1357664 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種電子元器件之製程，尤其係關於 —種影像感測晶片封裝之製程。 【先前技術】 目前，數位相機及帶數位相機之行動電話越來越普 及，數位相機不可缺少之核心元件影像感測晶片封裝之 需求亦隨之與日俱增。同時’消f者亦希望數位相機更 加朝小型化、高品質、低價格方向發展，也就是說影 像感測晶片封裝要有更好之品f，從而對影像感測晶片/ 封裝之製造提出了更高要求。 請參閲第—圖’―種習知影像感測器封裝方法，如 中國大陸專射請第〇31_61 2號所揭示，其包括以下 步驟：首先提供複數個匸狀截面之導電片13〇，·射 型包覆住各導電片13〇之第一成型體146，該第一成型 體146使導電片130之部分露出；射出成型於第一成型 體146上形成第二成型體148，該第二成型體盘第 —成㈣146共同形成凹槽bo;將設有複數焊塾'154 ^影像感測^ 152設置於凹槽⑼内；藉由複數條引 秦156使影像感測晶片152之焊墊154與導電片電 連接’將透光板158設置於第二成型體148上，以包覆 住影像感測晶片152。 上述影像感測晶>{封裝方法之缺點在於：儘管該封 ，方法便於大里生産’然而只能單顆製造，造成生産效 '車乂低，另，由於上述影像感測晶片152及複數引線156 1357664 皆谷置於凹槽15 0内’且為方便打線器操作，故使得凹 槽150較大，由此，封裝後之凹槽150存在較多粉塵， 且於封裝過程及影像感測晶片封裝安裝於鏡頭及鏡頭調 焦過程中不可避免之震動均會使凹槽150周壁上之粉塵 等雜質掉落於影像感測晶片15 2上，污染影像感測晶片 152之感測區，導致品質不良、生産良率降低。 【發明内容】 鑒於以上内容’提供一種生産效率較高、所得影像 φ 感測晶片影像感測品質較好之影像感測晶片封裝之製程 實為必要。 一種影像感測晶片封裝之製程包括以下步驟： 提供一支架，該支架係將一導電板藉由衝壓成型方 式而成’該支架包括二間隔之料帶、複數連接二料帶之 橫樑及複數形成於橫樑上之導電片； 將支架之一部分放入一模具之型腔内，並於型腔内 注入塑膠材料，冷卻後成型出複數包覆該支架之導電片 •之基體，導電片部分暴露於基體外，每一基體包括一容 置腔； 提供一包括一感測區之影像感測晶片，將該影像感 測晶片設置於基體之容置腔内； 設置複數引線，使每一引線電連接影像感測晶片與 導電片； 提供一透光板，將該透光板設置於基體上，將容置 腔蓋住； 將複數基體分割’形成單個封裝體； 5 1357664 將導電片包覆。 相較習知技術，所述影像感測晶片之封裝製程所得 之影像感測晶片之封裝之感測區包覆於黏膠形成之較I 空腔内，故其極難被污染，從而使該影像感測晶片保持 良好品質；導電片被基體包覆其中，可降 響進而提高產品可#度；該隸可科生 測晶片之封裝，極大地提高了生産效率。 【實施方式】 下面將結合附圖與實施例對本技術方案作進一步詳 細說明。 請參閲第二圖，本發明較佳實施方式影像感測晶片 之封裝結構包括一載具（圖未標）、一影像感測晶片22、 複數引線26及一透光板28。該載具包括複數導電片2〇 及一基體24,該複數導電片20相互間隔平行排列地嵌 卡於該基體24上；該影像感測晶片22包括一位於其頂 邙中央之感測區222 ;每一引線26之一端連接至一導電 片20上，另一端連接至影像感測晶片22上，且每一引 線26均被黏膠34包覆；該透光板28設置於基體24上， 將影像感測晶片22覆蓋。包覆引線26之黏膠34進一步 黏附於透光板28上，且於影像感測晶片22之感測區222 周緣形成一整圈，從而將影像感測晶片22之感測區222 包覆於該黏膠34與透光板28形成之空腔32内。 本發明影像感測晶片封裝之製程包括以下步驟： 凊參閲第三圖及第四圖，提供一支架4〇。該支架4〇 6 1357664 ^括二相互間隔平行之料帶42、連接二料帶42之複數 •橫# 44及複數形成於橫樑44上之導電片20。該複數樺 •襟4 4均勾分佈於該二料帶4 2之間並垂直於料帶4 2，每 一導電片20均平行於料帶42，且每一橫樑料上設有均 自分佈之複數導電片20,除兩端之：橫樑44僅一側設 有導電片20外，其餘橫樑44兩側均設有導電片％。該 導電片20包括一與橫樑44相連之第一板私2、一位於 導電片20端部之第二板463及一連接第一板462盥第二 •板463之第三板464，該第一板偏與第二板偏相^ .平行且間隔錯開一定距離，該第三板464相對第一板4 .^第二板463傾斜-定角度。製造該支架二，先板選46一2 •導電板（如金屬板）’藉由衝壓成型法或蝕刻方法將該導 電板形成所述之支架40結構。 請參閲第五圖，以嵌入成型法（insertm〇lding) 一 體成型方式射出成型複數所述基體24於該支架40上， 即將支架40放入一模具之型腔内，向該型腔内注入熔融 _狀!之塑膠材料，從而形成所述載具，其結構請一併參 閲第/、圖。该基體24形成於支架4〇之周緣及上下表面， 其為長方體形，且由塑膠材料製成。該基體24包括四侧 240及一底部243，該四側壁240與底部243共同圍 成一容置腔30。該侧壁24〇包括一上部241及一下部 242，二相對側壁240之下部242鄰近容置腔3〇之一側 係一斜面244 ’該支架40之第一板462嵌卡於該下部242 之與上部241連接處並伸出基體24外，第二板463嵌卡 於邊底部243，該第三板464倚靠設於基體24下部242 7 1357664 之斜面244上。支架4〇之料帶42及橫樑44均位於於基 體24外。 清參閱第六圖，提供複數影像感測晶片22。於每一 基體24之底部243上塗布黏膠，將該複數影像感測晶片 22分別放置於該黏膠上，從而固定於基體24之容置腔 〇内所述衫像感測晶片22頂面中央之感測區222之 周緣佈設有多個晶片焊墊224。 請參閱第七圖，用打線機打出複數引線26，每一引 •線26之一端電連接於影像感測晶片22之晶片焊墊 =4,另一端電連接於導電片2〇之第一板462上以使 衫像感測晶片22之訊號得以傳遞至複數導電片2〇。該 複數引線26之材料為導電性較好之黃金等金屬。然後於 衫像感測晶片22頂面中央之感測區222之周緣塗佈黏膠 34，以將每一引線26包覆。 請參閱第八圖，提供一透光板28。於基體24頂部 塗布黏膠，將該透光板28蓋於基體24之上部241上， _從而將基體24之容置腔30蓋住，同時使黏膠％緊靠並 黏附透光板28，從而將影像感測晶片22之感測區222 包覆於一空腔32内。該透光板28為一透光玻璃。 請再次參閱第五圖，將該複數基體24分別切割開 來，使支架40之料帶42被切斷，同時使所述導電片2〇 之第一板462被割斷，同一橫樑44兩側之導電片2〇分 別位於兩個預封裝體2内’形成單個之預封裝體2。此 時，導電片20之端部露出於基體24而暴露於空氣令， 如第九圖所示。 8 1357664 請參閲第九圖，採用熔接技術，如超聲波熔接、鈐 . 射熔接、熱熔接等，將該熔接該基體24之邊緣，將導= .片20包覆於基體24内，從達到更好之包覆效果。“ 可以理解，分割各個基體24之製程可提前至基體 24成型與黏貼影像感測晶片22製程之間；黏膠％二形 成與透光板28之覆蓋可同時進行，由此黏膠34可緊^1357664 VI. Description of the Invention: [Technical Field] The present invention relates to a process for manufacturing electronic components, and more particularly to a process for image sensing chip packaging. [Prior Art] At present, digital cameras and mobile phones with digital cameras are becoming more and more popular, and the demand for core component image sensing chip packages, which are indispensable for digital cameras, is increasing. At the same time, 'there is also a desire for digital cameras to be more miniaturized, high quality, and low price. That is to say, image sensing chip packages should have better products, so that the manufacture of image sensing chips/packages is proposed. Higher requirements. Please refer to the figure---A kind of conventional image sensor packaging method, as disclosed in the Chinese mainland, please refer to No. 31_61 No. 2, which includes the following steps: firstly, a plurality of conductive sheets 13匸 having a braided section are provided. The first molded body 146 of the conductive sheets 13 is exposed, and the first molded body 146 exposes a portion of the conductive sheet 130. The second molded body 148 is formed by injection molding on the first molded body 146. The two molded body discs - into (four) 146 together form a groove bo; a plurality of soldering tips '154 ^ image sensing ^ 152 are disposed in the recess (9); the image sensing wafer 152 is soldered by a plurality of lead 156 The pad 154 is electrically connected to the conductive sheet. The light transmissive plate 158 is disposed on the second molded body 148 to cover the image sensing wafer 152. The above image sensing crystals have a disadvantage in that the packaging method is convenient for the production of Dali, but it can only be manufactured in a single unit, resulting in a low production efficiency, and, due to the above image sensing wafer 152 and the plurality of leads 156 1357664 is placed in the groove 150 and is convenient for the wire cutter to operate, so that the groove 150 is larger, thereby the groove 150 after the package has more dust, and the package process and image sensing chip package The inevitable vibrations during the lens and lens focusing process cause impurities such as dust on the peripheral wall of the recess 150 to fall on the image sensing wafer 15 2, contaminating the sensing area of the image sensing wafer 152, resulting in poor quality. Production yield is reduced. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a process for image sensing chip packaging with high production efficiency and good image sensing quality of the obtained image φ sensing wafer. An image sensing chip package process includes the following steps: providing a bracket, the bracket is formed by stamping and forming a bracket. The bracket comprises two spaced strips, a plurality of beams connecting the two strips, and a plurality of forming a conductive sheet on the beam; one part of the bracket is placed in a cavity of a mold, and a plastic material is injected into the cavity, and after cooling, a plurality of substrates covering the conductive sheet of the bracket are formed, and the conductive sheet is partially exposed Each of the substrates includes a receiving cavity; an image sensing chip including a sensing region is disposed, and the image sensing wafer is disposed in the receiving cavity of the substrate; and the plurality of leads are disposed to electrically connect each lead The image sensing wafer and the conductive sheet; providing a light-transmitting plate, the light-transmitting plate is disposed on the substrate to cover the receiving cavity; dividing the plurality of substrates into a single package; 5 1357664 wrapping the conductive sheet. Compared with the prior art, the sensing region of the package of the image sensing chip obtained by the packaging process of the image sensing chip is coated in the I cavity formed by the adhesive, so that it is extremely difficult to be contaminated, thereby making the The image sensing wafer maintains good quality; the conductive sheet is covered by the substrate, which can reduce the sound and thus improve the product's degree; the package of the scientific test wafer can greatly improve the production efficiency. [Embodiment] Hereinafter, the technical solution will be further described in detail with reference to the accompanying drawings and embodiments. Referring to the second embodiment, a package structure of an image sensing chip according to a preferred embodiment of the present invention includes a carrier (not shown), an image sensing wafer 22, a plurality of leads 26, and a light transmitting plate 28. The carrier includes a plurality of conductive sheets 2A and a substrate 24. The plurality of conductive sheets 20 are embedded in the substrate 24 in parallel with each other. The image sensing wafer 22 includes a sensing region 222 at the center of the top of the top. One end of each lead 26 is connected to a conductive sheet 20, and the other end is connected to the image sensing wafer 22, and each lead 26 is covered by an adhesive 34; the transparent plate 28 is disposed on the base 24. The image sensing wafer 22 is covered. The adhesive 34 covering the lead 26 is further adhered to the transparent plate 28, and a full turn is formed on the periphery of the sensing region 222 of the image sensing wafer 22, thereby covering the sensing region 222 of the image sensing wafer 22 with The adhesive 34 is formed in the cavity 32 formed by the light transmissive plate 28. The process of the image sensing chip package of the present invention comprises the following steps: 凊 Referring to the third and fourth figures, a bracket 4 is provided. The bracket 4 〇 6 1357664 includes two strips 42 spaced apart from each other, a plurality of strips connecting the two strips 42 , a cross section 44 , and a plurality of conductive sheets 20 formed on the beam 44 . The plurality of birch 襟 4 4 hooks are distributed between the two strips 4 2 and perpendicular to the strips 4 2 , and each of the conductive sheets 20 is parallel to the strip 42 , and each of the strips is self-distributed The plurality of conductive sheets 20 are except for the two ends: the beam 44 is provided with the conductive sheet 20 on only one side, and the other beams 44 are provided with conductive sheets % on both sides. The conductive sheet 20 includes a first board 2 connected to the beam 44, a second board 463 at the end of the conductive sheet 20, and a third board 464 connecting the first board 462 and the second board 463. One plate is offset from the second plate by a certain distance, and the third plate 464 is inclined at an angle with respect to the first plate 4 . The bracket 2 is manufactured, and the first board is selected as a 46. 