TWI350427B - Radiation-sensitive resin composition - Google Patents
Radiation-sensitive resin compositionInfo
- Publication number
- TWI350427B TWI350427B TW093126944A TW93126944A TWI350427B TW I350427 B TWI350427 B TW I350427B TW 093126944 A TW093126944 A TW 093126944A TW 93126944 A TW93126944 A TW 93126944A TW I350427 B TWI350427 B TW I350427B
- Authority
- TW
- Taiwan
- Prior art keywords
- radiation
- resin composition
- sensitive resin
- sensitive
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
- H01B1/127—Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003319932 | 2003-09-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200510929A TW200510929A (en) | 2005-03-16 |
TWI350427B true TWI350427B (en) | 2011-10-11 |
Family
ID=34308589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093126944A TWI350427B (en) | 2003-09-11 | 2004-09-07 | Radiation-sensitive resin composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4621870B2 (en) |
KR (1) | KR101103241B1 (en) |
TW (1) | TWI350427B (en) |
WO (1) | WO2005027145A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4583917B2 (en) * | 2004-12-27 | 2010-11-17 | 株式会社フジクラ | Method for manufacturing electronic device and method for manufacturing transparent conductive circuit board |
KR101177087B1 (en) | 2004-12-27 | 2012-08-24 | 가부시키가이샤후지쿠라 | Electronic device and method for manufacturing same |
KR101438172B1 (en) | 2006-08-21 | 2014-09-11 | 아그파-게바에르트 엔.브이. | UV-photopolymerizable composition for producing organic conductive layers, patterns or prints |
JP5014750B2 (en) * | 2006-11-27 | 2012-08-29 | 信越ポリマー株式会社 | Conductive polymer paint and conductive coating film |
JP2010161013A (en) * | 2009-01-09 | 2010-07-22 | Toagosei Co Ltd | Method for manufacturing laminate having conductive resin pattern, and laminate |
JP5569144B2 (en) * | 2010-02-24 | 2014-08-13 | 日立化成株式会社 | Photosensitive conductive film, method for forming conductive film, and method for forming conductive pattern |
JP5673675B2 (en) * | 2010-04-26 | 2015-02-18 | コニカミノルタ株式会社 | Method for producing transparent electrode, transparent electrode and organic electronic device |
JP5741581B2 (en) * | 2010-07-29 | 2015-07-01 | コニカミノルタ株式会社 | Transparent conductive film and organic electroluminescence element |
JP6977246B2 (en) * | 2015-12-04 | 2021-12-08 | 東ソー株式会社 | Antistatic thin film and antistatic aqueous solution |
JP6436511B2 (en) * | 2017-04-26 | 2018-12-12 | 株式会社ジャパンディスプレイ | Capacitive touch panel manufacturing method |
JP6541201B2 (en) * | 2018-09-11 | 2019-07-10 | 株式会社ジャパンディスプレイ | Method of manufacturing capacitive touch panel |
US11971659B2 (en) | 2018-10-08 | 2024-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist composition and method of forming photoresist pattern |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6226268A (en) * | 1985-07-26 | 1987-02-04 | Mitsubishi Chem Ind Ltd | Organic semiconductor |
JPS62123444A (en) | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | Radiation sensitive resinous composition |
EP0686662B2 (en) * | 1994-05-06 | 2006-05-24 | Bayer Ag | Conductive coatings |
EP1474725A1 (en) * | 2002-02-05 | 2004-11-10 | Koninklijke Philips Electronics N.V. | Photo-sensitive composition |
JP2003241370A (en) * | 2002-02-15 | 2003-08-27 | Nippon Telegr & Teleph Corp <Ntt> | Photosensitive composition and method for producing electroconductive composition using the same |
-
2004
- 2004-08-20 JP JP2005513829A patent/JP4621870B2/en not_active Expired - Fee Related
- 2004-08-20 KR KR1020067004859A patent/KR101103241B1/en active IP Right Grant
- 2004-08-20 WO PCT/JP2004/012338 patent/WO2005027145A1/en active Application Filing
- 2004-09-07 TW TW093126944A patent/TWI350427B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200510929A (en) | 2005-03-16 |
JP4621870B2 (en) | 2011-01-26 |
JPWO2005027145A1 (en) | 2006-11-24 |
KR101103241B1 (en) | 2012-01-12 |
WO2005027145A1 (en) | 2005-03-24 |
KR20060133959A (en) | 2006-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |