周緣傾斜向下延伸的側壁 72 ’以及一由頂壁71與侧壁72共同界定出的模穴73，模穴73上部截面的投影是落在模穴73下部截面的範圍内（在圖8中為倒置），亦即模穴73的形狀是對應上述透鏡*的外形。然後進行步驟63，將可透光的膠狀物質灌注至模穴73 内’其中’踢狀物質可為熱固型樹脂（epc)xy或siliec>ne)等，但並不以此為限。再進行^驟64，將基座2連同發光半導體元件3置於模具7上而對位，也就是說，將基座2倒置使發光半導體元件3浸入膠狀物質中。之後進行步驟65，烘烤使可透光膠狀物質固化。最後是步驟66 ’脫模，將已固化的膠狀物質脫離模具 7,其中，固化的膠狀物質即形成上述之外形上小下大的透鏡4’且由於透鏡4外形為上小下大’故脫模容易。特別注意步驟63及步驟μ，上述步驟雖是先灌勝而後再對位，但熟習該項技藝者當知，亦可為先對位後，再灌 1360666 膠’不應以此為限，且步驟64中模具7與基座2的關係亦不限於如圖8所示之倒置，也就是說，亦可使模具7在上而基座2在下。需注意的是，上述具有透鏡4的光源裝置扇的製造方法除了利用模具7達成外，也可不利用模具7完成盆說明如下： ^ 參閱圖9及圖1G，首先進行步驟81，置備—透鏡套蓋The boundary is gradually increased toward the bottom surface, and the projection of the upper cross section of the lens falls within the range of the lower cross section of the lens. In a preferred embodiment of the invention, the top surface of the lens comprises a plurality of convex sections of a continuous surface structure, the convex sections are stepped coaxially arranged in a concentric circle; and 'defining a lens through the lens In the longitudinal section of the central outline/axis, the top surface may be a concave bowl shape or the like, a curved shape of D1, a bottom surface like a sigma-like shape, or a bottom-pointed tapered lens and a light-emitting surface. A preferred embodiment of the invention has the effect that the top of the lens comprises an uneven surface structure. When the light emitted by the light-emitting semiconductor element passes through the bottom surface and enters the top surface, part of the light is deflected by the uneven surface structure. Moving toward the top of the top surface, 'the light intensity in the direction of the normal angle with the normal of the light-emitting surface is reduced rather than the maximum', so that the light intensity in the direction of the light exiting the large angle is increased, and therefore, on the light-emitting surface A light field with a uniform light intensity distribution can be obtained. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Referring to FIG. 2, FIG. 3 and FIG. 4, a preferred embodiment of the present invention discloses a light source device 2A having a lens 4, which includes a susceptor 2, a light emitting semiconductor component 3, and a lens. 4. The center-axis 19, which is vertically passed through the lens, defines that the light-emitting semiconductor element 3 and the lens 4 are symmetric or nearly symmetrical with respect to the central axis 19. The susceptor 2 is a pedestal used for packaging a light-emitting semiconductor component, and may be a plastic-clad metal bracket, an upright bracket, a flat bracket or a piranha bracket. The light-emitting semiconductor element 3 is provided on the earth base 2 and is encapsulated by a die-bonding wire. Since it is a technique known to those skilled in the art, it will not be described. In the present embodiment, the light emitting semiconductor element 3 is a light emitting diode (LED). The lens 4 is also disposed on the susceptor 2 and encloses the illuminating semiconductor component 3 for receiving light emitted by the illuminating semiconductor component 3. The lens 4 can be injection molded of a generally transparent thermoplastic material such as: Acrylic acid (PMMA), $ & acid | (pC), 4 is a light-transmissive _ type plastic enamel glue, such as: epoxy or silicone (siHc〇ne) can also The light-transparent glass is molded by a mold; the refractive index is preferably between 12 and 18. The lens 4 includes a bottom surface 41, a top surface 42, and a side surface & bottom surface 41 which is in contact with the top surface of the susceptor 2 and faces the light-emitting semiconductor element 3 to receive light. The top surface 42 is opposite to the bottom surface 4b and includes a plurality of convex sections 422' which form an uneven surface structure 421 which are continuously extended in a stepped manner and arranged in concentric circles. The side surface 43 extends from the periphery of the top surface 42 toward the periphery of the bottom surface 41 to form a curved surface. The outer shape of the lens 4 gradually increases from the boundary between the top surface 42 and the side surface 43 toward the