TWI344326B - Flexible circuit board and method for preventing flexible circuit board from thermal expansion - Google Patents

Description

1344326 九、發明說明 【發明所屬之技術領域】 本發明是有關於一種軟性電路板，且特別是有關於一種 具有熱膨脹阻障孔貫穿其中之軟性電路板、以及利用熱膨脹 阻障孔來防止軟性電路板熱膨脹之方法。 【先前技術】 捲帶式晶片載體封裝板（TCP)、覆晶薄膜軟板（c〇F)以及 軟性印刷電路板（FPC)為液晶顯示器（LCD)與有機發光顯示器 (OLED)等平面顯示裝置之驅動器積體電路（Ic)封裝時最常採 用之封裝接合膜板。利用這些封裝膜板接合顯示面板與印刷 =路板（PCB)時，it常係運用熱壓縮的方式，因而需提高反應 πη·度以利封裝臈板之電性接腳與顯示面板上之電性接腳、 或印刷電路板上之電性接腳能順利接合。 由於封裝接合時，反應溫度會上升，因此捲帶式晶片載 體封裝板、覆晶薄膜軟板以及軟性印刷電路板等封裝膜片會 因溫度上升而產生熱膨脹現象。如此一來，將嚴重影響封二 膜片之電性接腳與顯示面板或印刷電路板上之電性接腳之間 的對位，進而導致封裝接合製程之準確率與可靠度下降。 目前’在設計封裝膜片之電性接腳的佈局時，大都會考 慮因反應溫度增加所造成之膜片材料的膨脹偏移，而導入收 縮值（Shrink Va丨ue)參數，亦即縮減一般溫度下之電性接腳之 間的間距以提供膜片於熱壓合時之熱膨脹偏移空間，藉以改 善膜片材料因熱膨脹所造成之電性接腳的偏移而無法順利與 6 1344326 顯示面板或印刷電路板上之電性接腳準確接合。 然而’隨著顯示器持續朝大尺寸的趨勢發展下，封裝膜 片之尺寸也隨之增加，再加上材料之熱膨服有材料延續性而 .、，臈片較為外側上之電性接腳產生較大之熱偏移距離，因 此，使在。又δ十封裝膜片之電性接腳時雖已導入收縮值參數， 疋仍無法有效改善封裝膜片上之電性接腳與欲接合之元件 上的電性接腳的接合可靠度。 【發明内容】 因此，本發明之目的就是在提供一種軟性電路板，設有 熱膨脹阻障孔貫穿於其t，而可阻斷材料熱膨脹的延續性。 • 本發明之另一目的是在提供一種防止軟性電路板熱膨脹 .之方法，其係在基板之銲接區上的電性接腳之間或外侧設置 貫穿基板之至少一熱膨脹阻障孔，由於此熱膨脹阻障孔貫穿 ，板，因此可有效阻斷基板材料熱膨脹的延續效果進一步 提升軟丨生電路板之電性接腳與電路板及/或元件之接腳電性接 •合的可靠度。 ' 根據本發明之上述目的，提出一種軟性電路板，至少包 括：一基板；複數個電性接腳，設置在基板之銲接區（b〇nding area)上；以及至少一熱膨脹阻障孔，設置在基板之銲接區上 並貫穿此基板。 依照本發明一較佳實施例，上述之至少一熱膨脹阻障孔 係一對準標記。 根據本發明之目的，提出一種防止軟性電路板熱膨脹之 71344326 IX. Description of the Invention The present invention relates to a flexible circuit board, and more particularly to a flexible circuit board having a thermal expansion barrier hole therethrough and a thermal expansion barrier to prevent a flexible circuit The method of thermal expansion of the plate. [Prior Art] Tape and Reel Wafer Carrier Package Board (TCP), Flip Chip Soft Board (c〇F), and Flexible Printed Circuit Board (FPC) are flat display devices such as liquid crystal displays (LCDs) and organic light emitting displays (OLEDs). The package bonding film board most commonly used in the package integrated circuit (Ic) package. When these display film sheets are used to join the display panel and the printed circuit board (PCB), it is often used in the form of thermal compression, so it is necessary to increase the reaction πη·degree to facilitate the electrical pins on the package and the electricity on the display panel. The pins on the pins, or on the printed circuit board, can be joined smoothly. Since the reaction temperature rises when the package is bonded, the package film such as the tape-wound wafer carrier package, the chip-on-film flexible board, and the flexible printed circuit board may thermally expand due to an increase in temperature. As a result, the alignment between the electrical pins of the sealing film and the electrical pins on the display panel or the printed circuit board is seriously affected, thereby causing a decrease in the accuracy and reliability of the package bonding process. At present, when designing the layout of the electrical pins of the packaged diaphragm, the expansion of the diaphragm material caused by the increase of the reaction temperature is considered, and the Shrink Va丨ue parameter is introduced, that is, the reduction is generally The spacing between the electrical pins at the temperature to provide the thermal expansion offset space of the diaphragm during thermal compression, thereby improving the offset of the electrical material caused by thermal expansion of the diaphragm material and failing to be smoothly displayed with 6 1344326 The electrical pins on the panel or printed circuit board are accurately joined. However, as the display continues to move toward the trend of large size, the size of the package film also increases, and the thermal expansion of the material has material continuity, and the electrical pins on the outer side of the chip. Produces a large thermal offset distance and, therefore, makes it. In addition, although the shrinkage value parameter has been introduced in the electrical pin of the δ-encapsulated film, the bonding reliability of the electrical pin on the package film and the electrical pin on the component to be bonded cannot be effectively improved. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a flexible circuit board having a thermal expansion barrier aperture extending through its t to interrupt the continuity of thermal expansion of the material. A further object of the present invention is to provide a method of preventing thermal expansion of a flexible circuit board by providing at least one thermal expansion barrier through the substrate between or outside the electrical pins on the pads of the substrate. The thermal expansion barrier hole penetrates through the board, so that the continuation effect of the thermal expansion of the substrate material can be effectively blocked, and the reliability of the electrical connection between the electrical pins of the soft-generated circuit board and the pins of the circuit board and/or components can be further improved. According to the above object of the present invention, a flexible circuit board is provided, comprising: at least: a substrate; a plurality of electrical pins disposed on a bonding area of the substrate; and at least one thermal expansion barrier hole, The substrate is passed over the land of the substrate. In accordance with a preferred embodiment of the present invention, at least one of the thermal expansion barrier apertures is an alignment mark. According to the purpose of the present invention, a thermal expansion preventing of a flexible circuit board is proposed.

Claims (1)

1344326 申請專利範 1. 一種軟性電路板，至少包括： 一基板； 銲接區（bonding 複數個電性接腳H㈣基板之一 area)上；以及 之違鲜接區上並貫 至少一熱膨脹阻障孔，設置在該基板 穿該基板。 2. 如申請專利範圍第！項所述之軟性電路板，其中該 至少一熱膨脹阻障孔係一對準標記。 3. 如申請專利範圍第i項所述之軟性電路板，其中該 至少一熱膨脹阻障孔係一虛設接腳（Dummy pin) ^ 4·如申請專利範圍第1項所述之軟性電路板，其中該 至少一熱膨脹阻障礼係位於該些電性接腳之間。 5.如申4專利範圍第1項所述之軟性電路板，其中該 至少一熱膨脹阻障孔係位於該些電性接腳之外側。 6.如申請專利範圍第1項所述之軟性電路板，其中該至 少一熱膨脹阻障孔係位於該軟性電路板之一訊號輸入端與 一訊號輸出端’且該訊號輸入端與該訊號輸出端係分別位於 13 1344326 該軟性電路板之兩端β 7.如申β專利範圍第〗項所述之軟性電路板其中該軟 性電路板係一捲帶式晶片載體封裝板（tcp)。’、 8’如申π專利範圍第1項所述之軟性電路板，其中該 軟性電路板係一覆晶薄膜軟板（c〇F) ^ 9. 如申叫專利範圍第丨項所述之軟性電路板，其中該 軟性電路板係一軟性印刷電路板（Fpc) ^ 10. 一種防止軟性電路板熱膨脹之方法，至少包括： 提供一基板； 設置複數個電性接腳於該基板之—銲接區（bonding are a)上；以及 設置至少-㈣脹阻障孔於該基板之該辉接區中，其中 該至少一熱膨脹阻障孔貫穿該基板。 ^ 11·如申請專利範圍第10項所述之防止軟性電路板熱 膨脹之方法，纟中該至少-熱膨脹阻障孔係—對準標記。 12·如申請專㈣圍第u項所述之防止軟性電路板熱 膨脹之方法，其中設置該些對準標記之步驟至少包括： 設置複數個金屬層於該基板上；以及 14 1344326 :穿該些金屬廣與下方之該基板，以在該些金屬層與該 基板中形成該些對準標記。 膝脹4利範圍第12項所述之防止軟性電路板熱 /服之方法，其中設置該 眉 金屬層步驟與設置該些電性接 腳之步驟同時進行。 膨脹之方法，其中 如申π專利範圍第！ 2項所述之防止軟性電路板熱 忒些金屬層之材質為銅、錫或銅錫合金 圍第10項所述之防止軟性電路板熱 1 5.如申請專利範 膨脹之方法，^ ^ ，、中該至少一熱膨脹阻障孔係一虛設接腳。 农具中该至少一熱膨脹阻障孔位於該些電接腳 膨脹阻障孔位於該些電性接腳 ，詩請專利範㈣1G項所述之防止軟性電路板執 ,膨脹之方法，其中該至少一执 〆 «、，、 之外側。 1 8.如申請專利範圍第丨〇項所述之防止軟性 ^脹之方法’纟中該軟性電路板係—捲帶式晶片載體封裝 15 1344326 1 9.如申請專利範圍第1 0項所述之防止軟性電路板熱 膨脹之方法，其中該軟性電路板係一覆晶薄膜軟板。 20.如申請專利範圍第1 0項所述之防止軟性電路板熱 膨脹之方法，其中該軟性電路板係一軟性印刷電路板。1344326 Patent application 1. A flexible circuit board comprising at least: a substrate; a bonding region (bonding a plurality of electrical pins H (four) substrate one); and a transparent expansion barrier at least one thermal expansion barrier And disposed on the substrate to penetrate the substrate. 2. If you apply for a patent scope! The flexible circuit board of the present invention, wherein the at least one thermal expansion barrier is an alignment mark. 3. The flexible circuit board of claim 1, wherein the at least one thermal expansion barrier is a dummy pin, and the flexible circuit board according to claim 1 is The at least one thermal expansion barrier is located between the electrical pins. 5. The flexible circuit board of claim 1, wherein the at least one thermal expansion barrier is located on an outer side of the electrical pins. 6. The flexible circuit board of claim 1, wherein the at least one thermal expansion barrier is located at a signal input end of the flexible circuit board and a signal output end and the signal input end and the signal output The end systems are respectively located at 13 1344326, the two ends of the flexible circuit board, and the flexible circuit board is a flexible tape carrier package (tcp). ', 8', the soft circuit board according to the first aspect of the invention, wherein the flexible circuit board is a flip chip soft film (c〇F) ^ 9. The flexible circuit board, wherein the flexible circuit board is a flexible printed circuit board (Fpc) ^ 10. A method for preventing thermal expansion of a flexible circuit board, comprising at least: providing a substrate; and providing a plurality of electrical pins on the substrate - soldering Bonding are a; and providing at least a (four) expansion barrier hole in the junction region of the substrate, wherein the at least one thermal expansion barrier hole penetrates the substrate. The method of preventing thermal expansion of a flexible circuit board as described in claim 10, wherein the at least the thermal expansion barrier is an alignment mark. 12) The method for preventing thermal expansion of a flexible circuit board according to the application of (4), wherein the step of setting the alignment marks comprises at least: setting a plurality of metal layers on the substrate; and 14 1344326: wearing the The metal is wide and below the substrate to form the alignment marks in the metal layers and the substrate. The method of preventing the soft circuit board heat/heating according to Item 12 of the present invention, wherein the step of setting the eyebrow metal layer is performed simultaneously with the step of setting the electrical pins. The method of expansion, such as the scope of the application of π patent! The protection of the flexible circuit board according to the two items is made of copper, tin or copper-tin alloy to prevent the soft circuit board heat as described in Item 10. 5. For the method of applying for patent expansion, ^ ^ , The at least one thermal expansion barrier is a dummy pin. The at least one thermal expansion barrier hole of the agricultural tool is located at the electrical pin expansion barrier hole located at the electrical pins, and the method for preventing the soft circuit board from being expanded and expanded according to the 1G item of the patent application (4), wherein the at least one Execute the outside of «,,,. 1 8. The method for preventing softness and expansion according to the scope of the application of the patent application, the flexible circuit board system, the tape carrier type wafer carrier package 15 1344326 1 9. As described in claim 10 The method for preventing thermal expansion of a flexible circuit board, wherein the flexible circuit board is a flip chip soft board. 20. A method of preventing thermal expansion of a flexible circuit board as described in claim 10, wherein the flexible circuit board is a flexible printed circuit board. 16 1344326 發明專利說明書 _ΖΛ] (本說明書格式、順序及粗逋字，請勿任意更動，※記號部分請勿填寫） ※申請案號：fr/z ^7 '※申請日期：外Ά/3'※以分類：//^·ν〇‘ 一、發明名稱：（中文/英文） * 軟性電路板及防止軟性電路板熱膨脹之方法 ’ FLEXIBLE CIRCUIT BOARD AND METHOD FOR PREVENTING flexible circuit board from thermal expansion φ 一、申請人：（共2人） 姓名或名稱：（中文/英文） 1.奇晶光電股份有限公司/ CHI MEI EL CORPORATION 2·奇美電子股份有限公司/Chimei InnoLux Corporation 代表人：（中文/英文） 1. 何昭陽/Jau-YangHO 2. 段行建 /Hsing-Chien TUAN 住居所或營業所地址：（中文/英文） 1 _台南縣台南科學工業園區奇業路1號/ No. 1，Chi-Yeh Road, Tainan Science-Based Industrial Park, Tainan County 74144, Taiwan R.O.C. 2.新竹科學工業園區苗栗縣竹南鎮科學路16〇號 No. 160 Kesyue Rd., Chu-Nan Site,Hsinchu Science Park, Chu-Nan 350, Miao-Li County, Taiwan. 國籍：（中文/英文） 1.中華民國/R.O.C. 2.中華民國/R.O.C. 三、發明人：（共2人） 姓名：（中文/英文） 1. 陳聖偉/ CHEN, SHENGWEI 2. 林志展/ LIN, CHIHCHAN 9109 A-A3 5217TWF1 (20100910) 1 I344326 咕’](“,沒㈣換頁丨 —, , j. 方法’至少包括：提供一基板；設置複數個電性接腳-於7:’ 之銲接區上；以及設置至少一熱膨脹阻障孔於基板之銲接區 中’其中此至少一熱膨脹阻障孔貫穿基板。 ，依照本發明一較佳實施例，上述之至少一熱膨脹阻障孔 可為對準標記或虛設接腳。 【實施方式】 本發明揭露一種軟性電路板及防止軟性電路板熱膨脹之 方法，其中此軟性電路板設有貫穿其中之熱膨脹阻障孔，可 有效阻斷軟性電路板材料之熱膨脹延續性，進一步提高封裝 接合之可靠度。為了使本發明之敘述更加詳盡與完備，可參 照下列描述並配合第1圖與第2圖之圖示。 請參照第1圖，其係繪示依照本發明一較佳實施例的一 種軟性電路板之上視示意圖。軟性電路板1 00主要係由基板 1 02、數個電性接腳u 〇與丨丨2以及數個對準標記116與i 所組成。在本發明中，軟性電路板100可為捲帶式晶片載體 封裝板、覆晶薄膜軟板或軟性印刷電路板，其中當軟性電路 板10 0為捲可式晶片載體封裝板或覆晶薄膜軟板時軟性電 路板1 〇〇上更设有積體電路晶片1 04。軟性電路板1 〇〇 一般可 設有二銲接區】〇6與丨〇8，且此二銲接區i 〇6與丨〇8分別設於 軟性電路板1 00之兩側的訊號輸入端i 22與訊號輸出端i 24 上，其中數條電性接腳11〇設置在銲接區1〇6中，而數條電 性接腳1 12則設置在銲接區1〇8中。此外’晶片1〇4則可設 置在介於銲接區106與銲接區1〇8之間的基板1〇〇上。 丄344326 ff年2月仏日修(雯)正替換頁 在本發明中，軟性電路板之每個銲接區】〇6與 二又有至乂 熱恥脹阻障孔，其中此熱膨脹阻障孔係貫穿軟 性電路板100之貫穿孔。本發明之熱膨脹阻障孔可為虛設接 (ummy Pln)或對準標記，因此熱膨脹阻障孔可設置在每個 銲接區之電性接腳之中、或者設置在每個銲接區之電性接腳 的外側。當熱膨脹阻障孔為對準標記時，可無f佔用電性接 腳的：置區域。在本發明中，軟性電路板丨〇〇之每個銲接區 至乂叹有一熱膨脹阻障孔，且軟性電路板1 〇〇可具有虛設接 腳型之熱膨脹阻障孔、對準標記型之熱膨脹阻障孔、或者同 時具有虛設接腳型與對準標記型之熱膨脹阻障孔。在本實施 例中，熱膨脹阻障孔係為貫穿基板1〇2之對準標言己ιΐ6盥 ⑵，其中可同時兼做熱膨脹阻障孔之對準標記μ盘⑽係 分別設於軟性電路板100之訊號輸入端122之電性接聊⑽ 的外側與訊號輸出端m之電性㈣η2的外側，如第工圖 所示。 