TWI348408B - Laser processing device - Google Patents

Laser processing device

Info

Publication number
TWI348408B
TWI348408B TW094113232A TW94113232A TWI348408B TW I348408 B TWI348408 B TW I348408B TW 094113232 A TW094113232 A TW 094113232A TW 94113232 A TW94113232 A TW 94113232A TW I348408 B TWI348408 B TW I348408B
Authority
TW
Taiwan
Prior art keywords
processing device
laser processing
laser
processing
Prior art date
Application number
TW094113232A
Other languages
English (en)
Other versions
TW200538223A (en
Inventor
Yukio Eda
Sadashi Adachi
Norio Kurita
Tetsuya Osajima
Original Assignee
Olympus Corp
Hamamatsu Photonics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004132995A external-priority patent/JP4681821B2/ja
Priority claimed from JP2004132997A external-priority patent/JP4686135B2/ja
Application filed by Olympus Corp, Hamamatsu Photonics Kk filed Critical Olympus Corp
Publication of TW200538223A publication Critical patent/TW200538223A/zh
Application granted granted Critical
Publication of TWI348408B publication Critical patent/TWI348408B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Laser Surgery Devices (AREA)
  • Microscoopes, Condenser (AREA)
  • Lenses (AREA)
TW094113232A 2004-04-28 2005-04-26 Laser processing device TWI348408B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004132995A JP4681821B2 (ja) 2004-04-28 2004-04-28 レーザ集光光学系及びレーザ加工装置
JP2004132997A JP4686135B2 (ja) 2004-04-28 2004-04-28 レーザ加工装置

Publications (2)

Publication Number Publication Date
TW200538223A TW200538223A (en) 2005-12-01
TWI348408B true TWI348408B (en) 2011-09-11

Family

ID=35241817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113232A TWI348408B (en) 2004-04-28 2005-04-26 Laser processing device

Country Status (5)

Country Link
US (2) US7333255B2 (zh)
EP (1) EP1684109B1 (zh)
KR (1) KR100789538B1 (zh)
TW (1) TWI348408B (zh)
WO (1) WO2005106564A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200538758A (en) * 2004-04-28 2005-12-01 Olympus Corp Laser-light-concentrating optical system
TWI348408B (en) * 2004-04-28 2011-09-11 Olympus Corp Laser processing device
JP4749799B2 (ja) * 2005-08-12 2011-08-17 浜松ホトニクス株式会社 レーザ加工方法
JP5101869B2 (ja) * 2006-11-15 2012-12-19 株式会社ディスコ ウエーハの加工方法
JP4402708B2 (ja) 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
US20100012714A1 (en) * 2008-07-15 2010-01-21 Kelly Weesner Environmentally conscious, socially responsible greeting card with integrated gift
JP5692969B2 (ja) 2008-09-01 2015-04-01 浜松ホトニクス株式会社 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム
JP5254761B2 (ja) 2008-11-28 2013-08-07 浜松ホトニクス株式会社 レーザ加工装置
JP5479925B2 (ja) 2010-01-27 2014-04-23 浜松ホトニクス株式会社 レーザ加工システム
KR101156018B1 (ko) * 2011-11-06 2012-06-18 아이오솔루션(주) 이산화탄소 레이저 가공장치용 에프세타 렌즈계
KR101309805B1 (ko) * 2011-12-28 2013-09-23 주식회사 이오테크닉스 인고트 절단 방법
WO2014164929A1 (en) * 2013-03-11 2014-10-09 Kla-Tencor Corporation Defect detection using surface enhanced electric field
JP6134862B2 (ja) * 2015-02-20 2017-05-24 技術研究組合次世代３Ｄ積層造形技術総合開発機構 光加工ヘッド、光加工装置およびその制御方法ならびに制御プログラム
KR102410583B1 (ko) * 2016-03-10 2022-06-17 하마마츠 포토닉스 가부시키가이샤 레이저광 조사 장치 및 레이저광 조사 방법
JP6670786B2 (ja) * 2017-03-23 2020-03-25 キオクシア株式会社 ダイシング方法及びレーザー加工装置
JP6959073B2 (ja) * 2017-08-30 2021-11-02 株式会社ディスコ レーザー加工装置
US20190151993A1 (en) * 2017-11-22 2019-05-23 Asm Technology Singapore Pte Ltd Laser-cutting using selective polarization
CN108227169A (zh) * 2018-03-19 2018-06-29 深圳市恩兴实业有限公司 一种激光焊接镜头结构以及激光焊接设备
JP6920540B2 (ja) * 2018-03-23 2021-08-18 Ｐｒｉｍｅｔａｌｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｊａｐａｎ株式会社 レーザ加工ヘッド及びレーザ加工装置並びにレーザ加工ヘッドの調整方法
CN109765213B (zh) * 2019-03-27 2024-03-29 苏州威邦震电光电技术有限公司 相干反斯托克斯拉曼散射显微镜成像装置
JP7103991B2 (ja) * 2019-04-19 2022-07-20 ファナック株式会社 レーザ加工機の焦点位置ずれを学習する機械学習装置及び機械学習方法、並びに焦点位置ずれを補正するレーザ加工システム
EP4260131A1 (en) * 2020-12-08 2023-10-18 Electro Scientific Industries, Inc. Optical relay system and methods of use and manufacture

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2096880A1 (en) * 1970-06-11 1972-03-03 Mitsubishi Electric Corp Laser beam machining appts - automatically adjusted using control beam passing through semi-transparent mirrors
US3689159A (en) 1970-06-11 1972-09-05 Mitsubishi Electric Corp Laser processing apparatus
US4546231A (en) * 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
JPS6267689A (ja) 1985-09-19 1987-03-27 オムロン株式会社 自動手続処理システム
JPS6267689U (zh) * 1985-10-18 1987-04-27
JPS63271731A (ja) * 1987-04-30 1988-11-09 Hitachi Ltd 光ヘツドの焦点制御方法
US5272552A (en) * 1988-05-11 1993-12-21 Canon Kabushiki Kaisha Optical modulation device and method using modulation layer of helical polymer liquid crystal having a helical chiral smectic C phase
JPH04327394A (ja) * 1991-04-30 1992-11-16 Amada Co Ltd 光移動型レーザ加工機
JP3280402B2 (ja) 1991-10-28 2002-05-13 オリンパス光学工業株式会社 顕微鏡対物レンズ
US5637244A (en) * 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
DE9407288U1 (de) 1994-05-02 1994-08-04 Trumpf Gmbh & Co, 71254 Ditzingen Laserschneidmaschine mit Fokuslageneinstellung
US6087617A (en) 1996-05-07 2000-07-11 Troitski; Igor Nikolaevich Computer graphics system for generating an image reproducible inside optically transparent material
DE19655127C2 (de) * 1996-07-25 2001-09-27 Precitec Gmbh Anschlußkopf zur Bearbeitung eines Werkstücks mittels eines Laserstrahls
US6392683B1 (en) * 1997-09-26 2002-05-21 Sumitomo Heavy Industries, Ltd. Method for making marks in a transparent material by using a laser
JP2000071088A (ja) * 1998-08-27 2000-03-07 Nisshinbo Ind Inc レ−ザ加工機
US6075656A (en) * 1998-11-09 2000-06-13 Eastman Kodak Company High numerical aperture objective lens
JP4441831B2 (ja) 1999-09-16 2010-03-31 株式会社ニコン 顕微鏡装置
JP4380004B2 (ja) * 2000-02-28 2009-12-09 ソニー株式会社 記録媒体の製造方法、および記録媒体製造用原盤の製造方法
US6495794B2 (en) * 2001-01-31 2002-12-17 Hanmin Shi Rapid prototyping method using 3-D laser inner cutting
JP3587805B2 (ja) * 2001-07-30 2004-11-10 松下電器産業株式会社 レーザ加工装置
JP2003175497A (ja) 2001-12-13 2003-06-24 Japan Science & Technology Corp 光ピンセット捕捉力強化光学系
JP2005129851A (ja) * 2003-10-27 2005-05-19 Disco Abrasive Syst Ltd レーザ光線を利用した加工方法
TW200538758A (en) * 2004-04-28 2005-12-01 Olympus Corp Laser-light-concentrating optical system
TWI348408B (en) * 2004-04-28 2011-09-11 Olympus Corp Laser processing device
JP4354376B2 (ja) * 2004-09-28 2009-10-28 株式会社ディスコ レーザ加工装置
US7366378B2 (en) * 2004-10-29 2008-04-29 Matsushita Electric Industrial Co., Ltd. Ultrafast laser machining system and method for forming diffractive structures in optical fibers

Also Published As

Publication number Publication date
EP1684109B1 (en) 2013-06-26
WO2005106564A1 (ja) 2005-11-10
KR20070005928A (ko) 2007-01-10
KR100789538B1 (ko) 2007-12-28
US8022332B2 (en) 2011-09-20
EP1684109A1 (en) 2006-07-26
TW200538223A (en) 2005-12-01
US7333255B2 (en) 2008-02-19
EP1684109A4 (en) 2007-06-13
US20060228095A1 (en) 2006-10-12
US20080029497A1 (en) 2008-02-07

Similar Documents

Publication Publication Date Title
TWI348408B (en) Laser processing device
TWI366493B (en) Laser processing method
EP1905529A4 (en) HYBRID LASER PROCESSING DEVICE
EP2070634A4 (en) LASER PROCESSING DEVICE
EP1944118A4 (en) LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
GB2422654B (en) Superconduction-technology device
EP1811550A4 (en) LASER PROCESSING PROCESS
HK1096751A1 (en) Information processing device
HK1253017A1 (zh) 裝置
EP1724617A4 (en) OPTICAL EQUIPMENT
HK1104126A1 (en) Battery-recharging device
HK1080130B (zh) 一種工具轉換裝置
GB0424882D0 (en) Device
IL175893A0 (en) Anti-roosting device
EP1701469A4 (en) INFORMATION PROCESSING DEVICE
EP1795930A4 (en) OPTICAL DEVICE
GB0522974D0 (en) Hand-held laser device
GB0409197D0 (en) Device
GB2412235B (en) An optoelectronic device
GB0415190D0 (en) Device
GB2410441B (en) Magnotherapy device
GB0403081D0 (en) Cutting device
HK1108590A1 (en) Information processing device
GB2419154B (en) Strap-adjusting device
GB0413143D0 (en) Device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees