1358101 九、發明說明： 【發明所屬之技術領域】 本發明係有關於半導體製造，特別是有關於用以加 速監測製造機台是否正常發揮功能的系統和方法。 【先前技術】 隨著半導體製造相關技術的成長，半導體產品製造 之複雜度與曰倶增。目前半導體產品製造，由於大小或 _ 排列等因素，對於錯誤的容許度非常小。然而，於複雜 . 的製程中，常會因為機台運作狀況不理想而導致錯誤發 味 0 於一個半導體製造企業中，製造機台可用以執行諸 如半導體晶圓製造、監督製造作業以及於機台中運送晶 圓或其他類似之工作。通常會定期（如一天），利用控 片（control wafer )的處理及檢測，來監測機台運作狀況 是否正常。而不同的機台運作特性，可以藉由不同種類 的控片來加以監測。例如，先將某一種特定的控片經由 .一處理機台處理，然後將該處理過的控片送到檢測機台 進行檢測，以確認該處理機台的某一特定運作特性是否 在正常範圍内。 第1圖顯示習知的製造系統中的機台監測方法的示 意圖。製造系統10包含：物料搬運設備11、處理設備 13、及檢測設備15 〇 物料搬運設備1.1係用以搬動複數晶圓載具，而這些 0503-A31127TWF/aUcewu 5 晶圓載具則分別承載 片。這此'同的檢測程序之複數晶圓控 乃t二阳®載具係儲存於倉. (圖未顯示）來搬運。如1倉儲111 ’並猎由一運送裝置 〜A25適用;^一 4 1 '晶圓载具A承載晶圓控片A1 片B1 1 = 一粒子檢測程序，晶圓載具B承載晶圓_ 圓枰片ci〜m 度心測程序，晶圓載具C承載晶 圓控^ C1⑶適用於一疊對檢測程序。 處理設備13包含處理機a1358101 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to semiconductor manufacturing, and more particularly to systems and methods for accelerating the monitoring of whether a manufacturing machine functions properly. [Prior Art] With the growth of semiconductor manufacturing related technologies, the complexity of semiconductor product manufacturing has increased. At present, semiconductor product manufacturing has very little tolerance for errors due to factors such as size or _ arrangement. However, in complex processes, it is often caused by unsatisfactory operation of the machine. In a semiconductor manufacturing company, the manufacturing machine can be used to perform semiconductor wafer fabrication, supervise manufacturing operations, and ship in the machine. Wafer or other similar work. It is usually used regularly (such as one day) to monitor the operation of the machine using the control wafer's processing and detection. Different machine operating characteristics can be monitored by different kinds of control pieces. For example, a specific control chip is first processed by a processing machine, and then the processed control film is sent to the detection machine for detection to confirm whether a certain operational characteristic of the processing machine is in a normal range. Inside. Figure 1 shows a schematic representation of a machine monitoring method in a conventional manufacturing system. The manufacturing system 10 includes: a material handling device 11, a processing device 13, and a testing device 15 〇 The material handling device 1.1 is used to carry a plurality of wafer carriers, and the 0503-A31127TWF/aUcewu 5 wafer carriers respectively carry the sheets. This multiple test of the same wafer control is stored in the warehouse (not shown). Such as 1 storage 111 'and hunting by a transport device ~ A25 applies; ^ a 4 1 'wafer carrier A carrying wafer control A1 piece B1 1 = a particle detection program, wafer carrier B carrying wafer _ round 枰The chip ci~m degree heart test program, wafer carrier C carrier wafer control ^ C1 (3) is suitable for a stack of detection procedures. Processing device 13 includes processor a
135^/；；；；；^；^135〇4S A τ, n , 疋母隔24小時忒利用晶圓載且 A、B、C中的晶圓控片進行一次監測。 檢測設備15包含檢測機台⑸、153、155 機 :〕1執行一粒子檢測程序，檢測機台153執行一厚产 檢測：二，檢測機台155執行一疊對檢測程序。^ 田右人執行處理機台131的監測程 一 分別從晶圓載具A、B、及c中站+ 一/冋込別益12 選別器12分別從晶圓载呈 二:空片。例如’ :miC1。被抽出的晶圓控片A1、B1、 f入另-個晶圓载具121中。在此，晶圓載且係可 =式晶圓傳送 E (Fr_ 0pening Unified ㈣ F〇up)或 ，、他形式的晶圓载具。承载了晶圓控4 A1、B1、及C1 =晶，載具m被送到處理機台131。當晶圓載具⑵被 載入處理機台⑶後’處理機台131分別處理晶圓控片 i、m、及ci。處理過的晶圓控片A1、m、及 然放回晶圓載具121中。承載了處理過的晶圓控片刈、 B1、及ci的晶圓载具121被送到檢測.機台15卜當晶圓 〇503-A31127TWF/alice' 上358101 載具121被載入檢測機台151後 理後的晶圓控#A1進行預針對處 裎序完成之後，晶枝子檢測程序。粒子檢測 一 ’J 辑 J 依 圓截呈m哉，21被送到檢測機台135。當晶 =;=曰進行預定的厚度檢叫^ 晶圓载具⑵被载入檢測機台H 1 >當 對處理後的晶圓控片C1進行預定的H測機台⑸針 例子檢測程序、厚度檢 序。上述 果被傳送到分析系統17進行分析處對檢測程序的結 在。ί::的:二監:的運作方式，，有許多問題存 且晶圓控===作業料時_， 損傷。另外了η 中因為反覆的夹取而受到 晶圓载具的調度也會造成時間的浪費。因 而個更有效率的方式來執行機台監測。' 【發明内容】 本發明係有關於半導體製 逮監測製造機台是否正當㈣f別疋有關於用以加 太心·“發揮魏㈣統和方法 圓 本=提供-種機台監控系統，其 载具、一第—日 ，.〜穴巴符一弟一晶圓 機台、-第， 用以進行第一檢、、彳 日日圓载具係用以承載 弟，挪程序之一第一晶圓控片。該第二晶圓 載具係用以承_以進行第二檢測程; 之一第 晶 圓控 〇503-A31Z27TWF/aIice' msm 片。該第一處理機台接收該第一晶圓載具並處理該第一 晶圓控片，並接收該第二晶圓載具，及處理該第二晶圓 控片。該第一檢測機台係從該第一處理機台接收該第一 晶圓載具，並對被該第一處理機台處理過的該第一晶圓 控片執行該第一檢測程序。該第二檢測機台係從該第一 處理機台接收該第二晶圓載具.，並對被該第一處理機台 處理過的該第二晶圓控片執行該第二檢測程序。 本發明並提供一種機台監控方法。上述方法首先提 供一第一晶圓載具，其係.用以承載複數個用以進行第一 檢測程序之第一晶圓控片。並將該第一晶圓載具載入一 第一處理機台。使用該第一處理機台處理該複數第一晶 圓控片中之一者。將該第一晶圓載具載入一第一檢測機 台。並使用該第一檢測機台，對被該第一處理機台處理 過的該第一晶圓控片執行該第一檢測程序。 本發明並提供一種製造系統，其包括一物料搬運設 備、一處理設備、以及一檢測設備。其中，該物料搬運 設備，其係用以搬動一第一晶圓載具及一第二晶圓載 具，其中該第一晶圓載具承載複數個用以進行第一檢測 程序之一第一晶圓控片，其中該第二晶圓載具承載複數 個用以進行第二檢測程序之一第二晶圓控片。該處理設 備，.其包含一第一處理機台及一第二處理機台，其中該 第一處理機台接收該第一晶圓載具並處理該複數第一晶 圓控片中之一者，並接收該第二晶圓載具，及處理該複 數第二晶圓控片中之一者，其中該第二處理機台接收該 0503-A31127TWF/alicewu 8 第一晶上機台所處理之其他 理之其他第二晶圓：片、中亚：未被該第-處理機台所處 測設備，其包含2=測c理。