TWI349319B - Structure with embedded circuit and process thereof - Google Patents
Structure with embedded circuit and process thereofInfo
- Publication number
- TWI349319B TWI349319B TW096124690A TW96124690A TWI349319B TW I349319 B TWI349319 B TW I349319B TW 096124690 A TW096124690 A TW 096124690A TW 96124690 A TW96124690 A TW 96124690A TW I349319 B TWI349319 B TW I349319B
- Authority
- TW
- Taiwan
- Prior art keywords
- embedded circuit
- embedded
- circuit
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096124690A TWI349319B (en) | 2007-07-06 | 2007-07-06 | Structure with embedded circuit and process thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096124690A TWI349319B (en) | 2007-07-06 | 2007-07-06 | Structure with embedded circuit and process thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200903672A TW200903672A (en) | 2009-01-16 |
TWI349319B true TWI349319B (en) | 2011-09-21 |
Family
ID=44722174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096124690A TWI349319B (en) | 2007-07-06 | 2007-07-06 | Structure with embedded circuit and process thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI349319B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10433426B2 (en) | 2017-10-25 | 2019-10-01 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
US10477701B2 (en) | 2017-10-25 | 2019-11-12 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI384925B (en) * | 2009-03-17 | 2013-02-01 | Advanced Semiconductor Eng | Structure of embedded-trace substrate and method of manufacturing the same |
TWI405514B (en) * | 2009-12-22 | 2013-08-11 | Unimicron Technology Corp | Method for fabricating wiring structure of wiring board |
US9491866B2 (en) | 2010-07-08 | 2016-11-08 | Lg Innotek Co., Ltd. | Method for manufacturing a printed circuit board |
TWI419277B (en) * | 2010-08-05 | 2013-12-11 | Advanced Semiconductor Eng | Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereof |
TWI506738B (en) * | 2011-06-09 | 2015-11-01 | Unimicron Technology Corp | Semiconductor package and fabrication method thereof |
TWI533424B (en) | 2012-04-26 | 2016-05-11 | 旭德科技股份有限公司 | Package carrier |
-
2007
- 2007-07-06 TW TW096124690A patent/TWI349319B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10433426B2 (en) | 2017-10-25 | 2019-10-01 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
US10477701B2 (en) | 2017-10-25 | 2019-11-12 | Unimicron Technology Corp. | Circuit board and method for manufacturing the same |
US10729014B2 (en) | 2017-10-25 | 2020-07-28 | Unimicron Technology Corp. | Method for manufacturing circuit board |
US10813231B2 (en) | 2017-10-25 | 2020-10-20 | Unimicron Technology Corp. | Method for manufacturing circuit board |
Also Published As
Publication number | Publication date |
---|---|
TW200903672A (en) | 2009-01-16 |
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