TWI347646B - Wafer transfer apparatus - Google Patents
Wafer transfer apparatusInfo
- Publication number
- TWI347646B TWI347646B TW096149062A TW96149062A TWI347646B TW I347646 B TWI347646 B TW I347646B TW 096149062 A TW096149062 A TW 096149062A TW 96149062 A TW96149062 A TW 96149062A TW I347646 B TWI347646 B TW I347646B
- Authority
- TW
- Taiwan
- Prior art keywords
- transfer apparatus
- wafer transfer
- wafer
- transfer
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096149062A TWI347646B (en) | 2007-12-20 | 2007-12-20 | Wafer transfer apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096149062A TWI347646B (en) | 2007-12-20 | 2007-12-20 | Wafer transfer apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200929421A TW200929421A (en) | 2009-07-01 |
TWI347646B true TWI347646B (en) | 2011-08-21 |
Family
ID=44864475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096149062A TWI347646B (en) | 2007-12-20 | 2007-12-20 | Wafer transfer apparatus |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI347646B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI547427B (en) * | 2013-08-06 | 2016-09-01 | 台灣積體電路製造股份有限公司 | Wafer transfer robot, robot blade for a wafer transfer robot, and method of transferring a substrate |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI562269B (en) * | 2014-01-22 | 2016-12-11 | Taiwan Semiconductor Mfg Co Ltd | Wafer transfer device and wafer transfer method with calitration function |
CN104505361B (en) * | 2014-12-30 | 2017-10-24 | 苏州日月新半导体有限公司 | Wafer transfer tool |
-
2007
- 2007-12-20 TW TW096149062A patent/TWI347646B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI547427B (en) * | 2013-08-06 | 2016-09-01 | 台灣積體電路製造股份有限公司 | Wafer transfer robot, robot blade for a wafer transfer robot, and method of transferring a substrate |
Also Published As
Publication number | Publication date |
---|---|
TW200929421A (en) | 2009-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |