1342441 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種背光模組及發光二極體驅動板，特 別是關於一種應用於顯示器之背光模組及發光二極體驅 動板。 【先前技術】 發光二極體是由半導體材料所製成之發光元件，元件 具有兩個電極端子，在端子間施加電壓，通入極小的電 壓，經由電子電洞之結合，可將剩餘能量以光的形式激發 釋出。1342441 IX. Description of the Invention: [Technical Field] The present invention relates to a backlight module and a light-emitting diode driving board, and more particularly to a backlight module and a light-emitting diode driving board applied to a display. [Prior Art] A light-emitting diode is a light-emitting element made of a semiconductor material. The element has two electrode terminals. A voltage is applied between the terminals, and a very small voltage is applied. The remaining energy can be obtained by a combination of electron holes. The form of light stimulates the release.
不同於一般白熾燈泡，發光二極體係屬冷發光，具有 耗電量低,、7C件壽命長、無須暖燈時間、反應速度快等優 點再加上其體積小、耐震動、適合量產，容易配合應用 上的需求製成極小或陣列式的元件。目前發光二極體已普 遍使用於資5fL、通訊、消費性電子產品的指示器及顯示裝 置^，成為日常生活中不可或缺的重要元件。近來，利用 發光一極體更被用來作為液晶顯示器（叫心㈣Different from ordinary incandescent bulbs, the light-emitting diode system is cold-emitting, has low power consumption, long life of 7C parts, no need for warming time, fast reaction speed, etc., plus its small size, vibration resistance and mass production. It is easy to make very small or array components with the requirements of the application. At present, LEDs have been widely used in 5fL, communication, consumer electronics indicators and display devices ^, becoming an indispensable important component in daily life. Recently, the use of a light-emitting body has been used as a liquid crystal display (Calling Heart (4)
Duplay，LCD)背域㈣之光源’並有逐漸取代傳統冷 陰極螢光燈管的趨勢。 n月同時參考圖1及圖2，習知技術中，以發光二極體 科1光源之背光模組1，係具有—殼體11、複數發光二極 體早儿12、一巷妃η ^ 執板13、一驅動電路板14、以及至少一光 學薄膜15。 1342441. 各發光二極體單元12分別具有複數發光二極體元件 121 (LED Device)及一印刷電路板122。其中，複數發光 二極體元件121係設置於印刷電路板122。然後’再將各 個發光二極體單元12固定於載板13上’載板13係與殼 . 體11鎖固（圖中未顯示），載板13可為金屬材質’以協助 * 發光二極體單元12散熱。 • 驅動電路板14係具有發光二極體單元12之驅動迴 路、主動元件及被動元件，且驅動電路板14係固定於載 _ 板13而與發光二極體單元12相對而設。 然而，習知技術的背光模組1之組裝過程非常複雜， 要先將發光二極體元件121設置於印刷電路板122，以形 成發光二極體單元12後，才分別將各個發光二極體單元 12及驅動電路板14固定於載板13，然後再將載板13鎖 固於殼體11 ^最後，再將光學薄膜15，例如為一擴散板， 設置於載板13之上。如此複雜的組裝步驟，的確會造成 • 產品之生產成本增加。 接著’請參照圖3，其係為發光二極體元件121之結 構示意圖。發光二極體元件121之基板121a係設置於散熱 座l21b以利散熱，而晶粒121c係設置於基板i21a經由打 線接合至導線架121d，俾使晶粒121c藉由導線架121(1而 、/、他元件電性連接。由圖中可知，發光二極體之晶粒 1C係先與基板12la完成封裝後，才安裝於散熱座12lb 再加上打線接合的製程，因此發光二極體元件121之 製作過程也相當複雜。 程複雜本Ϊ發明人H種可以*決背域組之組裝過 發此L並坆成產品生產成本増加之問題的「背光模組及 九二極體驅動板」。 【發明内容】 有鏗於上述課題，本發明之目的為提供—種發光二體 Z及驅動迴路係設置於同—基板之背光模組及發光二 體驅動板。 出緣疋，為達上述目的，依本發明之背光模組係具有一 =面，背光模組包含一殼體、發光二極體驅動板以及一 :予薄膜。其中，發光二極體驅動板係設置於殼體。發光 ^極體驅動板係具有—基板、複數發光二極體晶粒及一驅 .迴路，複數發光二極體晶粒係分別直接設置於基板，發 光二極體晶粒係分別與驅動迴路電性連接，並分別由驅動 趣路驅動。光學薄膜係鄰設於發光二極體驅動板。 為達上述目的，依本發明之發光二極體驅動板係具有 一基板、複數發光二極體晶粒及一驅動迴路，複數發光二 極體晶粒係分別直接設置於基板，發光二極體晶粒係分別 與驅動迴路電性連接，並分別由驅動迴路驅動。 承上所述，因依本發明之一種背光模組及發光二極體 驅動板中’係具有直接設置於基板之發光二極體晶粒。與 習知技術相比，本發明之發光二極體晶粒係利用表面安 裝、凸塊、覆晶或打線接合之方式而將發光二極體晶粒直 接設置於基板’故可節省習知技術中發光二極體晶粒封裳 1342441 時所需要之承載基板的原料成本。另外，本發明之背光模 組組裝非常方便，只要將發光二極體驅動板固定於殼體 上’並放上光學薄膜後即可完成組裝。於本發明實施例 中’發光二極體驅動板更可具有備用墊片，當其中一個發 ' 光二極體晶粒損壞時，則不需更換整個佈設有複數發光二 -— 極體之電路板，只需要將新的發光二極晶粒與備用墊片電 性連接即可，故可避免原物料之浪費。 •【實施方式】 以下將參照相關圖式’說明依本發明之背光模組及發 光二極體驅動板之複數實施例。 首先，請參考圖4至圖8以說明本發明背光模組之實 施例。 如圖4所示，背光模組2包含一殼體21、發光二極體 驅動板22以及一光學薄膜23。其中，背光模組2可為一 φ 側光式背光模組或一直下式背光模組，本實施例則一直下 式背光模組為例，且背光模組2係具有一發光面D，發光 面D之尺寸大小係約略等於發光二極驅動板22之尺寸大 小 〇 忒體21之材質可為金屬或為塑膠，殼體21之大小及 形狀可依背光模組2實際所需之大小及形式來設計，例 如：殼體21可為一框體、一平板狀或其他形狀。發光二 極體驅動板22係可鎖固或以其他連結方式而設置於殼體 21上’並受殼體21支撐。 1342441. 如圖5所示，發光二極體驅動板22係具有一基板 221、複數發光二極體晶粒（die) 222及一驅動迴路223。 基板221係可為一印刷電路基板（PCB)或一玻璃電 路基板。其中’破螭基板之熱膨脹係數係與發光二極體晶 粒222之熱膨脹係數相似。 複數發光二極體晶粒222係分別直接設置於基板 ' 221 ’圖5中係以部份之發光二極體晶粒222為例’其中’ 發光二極體晶粒2 2 2之數量及排列可視實際產品之需求來 • 進行設計。所謂”直接設置”係代表利用表面安裝（SMT) 或凸塊等製程，直接將發光二極體晶粒222與基板221上 之接合墊221a (如圖7或圖8所示）接合，在此，並非指 發光二極體晶粒222封裝完後才設置於基板21上。 本實施例中’複數發光二極體晶粒222係具有可發出 紅色、綠色、藍色或其他顏色光線的晶粒，當然複數發光 二極體晶粒222也可以為發出相同色系的晶粒。 鲁 由於發光二極體晶粒222是利用表面封裝（SMT)、 覆晶或打線接合之方式’直接設置於基板221，並與驅動 噁路223電性連接’而由驅動迴路223驅動各發光二極體 晶板222。製程中不需要承載發光二極體晶粒222的基板 (如習知技術圖3中之12la)，不但可以節省原物料成本， 更可減少發光二極體晶粒222設置於基板21之製程步驟。 再請參照圖5’驅動迴路223係與發光二極體晶粒222 電性連接，並分別驅動各個發光二極體晶粒222。本實施 例中，驅動迴路223係包含一驅動迴路晶粒（出^) 223a， 驅動迴路晶粒223a係直接設置於基板221並與各個發光二 極體晶粒222電性連接，以進行複數光源的驅動控制。 另外，驅動迴路223更可包含一主動元件223b或〜 被動元件223c，其中，主動元件223b或被動元件223c係 與驅動迴路晶粒223a電性連接。本實施例中，係以驅動迴 路223包含複數主動元件223b及被動元件223c為例，其 中，主動元件223b可為一開關元件，例如為一電晶體為 一二極體；被動元件223c則可為一電容、一電阻、—電 或其組合。 & 如圖6所示’當然，驅動迴路223也可以具有複數驅 動迴路晶粒223a ’各驅動迴路晶粒223a係分別與複數發 光一極體晶粒222電性連接，例如同一排的發光二極 29 0 λ 艰曰曰 2係與同一個驅動迴路晶粒223a電性連接，而複數之 驅動迴路晶粒223a則再分別電性連接至一總驅動迴路晶 粒Dt〇tal (如圖6所示）。 凊同時參考圖5、圖7及圖8,其中圖7及圖8係為 圖5虛線中之發光二極體晶粒222及其附近區域放大之示 忍圖。本實施例中，基板221更可包含一備用墊片221a， 八中備用塾片221a可為一接合塾片（bonding pad)或 一晶片墊（die pad)以與驅動恧路223或發光二極體晶粒 222電性連接。 以往，於出廠前測試時，若發現複數發光二極體的其 中顇損壞時’往往需直接更換設置有複數發光二極體元 件之電路板，而賠上了許多功能正常的發光二極體元件， 1342441 並造成了原物料的浪費。本實施例中，由於基板221係具 有備用墊片221a以與發光二極體晶粒222或驅動廻路晶粒 223a電性連接，因此當有一顆發光二極體晶粒B損壞時， 即可利用緊臨於晶粒B旁的空間，將一顆良好的發光二極 體晶粒G (以虛線表示）利用打線接合、凸塊、表面安裝 或覆晶接合的方式來與備用墊片221a電性連結。其中，圖 7中係以晶粒G與備用墊片221a打線接合為例，而圖8 係以晶粒G與備用墊片221a覆晶接合為例。而損壞的發 光二極體B也可選擇不移除，以減少維修的步驟。因此， 可減少原物料之成本及維修製程的步驟。 再請參照圖4,光學薄膜23係鄰設於發光二極體驅動 板22。本實施例中，光學薄膜23可為一擴散膜或一擴散 板。 另外，背光模組2更可包含一光學膜片組合24，其係 設置於光學薄膜23之上。其中，光學膜片組合24係可包 含擴散板、偏光板或增亮膜等等。 本實施例中，只要需要將發光二極體驅動板22固定 於殼體21上，再加上光學薄膜23，即可完成背光模組2 之組裝，步驟相當迅速簡單。 接著，請參考圖9以說明本發明發光二極體驅動板之 實施例。 如圖9所示，發光二極體驅動板3係包含一基板31、 複數發光二極體晶粒（die) 32及一驅動迴路33。本實施 例中，發光二極體驅動板3係與前述背光模組2中之發光 ⑧ 1342441 二極體驅動板22可具有相同之功效及技術特徵，於此不 再贅述。 另外，發光二極體驅動板3除了可應用至背光模組2 中之外，更可直接作為一發光二極體顯示器（LED Display)，經由驅動迴路33來驅動複數發光二極體晶粒 32，即可使得發光二極體晶粒32發光。其中，複數發光 二極體晶粒32可發出相同或不相同的顏色的光線。 綜上所述，本發明之背光模組及發光二極體驅動板 中，係具有直接設置於基板之發光二極體晶粒。與習知技 術相比’本發明之發光二極體晶粒係利用表面安裝、凸 塊、覆晶或打線接合之方式而將發光二極體晶粒直接設置 於基板，故可節省習知技術中發光二極體晶粒封裝時所需 要之承載基板的原料成本。另外，本發明之背光模組組裝 非常方便’只要將發光二極體驅動板固定於殼體上，並放 上光學薄膜後即可完成組裝。於本發明實施例中，發光二 極體驅動板更可具有備用墊片，當其中一個發光二極體曰 粒損壞時，則不需更換整個佈設有複數發光二極體之電路 板，只需要將新的發光二極晶粒與備用墊片電性連接即 可，故可避免原物料之浪費。 以上所述僅為舉例性，而祚為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更， 應包含於後附之申請專利範圍中。 = 【圖式簡單說明】 12 1342441. 圖1係為習知具有複數發光二極體單元之背光模組之 一俯視示意圖； 圖2係為沿圖1中直線A-A’之一剖面示意圖； 圖3係為習知技術中發光二極體元件之一示意圖； 圖4係為本發明之背光模組之一示意圖； 圖5係為本發明背光模組之發光二極體驅動板之一部 份示意圖； 圖6係為本發明背光模組之發光二極體驅動板之另一 不意圖， 圖7係為圖5之發光二極體驅動板中，於虛線圓圈 内，基板係具有備用墊片之一示意圖； 圖8係為圖5中之發光二極體驅動板中，於虛線圓圈 内，基板係具有備用墊片之另一示意圖；以及 圖9係為本發明發光二極體驅動板之另一示意圖。 元件符號說明： 1 背光模組 11 殼體 12 發光二極體單元 121 發光二極體元件 121a 基板 121b 散熱座 121c 晶粒 121d 導線架 13 咳) 1342441. 122 印刷電路板 13 載板 14 驅動電路板 15 光學薄膜 2 背光模組 21 殼體 22 發光二極體驅動板 221 基板 221a 備用墊片 222 發光二極體晶粒 223 驅動迴路 223a 驅動迴路晶粒 223b 主動元件 223c 被動元件 23 光學薄膜 24 光學膜片組合 3 發光二極體驅動板 31 基板 32 發光二極體晶粒 33 驅動迴路 B 損壞之發光二極體晶粒 D 出光面 Dtotal 總驅動迴路晶粒 G 良好之發光二極體晶粒Duplay, LCD) The light source of the back domain (4) has a tendency to gradually replace the traditional cold cathode fluorescent tube. Referring to FIG. 1 and FIG. 2 at the same time, in the prior art, the backlight module 1 of the light source diode 1 light source has a shell 11 , a plurality of light emitting diodes 12 , and a lane 妃 η ^ A board 13, a driving circuit board 14, and at least one optical film 15. 1342441. Each of the LED units 12 has a plurality of LED devices 121 and a printed circuit board 122. The plurality of light emitting diode elements 121 are disposed on the printed circuit board 122. Then, each of the LED units 12 is fixed to the carrier 13 and the carrier 13 is attached to the casing. The body 11 is locked (not shown), and the carrier 13 can be made of metal material to assist the light-emitting diode. The body unit 12 dissipates heat. The drive circuit board 14 has a drive circuit, an active element, and a passive element of the light-emitting diode unit 12, and the drive circuit board 14 is fixed to the carrier plate 13 to face the light-emitting diode unit 12. However, the assembly process of the backlight module 1 of the prior art is very complicated, and the LEDs 121 are first disposed on the printed circuit board 122 to form the LED unit 12, and then the LEDs are respectively respectively The unit 12 and the driving circuit board 14 are fixed to the carrier board 13, and then the carrier board 13 is locked to the housing 11. Finally, an optical film 15, such as a diffusing plate, is disposed on the carrier board 13. Such complicated assembly steps do result in an increase in the production cost of the product. Next, please refer to Fig. 3, which is a schematic diagram of the structure of the light-emitting diode element 121. The substrate 121a of the LED device 121 is disposed on the heat sink l21b for heat dissipation, and the die 121c is disposed on the substrate i21a via wire bonding to the lead frame 121d, so that the die 121c is supported by the lead frame 121 (1). /, his components are electrically connected. As can be seen from the figure, the die 1C of the light-emitting diode is first packaged with the substrate 12la, and then mounted on the heat sink 12lb plus the wire bonding process, so the light-emitting diode component The production process of 121 is also quite complicated. The complexity of the process is that the inventor H can be used to assemble the "backlight module and the ninth diode drive board". SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a backlight module and a light-emitting two-body driving board in which a light-emitting two-body Z and a driving circuit are disposed on the same substrate. The backlight module of the present invention has a surface, the backlight module comprises a casing, a light-emitting diode driving board and a film, wherein the light-emitting diode driving board is disposed in the casing. ^Polar body drive board tie - a substrate, a plurality of light-emitting diode dies, and a first-pass circuit, the plurality of light-emitting diode dies are directly disposed on the substrate, and the light-emitting diode dies are electrically connected to the driving circuit respectively, and are respectively driven by the driving The optical film is disposed adjacent to the LED driver board. To achieve the above object, the LED driving board of the invention has a substrate, a plurality of LED chips and a driving circuit, and the plurality of LEDs The diode die is directly disposed on the substrate, and the LED die are electrically connected to the driving circuit respectively, and are respectively driven by the driving circuit. According to the above, the backlight module and the light emitting device according to the present invention The diode driving board has a light-emitting diode die directly disposed on the substrate. Compared with the prior art, the light-emitting diode chip of the present invention is surface-mounted, bumped, flip-chip or wire bonded. In this way, the light-emitting diode crystal grains are directly disposed on the substrate, so that the raw material cost of the carrier substrate required for the light-emitting diode die seal 1342441 in the prior art can be saved. The assembly of the optical module is very convenient, as long as the LED driver board is fixed on the housing and the optical film is placed, the assembly can be completed. In the embodiment of the invention, the LED driver board can have a spare pad. When one of the 'light diodes' is damaged, it is not necessary to replace the entire board with a plurality of light-emitting diodes, and only need to electrically connect the new light-emitting diodes to the spare pads. That is, the waste of the original material can be avoided. [Embodiment] Hereinafter, a plurality of embodiments of the backlight module and the LED driving board according to the present invention will be described with reference to the related drawings. First, please refer to FIG. 4 to 8 illustrates an embodiment of the backlight module of the present invention. As shown in FIG. 4, the backlight module 2 includes a housing 21, a light-emitting diode driving board 22, and an optical film 23. The backlight module 2 can be A φ side-lit backlight module or a continuous-type backlight module, in this embodiment, a lower-type backlight module is taken as an example, and the backlight module 2 has a light-emitting surface D, and the size of the light-emitting surface D is approximately equal to Illuminated two-pole driving board 22 The size of the housing 21 can be metal or plastic. The size and shape of the housing 21 can be designed according to the actual size and form of the backlight module 2. For example, the housing 21 can be a frame and a housing. Flat or other shape. The LED driver board 22 is lockable or otherwise attached to the housing 21 and supported by the housing 21. 1342441. As shown in FIG. 5, the LED driving board 22 has a substrate 221, a plurality of light emitting diode dies 222, and a driving circuit 223. The substrate 221 can be a printed circuit board (PCB) or a glass circuit substrate. The thermal expansion coefficient of the 'destructive substrate' is similar to that of the light-emitting diode crystal 222. The plurality of light-emitting diode 222 lines are respectively disposed directly on the substrate '221'. In FIG. 5, a part of the light-emitting diode crystal grains 222 is taken as an example of the number and arrangement of the light-emitting diode crystal grains 2 2 2 . Designed to meet the needs of actual products. The so-called "direct setting" means that the light-emitting diode die 222 is directly bonded to the bonding pad 221a (shown in FIG. 7 or FIG. 8) on the substrate 221 by a surface mount (SMT) or bump process. It does not mean that the light-emitting diode die 222 is disposed on the substrate 21 after being packaged. In the embodiment, the plurality of light-emitting diode crystal grains 222 have crystal grains which can emit red, green, blue or other color light. Of course, the plurality of light-emitting diode crystal grains 222 can also emit crystal grains of the same color system. . The light-emitting diode die 222 is directly disposed on the substrate 221 by means of surface mount (SMT), flip chip bonding or wire bonding, and is electrically connected to the driving circuit 223, and is driven by the driving circuit 223. Polar plate 222. The substrate (such as 12la in FIG. 3) of the light-emitting diode die 222 is not required in the process, which not only saves the cost of the raw material, but also reduces the process of disposing the LED die 222 on the substrate 21. . Referring to FIG. 5', the driving circuit 223 is electrically connected to the LED die 222, and drives the respective LED dipoles 222. In this embodiment, the driving circuit 223 includes a driving circuit die 223a, and the driving circuit die 223a is directly disposed on the substrate 221 and electrically connected to each of the LED dies 222 to perform a plurality of light sources. Drive control. In addition, the driving circuit 223 may further include an active component 223b or a passive component 223c, wherein the active component 223b or the passive component 223c is electrically connected to the driving circuit die 223a. In this embodiment, the driving circuit 223 includes a plurality of active components 223b and a passive component 223c. The active component 223b can be a switching component, for example, a transistor is a diode; the passive component 223c can be A capacitor, a resistor, an electric or a combination thereof. & As shown in Fig. 6, of course, the driving circuit 223 may also have a plurality of driving circuit dies 223a. Each of the driving circuit dies 223a is electrically connected to the plurality of illuminating body dies 222, for example, the same row of illuminating diodes The pole 29 0 λ hard 2 is electrically connected to the same drive circuit die 223a, and the plurality of drive circuit die 223a are electrically connected to a total drive circuit die Dt〇tal (as shown in FIG. 6). Show). Referring to Fig. 5, Fig. 7, and Fig. 8, Fig. 7 and Fig. 8 are enlarged views of the light emitting diode die 222 and its vicinity in the dotted line of Fig. 5. In this embodiment, the substrate 221 may further include a spare pad 221a. The eighth backup pad 221a may be a bonding pad or a die pad to drive the crotch 223 or the light emitting diode. The bulk crystal grains 222 are electrically connected. In the past, when testing before the factory, if the defects of the complex LEDs were found to be damaged, it is often necessary to directly replace the circuit board with the plurality of LED components, and many functional LED components are lost. , 1342441 and caused a waste of raw materials. In this embodiment, since the substrate 221 has the spare pad 221a to be electrically connected to the LED die 222 or the driving crest die 223a, when one of the LEDs B is damaged, Using a space next to the die B, a good light-emitting diode die G (indicated by a broken line) is electrically connected to the spare pad 221a by wire bonding, bumping, surface mounting or flip chip bonding. Sexual links. Here, in FIG. 7, the die G is bonded to the spare pad 221a as an example, and FIG. 8 is an example in which the die G is bonded to the spare pad 221a. The damaged light-emitting diode B can also be selected without removal to reduce the maintenance steps. Therefore, the cost of the raw materials and the steps of the maintenance process can be reduced. Referring to Fig. 4, the optical film 23 is disposed adjacent to the LED driving board 22. In this embodiment, the optical film 23 can be a diffusion film or a diffusion plate. In addition, the backlight module 2 further includes an optical film assembly 24 disposed on the optical film 23. Among them, the optical film assembly 24 may include a diffusion plate, a polarizing plate or a brightness enhancement film, and the like. In this embodiment, as long as the LED driving board 22 needs to be fixed to the housing 21 and the optical film 23 is added, the assembly of the backlight module 2 can be completed, and the steps are quite quick and simple. Next, please refer to Fig. 9 to explain an embodiment of the light-emitting diode driving board of the present invention. As shown in FIG. 9, the LED driving board 3 includes a substrate 31, a plurality of light emitting diode dies 32, and a driving circuit 33. In this embodiment, the LED driving board 3 has the same functions and technical features as the LED 8 1342441 diode driving board 22 in the backlight module 2, and details are not described herein. In addition, the LED driver board 3 can be directly applied to the backlight module 2, and can be directly used as a LED display to drive the plurality of LEDs 32 via the driving circuit 33. The light-emitting diode die 32 can be made to emit light. Wherein, the plurality of light-emitting diode crystal grains 32 can emit light of the same or different colors. In summary, the backlight module and the LED driving board of the present invention have LED dies directly disposed on the substrate. Compared with the prior art, the light-emitting diode die of the present invention directly mounts the light-emitting diode die on the substrate by surface mounting, bumping, flip chip bonding or wire bonding, so that conventional techniques can be saved. The raw material cost of the carrier substrate required for the package of the middle light emitting diode. In addition, the backlight module of the present invention is very easy to assemble. As long as the LED driver board is fixed to the housing and the optical film is placed, the assembly can be completed. In the embodiment of the present invention, the LED driving board can further have a spare gasket. When one of the LEDs is damaged, it is not necessary to replace the circuit board with the plurality of LEDs. The new light-emitting diode chip can be electrically connected to the spare gasket, so that the waste of the original material can be avoided. The above description is only exemplary and is not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims. Figure 1 is a top plan view of a conventional backlight module having a plurality of light emitting diode units; Fig. 2 is a schematic cross-sectional view taken along line A-A' of Fig. 1; 3 is a schematic diagram of a light-emitting diode component in the prior art; FIG. 4 is a schematic diagram of a backlight module of the present invention; FIG. 5 is a schematic diagram of a light-emitting diode driving board of the backlight module of the present invention; Figure 6 is another schematic view of the LED driver board of the backlight module of the present invention, and Figure 7 is the LED driver board of Figure 5, in the dotted circle, the substrate has a spare pad. FIG. 8 is another schematic view of the light-emitting diode driving board of FIG. 5 in a dotted circle, the substrate has a spare spacer; and FIG. 9 is a light-emitting diode driving board of the present invention. Another schematic diagram. Description of the components: 1 backlight module 11 housing 12 light-emitting diode unit 121 light-emitting diode element 121a substrate 121b heat sink 121c die 121d lead frame 13 cough) 1342441. 122 printed circuit board 13 carrier board 14 drive circuit board 15 Optical film 2 Backlight module 21 Housing 22 Light-emitting diode driving board 221 Substrate 221a Spare spacer 222 Light-emitting diode die 223 Driving circuit 223a Driving circuit die 223b Active component 223c Passive component 23 Optical film 24 Optical film Chip combination 3 Light-emitting diode driver board 31 Substrate 32 Light-emitting diode die 33 Driving circuit B Damaged light-emitting diode die D Light-emitting surface Dtotal Total drive circuit grain G Good light-emitting diode grain