2 • a conductive plate (e.g., a metal plate). The conductive plate is formed into the structure of the bracket 40 by a press forming method or an etching method. Referring to FIG. 5, a plurality of the base body 24 is injection molded on the bracket 40 by insert molding, that is, the bracket 40 is placed in a cavity of a mold, and the cavity is injected into the cavity. The plastic material is melted to form the carrier, and the structure thereof is also referred to the figure / figure. The base body 24 is formed on the periphery and upper and lower surfaces of the bracket 4, which has a rectangular parallelepiped shape and is made of a plastic material. The base body 24 includes four sides 240 and a bottom portion 243. The four side walls 240 and the bottom portion 243 together define a receiving cavity 30. The side wall 24 includes an upper portion 241 and a lower portion 242. The lower portion 242 of the opposite side wall 240 is adjacent to the side of the receiving cavity 3, and a slope 244 is formed. The first plate 462 of the bracket 40 is embedded in the lower portion 242. The second plate 463 is fitted to the side bottom 243, and the third plate 464 is placed on the slope 244 of the lower portion 242 7 1357664 of the base body 24. The strips 42 of the brackets 4 and the beams 44 are located outside the base 24. Referring to the sixth figure, a plurality of image sensing wafers 22 are provided. An adhesive is applied to the bottom 243 of each of the substrates 24, and the plurality of image sensing wafers 22 are respectively placed on the adhesive to be fixed to the top surface of the shirt image sensing wafer 22 in the receiving cavity of the base 24. A plurality of wafer pads 224 are disposed on the periphery of the central sensing region 222. Referring to the seventh figure, the plurality of leads 26 are punched by a wire puncher. One end of each lead wire 26 is electrically connected to the wafer pad of the image sensing wafer 22=4, and the other end is electrically connected to the first plate of the conductive sheet 2〇. The signal on the 462 is such that the signal of the shirt image sensing chip 22 is transmitted to the plurality of conductive sheets 2〇. The material of the plurality of leads 26 is a metal such as gold which is highly conductive. The adhesive 34 is then applied to the periphery of the sensing region 222 at the center of the top surface of the sensing wafer 22 to coat each lead 26. Referring to the eighth figure, a light transmissive plate 28 is provided. The adhesive is applied to the top of the base body 24, and the light-transmitting plate 28 is placed on the upper portion 241 of the base body 24, thereby covering the receiving cavity 30 of the base body 24, and at the same time, the adhesive% is abutted against the light-transmitting plate 28, The sensing region 222 of the image sensing wafer 22 is thus encapsulated in a cavity 32. The light transmissive plate 28 is a light transmissive glass. Referring again to the fifth figure, the plurality of bases 24 are respectively cut out, so that the strip 42 of the bracket 40 is cut, and the first plate 462 of the conductive sheet 2 is cut, and the two sides of the same beam 44 are cut. The conductive sheets 2 are respectively located in the two pre-packages 2 to form a single pre-package 2. At this time, the end portion of the conductive sheet 20 is exposed to the substrate 24 to be exposed to the air, as shown in Fig. 9. 