TWI342063B - A bonding structure of flexible films and bonding method therefor - Google Patents
A bonding structure of flexible films and bonding method therefor Download PDFInfo
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- TWI342063B TWI342063B TW96120885A TW96120885A TWI342063B TW I342063 B TWI342063 B TW I342063B TW 96120885 A TW96120885 A TW 96120885A TW 96120885 A TW96120885 A TW 96120885A TW I342063 B TWI342063 B TW I342063B
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Description
丄J4ZU0J 九、發明說明： •【發明所屬之技術領域】 本發明係有關_ -^r L A y, 種了 k 面結合結構及其結合方 法，特別是一種將二個可拉 J < ;1面之外引腳對應電性連接 “構人方4 W如將可撓電路板與可撓顯示器之外引 電路接點對應電性連接之結構與方法。 【先前技術】丄J4ZU0J IX. Description of the invention: • [Technical field to which the invention pertains] The present invention relates to _-^r LA y, a k-plane bonding structure and a combination thereof, and in particular, a method of combining two colas; The external pin corresponds to the electrical connection. The structure and method of electrically connecting the flexible circuit board and the flexible circuit display circuit contacts. [Prior Art]
。。具外引腳之可撓介面係包含軟性電路板、軟性顯示 /、中叙眭電路板又以軟性印刷電路板（FPC，. . The flexible interface with external pins includes a flexible circuit board, a flexible display, a medium-sized circuit board, and a flexible printed circuit board (FPC,
Flexible Printer! ’ . Clrcuit)、軟性扁平排線（FFC，FlatFlexible Printer! ’ . Clrcuit), soft flat cable (FFC, Flat)
Flexible Cabie)、捲帶式自動晶粒接合⑽，丁聊 AUt〇 :⑽―)及晶粒軟膜接合軟板(COF，Onp 0n Flex: 使用車乂夕&寺可撓介面之共同特性就是絲做兩個分 紅電路板之電性連接的橋樑，因此，可撓介面則會具Flexible Cabie), Tape and Reel Automatic Die Bonding (10), Ding Liao AUT〇: (10)-) and die soft film bonding soft board (COF, Onp 0n Flex: The common feature of using the car 乂 夕 & temple flexible interface is silk Make a bridge that electrically connects the two red boards, so the flexible interface will have
有？夂數個外引腳’每個外引腳均為導體’以便能將分離 之電路板的相對應接點電性連接。 在各種電子應用領域中，使用到具外引腳之可挽介 面之技術’多為以可撓介面來將二個硬質之電路板接合 並形成適當之電性連接，而在技術發展與應用層面之需 =形下’目前已進展到使用可撓介面來與可撓 " 、，’。5，例如將軟性顯示器與軟性電路板做扯人， 此種舄用f使用現有之結合技術，其可靠度將不：預 ^ C ”疋電性連接之可靠度大打折扣，茲說明如後。 5 1342063 • 請同時參考「第1圖-丨與「第2圖」，其係將軟性 .顯示器10依序疊置導電膠材]4與軟性電路板12，再 將軟性電路板12之複數個外引腳18a，]8b與軟性顯示 器丨〇之複數個外引腳163, 16b對應後，加熱及加愿於 軟性顯示器〗〇與軟性電路板12，使之結合，由於導電 膠材14内具有複數個導電顆粒]5a，i5b，因此，在: 合軟性顯示器1〇與軟性電路板12時，導電顆粒15: W即會被壓迫，並介於軟性顯示器1Q與軟性電路板 12之外引腳16a，16b, 之間，形成導電介質，Have? A plurality of outer pins 'each outer pin are conductors' so that the corresponding contacts of the separated circuit boards can be electrically connected. In various electronic applications, the technology of using a pull-out interface with an external pin is mostly a flexible interface for joining two rigid boards to form an appropriate electrical connection, at the technical development and application level. The need to form = shape has now progressed to the use of flexible interfaces to be flexible with ",". 5, for example, the soft display and the flexible circuit board to do people, this use f to use the existing combination technology, its reliability will not: pre-C "" electrical connection reliability is greatly reduced, as explained later. 5 1342063 • Please also refer to "1st drawing - 丨 and "2nd drawing", which will be soft. The display 10 is sequentially stacked with conductive adhesive material 4 and the flexible circuit board 12, and then a plurality of flexible circuit boards 12 After the external pins 18a, 8b correspond to the plurality of external pins 163, 16b of the flexible display, the heating and the soft display are combined with the flexible circuit board 12 to be combined, since the conductive adhesive 14 has A plurality of conductive particles 5a, i5b, therefore, when: the flexible display 1 〇 and the flexible circuit board 12, the conductive particles 15: W will be pressed and pinned outside the flexible display 1Q and the flexible circuit board 12 Between 16a, 16b, forming a conductive medium,
亚電^導通對應之外引腳16a，⑽，⑽，H 前述結合結構在結合初期之導電特性均能維持，但 由於軟性顯M 1G與魏電路板12兩者均具: 性^使用時即會產生彎折，當其產生如「第3圖^ 不寫柄，由於導電膠材14在固化後其硬度較高 得幫折時容易在導電顆粒以咖與外引腳…肩 18a’〗8b之間產生斷路. ’ 即會受影響，同時如此一來導電效果 【發明内容】，”，，構之可罪度即變差。 本發明提出—種可 法，目的在於結合-個可姑入…構及其結合方 連接之可“Μ:可撓介面’並使其接關之電性 =度不致在可撓介面受㈣時㈣低。 本务明之可撓介面結合結構人— 撓介面及一第_可诘人 馎畑用以結合一弟一可 弟-W介面’該第—可撓介面具有複數個 弟-外引腳’而該第二可撓介 腳，該具外^腳之可#介『士八社二外引 至少-溝# m 包括—接合耀材及 第-可/ 5㈣係設置於該第―可撓介面㈣ 弟一了撓介面之間，並 …人 引腳對鹿電,’腳與該等苐二外 連接，而該溝槽係設置於相鄰t + 連接之二個w目叙對應電性 似卜外引聊或/與該第二外引腳之間。 撓介面可撓介面結合方法，係用以結合-第-可 第外#一可撓介面’該第-可撓介面具有複數個 …卜引腳，而該第二可撓介面具有複 . :’撕方法包括:設置一接合膠材於該第 引瓦置^二可撓介面於該接合勝材，並使該等第二 腳對應該等第一外引腳;接合該第一可撓介面 面’使該等第-外引腳與對應之該等第二; 引心性連接’·以及，至少—溝槽於相鄰之二個 一外引腳或/與第二外引腳之間。 Μ弟 有關本發明的特徵與實作’兹 細說明如下。 固丁忭“e例砰 【實施方式】 首先，請同時參照「第4圖」及「第5圖」，「第4 圖」係為本發明結合結構之第一實施例之頂視圖，而 5圖」則是「第4圖」在5-5位置之剖視圖，自圖中可 以看見接合踢材40係爽置於第一可撓介面勤第二可 撓介面3。之間，此處之接合膠材4〇係以—種導 1342063 .y、彳欠詳述）為例，此種接合勝材4 〇具有複數個導電顆 粒41^ 41b，藉導電顆粒4]a，41b而分別將對應之複 數们第外引腳21a，21b與複數個第二外引腳3ia， ^ b相互電性連接’導通第-可撓介面20與第二可撓 面30，此外，本發明另具有一溝槽50，係設置於相 ，之對應電性連接之二個該第一外引腳21a，抓與該 第:外引腳3]a’ 31b之間，使得當此結合結構在被如 「弟3圖」方式f曲時，得以呈現「第6圖」所示之彎 曲狀態^不致於損冑電性連接之部位（第-外引腳21a， 21b、導電顆粒41a，仍、及第二外引腳…，仙間 之電性連接）。 前述之第一可撓介面20與第二可撓介面3〇係可為 不限於m顯示&、軟性電路板、軟性扁平排線、載 π自動鍵D板、及軟膜覆晶接合板，財所示之範例係The sub-electrical conduction is independent of the external pins 16a, (10), (10), and H. The above-mentioned bonding structure can maintain the electrical conductivity at the initial stage of bonding, but since both the soft display M 1G and the Wei circuit board 12 have: Will produce a bend, when it produces as the "3rd figure ^ does not write the handle, because the conductive adhesive 14 after the solidification of its hardness is higher, it is easy to be in the conductive particles with coffee and outer pins... shoulder 18a' 8b There is an open circuit between them. 'I will be affected, and at the same time, the conductive effect [invention content],", the guilty degree of the structure is worse. The invention proposes a method which can be combined with a combination of a configurable structure and a bond that can be connected to the connector and can be electrically connected to the flexible interface without being subjected to the fourth interface. (4) Low. The savvy interface combined with the structure of the person - the interface and the first _ 诘 诘 馎畑 馎畑 结合 结合 结合 结合 结合 结合 结合 - 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该'And the second flexible foot, the outer foot can be #介"士八社二外引 at least - groove # m including - joint glazing and the first - can / 5 (four) is set in the first - flexible Interface (4) The younger one is between the interface, and ... the pin is connected to the deer, the 'foot is connected to the other, and the groove is set to the adjacent t + connection. Between the external chatter or / and the second outer pin. The flexible interface flexible interface bonding method is used to combine - the first - the outer - a flexible interface - the first - flexible interface has a plurality of The second flexible interface has a complex: : 'Tear method includes: providing a bonding material to the first guiding tile to place the flexible interface on the bonding material, and Waiting for the second leg to wait for the first outer pin; engaging the first flexible interface surface 'to make the first-outer pins correspond to the second; the centroid connection '· and, at least, the groove Between the two adjacent external pins or / and the second outer lead. The features and implementations of the present invention are described in detail below. "Essence" [Embodiment] First, please Referring to "4th" and "5th", "4th drawing" is a top view of the first embodiment of the combined structure of the present invention, and 5" is "4th drawing" at the 5-5 position. In the cross-sectional view, it can be seen from the figure that the engaging kicking material 40 is placed on the first flexible interface second flexible interface 3. Between the two, the bonding material 4 〇 has a plurality of conductive particles 41 ^ 41b, by the conductive particles 4] a And 41b respectively electrically connecting the corresponding plurality of outer pins 21a, 21b and the plurality of second outer pins 3ia, ^b to each other to conduct the first flexible surface 20 and the second flexible surface 30, and further, The present invention further has a trench 50 disposed between the two corresponding first external leads 21a electrically connected between the first external pin 3a and the outer lead 3]a' 31b, so that when combined When the structure is f-shaped as in the "3D" mode, the curved state shown in "Fig. 6" is displayed, and the portion where the electrical connection is not caused (the first-outer pins 21a, 21b, the conductive particles 41a, Still, and the second outer pin..., the electrical connection between the fairy). The first flexible interface 20 and the second flexible interface 3 can be not limited to m display &, flexible circuit board, flexible flat cable, π automatic key D board, and soft film flip chip bonding board. The example shown
:軟性顯示器做為第一可撓介面，而以軟性電路板做為 弟-可撓介面’而此二者亦可以相互對調，仍得以應用 本發明之技術手段。 前述之接合朦材40 τ包括：異方性導電膠（aca, N〇n-C〇ndUctlve Adhesive )或等向性導電膠（icp， Isotropic Conduct】ve pasie)，以較常見之昱/方性導 電勝為例’此《材在進行外引腳接合（㈣『U b〇ndlng)作業時，係採同時加熱與加壓之方式將第一可 1342063 .^ w面20與第一可撓介面30壓合並籍接合膠材4〇而 .結合’形成電性連接，然而其他不同固化方式之接合膠 材40亦可應用於本發明中’例如，其他種類之昱方性 導電膠或非導電膠目前亦有採用紫外線固化及加屢方 式達到接合之目的’而等向性導電膠材則可採用加敎盘 加壓方式接合，唯各種膠材之接合溫度與接合壓力不 同，視一其技術手冊而定，但並非限定本發明範圍之停件。 =一可撓介面2。與第二可撓介面3。係各別具 有讀個外引腳21a，2ib，仏，仙（。心^⑷， 且王一對—對應配置，以i隹^?中w·4 以進仃-电性連接，此等外引腳 山、’ ，]a’ 3]b之數量少則一條，多則數十停， 細視電性訊號傳遞之需要而定。 溝槽5CM系貫穿第—可挽介面2 彻掉人舻u Α η 步一』視介面J Ο 與接5膠材40。前述溝样 連接之二個第一外引：;:=相鄰之對應電性 3比之間，且奸⑽與弟二外引腳-， 21a2lbM 之轴向係與該相鄰之第-外引腳 :—卜引腳3】a，3〗b之軸向相同，即 4圖」所不之平行方沬 31a 31bi77^ 置，以避免將外引腳2〗a, 21b， a，31b切断，影響其電性連接。 除此之外，如「第7圖， 結構之第二實施例頂視圖，盆中溝样5、/=本發明結合 於每二個相鄰之對應電 ：，·如分別設置 與第二外；丨腳31a 3lh # ^引腳21a，21b ， 之間，也就是說每二個外引腳 1342063 -來，若之間均具有—溝槽5】，52，如此 之彎曲面2°與第二可撓介面3。承受較大 守，亦不致會損壞電性連接部分。 其次’請配合「第9同 BB S« 人彡+ & 圖」閱覽之’其係為本發明έ士 構第三實施例 'π 饥係沿相鄰之第外:圖圖中可以見悉溝槽心 31bu ”卩* —外⑽叫训與第二外引腳3la 3 1 b之轴向呈斷續線形 ， 明之目的。 W狀延伸’如此結構亦可達到本發 續請參閱「第9圖」，1籽幺士八口口 每^ 」其仏為本發明結合結構第四 ::示；圖’此圖係與「第5圖」相同為剖視圖， =可以看見溝槽54係開設於第二可撓介面3。表面 方形凹槽或三角形凹槽等 開設於第一可%主 肉此溝槽亦可 J 丨面20表面’兩者效果相同。 響 m〔♦帛1G目」’其係為本發明結合結構第五麻 靶例之示意圖，圖中可 只 設於Μ ία 有出/冓槽55a，咖係分別開 角與第二可撓介面3°之表面… 角肜凹槽或方形凹槽等其他形狀。 一 再參閱「第11圖」與「第12 ， 發明έ士人έ士拔公 0」’、係分別為本 :月、，、。合結構第六與第七實施例之示意圖 中可以知悉溝槽56係貫穿該第二可 :11圖」 合膠材40，步成一 ρ %认 0與部分接 曲、.「一 形凹槽’做為撓曲時之彎 弟12圖」中則可以看出溝槽”亦為； 面3〇與部分接合膠材40’形成—較深的三 】0 1342063 角形凹槽。 第13B圖」、「第 ，其係為本發明 再者，請依序參閱「第13A圖」、「 13C圖」、「第13D圖」、及「第13E圖 結合方法之步驟示意圖，其包含： 步驟一.設置接合膠材4〇於第一可撓介面2〇 ;(如 「第13A圖」及「第13B圖」所示）The soft display is used as the first flexible interface, and the flexible circuit board is used as the younger-flexible interface, and the two can also be mutually adjusted, and the technical means of the present invention can still be applied. The foregoing joint coffin 40 τ includes: an asymmetrical conductive adhesive (aca, N〇nC〇ndUctlve Adhesive) or an isotropic conductive adhesive (icp, Isotropic Conduct) ve pasie, which is more common in the 昱/square conductivity. For example, when the material is subjected to external pin bonding ((4) "U b〇ndlng"), the first 1342063 . . . surface 20 and the first flexible interface 30 are pressed by simultaneous heating and pressurization. The bonding adhesive material is combined and formed to form an electrical connection. However, other bonding materials 40 of different curing methods can also be used in the present invention. For example, other types of conductive conductive adhesives or non-conductive adhesives are also currently used. The use of UV curing and repeated methods to achieve the purpose of the joint 'isotropic conductive adhesive can be joined by the twisting plate pressure method, but the bonding temperature and bonding pressure of various rubber materials are different, depending on a technical manual However, it is not intended to limit the scope of the invention. = a flexible interface 2. And the second flexible interface 3. Each has a read external pin 21a, 2ib, 仏, 仙 (.心^(4), and a pair of kings - corresponding configuration, i隹^? w·4 to enter the 仃-electrical connection, etc. The number of pin mountains, ',] a' 3]b is less than one, and many dozens of stops, depending on the needs of electrical signal transmission. The groove 5CM system runs through the first - the removable interface 2 u Α η step one 』view interface J Ο and connect 5 glue 40. The two first outer leads connected by the above-mentioned groove-like:;:= adjacent to the corresponding electrical ratio of 3, and rape (10) and brother two The axial direction of the pin-, 21a2lbM is the same as the axial direction of the adjacent first-outer pin: -b pin 3]a,3〗b, that is, the parallel figure 31a 31bi77^ In order to avoid cutting the outer pins 2 a, 21b, a, 31b, affecting their electrical connection. In addition, as shown in Figure 7, the top view of the second embodiment of the structure, the groove in the basin 5, / = The present invention is combined with each of two adjacent corresponding electrical:, if set separately from the second outer; the foot 31a 3lh # ^ pins 21a, 21b, that is, each of the two outer pins 1342206 - Come, if there is between - groove 5], 52, Such a curved surface 2° and the second flexible interface 3 are subjected to a large degree of protection, and the electrical connection portion is not damaged. Secondly, please read the "9th with BB S« 人彡+ & 图" It is the third embodiment of the present invention. The π hunter is adjacent to the outer side: the groove heart 31bu can be seen in the figure. 卩*-outer (10) training and the second outer lead 3la 3 1 b The axial direction is a discontinuous line shape, which is the purpose of the purpose. W-shaped extension 'This structure can also reach this continuation. Please refer to "9th picture", 1 seed gentleman, eight mouths each ^" The following figure is the same as the "figure 5" is a cross-sectional view, = can be seen that the groove 54 is opened in the second flexible interface 3. The surface square groove or triangular groove is opened at the first The main flesh can also be the same as the surface of the J-face 20. The sound m [♦ 帛 1G mesh" is a schematic diagram of the fifth hemp target of the combined structure of the present invention, and the figure can be set only in Μ ία There are outlets/grooves 55a, the cavities are respectively open and the surface of the second flexible interface is 3°... other shapes such as corners or square grooves. "11th" and "12th, invented gentleman gentleman 0", respectively, are: month, ,, and the schematic diagram of the sixth and seventh embodiments of the structure can be seen in the groove 56 system Through the second: 11"" glue 40, step into a ρ% recognize 0 and part of the joint, "one-shaped groove as a deflection of the curved figure 12" can be seen in the groove Also, the surface 3〇 is formed with a portion of the bonding material 40'--the deeper three] 0 1342063 angular groove. Figure 13B", "The first is the invention, please refer to "13A" Figure, "13C", "13D", and "13E" are schematic diagrams of the steps of the method, including: Step 1. Set the bonding material 4 to the first flexible interface 2; (eg " 13A" and "Fig. 13B")
步驟一 · 3置第二可撓介面30於接合膠材40，並 使複數個第二外引腳31a，31b對應複數個第一外引腳 21a’ 21b ;(如「第i3C圖」所示） 步驟三：接合（例如：加熱或/與壓合）第一可撓介面 20與第二可挽介面30，使第一外引腳21a，21b與對應 之第-外引腳31a，31b電性連接；（如「第13D圖」所 示）Step 1·3 places the second flexible interface 30 on the bonding material 40, and the plurality of second outer leads 31a, 31b correspond to the plurality of first outer leads 21a' 21b; (as shown in "i3C" Step 3: bonding (eg, heating or/and pressing) the first flexible interface 20 and the second switchable interface 30 to electrically connect the first outer leads 21a, 21b and the corresponding first-outer pins 31a, 31b Sexual connection; (as shown in Figure 13D)
步驟四：開設至少—溝槽58於相鄰之二個該第一 外引腳或/與該第二外引腳之間。（如「第13E圖」所示） 再請依序參閱「第14A圖」、「第14B圖」、「第uc 圖」、「第14D圖」、及「第14E圖」，其係為本發明另一 結合方法之步驟示意圖，其包含·· 步驟一.设置接合膠材4〇於第一可撓介面2〇 ;(如 「第14A圖」及「第14B圖」所示） 步驟二：開設至少—溝槽59於接合膠材40，溝槽 59係位於相鄰之二個第—外引腳21a，21b之間的接合 膠材40上；（如「第14c圖」所示 42063 ' 步.驟三：晶32益_ ，使讀等第二外：3二==於_材4。，並 I以及（如「第⑽等第—外引腳叫 步驟四：接合(例如:加熱 Μ輿第二可換介面3〇，使卜可挽介面 對應之該等第二外引腳31^3^聊〜抓與 ⑽圖」所示） ，仙电性連接。（如「第 鲁 介简20 Μ第：二f:形成之溝槽59係位於第-可撓 與第二—Λ 30之間，且第-可撓介面2。 〜切割於其上，因此:=?接合狀態’未有 2lb, 31a ,lh . P,在產生穹折枯，各外引腳21a， 人 ， 4仍有第—可撓介面20盥第 介面3Q表面之保護，維持其強度。。一可撓 前述開設溝槽58、59之太士私__ 方式（如卫具機裁切），亦；機械切割之 法，但並不限於此等方法用由射切割或姓刻等方 請依序參閱「第15A圖」、「第15β圖」、及「第况 其係為本發明又-結合方法之步驟示意圖，其包 步驟®置第-可撓介面20與第二可撓介面 =’· 外引腳253, 25b與第二外引_ 31a，31b相對 應，（如「第15A圖」所示） 步驟二：接合(例如:熔接)相對應之第—外引腳 12 1342063 25a，25b與第二外引腳3〗a，3]b，使其形成電性連接； 以及（如「第15B圖」所示） 步驟三：開設至少一溝槽6〇a，6〇b於相鄰之二個第 二外引腳31a，31b之間；（如「第】5C圖」所示） 月述之溝漕60a，60b係以二種不同之實施方式為 之，其一為以溝槽60a未貫穿第二可撓介面3〇之方式 實施，而另一之溝槽60b則貫穿了第二可挽介面3〇, 兩者之效果不同，但均足以達成本案之目的。 此實施例在施行時，可在第一外引腳25a，25b與第 二外引腳31a，31b溶接後，此處之炫接係以第—外引腳 25a，25b炫融，而第二外引腳31a，仙與之接合為例， 但實施上，可以採用第二外引腳31a，灿炫融，而第 一/卜引腳心，挪與之接合，亦或是第-外引腳25a 2讣與第二外引腳31a，灿兩者皆呈熔融狀態均可： :於第-可撓介面20與第二可撓介面3〇之間填充並固 =接合膠材42(如第16C圖所示），此種接合膠 歧用非導電式的膠材，如底膠（unferf⑴）， 與第二可撓介面2〇, 3〇間之接人 _ _ σ更加穩固，同時能阻絕 化乳’長:咼整體結合效果之貪 少、婆沾一 T养度，唯若使用前述60b 紅貫㈣樣時，此填_材 前即完成。 幻而開a又溝槽之 別述炫接第一外引腳ocu 31a 〇1h ^ Μ卿心，25b與第二外引腳 ，1 b之步驟，可由高溫 被共晶或擴散等方式來 13 k订:其主要係'將第—外引腳25a，25b採用低炼點会屬 之材質來f作’之後再加溫使之轉，完成電性連接之 目的。 「叫依序芩閱「第]6A圖」、「第16B圖」、「第16C圖」、 ^第1 6D圖」’其係為本發明再一結合方法之步驟示 意圖，其包含： 步驟—：疊置第一可撓介面2〇與第二可撓介面 〇使第一外引腳25a，25b與第二外引腳31a，3】b相對 應；（如「第16A圖」所示） 步驟一 .，j：谷接相對應之第一外引腳25&，2讣與第二 外引腳31a，31b，使其形成電性連接；（如「第16β圖」 所示） 步驟—·填充接合膠材42於第一可撓介面2〇與第 二可撓介面3G之間，並使接合#材42固化，以接合第 -可撓介面20與第二可撓介面3〇 ;以及(如「第⑽ 圖」所示） 步驟四m少一溝才曹61則目鄰之二個第二外 引腳31a，31b之間；以及(如「第16D圖」所示） 本實施例之溝槽61係穿過第二可挽介面3〇並深達 接合膠材42,使得彎折時之可撓性變佳。 其係用以結合一第·一 ，該第一可撓介面20 而該第二可撓介面30 最後，總結本發明結合方法， 可撓介面20及一第二可撓介面 具有複數個第一外引腳21 a, 21 b， 14 1342063 具有硬數個第二外引腳30a，30b,該具外引腳之可撓介 面結合方法包括： ’第_可撓介面30與έ玄第一可撓介面2〇，並 使言夕墓笛一 ^ ·罘二外引腳31a, 31b對應該等第一外引腳 21a, 21b ； 二#，合該第—可撓介面20與該第二可撓介面30，使Step 4: Opening at least the trench 58 between the adjacent two of the first outer pins or/and the second outer pins. (as shown in Figure 13E). Please refer to "Figure 14A", "Figure 14B", "Cuc Figure", "第14D图" and "第14E图". A schematic diagram of the steps of another combined method, comprising: step 1. setting the bonding adhesive 4 to the first flexible interface 2; (as shown in "Fig. 14A" and "Fig. 14B") Step 2: Opening at least the groove 59 is formed in the bonding material 40, and the groove 59 is located on the bonding material 40 between the adjacent two first outer pins 21a, 21b; (as shown in "Fig. 14c" 42063' Step 3. Step 3: Crystal 32 benefits _, so that read the second outer: 3 two == _ material 4, and I and (such as "the (10) etc. - outer pin called step four: joint (for example: heating Μ舆The second interchangeable interface is 3〇, so that the second external pin 31^3^ corresponds to the (10) diagram), and the connection is made.简体 20 Μ: two f: the formed groove 59 is located between the first-flexible and the second-twist 30, and the first-flexible interface 2. ~ cut on it, therefore: =? joint state 'not There are 2lb, 31a, lh. P, in the production of 穹, Each of the outer leads 21a, 4, 4 still has the protection of the surface of the first flexible surface 20 盥 interface 3Q, maintaining its strength. A flexible way to open the trenches 58, 59 __ way (such as Wei Machine cutting, also; mechanical cutting method, but not limited to these methods, please use "cutting 15", "15th figure", and "the condition" The present invention is a schematic diagram of the steps of the method of the present invention, the package step of the first flexible interface 20 and the second flexible interface = '· the outer pins 253, 25b correspond to the second outer leads _ 31a, 31b, (As shown in Figure 15A) Step 2: Bonding (for example, welding) the corresponding first-outer pin 12 1342063 25a, 25b and the second outer pin 3〗 〖a, 3] b to make it electrically Sexual connection; and (as shown in Figure 15B) Step 3: Open at least one trench 6〇a, 6〇b between the adjacent two second outer leads 31a, 31b; 】 5C diagram") The gully 60a, 60b of the month is implemented in two different embodiments, one of which is implemented by the groove 60a not penetrating the second flexible interface 3〇, The groove 60b penetrates the second switchable surface 3〇, and the effects of the two are different, but both are sufficient for the purpose of the present invention. This embodiment can be applied to the first outer leads 25a, 25b and the second. After the outer leads 31a, 31b are fused, the dazzle is fused by the first outer leads 25a, 25b, and the second outer lead 31a is joined to the singular, but in practice, the second can be used. The outer lead 31a is fused, and the first/b pin is engaged with it, or the first-outer pin 25a 2讣 and the second outer lead 31a, both of which are in a molten state. The adhesive material 42 can be filled and fixed between the first flexible interface 20 and the second flexible interface 3 (as shown in FIG. 16C), and the bonding adhesive is made of a non-conductive adhesive. Such as the bottom glue (unferf (1)), and the second flexible interface 2 〇, 3 之 _ _ σ is more stable, while blocking the milk 'long: 咼 咼 咼 咼 、 、 、 、 、 、 、 However, if the above 60b red (four) sample is used, this is completed before the filling. The illusion opens a groove and the other is the first external pin ocu 31a 〇1h ^ Μ 心, 25b and the second outer pin, 1 b step, can be eutectic or diffuse by high temperature 13 k order: The main reason is that the first-outer pins 25a, 25b are made of low-refining materials, and then heated to turn them to complete the electrical connection. "In order to read "6A", "16B", "16C", ^1 6D", which is a schematic diagram of the steps of a further method of the present invention, comprising: : stacking the first flexible interface 2〇 and the second flexible interface 〇 such that the first outer leads 25a, 25b correspond to the second outer leads 31a, 3] b; (as shown in FIG. 16A) Step one, j: valley corresponding to the first outer pin 25&, 2讣 and the second outer pin 31a, 31b to make an electrical connection; (as shown in "16th figure") - Filling the bonding glue 42 between the first flexible interface 2 〇 and the second flexible interface 3G and curing the bonding material 42 to bond the first flexible interface 20 and the second flexible interface 3 〇; (as shown in the figure (10)) Step 4 m is less than one groove, then Cao 61 is between the two adjacent second external pins 31a, 31b; and (as shown in "16D"). The groove 61 passes through the second switchable interface 3〇 and reaches the bonding material 42 so that the flexibility at the time of bending becomes better. The first flexible interface 20 and the second flexible interface 30. Finally, the binding method of the present invention is summarized. The flexible interface 20 and the second flexible interface have a plurality of first interfaces. The pins 21 a, 21 b, 14 1342063 have a plurality of second outer pins 30a, 30b, and the flexible interface bonding method with the outer pins includes: 'the first flexible interface 30 and the first flexible The interface is 2〇, and the outer horn 31a, 31b corresponds to the first outer lead 21a, 21b; 2#, the first flexible interface 20 and the second flexible Interface 30, so
该寻第一外引腳21a，2]b與與之對應之該等第二外引 胸7 3】a，3]b電性連接；以及 一開=至少一溝槽58、59、60a、60b、6]於相鄰之 一個該第二外引腳31a，31b之間。 兩述:個步驟係可相互對調，亦能達成相同效果； 〇依據則述方法之第一實施例，在前述接合步驟前亦 可具有一步驟：夾置-接合膠材40於該第一可撓介面 20與該第二可撓介面30之間；The first outer lead 21a, 2] b is electrically connected to the second outer lead 7 3 a, 3] b corresponding thereto; and the open = at least one groove 58, 59, 60a, 60b, 6] between adjacent ones of the second outer leads 31a, 31b. Descrição: The steps can be mutually adjusted, and the same effect can be achieved. 〇 According to the first embodiment of the method, there may be a step before the bonding step: the sandwich-bonding glue 40 is applied to the first Between the flexible interface 20 and the second flexible interface 30;
除此之外，前述接合步驟係可採用加熱及加壓、紫 外鍊固化及加壓等方式進行。 在前述開設溝槽步驟前或後亦可加入一步驟：填充 及固化一接合膠材42(如第lfir闰6^-、 π以罘丨化圖所不）於該第一可撓 介面20及該第二可撓介面30之間。 、綜上所述’㈣本發明以前述之實施例揭露如上， 然其亚非用以限定本發明’任何熟習相關技藝者，在不 脫離本發明之精神和範圍 巳图門田可作些許之更動與潤 牟’但均仍應屬本發明之範》#·，田卜卜士 心乾可因此本發明之專利保護 15 .ji 範圍須視本兮ΒΒ 4 【圖式簡所附之中請專利範圍所界定者為準。 J二：:為習知可撓介面結合結構頂視圖； 弟Z圖，係μ ”、、弗】圖2·2位置之剖視圖； 圖’係為第2圖之撓曲示意圖； 第4圖圖係為本發明結合結構第-實施例示意圖之頂視 f 5圖，係為第4圖5-5位置之剖視圖； 第6圖保為第5圖撓曲示意圖. 本發明結合結構第二實施例之頂視圖； 第9圖，二^明結合結構第三實施例之頂視圖； 圖不為本發明結合結構第四實施例之示音圖. 弟10圖’係為本發明結合結構第五實施例之干f， 第11圖，係為本發明結合結構第六實施例之；:：； 弟12圖，係為本發明結合結構第七 ’ sl3V：V3!r13^— 第14Α，1仇14C，風丨4£圖，係為本發明另一 方法之步驟示意圖； μ & 第15Α，15Β，15C圖，係為本發明又一 έ士人 示意圖丨以及 、、·。5方法之步驟 第16Α’ 16Β，16C，16D圖，係為本發明再一仏人 之步驟示意圖。 '、、σ &方法 16 1342063 【主要元件符號說明】 10 軟性顯示器 12 軟性電路板 14 導電膠材 1 5a, 15b 導電顆粒 16a, 16b, 18a, 18b 外引腳 19 脫層 20 第一可撓介面 21a, 21b, 25a, 25b 第一外引腳 30 第二可撓介面 31a, 31b 第二外引腳 40, 42 接合膠材 41 a, 41b 導電顆粒 50, 51, 52, 53a, 53b, 54,55a, 55b 溝槽 56, 57, 58, 59, 60a, 60b, 61 溝槽In addition to the above, the bonding step may be carried out by heating and pressurization, ultraviolet chain curing, and pressurization. A step may be added before or after the step of forming the trench: filling and curing a bonding adhesive 42 (such as lfir闰6^-, π to suppress the image) and the first flexible interface 20 and Between the second flexible interfaces 30. In the above, the present invention is disclosed above in the foregoing embodiments, and the invention is not limited to the skilled artisan of the present invention, and may be modified without departing from the spirit and scope of the present invention. And Run 牟 'but both should still belong to the scope of the present invention #·, 卜卜卜士干干 Therefore, the patent protection of the present invention 15 ji range depends on this 兮ΒΒ 4 [with the scope of the patent The definition is subject to change. J 2:: is a top view of the conventional flexible interface combined structure; the younger Z diagram is a cross-sectional view of the position of Fig. 2·2; Fig. 2 is a schematic diagram of the deflection of Fig. 2; Fig. 4 The top view of the first embodiment of the present invention is a cross-sectional view of the fifth embodiment, and is a cross-sectional view of the position of FIG. 4; FIG. 6 is a schematic view of the fifth embodiment of the present invention. FIG. 9 is a top view of a third embodiment of the combined structure; the figure is not a sound diagram of the fourth embodiment of the present invention. FIG. 10 is a fifth embodiment of the combined structure of the present invention. Example f, Fig. 11 is a sixth embodiment of the combined structure of the present invention;::; brother 12, which is the seventh structure of the invention combined with the structure of the seventh sl3V:V3!r13^- 14th, 1 Qiu 14C Figure 4 is a schematic diagram of the steps of another method of the present invention; μ & 15th, 15th, 15C, is a schematic diagram of another gentleman of the present invention, and steps of the method of 16Α' 16Β, 16C, 16D diagram, is a schematic diagram of the steps of the present invention. ', σ & method 16 1342063 [mainly Component symbol description] 10 Flexible display 12 Flexible circuit board 14 Conductive adhesive material 1 5a, 15b Conductive particles 16a, 16b, 18a, 18b Outer pin 19 Debonding 20 First flexible interface 21a, 21b, 25a, 25b First external Pin 30 second flexible interface 31a, 31b second outer lead 40, 42 bonding adhesive 41 a, 41b conductive particles 50, 51, 52, 53a, 53b, 54, 55a, 55b trench 56, 57, 58 , 59, 60a, 60b, 61 groove
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96120885A TWI342063B (en) | 2007-06-08 | 2007-06-08 | A bonding structure of flexible films and bonding method therefor |
| JP2007215979A JP4729024B2 (en) | 2007-06-08 | 2007-08-22 | Flexible film bonding structure and bonding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96120885A TWI342063B (en) | 2007-06-08 | 2007-06-08 | A bonding structure of flexible films and bonding method therefor |
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| Publication Number | Publication Date |
|---|---|
| TW200849532A TW200849532A (en) | 2008-12-16 |
| TWI342063B true TWI342063B (en) | 2011-05-11 |
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| TW96120885A TWI342063B (en) | 2007-06-08 | 2007-06-08 | A bonding structure of flexible films and bonding method therefor |
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| TW (1) | TWI342063B (en) |
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| CN103607855B (en) * | 2013-10-26 | 2016-06-08 | 溧阳市东大技术转移中心有限公司 | The manufacture method of a kind of composite flexible substrate |
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| JPH07123179B2 (en) * | 1990-10-05 | 1995-12-25 | 信越ポリマー株式会社 | Circuit board connection structure with anisotropic conductive adhesive |
| JP2973678B2 (en) * | 1992-01-27 | 1999-11-08 | 松下電器産業株式会社 | Wiring pattern connection method |
| JPH104248A (en) * | 1996-06-17 | 1998-01-06 | Teikoku Tsushin Kogyo Co Ltd | Board connection structure |
| US6927344B1 (en) * | 2004-02-27 | 2005-08-09 | Motorola, Inc. | Flexible circuit board assembly |
| CN101194540B (en) * | 2005-04-11 | 2010-06-16 | 3M创新有限公司 | Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
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| JP2008306153A (en) | 2008-12-18 |
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