該檢 _該第一檢測機台係從該W一二 弟一檢測機台，其 戴具，並對被該第一處：:：理機台接收該第-晶圓 執行該第一檢夠程序 D:理過的該第-晶圓控片 機台接收該第—日_:弟4測機台更從該第二處理 過的該第；第二處理機台處理 檢測機台係從該第一處序二中該第二 二檢測程序，該二晶圓控片執行該第 .該第二晶圓载具，並對被二更：該第二處理機台接收 二晶圓嶋行該第=處理機台處理過的該第 【實施方式】 下文特舉明之目的、特徵、及優點能更明顯易懂， 例，並配合所附圖示第2圖至第5圖， 本發明°本發明說明書提供*同的實施例來說明 式的技術特徵。其中，實施例中的^ 施例中n彳：、°兄明之用’並非用以限制本發明。且實 =圖她虎之部分重複，係為了簡化說明，並非意 才曰不同貫施例之間的關聯性。 〇5〇3-A31127TWF/alice' 監測:法2的圖::圖依:i發明實施例之論 處理設備23、1檢;^2Γ包含：物料搬運設備21、 晶圓數晶圓載具’而這些 片。這此、曰®载用於不同的檢測程序之複數晶圓控 (圖未顯搬，存於倉儲2n’並藉由—運送裝置 〜A25適用於—二:如晶圓載具A承載晶圓控片A1 片b】〜B25、_ 測程序，晶圓載具B承載晶圓控 = = 一厚度檢測程序，晶圓载具。承❹ 二 23適用於一疊對檢測程序。 機4=23包含處理機台231、233、及235。處理 A 二、日及235都是每隔24小時就利周晶圓载具 令日日圓控片進行一次監測。 檢測設備25包含檢測機台251、扮 。 :、2物-粒子檢測程序，檢測機台253執行= 榀測=序’檢測機台255執行一疊對檢測程序。 :欲執行處理機台231的監測程序時，分別將晶圓 :、 及C運送到處理機台231，並將晶圓載具A、 載呈Π刀另i載人處理機台231以進行處理。在此，晶圓 Ρ Γ ^ ^ ^ ^ ^ ® (^〇nt Opening Unified135^/;;;;;^;^135〇4S A τ, n , The mother-in-law is monitored 24 hours a day using wafer control wafers in A, B, and C. The detecting device 15 includes the detecting machine (5), 153, 155 machine: 1 executes a particle detecting program, and the detecting machine 153 performs a thick product test: Second, the detecting machine 155 executes a stack of detecting programs. ^ Tianyouren performs the monitoring process of the processing machine 131. From the wafer carriers A, B, and c, respectively, the station + one/冋込Bei 12 selector 12 is loaded from the wafer two: empty. For example ' :miC1. The wafer control sheets A1, B1, and f that are extracted are taken into another wafer carrier 121. Here, the wafer carrier can be a wafer carrier E (Fr_ 0pening Unified (four) F〇up) or , in the form of a wafer carrier. The wafer control 4 A1, B1, and C1 = crystals are carried, and the carrier m is sent to the processing machine 131. When the wafer carrier (2) is loaded into the processing machine (3), the processing machine 131 processes the wafer control sheets i, m, and ci, respectively. The processed wafer control sheets A1, m, and are placed back into the wafer carrier 121. The wafer carrier 121 carrying the processed wafer control cassettes B, B1, and ci is sent to the inspection machine 15 〇 〇 503-A31127TWF/alice' on the 358101 carrier 121 is loaded into the inspection machine After the wafer control #A1 after the stage 151 is processed, the pre-targeting is completed, and the crystal branch detection program is performed. Particle detection A 'J series J is truncated to m 哉, and 21 is sent to the detection machine 135. When the crystal ===曰 performs the predetermined thickness inspection ^ The wafer carrier (2) is loaded into the inspection machine H 1 > When the processed wafer control sheet C1 is subjected to the predetermined H measuring machine (5) needle example detection program Thickness check. The above results are transmitted to the analysis system 17 for analysis of the end of the test procedure. ί::: The second supervisor: the way of operation, there are many problems and wafer control === when working materials _, damage. In addition, the scheduling of wafer carriers due to repeated clamping in η also wastes time. Therefore, a more efficient way to perform machine monitoring. [Description of the Invention] The present invention relates to whether a semiconductor manufacturing monitoring and manufacturing machine is legitimate (four), and that it is used to add a heart to the "playing the Wei (four) system and method book = providing - seed machine monitoring system, its vehicle , a first day, a ~ acupoints a younger one wafer machine, - the first for the first inspection, the next day the Japanese carrier is used to carry the brother, the first wafer control film. The second wafer carrier is configured to perform a second inspection process; a first wafer control 503-A31Z27TWF/aIice' msm piece. The first processing machine receives the first wafer carrier and processes the Receiving the second wafer carrier, and receiving the second wafer carrier, and processing the second wafer carrier from the first processing machine, and receiving the first wafer carrier from the first processing machine The first wafer control slice processed by the first processing machine performs the first detection process. The second detection machine receives the second wafer carrier from the first processing machine. The second wafer control processed by the first processor performs the second detection process. A machine monitoring method, the method first provides a first wafer carrier for carrying a plurality of first wafer control sheets for performing a first inspection process, and loading the first wafer carrier a first processing machine. The first processing machine is used to process one of the plurality of first wafer control sheets. The first wafer carrier is loaded into a first inspection machine, and the first detection is used. The machine performs the first detection procedure on the first wafer control sheet processed by the first processing machine. The invention also provides a manufacturing system including a material handling device, a processing device, and a detection The material handling device is configured to carry a first wafer carrier and a second wafer carrier, wherein the first wafer carrier carries a plurality of first ones for performing the first detection procedure. a wafer control chip, wherein the second wafer carrier carries a plurality of second wafer control sheets for performing a second detection process. The processing device includes a first processing machine and a second processing machine Taiwan, wherein the first processor is connected The first wafer carrier processes and processes one of the plurality of first wafer control sheets, receives the second wafer carrier, and processes one of the plurality of second wafer control sheets, wherein the second processing The machine receives the other second wafer processed by the 0503-A31127TWF/alicewu 8 first crystal upper machine: slice, Central Asia: not tested by the first processing machine, which includes 2=test c The first detecting machine detects the machine from the W-two brothers, and wears the same, and performs the first by receiving the first wafer by the first::: Checking program D: the first wafer control machine receives the first day _: the fourth test machine is more from the second processed second; the second processing machine processes the detection machine From the second second detection procedure in the first second sequence, the two wafer control slices execute the second wafer carrier, and the second wafer carrier: the second processing machine receives two wafers. The first embodiment of the processing machine is the same as the following, and the objects, features, and advantages of the invention will be more apparent and easy to understand. FIGS. 2 through FIG. 5, the present invention provides * ° embodiments of the present invention, the description of the embodiment with the formula described technical features. In the embodiment, the n 彳:, ° 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 And the fact that the part of her tiger is repeated is to simplify the explanation, and it is not intended to be related to the different examples. 〇5〇3-A31127TWF/alice' Monitoring: Diagram of Method 2:: Diagram: Processing device 23, 1 inspection of the invention embodiment; ^2Γ includes: material handling equipment 21, wafer number wafer carrier' These pieces. In this case, 曰® is used for multiple wafer control of different inspection procedures (the figure is not displayed, stored in the storage 2n' and by - the transport device ~ A25 is applicable to - 2: if the wafer carrier A bears the wafer control Sheet A1 sheet b] ~ B25, _ test program, wafer carrier B carrier wafer control = = a thickness inspection program, wafer carrier. Cheng ❹ 2 23 applies to a stack of detection procedures. Machine 4 = 23 contains processing The machines 231, 233, and 235. The processing A, the day, and the 235 are all monitored every 24 hours for the wafer carrier to make the day control film. The detecting device 25 includes the detecting machine 251 and the dress. The object-particle detection program, the detection machine 253 executes = 榀 test = sequence 'detection machine 255 executes a stack of detection programs. When the processing program of the processing machine 231 is to be executed, the wafers:, and C are respectively transported to The processing machine 231 processes the wafer carrier A and the carrying tool 231 to handle the processing. Here, the wafer Ρ Γ ^ ^ ^ ^ ^ ® (^〇nt Opening Unified
Pod，FOUP)或其他形式的晶圓載^ =了 ^ A1〜A25的晶圓載具a被送到處理 機口 231。备晶圓載具入被載入處理機台^丨後，處理 機台231抽出並處理晶圓控片ai〜a25中之一者。例 0503-A31127TWF/aIicewu 10 υ^ΙΟΙ 如，處理機台231抽出並處理晶圓控片A卜處理過的晶 圓控片A1仍然放回晶圓載具A中。承載了處理過的晶 圓控片A1的晶圓載且A姑·{矣為丨αχ 破廷到檢測機台251。當晶圓載 具Α被載入檢測機台251後’檢測機台251針對處理後 的晶圓控片A1進行預定的粒子檢測裎序。Pod, FOUP) or other forms of wafer carrier ^ = A1 ~ A25 wafer carrier a is sent to the processor port 231. After the wafer carrier is loaded into the processing machine, the processing machine 231 extracts and processes one of the wafer control sheets ai to a25. Example 0503-A31127TWF/aIicewu 10 For example, the processing machine 231 extracts and processes the wafer control sheet A. The processed wafer control sheet A1 is still placed back into the wafer carrier A. The wafer carrying the processed wafer control sheet A1 is loaded and the A · 矣 χ 到 到 到 到 到 到 到 到 检测 检测 检测 检测 检测. After the wafer carrier Α is loaded into the inspection machine 251, the inspection machine 251 performs a predetermined particle detection sequence for the processed wafer control sheet A1.
承載了晶圓控片B1〜R9S AA B ^ 1 β2：)的晶圓載具B被送到處理 機台別。當晶圓載具3被载入處理機台231後，處理 機台231抽出並處理晶圓控片Β1〜Β25中之-者。例如， 處理機台231抽出並處理晶圓控片Β】。處理過的晶圓.控 片B1仍然放回晶圓載具β中。承載了處理過的晶圓控片 的晶圓載具B被送到檢測機台253。當晶圓載具⑼ 載入檢測機台253後，檢測機台如針對處理後的晶圓 控片B1進行預定的厚.度檢測程序。 承載了晶圓控片C1〜C25的晶圓載具c被送到處理 殊台231。當晶圓載具C被載入處理機台231後，處理 機台2M抽出並處理晶圓控片中之—者。例如， =機台2 3 i抽出並處理晶圓控片c i。處理過的晶圓控 =C1仍然放回晶圓載具C中。承載了處理過的晶圓控片 =的土圓載具B被送到檢測機台255。當晶圓載具C被 0片255後’檢測機台255針對處理後的晶圓 控片C1進行預定的疊對檢測程序。 程序程序、厚度檢測程序、以及疊對檢測 序的、、，σ果?皮傳送·析线2 7進行分析處理。 第3Α〜3D圖顯示依據本發明實施例之機台監測方 0503-A31127rWF/alicei 1358101 法的流程圖。 參見第3A圖，在步驟幻】 =用以承嶋—— 驟S32】 使^用該第一處理機台處理該複數第 二晶!载具载入-第-處理機台（步 圓控 晶 二：::ί _S322)。將該第-晶圓载具载入-ί 該第-處理機台處理過_==機台，對被 測程序（步驟S324)。 日日®控片矣行該第一檢 上述步騾S312〜S324.係包含 一檢測機台來gt $丨$ . a日圓控片及第 J何口水皿凋弟一處理機台 參見第抑m & &机各。 /見弟3B圖，在步騾幻 且，苴俜用以孟參、—a 死供一弟二晶圓載 八/、用以承載禝數個用以進行第二檢洌_ 晶圓控片。 核列^序之第二 驟二載入-第二處理機台(步 二_台(步驟 該弟-處理機台處理過的該第二晶；： 測程序（步驟S335)。 A钒仃該弟一檢 上述步驟S331〜S335係包含使 二檢測機台來監测第一處理機台的方法弟^®控片及第 參見第3C圖，將該第一晶雜具載入一第二處理機 0503-A31127TWF/alicewu 12 台（步驟S34n m 晶圓控片中之一去 該第二處理機台處理該複數第- 入-第-檢二卡T342)。將該第一晶圓戴具車 -機台處理過的該第-晶圓控月執行該第 铋測私序（步驟S344) 。 τ袭弟 烚j步驟S341〜S344係包含使用第一晶圓控片及第 -檢測機，第二處理機台的方法流程，片及弟 圓弟311圖’在步驟S33l〜s335中使用的第二# /、.入一第二處理機台（步驟S351)。 曰 處理機台處理該複數第二曰圓W ^使用該弟二 ⑽）。將該第二晶控之一者（步驟 叫。使用該第二檢0二:=:，台(步驟 饿巧機台’對被該第二處理楼A卢了田 匕的該第二晶圓控片執行該第二檢測程序（步驟83°5Γ)。 私上述步驟S351〜S354係包含使周第二晶圓控 一才 "測機台來監測第二處理機台的方法流程。 y敘述-機台監測運作之實施例。該實施例中的 機=測程料以實施於第2圖相示的製造系統中。 f顯示依據本發明實施例中特定晶_ 具在機台監測程序中的處理之示意圖。第从 戟 :據本發明實施例t特定處理機台在機台監：= 處理之示意圖。 4狂厅甲的 依據本發明實施例，使用3種 機台231、加、及235運作狀況之監測。例== 具A承載晶_ A1〜A25適用於_粒子檢观 0503-A31 J27TWF/alicewu 13 圓载具β承載# 序，晶圓裁具（：二工/則〜肪適用於-厚度檢測程 測程序。而檢測機^曰51 = C1〜C25適用於一 4對檢 檢測機台255勃〜/J台2:53執行一厚度檢測程序， 賤公55執行-疊對檢測程序。 〜心用第二:：載於晶圓載具A中的晶圓控“〗 理機台=，理機台231、233、.當欲執行處 送到處理機 米曰 、日日0載具A载入處理機台231以進行處理。 出並處機纟231後，處理機台加抽 加:出%理4=25卜者，’處理機台 然放回晶:ΪΓΛ 處理過的晶圓控片ai仍 八 。承載了處理過的晶圓控片A1的 被送到檢測機台25卜當晶圓載具A被載入 =機，，後，檢測機台251針對處理後的晶圓控片 進行預疋的粒子檢測程序。 當欲執.行處理機台233的監辦程序時，將晶圓載呈a 運送到處理機台233,並將晶圓載具八載入處理機台扣 以進行處理。當晶圓載具A被載入處理機台如後，處 理機台233抽出並處理晶圓控片A2〜A25 二 如，處理機台233抽出並處理晶圓控片A2。處理過的曰 圓控片A2仍然放回晶圓載具A中。承載了處理過的= 圓控片A2的晶圓載具A被送到檢測機台251。當晶圓載 具A被載入檢測機..台..251後，撿測機台.251針對處理後 0503-A31127TWF/aIicewu 14 1358101 的s曰，控片A2進行預定的粒子檢測程序。 運送台235的監測程序時，將晶圓载具A 以進行處理=圓載並且將/=載具八載入處理機合说 理機台如抽出並處理晶圓wA3〜A25中之， ^處理機台说抽出並處理晶圓控月 ： 圓=仍然放回晶圓載具承載了處二 =片的晶圓載具續送到檢測機台25】。當晶圓載 被载入檢測機台251後，檢測機台25i針對處理後 的晶圓進行預定的粒子檢測程序。&理後 參見第4B圖，裝载於晶圓载具B中的晶圓控片扪 〜」係用於監測處理機台231、233、235。當欲 ==加的監測程序時，將晶圓載具以送到處理二 二圓載载具B載入處理機台231以進行處理。 處理機台231後，處理機台23"由 出亚處理曰曰圓控片Β1〜Β25中之一者。例理 =Α1°處理過的晶圓控片B1.㈣ 機台253。當晶圓載具⑼載入二 ，253後’核測機台253針對處理後的晶 行預定的厚度檢測程序。月 進 =執行處理機台233的監測程序時，將晶圓載且Β 迗1J處理機台233,並將晶圓載具B載入處理機△说 以進行處理。當晶圓翁B观錢理教台.233二严 0503-A31127TWF/alice\ 15 1358101 理機台233抽出並處理晶圓控片B2〜B25中之一者。例 如，處理機台233抽出並處理晶圓控片B2。處理過的晶 圓控片B2仍然放回晶圓載具B中。承載了處理過的晶圓 控片B2的晶圓載具B被送到檢測機台253。當晶圓載具 B被載入檢測機台253後，檢測機台253針對處理後的 晶圓控片B2進行預定的厚度檢測程序。 當欲執行處理機台235的監測程序時，將晶圓載具B 運送到處理機台235,並將晶圓載具B載入處理機台235 以進行處理。當晶圓載具B被載入處理機台235後，處 理機台235抽出並處理晶圓控片B3〜B25中之一者。例 如，處理機台235抽出並處理晶圓控.月B3。處理過的晶 圓控片B3仍然放回晶圓載具B中。承載了處理過的晶圓 控片B3的晶圓載具B被送到檢測機台253。當晶圓載具 A被載入檢測機台253後，檢測機台253針對處理後的 晶圓控片B3進行預定的厚度檢測程序。 參見第4C圖，裝載於晶圓載具C中的晶圓控片C1 〜C25係用於監測處理機台231、233、235。當欲執.行處 理機台231的監測程序時，將晶圓載具C運送到處理機 台231，並將晶圓截具C載入處理機台231以進行處理。 當晶圓載具C被載入處理機台231後，處理機台231抽 出並處理晶圓控片C1〜C25中之一者。例如，處理機台 231抽出並處理晶圓控片C1。處理過的晶圓控片C1仍然 放回晶圓載具C中。承載了處理過的晶圓控片C1的晶圓 載具C被送到檢測機合255β。當„晶屬，截具α被意入檢測 0503-Α31127TWF/alicewu 16 1358101 機台255後，檢測機台255針對處理後的晶圓控片Cl進 行預定的疊對檢測程序。 當欲執行處理機台233的監測程序時，將晶圓載具C 運送到處理機台233,並將晶圓載具C載入處理機台233 以進行處理。當晶圓載具C被載入處理機台233後，處 理機台233抽出並處理晶圓控片C2〜C25中之一者。例 如，處理機台233抽出並處理晶圓控片C2。處理過的晶 圓控片C2仍然放回晶圓載具C中。承載了處理過的晶圓 控片C2的晶圓載具C被送到檢測機台255。當晶圓載具 C被載入檢測機台255後，檢測機台.255針對處理後的 晶圓控片C2進行預定的疊對檢測程序。 當欲執行處理機台235的監測程序時，將晶圓載具C 運送到處理機台235，並將晶圓載具C載入處理機台235 以進行處理。當晶圓載具C被載入處理機台235後，處 理機台235抽出並處理晶圓控片C3〜C25中之一者。例 如，處理機台2.35抽出並處理晶圓控片B3。處理過的晶 圓控片C3仍然放回晶圓載具C中.。承載了處理過的晶圓 控片C3的晶圓載具C被送到檢測機台255。當晶圓載具 C被載入檢測機台255後，檢測機台255針對處理後的 晶圓控片C3進行預定的疊對檢測程序。 第5A〜5C圖顯示依據本發明實施例中特定處理機 台在機台監測程序中的處理之示意圖。 以第5A圖為例，當欲執行處理機台231的監測程序 時，分別將晶圓載具A、B,.、及.C.運送到處褒機台231， 0503-A31127TWF/alicewu 17 1358101 並將晶圓載具A、B、及C分別載入處理機台231以進行 處理。處理機台231分別從晶圓載具A中抽出並處理晶 圓控片A1、從晶圓載具B中抽出並處理晶圓控片B1、 從晶圓載具C中抽出並處理晶圓控片C1。被處理機台231 處理過的晶圓控片A1、B1、及C1分別送往檢測機台 25卜253、及255，以進行粒子檢測程序、厚度檢測程序、 以及豐對檢測程序。 以第5B圖為例，當欲執行處理機台233的監測程序 • 時，分別將晶圓載具A、B、及C運送到處理機台233， . 並將晶圓載具A、B、及C分別載入處理機台233以進行 處理。處理機台233分別從晶圓載具A中抽出並處理晶 圓控片A2、從晶圓載具B中抽出並處理晶圓控片B2、 從晶圓載具C中抽出並處理晶圓控片C2。被處理機台233 處理過的晶圓控片A2、B2、及C2分別送往檢測機台 25卜253、及255，以進行粒子檢測程序、厚度檢測程序、 以及疊對檢測程序。 胃以第5C圖為例，當欲執行處理機台235的監測程序 時，分別將晶圓載具A、B、及C運送到處理機台235， 並將晶圓載具A、B、及C分別載入處理機台235以進行 處理。處理機台235分別從晶圓載具A中抽出並處理晶 圓控片A3、從晶圓載具B中抽出並處理晶圓控片B3、 從晶圓載具C中抽出並處理晶圓控片C3。被處理機台235 處理過的晶圓控片A3、B3、及C3分別送往檢測機台 251、253、及255，以進行粒子檢測程序、厚度檢測程序、 0503-A31127TWF/alicewu 18 1358101 以及豐對檢測程序。 依據本發明實施例，毋須進行晶圓控片的選別程 序，且可以更有效率地執行機台監測的程序。 雖然本發明已以較佳實施例揭露如上’然其並非用 以限定本發明，任何熟悉此項技藝者，在不脫離本發明 之精神和範圍内，當可做些許更動與潤飾，因此本發明 之保護範圍當視後附之申請專利範圍所界定者為準。The wafer carrier B carrying the wafer control sheets B1 to R9S AA B ^ 1 β2:) is sent to the processing machine. When the wafer carrier 3 is loaded into the processing machine 231, the processing machine 231 extracts and processes the wafer control sheets 1 to 25. For example, the processing machine 231 extracts and processes the wafer control unit. The processed wafer. The wafer B1 is still placed back into the wafer carrier β. The wafer carrier B carrying the processed wafer control is sent to the inspection machine 253. After the wafer carrier (9) is loaded into the inspection machine 253, the inspection machine performs a predetermined thickness measurement procedure for the processed wafer control sheet B1. The wafer carrier c carrying the wafer control sheets C1 to C25 is sent to the processing stage 231. When the wafer carrier C is loaded into the processing machine 231, the processing machine 2M extracts and processes the wafer control. For example, = machine 2 3 i extracts and processes wafer control c i . The processed wafer control = C1 is still placed back into the wafer carrier C. The soil circle carrier B carrying the processed wafer control sheet = is sent to the inspection machine 255. When the wafer carrier C is subjected to the 0 piece 255, the inspection machine 255 performs a predetermined overlap detection process for the processed wafer control sheet C1. The program program, the thickness detecting program, and the stacking detection sequence, and the σ fruit skin transfer and analysis line 27 are analyzed and processed. The third to third figures show a flow chart of the machine monitoring method 0503-A31127rWF/alicei 1358101 according to an embodiment of the present invention. See Fig. 3A, in the step illusion = = for bearing 骤 - step S32] to use the first processing machine to process the plurality of second crystals! Vehicle loading - the first processing machine (step round control crystal Two::: ί _S322). The first wafer carrier is loaded - the processing machine has processed the _== machine, and the program is tested (step S324). The daily control chip is the first step S312~S324. The system includes a detection machine to gt $丨$. A day control film and the Jth water dish with a treatment machine see the m && machine. / See the brother 3B picture, in the step of illusion, and use the ginseng, - a die for a brother and two wafers eight /, used to carry a number of for the second inspection _ wafer control. The second step of the kernel sequence is loaded into the second processing machine (step two_stage (step the second - the second crystal processed by the processing machine;: the test procedure (step S335). A vanadium 仃The first step S331 to S335 includes the method of causing the second detecting machine to monitor the first processing machine, and the third control chip, and the third crystal cutting tool is loaded into the second processing. Machine 0503-A31127TWF/alicewu 12 sets (one of the step S34n m wafer control sheets goes to the second processing machine to process the plurality of first-in-first-check two cards T342). The first wafer wearing vehicle - the first wafer control month processed by the machine performs the second test private sequence (step S344). τ 烚 烚 j steps S341 to S344 include using the first wafer control chip and the first detector, The method flow of the second processing machine, the slice and the younger brother 311, the second # /, used in steps S33l to s335, enters a second processing machine (step S351). The processing machine processes the plural number Two rounds W ^ use the second two (10)). One of the second crystal controls (step called. Use the second check 0:=:, the station (step hungry machine' is the second place The second wafer control piece of the management building A Lu Tiantian performs the second detection procedure (step 83°5Γ). The above steps S351~S354 are included to make the second wafer control one of the week" The method flow for monitoring the second processing machine. y narration - an embodiment of the machine monitoring operation. The machine in the embodiment = the measuring material is implemented in the manufacturing system shown in Fig. 2. f shows according to the invention The schematic diagram of the processing of the specific crystal in the machine monitoring program in the embodiment. The following: According to the embodiment of the present invention, the specific processing machine is in the machine monitoring: = the schematic diagram of the processing. In the embodiment, the monitoring of the operating conditions of the three types of machines 231, plus, and 235 is used. Example == with A bearing crystal _ A1 ~ A25 is suitable for _ particle inspection 0503-A31 J27TWF/alicewu 13 round carrier β bearing # , wafer cutting tool (: two work / then ~ fat is suitable for - thickness detection test program. And detection machine ^ 曰 51 = C1 ~ C25 applies to a 4 pairs of inspection machine 255 Bo ~ / J Taiwan 2: 53 Perform a thickness test procedure, 贱 55 execution-stack test procedure. ~ Heart use second:: wafers carried in wafer carrier A "〗 physics machine =, machine 231, 233, when the execution is sent to the processor meter, day 0 carrier A loading processor 231 for processing. After the machine 231, Processing machine plus pumping: out of the 4% 25 =, the processor is placed back to the crystal: ΪΓΛ The processed wafer control ai is still eight. The loaded wafer control A1 is sent When the wafer carrier A is loaded into the inspection machine 25, the inspection machine 251 performs a preliminary particle detection program for the processed wafer control sheet. When the supervisory program of the processing machine 233 is to be executed, the wafer carrier a is transported to the processing machine 233, and the wafer carrier 8 is loaded into the processing machine for processing. When the wafer carrier A is loaded into the processing machine, the processing machine 233 extracts and processes the wafer control sheets A2 to A25. For example, the processing machine 233 extracts and processes the wafer control sheet A2. The processed 圆 round control piece A2 is still placed back into the wafer carrier A. The wafer carrier A carrying the processed = circular control sheet A2 is sent to the inspection machine 251. When the wafer carrier A is loaded into the inspection machine.. 251, the inspection machine. 251 is processed for 0503-A31127TWF/aIicewu 14 1358101, and the control piece A2 performs a predetermined particle detection process. When the monitoring program of the transfer station 235 is performed, the wafer carrier A is processed for processing = round load and the /= carrier is loaded into the processing machine, and the processing machine is extracted and processed in the wafers wA3 to A25, ^ processing machine Said to extract and process the wafer control month: Round = still put back the wafer carrier carrying the two = wafer carrier to continue to the inspection machine 25]. After the wafer load is loaded into the inspection machine 251, the inspection machine 25i performs a predetermined particle detection process for the processed wafer. & Referring to Figure 4B, the wafer control cassettes loaded in the wafer carrier B are used to monitor the processing stations 231, 233, 235. When the monitoring program is to be == plus, the wafer carrier is sent to the processing binary carrier B to be loaded into the processing machine 231 for processing. After the processing machine 231, the processing machine 23" handles one of the round control pieces Β1 to Β25. Example = Α1° processed wafer control sheet B1. (4) Machine table 253. When the wafer carrier (9) is loaded into the second, 253, the nuclear measuring machine 253 is subjected to a predetermined thickness detecting procedure for the processed wafer. Monthly = When the monitoring program of the processing machine 233 is executed, the wafer is loaded onto the 1J processing machine 233, and the wafer carrier B is loaded into the processing machine △ for processing. When the wafer Weng B Guan Qiang teaching station. 