TWI347690B - Package and manufacturing method thereof - Google Patents

Package and manufacturing method thereof

Info

Publication number
TWI347690B
TWI347690B TW096125471A TW96125471A TWI347690B TW I347690 B TWI347690 B TW I347690B TW 096125471 A TW096125471 A TW 096125471A TW 96125471 A TW96125471 A TW 96125471A TW I347690 B TWI347690 B TW I347690B
Authority
TW
Taiwan
Prior art keywords
package
manufacturing
Prior art date
Application number
TW096125471A
Other languages
Chinese (zh)
Other versions
TW200903854A (en
Inventor
Chih Wei Lin
Yun Yi Tien
Chieh Hsiu Lin
yu huan Liu
I Jeng Chen
Chihlin Wang
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW096125471A priority Critical patent/TWI347690B/en
Publication of TW200903854A publication Critical patent/TW200903854A/en
Application granted granted Critical
Publication of TWI347690B publication Critical patent/TWI347690B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
TW096125471A 2007-07-12 2007-07-12 Package and manufacturing method thereof TWI347690B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096125471A TWI347690B (en) 2007-07-12 2007-07-12 Package and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096125471A TWI347690B (en) 2007-07-12 2007-07-12 Package and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200903854A TW200903854A (en) 2009-01-16
TWI347690B true TWI347690B (en) 2011-08-21

Family

ID=44722210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096125471A TWI347690B (en) 2007-07-12 2007-07-12 Package and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI347690B (en)

Also Published As

Publication number Publication date
TW200903854A (en) 2009-01-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees