1345529 . · ‘九、發明說明： 【發明所屬之技術領域】 本發明涉及一種殼體及表面處理方法，尤其係一種帶 有塗層之殼體及表面處理方法。 【先前技術】 隨著電子產品之快速發展’攜帶式電子裝置（如行動 電話、MP3播放器、個人數位助理）之使用已非常普遍。並 且為使攜帶式電子裝置之具有較好之外觀以及手感，攜帶 鲁式電子裝置常會使用各種各樣之材質來做殼體。 例如為使攜帶式電子裝置具有金屬外觀，會用金屬材 料來做攜帶式電子裝置之殼體。惟，儘管金屬具有較高之 表面強度，但由於金屬殼體之外表面直接暴露於空氣中， 因此於一段時間使用後，其仍容易被到傷、磨損及氧化。 並且金屬之硬度較高、柔軟度不足，還容易造成金屬殼體 手感不佳。 • 為避免金屬殼體被到傷、磨損及氧化及提升金屬殼體 之手感，習知技術中會採用於金屬殼體上塗佈面漆形成外 覆層來保濩金屬表面及提升殼體之柔軟度。外覆層可對金 屬表面起到一定保護作用，但使用一段時間後，外覆層本 身卻容易發生脫落、腐蝕，而仍影響產品之外觀。 【發明内容】 雲於以上内容’有必要提供一種可避免塗層損壞而影 響外觀之殼體及表面處理方法。 一種殼體’其包括一金屬基材及形成於該金屬基材表 1345529 . · .面之塗層，該塗層包括處於外表面之外覆層，其中該塗層 還包括一黏合層，其位於該外覆層與該金屬基材之間且與 該外覆層相連。 一種表面處理方法，於一金屬基材表面塗佈黏合劑， 形成黏合層；及於該黏合層上塗佈面漆，形成外覆層。 另一種表面處理方法，於一金屬基材表面塗佈底漆， 形成一底層；於該底層沈積一鍍膜層；於該鍍膜層上塗佈 黏合劑，形成一黏合層；及於該黏合層上塗佈面漆，形成 •外覆層。 上述殼體之塗層包括黏合層，黏合層可增強外覆層於 金屬基材上之結合力，因此可防止或減少外覆層於使用時 脫落，從而避免該塗層損壞，確保產品具有較好之外觀。 【實施方式】 下面將結合附圖及實施例對殼體及表面處理方法做 進一步詳細說明。 • 請參閱圖i，所示為本發明較佳實施方式一之殼體 1〇，其可用於攜帶式電子裝置。殼體1〇包括金屬基材12 及形成於金屬基材12表面之塗層14。塗層14包括與金屬 基材12表面相連接之鍍膜層142，形成於鍍膜層142上之 黏合層144,及形成於黏合層144上且處於外表面之外覆 層146。其中，鍍膜層142之厚度可為1〇奈米至1〇微米， 黏合層144之厚度可為丄微米至2〇微米，外覆層146之厚 度可為10微米至80微米。 金屬基材12之材質可為鋁合金、鎂合金、不銹鋼及 1345529 ♦ · •其他金屬之一或其組合物。此外，為確保殼體10具有較好 . 之外觀，金屬基材12與鍍膜層142相接之表面最好較為光 滑。 鍍膜層142可為導電層或電絕緣層，其材質可為錫、 铭、<5夕銘合金、鈦、碳化鈦、氮化鈦、錫、銦、二氧化石夕 及不錄鋼之一或其組合物。 黏合層144之材質可由含氣聚浠烴（如聚氯乙烯，聚 氣丙稀）構成，或由重量比為1%至99%之含氯聚烯烴及其 • 他材質構成，該其他材質可為羥基聚合物、胺基聚合物、 羧基聚合物及環氧基聚合物之一或其組合。 外覆層146之主要成分可為丙烯酸樹脂。 一種可製備殼體10之表面處理方法包括以下步驟： 步驟一，於金屬基材12之表面真空沈積一鍍膜層 142。沈積之方式可為物理氣相沈積（Physical Vapor Deposition)、絕緣真空鍍膜（Non Conductive Vacuum • Metallization)或化學氣相沈積（Chemical Vapor Deposition)。其中當採用物理氣相沈積或絕緣真空鍍膜形 成鍍膜層142時，可用錫、鋁、矽鋁合金、鈦、碳化鈦、 氮化鈦、錫、銦、二氧化^夕及不錄鋼之一或其組合物為乾 材，用磁控濺射、等離子濺鍍或蒸鍍之方式把靶材沈積到 金屬基材12上形成鍍膜層142。需要重點說明：用絕緣真 空鍍膜方法沈積之鍍膜層142可為電絕緣層。 步驟二，於鍍膜層142上塗佈黏合劑，形成一黏合層 144。該步驟可於常溫下進行。該黏合劑可全部由含氯聚烯 1345529 •煙構成（如聚氣乙烯，聚氯丙稀）’或由重量比為1%至99% - 之含氣聚烯烴及其他物質構成，該其他物質可為羥基聚合 .物、胺基聚合物、羧基聚合物、環氧基聚合物之一或其組 合0 步驟三，於黏合層144上塗佈面漆，形成一外覆層 146。其中塗佈方式可為喷塗或手塗。該面漆可以係透明漆 或色漆’一般選用主要成分為丙烯酸樹脂之面漆。將面漆 塗佈於黏合層144上後，可再依次經過流平、固化等步驟 >來形成外覆層146。固化方式可為熱固化或光固化，例如 當該面漆為紫外線固化漆時，面漆之固化就採用紫外線固 化。 上述殼體10’由於於鍍膜層142與外覆層146之間形 成有黏合層144，黏合層144可增強鍍膜層142與外覆層 146之間之結合力，因此可防止或減少外覆層ι46於使用 時脫落，避免錄膜層142被損壞’從而確保產品具有較好 p 之外觀。 具體於本實施方式中，黏合層144包括含氯聚烯烴， 含氯聚烯烴之氣可與鍍膜層142中之金屬原子相作用形成 具有較強作用力之化學鍵，且含氣聚浠烴中之有機分子鏈 可與外覆層146之有機分子鏈相互吸引形成較強之結合 力’因此黏合層144可使外覆層146與鍍膜層142之結合 力增強’從而防止外覆層146從金屬基材12上脫落，避免 或減少鍍膜層142被氧化或腐蝕。並且由於黏合層144係 由聚合物材料組成，其還具有一定之彈性，因此會增加處 上345529 外覆層146之柔軟度，從而提升殼體之手感。 之乾材:二殼體10之表面處理過程中，通過使用不同 體t材來拖尤積鑛膜層142或改變面漆之顏色，還易於對殼 之顏色進行變更，從而滿足不同之外觀需求。以 线膜法形成絕緣鑛膜層142時，絕⑽膜層142 之=穿過’因此其0影_帶式電子裝置既定 之射頻（RF)性能與電磁相容（ESD)性能。 凊參閱圖2，所示為本發明較佳實施方式二之殼體 加。殼體20與殼體10相似，包括金屬基材肢塗乂體 塗層24包括鍍膜層242、黏合層⑽及外㈣⑽，苴不 =在於··塗層24還包括-底層241。底㉟241形成於金 屬基材22之表面，處於金屬基材22與鍍臈層242之間。 底層如之厚度可為！微米至3〇微米。表面處理過程係先 於金屬基材22上塗佈底漆，並依次經過流平、固化等步驟 形成底層241，然後再依次於底層241沈積鍍膜層242，塗 佈黏合劑形成黏合層244及塗佈面漆形成外覆層246。其 中底漆之主要成分可為丙婦酸樹脂，固化方式可為熱固化 或光固化。可以理解，於殼體2〇中，由於存在底層”241， 因此金屬基材22與底層241之相接表面即使為粗糙面也可 確保殼體20具有較好之外觀。 可以理解，若金屬基材表面外觀較好，且具有一定的 化學活性時’殼體可無需鍍膜層。如圖3所示，殼體3〇 包括金屬基材32及形成於金屬基材32表面之塗層34。塗 層34包括與金屬基材32表面直接相連接之黏合層344， 1345529 處理過程係先於金屬基材32上$ 及塗佈面漆形成外覆層346。 •及形成於黏合層344上且處於外表面之外覆層346。表面 塗佈黏合劑形成黏合層344 :以理解，上述表面處理方法並不限於製備殼體，例 如其迺可用於處理部分表面處於設備外部之零件之表面。 綜上所述，本發明符合發明專利要件，妥依法提出專 利申請。$，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技藝 之人士；^板依本案發明精神所作之等效修飾或變化，皆 應包含於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明較佳實施方式一之殼體。 圖2係本發明較佳實施方式二之殼體。 圖3係本發明較佳實施方式三之殼體。 【主要元件符號說明】 殼體 金屬基材 塗層 鑛膜層 黏合層 外覆層 底層 10、20、30 12、22、32 14 、 24 、 34 142 、 242 144 、 244 、 344 146 、 246 、 346 241 111345529 . </ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [Prior Art] With the rapid development of electronic products, the use of portable electronic devices (such as mobile phones, MP3 players, personal digital assistants) has become very common. In order to make the portable electronic device have a good appearance and feel, the portable electronic device often uses a variety of materials for the housing. For example, in order for the portable electronic device to have a metallic appearance, a metal material is used as the housing of the portable electronic device. However, although the metal has a high surface strength, since the outer surface of the metal casing is directly exposed to the air, it is easily damaged, worn, and oxidized after a period of use. Moreover, the hardness of the metal is high and the softness is insufficient, and the metal casing is also likely to be inferior. • In order to avoid the metal casing being damaged, worn and oxidized and to enhance the feel of the metal casing, it is known in the prior art to apply a topcoat to the metal casing to form an outer coating to protect the metal surface and lift the casing. Softness. The outer cover can protect the surface of the metal. However, after a period of use, the outer cover itself is prone to fall off and corrode, and still affect the appearance of the product. SUMMARY OF THE INVENTION Clouds in the above are required to provide a housing and surface treatment method that can avoid coating damage and affect the appearance. A casing comprising a metal substrate and a coating formed on the surface of the metal substrate 1345529, the coating comprising a coating on the outer surface, wherein the coating further comprises an adhesive layer Located between the outer cover and the metal substrate and connected to the outer cover. A surface treatment method is characterized in that a surface of a metal substrate is coated with a binder to form an adhesive layer; and a top coat is applied on the adhesive layer to form an outer cover layer. Another surface treatment method is: applying a primer to a surface of a metal substrate to form a bottom layer; depositing a coating layer on the bottom layer; applying a binder on the coating layer to form an adhesive layer; and forming the adhesive layer on the adhesive layer Apply a top coat to form an outer cover. The coating of the above casing comprises an adhesive layer, and the adhesive layer can enhance the bonding force of the outer covering layer on the metal substrate, thereby preventing or reducing the peeling of the outer covering layer during use, thereby avoiding damage of the coating layer and ensuring that the product has a comparative advantage. Good appearance. [Embodiment] The housing and the surface treatment method will be further described in detail below with reference to the accompanying drawings and embodiments. • Referring to Figure 1, there is shown a housing 1 of a preferred embodiment of the present invention that can be used in a portable electronic device. The casing 1 includes a metal substrate 12 and a coating 14 formed on the surface of the metal substrate 12. The coating 14 includes a coating layer 142 attached to the surface of the metal substrate 12, an adhesive layer 144 formed on the coating layer 142, and a coating layer 146 formed on the bonding layer 144 and outside the outer surface. The thickness of the coating layer 142 may be from 1 nanometer to 1 micrometer, the thickness of the adhesive layer 144 may be from 丄 micrometer to 2 micrometers, and the thickness of the outer cladding layer 146 may be from 10 micrometers to 80 micrometers. The material of the metal substrate 12 may be aluminum alloy, magnesium alloy, stainless steel and 1345529 ♦ · one of the other metals or a combination thereof. Further, in order to ensure a good appearance of the casing 10, the surface of the metal substrate 12 that is in contact with the coating layer 142 is preferably smooth. The coating layer 142 can be a conductive layer or an electrically insulating layer, and the material thereof can be tin, ming, <5 夕 铭 alloy, titanium, titanium carbide, titanium nitride, tin, indium, sulphur dioxide, and one of the unrecorded steels. Or a composition thereof. The material of the adhesive layer 144 may be composed of a gas-containing polysulfonated hydrocarbon (such as polyvinyl chloride, polypropylene) or a chlorine-containing polyolefin with a weight ratio of 1% to 99% and other materials. It is one of a hydroxyl polymer, an amine based polymer, a carboxyl polymer, and an epoxy polymer or a combination thereof. The main component of the outer cover 146 may be an acrylic resin. A surface treatment method for preparing the casing 10 includes the following steps: Step 1: A coating layer 142 is vacuum deposited on the surface of the metal substrate 12. The deposition method may be physical Vapor Deposition, Non Conductive Vacuum (Metalization) or Chemical Vapor Deposition. When the coating layer 142 is formed by physical vapor deposition or insulating vacuum coating, one of tin, aluminum, bismuth aluminum alloy, titanium, titanium carbide, titanium nitride, tin, indium, oxidized, and unrecorded steel may be used. The composition is a dry material, and the target layer is deposited on the metal substrate 12 by magnetron sputtering, plasma sputtering or evaporation to form a plating layer 142. It is important to note that the coating layer 142 deposited by the insulating vacuum coating method may be an electrically insulating layer. In step two, an adhesive is applied to the coating layer 142 to form an adhesive layer 144. This step can be carried out at room temperature. The binder may be composed entirely of chlorinated polyene 1345529 • smoke (such as polyethylene, polychloropropene) or a gas-containing polyolefin and other materials in a weight ratio of 1% to 99%. It may be a hydroxyl polymer, an amine polymer, a carboxyl polymer, an epoxy polymer or a combination thereof. Step 3: Apply a top coat to the adhesive layer 144 to form an outer cover 146. The coating method can be spray coating or hand coating. The topcoat can be a clear lacquer or a lacquer. The topcoat is generally made of an acrylic resin. After the topcoat is applied to the adhesive layer 144, the outer cover layer 146 can be formed by sequentially performing steps of leveling, curing, and the like. The curing method may be thermal curing or photocuring, for example, when the topcoat is an ultraviolet curing lacquer, the curing of the topcoat is UV curing. Since the casing 10' is formed with an adhesive layer 144 between the coating layer 142 and the outer cover 146, the adhesive layer 144 can enhance the bonding force between the coating layer 142 and the outer cover 146, thereby preventing or reducing the outer cover. Ip46 falls off during use, avoiding damage to the film layer 142' to ensure that the product has a better appearance. Specifically, in the embodiment, the adhesive layer 144 includes a chlorine-containing polyolefin, and the gas of the chlorine-containing polyolefin can react with the metal atom in the coating layer 142 to form a chemical bond having a strong force, and the gas-containing polysulfonated hydrocarbon The organic molecular chain can attract the organic molecular chain of the outer cover layer 146 to form a strong bonding force. Therefore, the adhesive layer 144 can enhance the bonding force between the outer cover layer 146 and the plating layer 