233 Liang Yan 0503-A31127TWF/alice \ 15 1358101 machine 233 draws out and processes one of the wafer control sheets B2 ~ B25. For example, the processing machine 233 extracts and processes the wafer control sheet B2. The processed wafer control sheet B2 is still placed back into the wafer carrier B. The wafer carrier B carrying the processed wafer control sheet B2 is sent to the inspection machine 253. After the wafer carrier B is loaded into the inspection machine 253, the inspection machine 253 performs a predetermined thickness detection procedure for the processed wafer control sheet B2. When the monitoring program of the processing machine 235 is to be executed, the wafer carrier B is transported to the processing machine 235, and the wafer carrier B is loaded into the processing machine 235 for processing. After the wafer carrier B is loaded into the processing station 235, the processing machine 235 extracts and processes one of the wafer control sheets B3 to B25. For example, the processing machine 235 extracts and processes the wafer control. Month B3. The processed wafer control sheet B3 is still placed back into the wafer carrier B. The wafer carrier B carrying the processed wafer control sheet B3 is sent to the inspection machine 253. After the wafer carrier A is loaded into the inspection machine 253, the inspection machine 253 performs a predetermined thickness detection procedure for the processed wafer control sheet B3. Referring to FIG. 4C, the wafer control sheets C1 to C25 loaded in the wafer carrier C are used to monitor the processing machines 231, 233, and 235. When the monitoring program of the processing machine 231 is to be executed, the wafer carrier C is transported to the processing machine 231, and the wafer carrier C is loaded into the processing machine 231 for processing. When the wafer carrier C is loaded into the processing machine 231, the processing machine 231 extracts and processes one of the wafer control sheets C1 to C25. For example, the processing machine 231 extracts and processes the wafer control chip C1. The processed wafer control chip C1 is still placed back into the wafer carrier C. The wafer carrier C carrying the processed wafer control sheet C1 is sent to the inspection machine 255β. When the genus, the yoke α is intended to detect the 0503-Α31127TWF/alicewu 16 1358101 machine 255, the inspection machine 255 performs a predetermined overlay detection procedure for the processed wafer control chip C1. In the monitoring process of the stage 233, the wafer carrier C is transported to the processing machine 233, and the wafer carrier C is loaded into the processing machine 233 for processing. When the wafer carrier C is loaded into the processing machine 233, processing is performed. The machine 233 extracts and processes one of the wafer control sheets C2 to C25. For example, the processing machine 233 extracts and processes the wafer control sheet C2. The processed wafer control sheet C2 is still placed back into the wafer carrier C. The wafer carrier C carrying the processed wafer control sheet C2 is sent to the inspection machine 255. When the wafer carrier C is loaded into the inspection machine 255, the inspection machine 255 is processed for the wafer control wafer. C2 performs a predetermined stacking detection process. When the monitoring program of the processing machine 235 is to be executed, the wafer carrier C is transported to the processing machine 235, and the wafer carrier C is loaded into the processing machine 235 for processing. After the wafer carrier C is loaded into the processing machine 235, the processing machine 235 extracts and processes the wafer control One of C3 to C25. For example, the processing machine 2.35 extracts and processes the wafer control sheet B3. The processed wafer control sheet C3 is still placed back into the wafer carrier C. The processed wafer control sheet is carried. The wafer carrier C of C3 is sent to the inspection machine 255. After the wafer carrier C is loaded into the inspection machine 255, the inspection machine 255 performs a predetermined overlay detection process for the processed wafer control chip C3. 5A to 5C are diagrams showing the processing of a specific processing machine in the machine monitoring program according to the embodiment of the present invention. Taking FIG. 5A as an example, when the monitoring program of the processing machine 231 is to be executed, the wafer carrier is respectively used. A, B, ., and .C. are transported to the machine 231, 0503-A31127TWF/alicewu 17 1358101 and the wafer carriers A, B, and C are loaded into the processing machine 231 for processing. The processing machine 231 The wafer control sheet A1 is extracted and processed from the wafer carrier A, and the wafer control sheet B1 is taken out from the wafer carrier B, and the wafer control sheet C1 is taken out from the wafer carrier C and processed. 231 The processed wafer control sheets A1, B1, and C1 are sent to the inspection machine 25, 253, and 255, respectively. Sub-test procedure, thickness detection procedure, and abundance detection procedure. Taking Figure 5B as an example, when the monitoring program of the processing machine 233 is to be executed, the wafer carriers A, B, and C are respectively transported to the processing machine. 233, . and load the wafer carriers A, B, and C into the processing machine 233 for processing. The processing machine 233 extracts and processes the wafer control A2 and the slave carrier B from the wafer carrier A, respectively. The wafer control sheet B2 is extracted and processed, and the wafer control sheet C2 is taken out from the wafer carrier C. The wafer control sheets A2, B2, and C2 processed by the processing machine 233 are sent to the inspection machines 25, 253, and 255, respectively, to perform a particle detection program, a thickness detection program, and a stack detection program. Taking the 5C figure as an example, when the monitoring program of the processing machine 235 is to be executed, the wafer carriers A, B, and C are respectively transported to the processing machine 235, and the wafer carriers A, B, and C are respectively The processing machine 235 is loaded for processing. The processing machine 235 extracts and processes the wafer control sheet A3 from the wafer carrier A, extracts and processes the wafer control sheet B3 from the wafer carrier B, and extracts and processes the wafer control sheet C3 from the wafer carrier C. The wafer control sheets A3, B3, and C3 processed by the processing machine 235 are sent to the inspection machines 251, 253, and 255, respectively, to perform a particle detection program, a thickness detection program, 0503-A31127TWF/alicewu 18 1358101, and abundance. For the test procedure. According to the embodiment of the present invention, it is not necessary to perform a wafer control sorting process, and the program of the machine monitoring can be performed more efficiently. Although the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.
0503-A31127TWF/alicewu 19 上〜〇川i 【圖式簡單說明】 為使本發明之上 k，下文特舉實施例， 如下： 述目的、待徵和優點能更明顯易 並配合所附圖示，進行詳細說明 第1圖顯示習知的製造李够中 意圖。 ’n充中的機台監測方法的示 統中的機台 據本發明實_之製造系 瓜冽方法的示意圖。 法的圖顯示依據本發明實施例之機台監剛方0503-A31127TWF/alicewu 19上~〇川i [Simplified illustration of the drawing] In order to make the present invention above k, the following specific embodiments are as follows: The purpose, the to-be-reported and the advantages can be more obvious and cooperate with the attached illustration Detailed Description FIG. 1 shows the conventional intention of manufacturing Lee. The machine in the display of the machine monitoring method of the 'n' is a schematic diagram of the manufacturing method according to the present invention. The diagram of the method shows the machine monitoring according to the embodiment of the present invention.
第4A〜4C 曰曰 圓戴4A~4C 圆 Round wear
第5A〜5C 圖顯示依據本發明實施例中鸫令南 台在機台監測料中的處理之示^域中“處 理機 〜A25 ; 〜B25 ; 〜C25 ; 131 、 133 、 135 ; l5l· ' 153、155 ; 【主要元件符號說明】 製造系_統〜1 〇 ; 處理設備〜13 ; 倉儲〜111 ; 晶圓控片A1 晶圓控片B1 晶圓控片C1 .處理機台〜 檢測機台·〜 物料搬運設備〜11 ; 檢測設備〜15 ; 曰曰圓載具A ; 晶圓載具B ; 晶圓载具C ; 0503-A31127TWF/alicewu 20 1358101 分析系統〜 17 ； 製造系統〜20 物料搬運設 〜21 ; 處理設備〜23 檢測設備〜 25 ； 倉儲〜211 ; 處理機台〜 231 ' 233 、 235 ； 檢測機台〜 251 ' 253 ' 255。 0503-A31127TWF/alicewu 215A to 5C are diagrams showing the processing of the processing of the south station in the monitoring material of the machine in the embodiment of the present invention. "Processor ~ A25; ~ B25; ~ C25; 131, 133, 135; l5l · ' 153 155; [Major component symbol description] Manufacturing system _ system ~ 1 〇; Processing equipment ~ 13; Warehousing ~ 111; Wafer control chip A1 Wafer control film B1 Wafer control chip C1. Processing machine ~ Detection machine · ~ Material handling equipment ~ 11; Testing equipment ~ 15; Rounding vehicle A; Wafer carrier B; Wafer carrier C; 0503-A31127TWF/alicewu 20 1358101 Analysis system ~ 17; Manufacturing system ~ 20 Material handling set ~ 21 Processing equipment ~ 23 detection equipment ~ 25; warehousing ~ 211; processing machine ~ 231 '233, 235; inspection machine ~ 251 '253 '255. 0503-A31127TWF/alicewu 21