在另-實施財，請參照第2圖，其料示依照本發明 另較佳貫施例的-種軟性電路板之上視示意圖。軟 板彻係-種軟性印刷電路板，其令軟性電路板之 :銲接"具有數個電性接腳組202，且每個電 均設有數條電性接腳·。相鄰二電性接腳組2 相 段間隔，而軟性電路板200更包括數個對準標記2〇4 = 些對準標言己2〇4可設置在二電性接腳組2〇2之間的間隔域 上。在本實施例令’對準標言己204穿設於金屬層2 ^ 穿軟性電路板謂，因而可同時作為熱膨脹阻障孔 ^ 1344326 實施例之對準標記204同時也係—熱膨脹阻障孔。 在本發明中，由於熱膨脹阻障孔貫穿軟性電路板，因此 :有效阻斷軟性料板之熱料延續性，故可在軟性電路板 =合之元件㈣合過程中，減低軟性電路板之熱膨服偏 移程度，進而可提升軟性電路板之接合對位的準確度，並增 進軟性電路板之接合製程的可靠度。 下歹Ux軟性電路板】〇〇為例說明在軟性電路板⑽上製 :熱膨脹阻障孔，以防止軟性電路板熱膨脹的方法。首先， 提供基板/ 02 ’其中此基板丨〇2之材料可例如採用聚亞醯胺 (I)接著於基板i 〇2之焊接區i 〇6與1⑽上分別設置電性 接腳no與112,並分別在電性接腳11〇肖"2之外側設置對 準標記H6之金屬層114與對準標記12〇之金屬層118。在本 發明中’電性接腳m與112'以及金屬層1]4與ιΐ8可採同 時製作的方式’亦可採分開製作的方式。電性接腳ιι〇與ιΐ2 、金屬層114與118的材料可為銅、錫或銅锡合金。接著， 在分別於金屬層114與"8上設置對準標記ιΐ6與12〇，其中 十準己116與120貫穿金屬層114與118及下方之基板102 為貝穿孔，因此對準標記11 6肖1 20可同時兼做為軟性電 ·; φ 之熱膨脹阻障孔。分別位於銲接區1 0 ό與1 0 8之對 準裇。己U6與120的數量較佳為二個以上，且對準標記116 與120可為十字型、梯型或L字型等。 時，本發明之其他實施例中，當熱膨脹阻障孔為虛設接腳 〇 ^電性接腳形成後，再移除預設位置上之電性接 腳及其下方之茸桕 土板’而形成貫穿軟性電路板之虛設接腳來作 10 134432616 1344326 Patent Description of Invention _ΖΛ] (The format, order and rough text of this manual should not be changed at any time. Please do not fill in the ※ part of the note.) ※Application number: fr/z ^7 '※Application date: 外Ά/3 '※ to classify: ^^·ν〇' I. Invention name: (Chinese / English) * Flexible circuit board and method for preventing thermal expansion of flexible circuit board 'FLEXIBLE CIRCUIT BOARD AND METHOD FOR PREVENTING flexible circuit board from thermal expansion φ Applicant: (2 in total) Name: (Chinese/English) 1. CHI MEI EL CORPORATION / Chi Mei InnoLux Corporation Representative: (Chinese / English) 1. He Zhaoyang/Jau-YangHO 2. Duan Xingjian/Hsing-Chien TUAN Residence or Business Office Address: (Chinese/English) 1 _ No. 1, Qiye Road, Tainan Science Industrial Park, Tainan County No. 1, Chi-Yeh Road, Tainan Science-Based Industrial Park, Tainan County 74144, Taiwan ROC 2. No. 160 Kesyue Rd., Chu-Nan, No. 16 Science Road, Zhunan Town, Miaoli County, Hsinchu Science Park Site, Hsinchu Science Park, Chu-Nan 350, Miao-Li County, Taiwan. Nationality: (Chinese/English) 1. Republic of China/ROC 2. Republic of China/ROC III. Inventor: (Total 2 persons) Name: ( Chinese/English) 1. Chen Shengwei / CHEN, SHENGWEI 2. Lin Zhizhan / LIN, CHIHCHAN 9109 A-A3 5217TWF1 (20100910) 1 I344326 咕'] (", no (four) page change ,,,, j. method' includes at least: provide one a substrate; a plurality of electrical pins are disposed on the soldering region of the 7:'; and at least one thermal expansion barrier is disposed in the soldering region of the substrate, wherein the at least one thermal expansion barrier penetrates the substrate. According to the present invention In a preferred embodiment, the at least one thermal expansion barrier can be an alignment mark or a dummy pin. [Embodiment] The present invention discloses a flexible circuit board and a method for preventing thermal expansion of a flexible circuit board, wherein the flexible circuit board is provided The thermal expansion barrier hole penetrating therein can effectively block the thermal expansion continuity of the flexible circuit board material, and further improve the reliability of the package bonding. In order to make the description of the present invention more detailed and complete, reference is made to the following description in conjunction with the drawings of Figures 1 and 2. Referring to FIG. 1, a top view of a flexible circuit board in accordance with a preferred embodiment of the present invention is shown. The flexible circuit board 100 is mainly composed of a substrate 102, a plurality of electrical pins u 〇 and 丨丨 2, and a plurality of alignment marks 116 and i. In the present invention, the flexible circuit board 100 may be a tape-type wafer carrier package board, a chip-on-film flexible board or a flexible printed circuit board, wherein the flexible circuit board 100 is a roll-type wafer carrier package board or a flip chip soft film. On the board, the flexible circuit board 1 is further provided with an integrated circuit chip 104. The flexible circuit board 1 〇〇 can generally be provided with two soldering regions 〇6 and 丨〇8, and the two soldering regions i 〇6 and 丨〇8 are respectively disposed on the signal input terminals i22 on both sides of the flexible circuit board 100. And the signal output terminal i 24 , wherein a plurality of electrical pins 11 〇 are disposed in the soldering zone 1 〇 6 , and a plurality of electrical pins 1 12 are disposed in the soldering zone 1 〇 8 . Further, the wafer 1 〇 4 may be disposed on the substrate 1 between the land 106 and the land 1 〇 8.丄344326 ff, February, 仏日修 (Wen) is replacing the page. In the present invention, each of the soldering regions of the flexible circuit board 〇6 and 2 has a thermal expansion barrier hole, wherein the thermal expansion barrier hole It is through the through hole of the flexible circuit board 100. The thermal expansion barrier hole of the present invention may be a dummy Pln or an alignment mark, so that the thermal expansion barrier hole may be disposed in the electrical pin of each pad or the electrical property of each pad. The outside of the pin. When the thermal expansion barrier hole is an alignment mark, the area of the electrical pin can be occupied without f. In the present invention, each of the solder pads of the flexible circuit board has a thermal expansion barrier, and the flexible circuit board 1 can have a thermal expansion barrier of a dummy pin type, and an index mark type thermal expansion. The barrier hole or the thermal expansion barrier hole of the dummy pin type and the alignment mark type at the same time. In this embodiment, the thermal expansion barrier hole is an alignment mark penetrating through the substrate 1〇2, wherein the alignment mark μ (10) which can simultaneously serve as the thermal expansion barrier hole is respectively disposed on the flexible circuit board. The signal input terminal 122 of the 100 is electrically connected to the outside of the signal (10) and the signal output terminal m is electrically (four) η2 outside, as shown in the figure. In another embodiment, please refer to FIG. 2, which is a top plan view of a flexible circuit board in accordance with another preferred embodiment of the present invention. The flexible board is a kind of flexible printed circuit board, which makes the flexible circuit board: soldered & has a plurality of electrical pin sets 202, and each of the electric wires is provided with several electrical pins. Two adjacent electrical pin groups are spaced apart by two segments, and the flexible circuit board 200 further includes a plurality of alignment marks 2〇4 = some alignment marks have been set 2 in the second electrical pin group 2〇2 On the interval between the fields. In this embodiment, the alignment alignment has been applied to the metal layer 2^ through the flexible circuit board, so that the alignment mark 204 of the embodiment of the thermal expansion barrier hole can be simultaneously used as a thermal expansion barrier. . In the present invention, since the thermal expansion barrier hole penetrates through the flexible circuit board, the thermal continuity of the soft material plate is effectively blocked, so that the heat of the flexible circuit board can be reduced during the process of combining the flexible circuit board and the component (four). The degree of deflection of the package can further improve the accuracy of the bonding of the flexible circuit board and improve the reliability of the bonding process of the flexible circuit board. The 歹Ux flexible circuit board] 〇〇 is used as an example to describe the method of making a thermal expansion barrier hole on the flexible circuit board (10) to prevent thermal expansion of the flexible circuit board. First, a substrate / 02 ' is provided, wherein the material of the substrate 丨〇 2 can be respectively provided with polyamines (I) and then electrical pins no and 112 respectively on the pads i 〇 6 and 1 (10) of the substrate i 〇 2, The metal layer 114 of the alignment mark H6 and the metal layer 118 of the alignment mark 12 are disposed on the outer side of the electrical pin 11 respectively. In the present invention, the manner in which the electrical pins m and 112' and the metal layers 1] 4 and ι 8 can be simultaneously produced can also be separately produced. The electrical pins ιι and ι 2, and the metal layers 114 and 118 may be copper, tin or copper-tin alloy. Next, alignment marks ι 6 and 12 are respectively disposed on the metal layers 114 and "8, wherein the ten cells 116 and 120 are pierced through the metal layers 114 and 118 and the substrate 102 below, so the alignment mark 116 Xiao 1 20 can also be used as a soft electrical barrier; φ thermal expansion barrier. They are located in the weld zone between 1 0 ό and 1 0 8 respectively. The number of U6 and 120 is preferably two or more, and the alignment marks 116 and 120 may be a cross type, a ladder type or an L shape. In other embodiments of the present invention, when the thermal expansion barrier hole is formed by the dummy pin and the electrical pin is formed, the electrical pin at the preset position and the underlying slab are removed. Form a dummy pin through the flexible circuit board to make 10 1344326 為熱膨脹阻障孔。 3月之—優點就是因 貫穿於其中，因此 減低電路板因熱膨 由上述本發明較佳實施例可知本發 4本發明之軟# «路板設有熱膨服阻障孔 可達到阻斷材料熱膨脹之延續性的目的， 脹所造成之偏移程度。 