142 to prevent the outer cover layer 146 from the metal base. The material 12 is detached to avoid or reduce the oxidation or corrosion of the coating layer 142. And since the adhesive layer 144 is composed of a polymer material, it also has a certain elasticity, so that the softness of the outer cover 146 of the 345529 is increased, thereby enhancing the hand feeling of the casing. Dry material: During the surface treatment of the two casings 10, by using different body t materials to drag the ore film layer 142 or change the color of the topcoat, it is also easy to change the color of the shell to meet different appearance requirements. . When the insulating ore film layer 142 is formed by the wire film method, the (10) film layer 142 is traversed by its predetermined radio frequency (RF) performance and electromagnetic compatibility (ESD) performance. Referring to Figure 2, there is shown a housing of a preferred embodiment of the present invention. The housing 20 is similar to the housing 10 and includes a metal substrate limb coating. The coating 24 includes a coating layer 242, an adhesive layer (10), and an outer (four) (10), and the coating 24 further includes a bottom layer 241. The bottom 35241 is formed on the surface of the metal substrate 22 between the metal substrate 22 and the rhodium-plated layer 242. The thickness of the bottom layer can be! Micron to 3 microns. The surface treatment process is to apply a primer on the metal substrate 22, and then to form a bottom layer 241 through steps of leveling, solidification, etc., and then deposit a coating layer 242 on the bottom layer 241, apply a binder to form an adhesive layer 244, and apply The topcoat forms an outer cover 246. The main component of the primer may be a bupropion resin, which may be cured by heat or light. It can be understood that in the casing 2, since the bottom layer "241" exists, the surface of the metal substrate 22 and the bottom layer 241 can ensure a good appearance even if it is a rough surface. When the surface of the material has a good appearance and has a certain chemical activity, the casing may not require a coating layer. As shown in FIG. 3, the casing 3 includes a metal substrate 32 and a coating 34 formed on the surface of the metal substrate 32. The layer 34 includes an adhesive layer 344 that is directly bonded to the surface of the metal substrate 32. The process of processing 1345529 precedes the metal substrate 32 and forms a topcoat 346 with the topcoat. </ RTI> and is formed on the adhesive layer 344 and is The outer surface is covered by a coating 346. The surface is coated with an adhesive to form an adhesive layer 344: it is understood that the above surface treatment method is not limited to the preparation of a casing, for example, the crucible can be used to treat a surface of a part of the surface of the part outside the apparatus. The invention is in accordance with the invention patent requirements, and the patent application is filed according to the law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments. The equivalent modifications or variations made by the skilled person in the spirit of the invention are to be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a view of a preferred embodiment of the present invention. 2 is a casing of a preferred embodiment of the present invention. Fig. 3 is a casing of a preferred embodiment of the present invention. [Description of main components] Shell metal substrate coated ore film layer adhesion layer outer layer 10 , 20, 30 12, 22, 32 14 , 24 , 34 142 , 242 144 , 244 , 344 146 , 246 , 346 241 11