bottom surface 41, that is, the distance from the side surface 43 to the central axis 19 is The bottom is gradually increased, and the projection of the upper section of the Wei 4 falls within the range of the lower section of the lens 4. The top surface 42 is generally a concave surface that is recessed toward the center. In the present embodiment, in the longitudinal section of the lens 4 along the central axis 19, the top surface 42 is recessed in a v shape, but is not limited thereto. In other embodiments, such as As shown in Fig. 12, in the longitudinal section along the central axis 19, the top surface 42' may also be an arc having a recessed opening upwardly, or as shown in Fig. 13, the top surface 42" may also be recessed into a horn. The opening shape, or as shown in Fig. 14, the top surface 42" may also be recessed to form a bowl shape having a tapered shape at the bottom. In this embodiment, the central shaft 19 passes through the center of the ν-shaped recess, and the bottom surface 41 is flushed with a light-emitting surface 423 formed by the periphery of the top surface 42, and the light-emitting surface 423 is perpendicular to the central axis 19. The specific dimensions of the lens 4 of this embodiment are as follows, but not limited thereto, the bottom surface 41 of the lens 4 is parallel to the light exit surface 423, and the top and bottom surfaces 42 are all circular, and the diameter D2 of the periphery of the page 42 is equal to 3〇4 The bottom of the bribe, the straight LD1 is equal to 4.97mm, the height Η of the lens 4 is equal to i.5mm. The surface 43 is half the distance between the lower end of the convex section 22 of the spherical surface of i% coffee, which is equal to (10) The distance between two adjacent upper ends of the convex section is equal to... The angle A between one of the inclined surfaces of the top surface 42 of the V-shaped surface and the horizontal light-emitting surface 423 may be equal to any angle such as 3·79 degrees, 7.49 degrees, U.16 degrees, or the like. However, the size (diameter, height, distance between the lower ends of the convex section 422, ...) of the above-mentioned lens 4 is not limited thereto. When the size of the lens 4 is changed, the uniformity of the light intensity distribution can be changed as required; Alternatively, when the size of the susceptor 2 or the light-emitting semiconductor element 3 is changed or the selected light-emitting semiconductor element 3 is different, the size of the lens 4 can be adjusted in accordance with the present invention to obtain a light intensity distribution of the ridge. / After the light emitted from the light-emitting semiconductor element 3 passes through the bottom surface 41 of the lens 4, part of the light is incident on the top surface 42 of the lens 4, and the other part of the light is incident on the side surface 43 of the lens 4 to exit the lens 4; 42 has an uneven surface structure 42. Therefore, the light _ _ portion of the human top surface 42 is deflected and does not travel directly above the top surface 42. Therefore, referring to FIG. 2 and FIG. The light intensity in the direction parallel to 19 (that is, the angle 0 with the normal to the light-emitting surface 423 is equal to the G-degree) becomes smaller, and the light intensity increases as the angle 出 between the light-emitting direction and the normal increases. The light intensity is maximum until the angle of incidence (angle Θ) is approximately equal to positive and negative 45 degrees, and then the light intensity decreases with the angle of light extraction (the angle increases. See Figure 6, when the light intensity is changed from the polar plot) When distributed, it can be seen that the light intensity distribution on the light exit surface 423 is substantially uniform. In the present embodiment, the light exit angle (clamp y) is approximately equal to positive and negative 45 degrees, and the light intensity is maximum, but not This is ~ in the following 'see Figure 2, Figure 7 and Figure 8, and according to the former The components are used to describe the manufacturing method of the light source device having the lens 4. The first step is to mount the light-emitting semiconductor component 3 on the susceptor 2, including the action of solid-crystal bonding, etc. Next, proceed to step 62, providing - The mold 7, the mold 7 includes a top wall 71 having a non-flat surface, a side wall 72' extending obliquely downward from the periphery of the top wall 71, and a cavity 73 defined by the top wall 71 and the side wall 72, the cavity The projection of the upper section of 73 is within the range of the lower section of the cavity 73 (inverted in Fig. 8), that is, the shape of the cavity 73 corresponds to the shape of the lens *. Then, step 63 is performed to transmit light. The gelatinous substance is poured into the cavity 73, wherein the kicking substance may be a thermosetting resin (epc) xy or siliec>ne), etc., but is not limited thereto. Further, step 64 is performed to position the susceptor 2 together with the light-emitting semiconductor element 3 on the mold 7, i.e., the susceptor 2 is inverted to immerse the light-emitting semiconductor element 3 in the gel-like substance. Then, in step 65, baking is performed to cure the light transmissive gelatinous substance. Finally, in step 66, the mold is released, and the solidified gelatinous substance is released from the mold 7, wherein the solidified gel-like substance forms the lens 4' which is smaller in size and larger in size, and since the shape of the lens 4 is upper and lower. Therefore, demoulding is easy. Pay special attention to step 63 and step μ. Although the above steps are first filled and then re-aligned, but those skilled in the art know that it can be used after the first alignment, and then 1360666 glue should not be limited to this, and The relationship between the mold 7 and the susceptor 2 in step 64 is also not limited to the reverse as shown in Fig. 8, that is, the mold 7 may be placed above and the susceptor 2 may be lowered. It should be noted that the method for manufacturing the light source device fan having the lens 4 described above can be completed without using the mold 7. The description of the pot can be completed without using the mold 7. As follows: Referring to FIG. 9 and FIG. 1G, step 81 is first performed, and the lens cover is provided. cover

5’透鏡套蓋5包含一外壁面不平整的頂壁51、一自頂壁 51周緣傾斜向下延伸的㈣52，以及_由頂壁51與側壁 52共同界定出的容室53,容室53上部截面的投影是落在容室53下部截面的範圍内’亦即透鏡套蓋5的外形是對應上述透鏡4的外形。接著進行步驟82,置備發光半導體元件3及基座2, 其中，發料導體元件3是經固晶打線在基座2上。The 5' lens cover 5 includes a top wall 51 whose outer wall surface is uneven, a (four) 52 which extends obliquely downward from the periphery of the top wall 51, and a chamber 53 which is defined by the top wall 51 and the side wall 52, and the chamber 53 The projection of the upper cross section falls within the range of the lower cross section of the chamber 53. That is, the outer shape of the lens cover 5 corresponds to the outer shape of the lens 4. Next, in step 82, the light-emitting semiconductor element 3 and the susceptor 2 are provided, wherein the discharge conductor element 3 is bonded to the susceptor 2 via a die bond.

然後進行步驟83，將基座2與透鏡套蓋5對位接合，使得發光半導體元件3位於透鏡透蓋5下方，也就是發光半導體元件3位於透鏡套蓋5與基座2間。再進行步驟84,灌注可透光膠狀物質至透鏡套蓋5的容室53内。最後進行步驟85，烘烤使可透光膠狀物質固化。卜本發明更知供先行完成透鏡4製作然後再與發光半導體7G件3及基座2組合的具有透鏡4的光源裝置2〇〇的製造方法。參閱圖11，首先進行步驟91，置備如上述具上小下大 11Then, step 83 is performed to align the susceptor 2 with the lens cover 5 such that the light-emitting semiconductor component 3 is positioned below the lens permeable cover 5, that is, the light-emitting semiconductor component 3 is located between the lens cover 5 and the susceptor 2. Step 84 is further performed to infiltrate the light transmissive gelatinous substance into the chamber 53 of the lens cover 5. Finally, in step 85, baking is performed to cure the light transmissive gelatinous substance. Further, the present invention further relates to a method of manufacturing a light source device 2A having a lens 4 which is formed by completing the lens 4 and then combining it with the light-emitting semiconductor 7G member 3 and the susceptor 2. Referring to Figure 11, first step 91 is performed, and the provision is as described above.

< S 1360666 外形的實心透鏡4,透鏡4的材質可為透光的熱塑性高分子材科、熱固型塑膠或玻璃，但並不以此為限。接著進行步驟92,置備一發光半導體元件3及一基座 2 ’其中’發光半導體元件3是經固晶打線而較於基座2 上。然後進行步驟93 ’將基座2頂面與透鏡4的底面41對仅接合’使得發光半導體元件3位於透鏡4下方也就是發光半導體it件3位於透鏡4與基座2間，透鏡4與基座2 間可用膠黏合以固定。此方法與别述方法不同之處在於，前述方法是置備中空的透鏡套蓋5使用’而此方法則是使用實心的透鏡4。歸納上述，本發明透鏡4及具有該透鏡4的光源裝置〇藉由使透鏡4的頂面42形成一不平整表面結構42 J，例如形成多數個呈階梯狀連續延伸且排列成同心圓的凸面奴422，則备發光半導體元件3發出的光線入射頂面時，會有部分光線被不平整表面結構421偏折而不朝頂面42 的正上方行進；所以，在與出光自423的法線之夾角0等於〇度的方向上的光強度會降低’使得在出光角度（夾角0) 大約等於正、負45度時的光強度增加為最大，因此，在出光面423上可獲得光強度分佈均勻的光場以提供均勻的照明，故破實能達成本發明的目的。惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 12 1360666 屬本發明專利涵蓋之範圍内。【圖式簡單說明】圖1是一光強度的極座標圖，說明習知發光二極體發光時如同一點光源；圖2是一側視剖面圖，說明本發明透鏡及具有該透鏡的光源裝置之較佳實施例；圖3是一俯視圖，說明該較佳實施例的透鏡；圖4是一示意圖，說明該較佳實施例的透鏡之凸面段圖5是一光強度的直角座標圖，說明該較佳實施例的射出透鏡之光線在各出光方向上的光強度；圖6是一光強度的極座標圖，說明該較佳實施例的射出透鏡之光線在出光面上的光強度分佈大致均勻；圖7是一流程圖，說明該較佳實施例的製造方法；圖8是-示意圖，說明該較佳實施例的製造方法之模具；圖9疋一流程圖，說明該較佳實施例的另一製造方法，圖10疋一侧視剖面圖，說明該較佳實施例的製造方法之透鏡套蓋；圖11疋一流程圖，說明該較佳實施例的又一製造方法 f 0 疋不思圖’說明該較佳實施例的頂面凹陷呈開口朝上之弧形的輪廓態樣； 13 1360666 圖13是一示意圖，說明該較佳實施例的頂面凹陷呈喇口八開口狀之輪廓態樣；及圖14是一示意圖，說明該較佳實施例的頂面凹陷呈底部呈尖錐狀之碗形的輪廓態樣。 14 1360666 【主要元件符號說明】 19.........中心軸 200 .......光源裝置 2 ..........基座 3 ..........發光半導體元件 4 ..........透鏡 41 .........底面 42 .........頂面< S 1360666 The shape of the solid lens 4, the material of the lens 4 can be a light-transmissive thermoplastic polymer, thermosetting plastic or glass, but not limited thereto. Next, in step 92, a light-emitting semiconductor device 3 and a susceptor 2' are disposed, wherein the light-emitting semiconductor device 3 is bonded to the susceptor 2 via a die bond. Then proceeding to step 93 'the top surface of the susceptor 2 and the bottom surface 41 of the lens 4 are only joined' such that the illuminating semiconductor element 3 is located below the lens 4, that is, the illuminating semiconductor element 3 is located between the lens 4 and the susceptor 2, and the lens 4 and the base The seat 2 can be glued to fix it. This method differs from the other methods in that the aforementioned method is to provide a lens cover 5 for use in the hollow, and this method uses a solid lens 4. In summary, the lens 4 of the present invention and the light source device having the lens 4 form an uneven surface structure 42 J by forming the top surface 42 of the lens 4, for example, forming a plurality of convex surfaces extending in a stepwise manner and arranged in concentric circles. In the slave 422, when the light emitted from the light-emitting semiconductor element 3 enters the top surface, part of the light is deflected by the uneven surface structure 421 and does not travel directly above the top surface 42; therefore, the normal line from the light exiting from 423 The light intensity in the direction where the angle 0 is equal to the twist is lowered, so that the light intensity increases when the light exit angle (the angle 0) is approximately equal to the positive and negative 45 degrees, so that the light intensity distribution is obtained on the light exit surface 423. A uniform light field provides uniform illumination, so that the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All still 12 1360666 is within the scope of the patent of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a polar plot of light intensity, illustrating a conventional light-emitting diode as a light source when illuminated; FIG. 2 is a side cross-sectional view showing the lens of the present invention and a light source device having the same 3 is a top view showing the lens of the preferred embodiment; FIG. 4 is a schematic view showing the convex section of the lens of the preferred embodiment. FIG. 5 is a right angle coordinate diagram of light intensity, illustrating The light intensity of the light exiting the lens in each light-emitting direction of the preferred embodiment; FIG. 6 is a polar plot of the light intensity, illustrating that the light intensity distribution of the light exiting the lens of the preferred embodiment is substantially uniform on the light-emitting surface; Figure 7 is a flow chart illustrating the manufacturing method of the preferred embodiment; Figure 8 is a schematic view showing the mold of the manufacturing method of the preferred embodiment; Figure 9 is a flow chart showing another embodiment of the preferred embodiment FIG. 10 is a side elevational cross-sectional view showing the lens cover of the manufacturing method of the preferred embodiment; FIG. 11 is a flow chart showing another manufacturing method of the preferred embodiment f 0 Figure ' It is to be noted that the top surface depression of the preferred embodiment has an arc-shaped outline with an opening upward; 13 1360666 FIG. 13 is a schematic view showing the top surface of the preferred embodiment having a concave shape and an open shape. And FIG. 14 is a schematic view showing the top surface of the preferred embodiment having a bowl-shaped outline with a tapered shape at the bottom. 14 1360666 [Description of main component symbols] 19.........central axis 200 .......light source device 2 .......... pedestal 3 ...... ...light emitting semiconductor component 4 .......... lens 41 ... ... bottom surface 42 ... ... top surface

53.........容室 61〜66 —步驟 7 ..........模具 71 .........頂壁 72 .........側壁 73 .........模穴 81〜85·…步驟 91〜93.…步驟 A..........夾角 D1 ........直徑 D2........直徑 Η..........高度 42,、42，，、43，’， ............頂Φ 421 .......不平整表面結構 422 .......凸面段 423 .......出光面 43.........{則面 hi.........距離 5 ..........透鏡套蓋 Θ 夾角 51 .........頂壁53.........room 61~66 - step 7 ..... mold 71 ......... top wall 72 ........ Side wall 73 ......... cavity 81~85·...Steps 91~93....Step A..........Angle angle D1 ........ Diameter D2. .......diameter Η..........height 42, 42, 42, 43,, ', ............ top Φ 421 .... ...uneven surface structure 422 ....... convex section 423 .......light surface 43.........{face hi... Distance 5 ..........Lens cover 夹 Angle 51 ......... top wall

52 .........侧壁 1552 ......... sidewall 15

Claims

1360666 第〇96143213號專利申請案說明書替換頁（修正日期：100 9)1360666 Replacement page of patent application No. 96132213 (Revised: 100 9)

年 0 0·9.二替換頁 -出線—，- 、申請專利範圍：一種透鏡，用於接收一發光半導體元件該透鏡包含：一底面，面對該發光半導體元件以接收光線；一頂面，相反於該底面’該頂面包括一使穿過該底面且入射該頂面的部分光線偏折而不朝該頂面之正上方行進的不平整表面結構；及一側面，由該頂面周緣往該底面周緣延伸，則穿過該底面且入射該侧面的光線射出該透鏡；該透鏡外形由該頂面及該側面交界處往該底面方向逐漸增大，且該透鏡上部截面的投影是落在該透鏡下部截面的範圍内；穿過該底面的另一部分的光線係由該侧面射出。 2·依據申請專利範圍第1項所述之透鏡，其中，該頂面包括多數個形成該表面結構的凸面段，該等凸面段呈階梯狀連續延伸。 3.依據申請專利範圍第2項所述之透鏡，其中，該等凸面段排列成同心圓。 4·依據申請專利範圍第1〜3其中任一項所述之透鏡，其中 ’定義一通過該透鏡的中心軸，該頂面概呈一越趨中央越往下凹陷的凹陷面。 5.依據申請專利範圍第4項所述之透鏡，其中，於該透鏡沿該中心軸的縱向斷面中’該頂面凹陷概呈V形。 6·依據申請專利範圍第4項所述之透鏡，其中，於該透鏡 g該中心軸的縱向斷面中，該頂面凹陷概呈開口朝上的 16Year 0 0·9. 2 replacement page-outline-,-, patent application scope: A lens for receiving a light-emitting semiconductor component. The lens comprises: a bottom surface facing the light-emitting semiconductor component to receive light; a top surface Conversely to the bottom surface, the top surface includes an uneven surface structure that deflects a portion of the light passing through the bottom surface and incident on the top surface without traveling directly above the top surface; and a side surface from the top surface The periphery extends toward the periphery of the bottom surface, and the light passing through the bottom surface and incident on the side surface emits the lens; the lens shape is gradually increased from the boundary between the top surface and the side surface toward the bottom surface, and the projection of the upper portion of the lens is It falls within the range of the lower cross section of the lens; the light passing through another portion of the bottom surface is emitted from the side. 2. The lens of claim 1, wherein the topping comprises a plurality of convex sections forming the surface structure, the convex sections extending continuously in a stepped manner. 3. The lens of claim 2, wherein the convex segments are arranged in concentric circles. The lens according to any one of claims 1 to 3, wherein the definition of a central axis passing through the lens is a concave surface which is recessed toward the center. 5. The lens of claim 4, wherein the top surface depression is generally V-shaped in a longitudinal section of the lens along the central axis. 6. The lens of claim 4, wherein in the longitudinal section of the central axis of the lens g, the top surface depression is open upwards.

1360666 8. 依據申請專利範圍第4項所述之透鏡，其中，於該透鏡沿s玄中心軸的縱向斷面中，該頂面凹陷概呈底部呈尖錐狀的碗形。 9. 依據申請專利範圍第5項所述之透鏡，其中，該侧面為一曲面。 10·依據申請專利範圍第5項所述之透鏡，其中，該側面為一球面的一部份。 11. 依據申請專利範圍第5項所述之透鏡，其中，該底面平行於一由該頂面周緣所形成的出光面。 12. —種具有透鏡的光源裝置，包含：一基座；一發光半導體元件，設於該基座上；及一透鏡，設於該基座上’用於接收該發光半導體元件所發出的光線，該透鏡包含：一底面’面對該發光半導體元件以接收光線；一頂面，相反於該底面，該頂面包括一使穿過該底面且入射該頂面的部分光線偏折而不朝該頂面之正上方行進的不平整表面結構；及一侧面，由該頂面周緣往該底面周緣延伸，則穿過該底面且入射該侧面的光線射出該透鏡；該透鏡外 17 1360666 第〇96143213號專利申請案說明書替換頁{修正日错^邠〇 «Λ J_ - -{0〇〇9.14> u 止·朁渙頁形由該頂面及該側面交界處往該底面方該透鏡上部截面的投影是落在該透鏡下部截面的範圍内 ’穿過該底面的另一部分的光線係由該侧面射出。 13.依據申請專利範圍第12項所述之光源裝置，其中，該基座為直立式支架、平面式支架或食人魚支架。 14. 依據申請專利範圍第12項所述之光源裝置，其中，該基座頂面與該透鏡的底面接觸。 15. 依據申請專利範圍第丨2項所述之光源裝置，其中，該頂面包括多數個形成該表面結構的凸面段，該等凸面段呈階梯狀連續延伸。 16. 依據申請專利範圍第15項所述之光源裝置，其中，該等凸面段排列成同心圓。 17. 依據申請專利範圍第丨2〜16其中任一項所述之光源裝置 ’其中’定義一通過該透鏡的中心軸，該頂面概呈一越趨中央越往下凹陷的凹陷面。 18. 依據申請專利範圍第17項所述之光源裝置，其中，於該透鏡沿該中心軸的縱向斷面中，該頂面凹陷概呈V形。 19·依據申請專利範圍第17項所述之光源裝置，其中，於該透鏡沿該中心軸的縱向斷面中，該頂面凹陷概呈開口朝上的弧形。 20.依據申請專利範圍第17項所述之光源裝置，其中，於該透鏡沿該中心轴的縱向斷面中，該頂面凹陷概呈喇叭開口狀。 21.依據申請專利範圍第π項所述之光源裝置，其中，於該 18 1360666 --- -- ,. 第〇96143213號專利申請案說明書替換頁（修正日則丨:^|g〇办丨八文;上替換頁透鏡沿該中心軸的縱向斷面中，該頂面凹」尖錐狀的碗形。 . 22. 依據申請專利範圍第18項所述之光源裝置，其中，該侧面為一曲面。 23. 依據申請專利範圍第18項所述之光源裝置，其中，該侧 t 面為一球面的一部份。 . 24.依據申請專利範圍第18項所述之光源裝置其中該底面平行於一由該頂面周緣所形成的出光面。 19The lens according to claim 4, wherein in the longitudinal section of the lens along the central axis of the s-Xuan, the top surface depression has a bowl shape with a tapered shape at the bottom. 9. The lens of claim 5, wherein the side surface is a curved surface. 10. The lens of claim 5, wherein the side is a portion of a sphere. 11. The lens of claim 5, wherein the bottom surface is parallel to a light exiting surface formed by the periphery of the top surface. 12. A light source device having a lens, comprising: a susceptor; an illuminating semiconductor component disposed on the pedestal; and a lens disposed on the pedestal for receiving light emitted by the illuminating semiconductor component The lens includes: a bottom surface 'facing the light emitting semiconductor component to receive light; a top surface opposite to the bottom surface, the top surface including a portion of the light passing through the bottom surface and incident on the top surface An uneven surface structure traveling directly above the top surface; and a side surface extending from the periphery of the top surface toward the periphery of the bottom surface, the light passing through the bottom surface and incident on the side surface exits the lens; the lens outer 17 1360666 Replacement page of patent application No. 96143213 {correction date error ^邠〇«Λ J_ - -{0〇〇9.14> u stop · 朁涣 page shape from the top surface and the side junction to the bottom side of the lens upper part The projection of the cross section falls within the range of the lower cross section of the lens. Light rays passing through another portion of the bottom surface are emitted from the side surface. 13. The light source device of claim 12, wherein the base is an upright bracket, a planar bracket or a piranha bracket. 14. The light source device of claim 12, wherein the top surface of the base is in contact with the bottom surface of the lens. 15. The light source device of claim 2, wherein the top surface comprises a plurality of convex segments forming the surface structure, the convex segments extending continuously in a stepped manner. 16. The light source device of claim 15, wherein the convex segments are arranged in concentric circles. 17. The light source device 'wherein' according to any one of claims 2 to 16 defines a central axis passing through the lens, the top surface being a concave surface which is recessed toward the center. 18. The light source device of claim 17, wherein the top surface depression is V-shaped in a longitudinal section of the lens along the central axis. The light source device according to claim 17, wherein in the longitudinal section of the lens along the central axis, the top surface depression has an arc shape with an opening facing upward. The light source device of claim 17, wherein the top surface of the lens has a flared opening in a longitudinal section of the lens along the central axis. 21. The light source device according to the πth aspect of the patent application, wherein the replacement page of the patent application specification of the Japanese Patent Application No. 96132236 The light source device according to claim 18, wherein the side surface is a longitudinally-shaped section of the upper-replacement lens along the central axis, the top surface is concavely shaped by a cone-shaped bowl. A light source device according to claim 18, wherein the side t-plane is a part of a spherical surface. The light source device according to claim 18, wherein the bottom surface Parallel to a light exit surface formed by the periphery of the top surface. 19