由上述本發明較佳實施料知，本發明之另 因為本發明之軟性電路板的熱膨 1疋 ^ m lL ^ 眼丨且丨羊孔可冋時作為對準桿 。因此可在不額外佔用軟性電路板之區域下，達到 性電路板之熱膨脹延續性的功效。 人 由上述本發明較佳實施例可知，本發明之又 因為本發明之防止軟性電路板 疋 ^ L ^ /脹之方法係在基板之銲接 £上的電性接腳之間或外側設置 暗a , ^ 芽土板之至 >、—熱膨脹阻 由於此熱膨脹阻障孔貫穿基板，因此可有效阻斷基板 材料熱膨脹的延續效果，進一步達到提升軟性電路板之電性 接腳與電路板及/或元件之接腳電性接合的準確性與可靠度。 雖然本發明已以一較佳實施例揭露如上，然其並非二以 ，定本發明’任何熟習此技藝者，在不脫離本發明之精神和 乾圍内，當可作各種之更動與潤飾’因此本發明之保護範圍 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係繪示依照本發明一較佳實施例的一種軟性電路 板之上視示意圖。 第2圖係繪示依照本發明另一較佳實施例的—種軟性電 11 [S] 1344326It is a thermal expansion barrier. The advantage of March is that it is penetrated by it, so that the circuit board is reduced by thermal expansion. According to the preferred embodiment of the present invention, the soft surface of the present invention can be blocked. The purpose of the continuity of the thermal expansion of the material, the degree of deflection caused by the expansion. It is apparent from the above preferred embodiment of the present invention that the flexible circuit board of the present invention is used as an alignment rod when the thermal expansion of the flexible circuit board is 1 疋 ^ m lL ^ eyelid. Therefore, the thermal expansion continuity of the circuit board can be achieved without additionally occupying a flexible circuit board. According to the preferred embodiment of the present invention described above, the method of the present invention for preventing the flexible circuit board from being swelled by the method is to provide a darkness between or outside the electrical pins on the soldering of the substrate. , ^ The swell of the slab soil>, the thermal expansion resistance penetrates the substrate through the thermal expansion barrier hole, so the continuation effect of the thermal expansion of the substrate material can be effectively blocked, and the electrical pin and the circuit board of the flexible circuit board are further improved. Or the accuracy and reliability of the electrical connection of the components. Although the present invention has been described above in terms of a preferred embodiment, it is not intended to be a part of the present invention, and it is possible to make various modifications and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top plan view showing a flexible circuit board in accordance with a preferred embodiment of the present invention. 2 is a soft electrical circuit 11 [S] 1344326 according to another preferred embodiment of the present invention. 路板之上視示意圖。 主要元件符號說明】 100 :軟性電路板 1 0 4 ·晶片 108 :銲接區 11 2 :電性接腳 11 6 :對準標記 120 :對準標記 124 :訊號輸出端 2 0 2 :電性接腳組 206 :金屬層 102 :基板 1 0 6 :銲接區 1 1 0 :電性接腳 1 14 :金屬層 Π 8 :金屬層 1 2 2 :訊號輸入端 200 :軟性電路板 204 :對準標記The schematic diagram above the road board. Main component symbol description] 100: Flexible circuit board 1 0 4 · Wafer 108: Solder pad 11 2 : Electrical pin 11 6 : Alignment mark 120 : Alignment mark 124 : Signal output terminal 2 0 2 : Electrical pin Group 206: metal layer 102: substrate 1 0 6 : soldering area 1 1 0 : electrical pin 1 14 : metal layer Π 8 : metal layer 1 2 2 : signal input terminal 200 : flexible circuit board 204 : alignment mark