8 1357664 Please refer to the ninth figure, using fusion welding technology, such as ultrasonic welding, splicing, heat welding, etc., to weld the edge of the substrate 24, and the sheet 20 is wrapped in the substrate 24 to reach Better coating effect. It can be understood that the process of dividing each of the substrates 24 can be advanced until the substrate 24 is formed and pasted with the image sensing wafer 22; the formation of the adhesive %2 can be simultaneously performed with the cover of the transparent plate 28, whereby the adhesive 34 can be tight ^
地黏附於透光板28上，從而保證空腔32之密封，減= 粉塵等。 / V • 綜上所述，本發明確已符合發明專利之要件，遂依The ground adheres to the light-transmitting plate 28, thereby ensuring the sealing of the cavity 32, minus = dust and the like. / V • In summary, the invention has indeed met the requirements of the invention patent, and converted
法提出專利申請。惟，以上所述者僅為本發明之較佳^ 施方式，自不能以此限制本案之申請專利範圍。舉凡熟 悉本案技藝之人士援依本發明之精神所作之等效修飾或 羑化，皆應涵蓋於以下申請專利範圍内。 S 【圖式簡單說明】 第一圖係習知影像感測晶片之封裝結構圖； 第二圖係本發明較佳實施方式之影像感測晶 籲結構圖； 7装 第三圖係本發明較佳實施方式之支架結構圖； 第四圖係第三圖沿IV-JV向剖視圖； 第五圖係本發明較佳實施方式支架與基體成型 圖；· 忍The law filed a patent application. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or modifications made by those skilled in the art in light of the spirit of the present invention are intended to be included within the scope of the following claims. S [Simplified description of the drawings] The first figure is a package structure diagram of a conventional image sensing chip; the second figure is an image sensing crystal frame of the preferred embodiment of the present invention; FIG. 4 is a cross-sectional view taken along line IV-JV; FIG. 5 is a view showing a bracket and a base forming diagram of a preferred embodiment of the present invention;
第六圖係本發明較佳實施方式之影像感測晶片 部分組裝圖； I 第七圖係本發明較佳實施方式影像感測晶片封 線黏膠後之結構圖； 、 9 1357664 第八圖係本發明較佳實施方式影像感測晶片封裝加 透光板之結構圖； 第九圖係本發明較佳實施方式影像感測晶片封裝熔 接之結構圖。 【主要組件符號說明】 預封裝體 2 導電片 20 影像感測晶片 22 感測區 222 晶片焊墊 224 基體 24 側壁 240 上部 241 下部 242 底部 243 斜面 244 引線 26 透光板 28 容置腔 in 空腔 32 黏膠 34 支架 40 料帶 42 橫樑 44 導電片 46 第一板 462 第二板 463 第三板 4646 is a partial assembly diagram of an image sensing wafer according to a preferred embodiment of the present invention; and FIG. 7 is a structural diagram of an image sensing wafer sealing tape after the preferred embodiment of the present invention; 9 1357664 A preferred embodiment of the present invention is a structural diagram of an image sensing chip package and a light transmissive plate. The ninth drawing is a structural view of a preferred embodiment of the image sensing chip package. [Main component symbol description] Pre-package 2 Conductive sheet 20 Image sensing wafer 22 Sensing area 222 Wafer pad 224 Substrate 24 Side wall 240 Upper part 241 Lower part 242 Bottom part 243 Slope 244 Lead 26 Translucent plate 28 容 cavity in cavity 32 Adhesive 34 Bracket 40 Tape 42 Beam 44 Conductive sheet 46 First board 462 Second board 463 Third board 464