1339462 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種光電收發器之連接框體結構，特別 是關於用於SFP光電收發器模組之延伸連接框體結構。 【先前技術】1339462 IX. Description of the Invention: [Technical Field] The present invention relates to a connection frame structure of an optoelectronic transceiver, and more particularly to an extension connection frame structure for an SFP optoelectronic transceiver module. [Prior Art]
光電收發器（optoelectronic transceiver)是一種可插拔 式的光電轉換器模組’通常用來作為各種網路設備（如路由 鲁器、置頂盒、網路伺服器等）之通訊鏈結端與外部各種規格 的光纖纜線之間的介面，以將來源端（即上述之網路設備） 傳來的電子訊號轉換成光訊號形式透過光纖實體媒介再發 送至另一與之互連之電子裝置端。它也可設計來連接一般 以電子訊號形式傳遞資料的銅纜線，如無遮蔽式銅雙絞線 (UTP，unshielded twisted pair，即一般的網路線）或是 BNC 同軸纜線，以讓一些需要將光訊號轉換為電子訊號傳遞的 主機使用。簡單地說，光電收發器即是一種將光電訊號互 φ 轉的介面。 • 目前業界與國際上存在有多種光電訊號的傳輸規格， ‘如以光纖而言，就分為LC、ST、FC及SC等連接器 (c〇nnect〇r)規格，再加m BNC這兩種電子訊號瘦線 規格，故一台處理光電訊號的網路設備要支援各種類型之 ^接規或端口規格)是很困難的，過多的連接端口不但 會佔去設備表面的有效區域，亦會增加設備的製造成本以 的不便°故目前業界將光電收發器模組做成可插 拔式的模組介面，士同 _ 如圖一所不，其為各種收發器模組與網 1339462 路設備上插槽之立體示意圖。每種光電收發器1〇1，1〇2, 103都有其對應之輸出入端口類型，如圖中所列舉之LC、 BNC或ST類型。只要藉著替換各種類型的收發器模組， 其連接之網路設備端1〇〇只要具備一種尺寸規格的插槽或 端口 1 〇4就能連接所有類型之實體纜線！ 〇7媒介來進行光 訊號或電訊號的資料接收與發送。 目前最為業界所熟知的光電收發器模組類型為超高速 _ 介面轉換器（GBIC，Gigabit Interface Converter)，顧名思 義’其可作為Gigabit乙太網路與光通道之間的光電轉換 介面。除了具備熱插拔功能以及支援上述各種類型的纜線 連接規格外’為了增加其主機連接端（及網路設備）可配置 之端口數目’業界亦制訂了一些微型化的轉換器尺寸規格 (form factor)標準以讓主機設備能在相同的面板面積下設 置更多的連接端口 ’舉例而言’小尺寸插拔式（SFP，small form factor pluggable ’如圖一所示之收發器外型）規格即為 ►目前業界廣泛接受之小尺寸光電收發器標準。SFP為以多 重來源協定（MS A, multi-source agreement)依 GBIC 規格所 -制訂出來的標準，可視為GBIC模組的升級版本，其體積 (長48 X寬14 x高1〇 mm )比原本GBIC模組大約減少一 半’也因此在相同大小的網路設備面板上，可提供多出一 倍的連接埠（即連接端口）數量。由於SFP與GBIC在功能 上並無差別’所以某些交換器廠商又稱 SFP為An optoelectronic transceiver is a pluggable optoelectronic converter module that is commonly used as a communication link and external for various network devices (such as routers, set-top boxes, network servers, etc.). The interface between the optical fiber cables of various specifications converts the electronic signals transmitted from the source end (that is, the above-mentioned network device) into optical signals and transmits them to the electronic device connected to each other through the physical medium of the optical fiber. . It can also be designed to connect copper cables that typically transmit data in the form of electronic signals, such as unshielded twisted pair (UTP) or BNC coaxial cable, to provide some Convert the optical signal to the host used for electronic signal transmission. Simply put, an optoelectronic transceiver is an interface that turns optoelectronic signals to each other. • There are a variety of optical signal transmission specifications in the industry and internationally. 'In terms of optical fiber, it is divided into LC, ST, FC and SC connectors (c〇nnect〇r) specifications, plus m BNC A kind of electronic signal thin wire specification, so it is very difficult for a network device that processes photoelectric signals to support various types of connection or port specifications. Excessive connection ports will not only occupy the effective area of the device surface, but also Increasing the manufacturing cost of the device is inconvenient. Therefore, the industry has made the optoelectronic transceiver module into a pluggable module interface, as shown in Figure 1, which is a variety of transceiver modules and network 1339462 road devices. A three-dimensional diagram of the upper slot. Each of the optoelectronic transceivers 1, 〇 1, 2, 103 has its corresponding input-input port type, such as the LC, BNC or ST type listed in the figure. By replacing various types of transceiver modules, the connected network device end can be connected to all types of physical cables as long as it has a size slot or port 1 〇4! 〇7 medium for receiving and transmitting data of optical signals or electrical signals. At present, the most well-known type of optoelectronic transceiver module is the ultra-high speed _ interface converter (GBIC, Gigabit Interface Converter), which can be used as the photoelectric conversion interface between Gigabit Ethernet and optical channel. In addition to the hot-swap capability and support for the various types of cable connections mentioned above, 'in order to increase the number of ports that can be configured for their host connections (and network devices), the industry has also developed some miniaturized converter size specifications (form Factor) standard to allow the host device to set more connection ports under the same panel area. For example, 'SFP, small form factor pluggable' (transceiver appearance shown in Figure 1) specifications It is the standard for small-sized optoelectronic transceivers widely accepted in the industry. The SFP is a standard developed by the GBIC specification based on the multi-source agreement (MS A). It can be regarded as an upgraded version of the GBIC module. Its volume (length 48 X width 14 x height 1〇mm) is larger than the original. The GBIC module is reduced by about half, so it can provide twice the number of ports (ie, connection ports) on the same size network device panel. Since SFP and GBIC are not functionally different, some switch manufacturers are also called SFPs.
Mini-GBIC。 根據以上所述，收發器模組已能相容對應各種光電傳 6 1339462 輸規格，餘下的光電網路設備只要能提供一個統一的插样 規格供以各種類型之收發器模組接合其上，即能進行光電 訊息的發收與接送，如圖一中之104，105，即為符合SFp 標準規格之收發器插槽與容納框體。 由於收發器模組要在主機上進行插拔的動作，一般的 光電收發器模組上都會含有一特別的鬆脫結構（delatch)來 幫助其自框體中拔出，而其容納之框體亦會有電磁輻射控 制與模組固定等結構設計以幫助模組之運作。特別在光電 訊號處理設備（如各種的高速網路設備）的測試中，光電收 發器模組會在主機上進行頻繁的插拔以測試主機的功能， 其原本鬆脫機制之設計在訊號纜線接著的狀態下並不容易 施行，再加上收發器模組本體結構脆弱且價格昂貴，故用 以測試之光電收發器模組於主機設備的測試期間易受到損 壞，無形中增加了設備測試的成本。 於此，本發明提出一種SFP收發器模組之延伸連接裝 置’可取代SFP收發器模組本體來與主機端（如網路設備） 的SFP容納框體進行連接，以避免昂貴的卿收發器模组 本體受損。 【發明内容】 本毛月之目的在於&供一 SFp收發器模組之延伸連接 裝置，可在測試光電網路設備的期間作為SFP收發器模组 與設備主機之間的媒介，以取代該收發器模組來與主機進 行直接的電路連接，避免脆料貴的SFP收發賴組損壞。 -亥延伸連接裝置具有：一 SFp容納框體，其尺寸規格 7 1339462 被设0十來讓一 SFP收發器模組***；一插件部位，其尺寸 外型與SFP收發器模組模組大致上相同，被設計來取代 SFP收發器模組***主機的SFp容納框體中；一位於延伸 連接裝置内部的電路板結構，配置在延伸連接裝置上的 SPF容納框體以及插件部位之中。透過電路板内部電路佈 線的連接’可讓插於其上之SFp模組與主機設備端電路連 本發明裝置之運作如下：首先訊號規線先與測試用之 SFP收發器模組頭端連接。接著將該卿收發器模组尾端 ***延伸連接裝置之SFP容納框體中。最後再從延伸連接 裝置的插件部位將整個延伸結構插在受測的主機設備上。 經由延伸連結裝置中的電路板傳輸，訊號镜線中傳來的資 料可自訊號麟端經由SFP模組、延伸連結裝置之電路 板乙伸逹、纟σ扁置之插件部位，而傳入主機設備中；反之， 主機設備端的資料亦可經由與上述流程相反 部的電子設備去。 f ^卜 士 月的優點之—疋作為SFP收發11模組與其欲連結 之主機设備端之間的一連接媒介。 本土明之另-優點為取代SFp收發器模組來愈該主機 =端進行直接連接，以避免脆弱的卿收發器模組 相壞。 本發明之另一優點為讓整個卯 之⑽賴能方便地自主機㈣端拆卸下來。… &者之後較佳實施例的描述，伴隨著圖示與附上之專 8 丄 wy462 利叫求項，本發明的優點將愈加明顯。 【實施方式】 現在凊參照圖示，其中的展示係只為了說明本發明之 較佳實施例’而非侷限了其範疇。圖二a為說明一 SFP收 發范模組之立體圖。SFp收發器模組2〇〇含有一頭端2〇1 和尾端2〇2’頭端201是SFP收發器模組200與訊號纜線（如 圖中的107)之連接端’不同的頭端外型會對應到不同的 鲁Λ唬纜線1〇7與傳輸方式。尾端202是SFP收發器模組200 /、主機δ又備端電路的連接端，如圖二b所示，sFp收發器 杈組200尾端202的内部含有一電路接觸端（俗稱金手指） 2〇4 亥電路接觸端為SFP收發器模組内部一 peg電路板 之佈線終端，可將頭端2〇1自訊號纜線處傳來之資料訊號 傳到與之連接之主機設備（如機上盒、路由器等），亦可將 主機設備發出的訊號傳至SFP收發器模組端。參照圖六a， 其為主機設備100中與SFP收發器模組2〇〇連接之電路板 籲部位不意@。圖中的長方形部位6()2即為預定用來設置 _ SFP容納框體之位置。該長方形部位術中有配置一塊狀 .的電路插槽603。當SFP收發器模组2〇〇被***固定在主 機上的容納框體中時，SFP收發器模組200尾端202的電 路接觸端204會與上述主機電路板6〇1上的電路插槽6〇3 產生電路連結’以將電子資料傳人或傳出主機設備。Mini-GBIC. According to the above, the transceiver module can be compatible with various photoelectric transmission 6 1339462 transmission specifications, and the remaining optical network equipment can provide a uniform insertion specification for bonding various types of transceiver modules. That is, the transmission and reception of photoelectric information can be carried out, as shown in Fig. 1, 104, 105, which is the transceiver slot and the receiving frame conforming to the SFp standard specification. Because the transceiver module needs to be plugged and unplugged on the host, the general optoelectronic transceiver module will have a special delatch to help it be pulled out of the frame, and the housing is accommodated. There are also structural designs such as electromagnetic radiation control and module fixing to help the module operate. Especially in the test of photoelectric signal processing equipment (such as various high-speed network equipment), the optical transceiver module will be frequently plugged and unplugged on the host to test the function of the host. The original loose mechanism is designed in the signal cable. In the following state, it is not easy to implement. In addition, the structure of the transceiver module is fragile and expensive. Therefore, the optoelectronic transceiver module used for testing is susceptible to damage during testing of the host device, and the device test is invisibly added. cost. Therefore, the present invention provides an SFP transceiver module extension connection device that can replace the SFP transceiver module body to connect with the SFP receiving frame of the host end (such as a network device) to avoid expensive transceivers. The module body is damaged. SUMMARY OF THE INVENTION The purpose of this month is to provide an extension connection device for an SFp transceiver module, which can be used as a medium between the SFP transceiver module and the device host during testing of the optoelectronic network device. The transceiver module is used to make a direct circuit connection with the host to avoid damage to the expensive SFP transceiver group. -Hai extension connection device has: an SFp receiving frame body, the size specification 7 1339462 is set to 0 to allow an SFP transceiver module to be inserted; a plug-in part, the size of the external shape and the SFP transceiver module module substantially Similarly, it is designed to replace the SFP transceiver module into the SFp receiving frame of the mainframe; a circuit board structure located inside the extended connecting device is disposed in the SPF receiving frame and the inserting portion on the extended connecting device. The connection of the internal circuit wiring through the board allows the SFp module inserted thereon to be connected to the host device terminal circuit. The operation of the device of the present invention is as follows: First, the signal regulation line is first connected to the head end of the SFP transceiver module for testing. The rear end of the clear transceiver module is then inserted into the SFP housing frame of the extension connector. Finally, the entire extension structure is inserted into the host device under test from the plug-in portion of the extension connector. Through the transmission of the circuit board in the extension connection device, the data transmitted from the signal mirror line can be transmitted from the signal terminal to the host through the SFP module, the circuit board of the extension connection device, and the plug-in portion of the 纟σ flat In the device, the data of the host device can also go through the electronic device opposite to the above process. f ^Bushi's advantage of the month - as a connection medium between the SFP transceiver 11 module and the host device side to which it is connected. Another advantage is that instead of replacing the SFp transceiver module, the host = terminal is directly connected to avoid the fragile clear transceiver module. Another advantage of the present invention is that the entire raft can be easily removed from the main (four) end. The description of the preferred embodiment is followed by the accompanying drawings and the appended claims, and the advantages of the present invention will become more apparent. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention is described with reference to the preferred embodiments of the invention, and is not intended to limit the scope thereof. Figure 2a is a perspective view showing an SFP transceiver module. The SFp transceiver module 2 includes a head end 2〇1 and a tail end 2〇2' head end 201 is a different end of the SFP transceiver module 200 and the signal cable (107 in the figure) The appearance will correspond to different reckless cables 1〇7 and transmission mode. The tail end 202 is a connection end of the SFP transceiver module 200 /, the host δ and the standby circuit, as shown in FIG. 2b, the inside end of the sFp transceiver group 200 has a circuit contact end (commonly known as a gold finger). The contact terminal of the 2〇4 circuit is a wiring terminal of a peg circuit board inside the SFP transceiver module, and the data signal transmitted from the head end 2〇1 to the signal cable can be transmitted to the host device connected thereto (such as the machine) The box, router, etc.) can also transmit the signal sent by the host device to the SFP transceiver module. Referring to FIG. 6a, the circuit board connected to the SFP transceiver module 2 in the host device 100 is not intended to be @. The rectangular portion 6() 2 in the figure is a position intended to set the _SFP accommodating frame. The rectangular portion has a circuit slot 603 configured in a block shape. When the SFP transceiver module 2 is inserted into the receiving frame fixed on the mainframe, the circuit contact end 204 of the rear end 202 of the SFP transceiver module 200 and the circuit slot on the host circuit board 6〇1 6〇3 Generate circuit connections' to transfer electronic data to or from the host device.
“、、圖—a ’其為本實施例中用來容納收發器模 組200之框體。框體300為一 ttSFp標準尺寸規格（長I 見14χ肖10mm)稍大之長方形金屬體，被設定來容納標 9 1339462 準的SFP收發器模組。框體3〇〇前端有一開口 3〇1可讓 SFP收發器模組2〇〇進入。該開口端3〇1的四個側面上分 別配置有數個長條狀的接地凸片3〇3，可與框體周圍具導 電性的底盤接觸以達到接地效果。框體3〇〇的頂面上還具 有數個按規律圖形排列之通氣孔3〇4，如圖三a所示。在 圖三b中，開口端3〇1的底面上有一簧片結構3〇7，該簧 片結構307上有一個三角形開口 3〇2。當SFp收發器模組 200***框體300中時，SFP收發器模組2〇〇本體上一三 角形凸起205(如圖二b所示）會嵌入該三角形開口 3〇2中以 將之固定。在圖三b中，可以看到框體遍的底部末端有 一矩形的開口 305,該開口 305提供了一空間讓前述主機 電路板601上之電路插槽6〇3伸入，使得該電路插槽6们 能配置於框體300内部以讓***其中的SFp收發器模組接 合。框體300兩側面的底部邊緣設置有多個接合引腳3〇5, 該接合引腳305可以引腳焊接（s〇〗dering)或是引腳壓合 (^ress fit)的方式將整個框體3〇〇固定在主機電路板6〇ι預 丈的的長方形區域602上，如圖六b所示。圖六a中長方 形區域邊緣附近的孔洞604即為讓接合引腳焊接或壓合的 區域。另外，在框體300底部開口 305的周圍還配置有數 個防止電磁波干擾的引腳（EMI引腳），該腦引腳规之 長，較上述之接合引腳3〇5來的短，同樣可使用引腳焊接 或是引腳壓合的方式固定在主機電路板6〇1上。 SFP收發器模組200與框體3〇〇接合後的樣子如圖四 所不’圖中的框體遍後端内壁上有配置兩個相互對稱的 1339462 推出簧片4(M，該推出簽片4〇1在SFp收發器模組細插 入後可提供該模組一推斥力使SFp模組2〇〇上的三角形凸 起205與框體300上的三角形開口 3〇2之間的嵌合更為緊 '· 般而D SFP收發器模組通常都具有一鬆脫結構 (delatch)以讓模組能夠方便地移出容納框體外，圖四中所 不之軸桿402即為其中一種鬆脫結構。該軸桿4〇2具有一 把手端403以及一突起端404，使用者可手持該把手4〇3 將軸桿402沿圖中弧狀箭頭方向作樞轴轉動。當此動作進 行時，突起端404會隨軸桿402之樞軸轉動而推擠到其鄰 近之一活動板405，使之沿圖中黑色箭頭方向移動。因為 活動板405之移動，其前端之捲曲處會推擠到框體3〇〇底 面之簧片307而將之頂起，於此，SFp收發器模組2〇〇上 的三角形凸起205會與框體300之簧片3〇7鬆脫，此時推 出簧片401會將SFP收發器模組向外推出，而使用者可手 持把手403將模組拉出框體3〇〇。 參照圖五a，其為本發明實施例中一延伸連接裝置之 立體圖，該延伸連接裝置5〇〇是由框體5〇1、插件5〇2以 及電路板結構503等三個部位所構成。在此實施例中，框 體501之尺寸大小與細節特徵與上面描述之框體3〇〇相同， 故此處不再予以贅述。框體5〇1可藉由其下端引腳5〇4施 以引腳焊接或壓合的方式固定在電路板結構5〇3上。圖五 b為本發明實施例中將框體5〇丨移除後之延伸連接裝置5〇〇 頂視圖，可以看到在電路板5〇3的正面上配置有一電路插 槽506 ’其以表面黏著方式銲在電路板5〇3上，該電路插 1339462 槽506被設計成來對應SFP規格標準，可與SFp收發器模 組的電路接觸端接合產生電路連結。參照圖五c，其為本 發明實施例中延伸連接裝置5〇〇之底視圖，圖中由粗黑線 體框起來的範圍即為此連接裝置中的電路板5〇3部分，可 以看到電路板503不止分佈在SFP框體501的下方，也延 伸經過插件部分502内部到達延伸連接裝置的尾端5〇7， 如圖五c所示。該電路板503的尾端5〇7部分配置有電路 鲁接觸端508，其設計與接腳數目與SFP收發器模組上之電 路接觸端204相同，故與SFP模組規格的標準插檜相容。 延伸連接裝置500的插件部分5〇2被設計來***SFp 規格標準之插槽（或框體），其尺寸及外型與圖二a、圖二b 中SFP收發器模組200之外型相同。插件5〇2尾端内部同 樣具備有與SFP收發器模組2〇〇相同的電路接觸端5〇8， 可取代其***主機設備端100的框體中。 再來參照圖七。圖七為SFP收發器模組200、延伸連 •接裝置5〇〇與主機電路板601連接後之示意圖。首先，SFp 收發器模組200會從延伸連接裝置5〇〇的開口端5〇8*** 延伸連接裝置500上的框體501中。插裝後，SFp收發器 模組200内部的電路接觸端2〇4會與框體5〇1内部的電路 插槽506電路接合。之後，延伸連接裝置5〇〇連同其上的 SFP收發器模組200會自其插件部位5〇2***主機電路板 6〇1上的框體605之中。插裝後，延伸連接裝置5〇〇插件 部位502尾部的電路接觸端5〇8會與p框體6〇5内部的電 路插槽6 〇3電路接合。如圖七戶斤*，延伸連接裝置5 〇 〇被 12 1339462 作為SFP收發器模組200與主機設備端1 〇〇之間—延伸的 連接媒介。 故，經以上之敘述，資料纜線107可將外部裝置之資 料訊號傳入SFP收發器模組200中，SFP收發器模組2〇〇 會將資料纜線107傳入的光訊號形式資料訊息轉換成電子 訊號形式。電子訊號形式的資料會經過SFP收發器模組 200内部的電路佈線傳至該模組尾端的電路接觸端2〇4。經 ^ 由該電路接觸端204與延伸連接裝置框體501内部的電路 插槽506連接，該電子訊號可傳入延伸連接裝置5〇〇内部 的電路板結構503中。同樣的，電路板結構5〇3上的電路 佈線會將該電子訊號傳到延伸連接裝置尾端的電路接觸端 508。再經由該電路接觸端5〇8與主機電路板6〇1上電路插 槽603連接，使電路板503上的電子訊號能傳入主機電路 板之中，讓主機設備100能接收到外部傳入的光訊號資 料。反之，主機設備100亦可依循相反的途徑將其内部的 • 電子訊號轉換成光形式傳到外部裝置去。 【圖式簡單說明】 本發明在某些部份與配置會以物理的方式呈現，其較 佳貫施例在說明書中會有詳細的描述與圖示，其中： 圖一為一般各種類型的SFP收發器模組與其容納框體 之不意圖0 圖一 a為一 SFP收發器模組之正面立體圖。 圖二b為圖二a中SFP收發器模組之反面立體圖。 圖三a為一 SFP容納框體之正面立體圖。 13 1339462 b為圖三a中SFp容納框體之反面 圆 ^…似；ISL〜久W儿篮圃 〇 圖四為SFP收發為模組與SFp容納框體插裝後之反面 立體圖。 圖五a為本發明實施例中 圖。 一延伸連接裝置之正面立體", Fig. a' is the frame for accommodating the transceiver module 200 in the embodiment. The frame 300 is a rectangular metal body of a ttSFp standard size specification (long I see 14 χ 10 mm) It is set to accommodate the SFP transceiver module of the standard 9 1339462. The front end of the frame 3 has an opening 3〇1 for the SFP transceiver module 2 to enter. The four sides of the open end 3〇1 are respectively arranged. There are several strip-shaped grounding lugs 3〇3, which can be in contact with the conductive chassis around the frame body to achieve the grounding effect. The top surface of the frame body 3〇〇 also has several vent holes arranged in a regular pattern. 〇4, as shown in Fig. 3a. In Fig. 3b, the bottom surface of the open end 3〇1 has a reed structure 3〇7, and the reed structure 307 has a triangular opening 3〇2. When the SFp transceiver When the module 200 is inserted into the frame 300, a triangular protrusion 205 (shown in FIG. 2b) of the SFP transceiver module 2 is embedded in the triangular opening 3〇2 to fix it. In b, it can be seen that the bottom end of the frame has a rectangular opening 305, which provides a space for the aforementioned main The circuit slots 6〇3 of the circuit board 601 extend into the chassis 300 so that the circuit sockets 6 can be disposed inside the frame 300 to engage the SFp transceiver modules inserted therein. The bottom edges of the two sides of the frame 300 are provided. A plurality of bonding pins 3〇5, the bonding pins 305 can be pin-bonded or soldered to the main circuit board 6 in a manner of pin-bonding (^ress fit) The rectangular area 602 of the pre-exposed shape is as shown in Fig. 6b. The hole 604 near the edge of the rectangular area in Fig. 6a is the area where the joint pin is welded or pressed. In addition, the bottom of the frame 300 is opened. There are also several pins (EMI pins) for preventing electromagnetic interference around the 305. The length of the brain pin gauge is shorter than that of the above-mentioned bonding pins 3〇5, and the same can be used for pin soldering or pinout. The method of pressing and fixing is fixed on the host circuit board 6〇1. The SFP transceiver module 200 is joined to the frame body 3〇〇 as shown in Fig. 4, and the frame body is disposed on the inner wall of the rear end. Symmetrical 1339462 introduces reed 4 (M, the launch of the signature 4〇1 is finely inserted in the SFp transceiver module The repulsion force of the module can be provided to make the fitting between the triangular protrusion 205 on the SFp module 2 与 and the triangular opening 3 〇 2 on the frame 300 tighter than the D SFP transceiver module. The set usually has a release structure to allow the module to be easily removed from the outside of the housing, and the shaft 402 is not a loose structure in the fourth embodiment. The shaft 4〇2 has a handle end 403. And a protruding end 404, the user can hold the handle 4〇3 to pivot the shaft 402 in the direction of the arcuate arrow in the figure. When the action is performed, the protruding end 404 will pivot with the shaft 402. Push to one of the adjacent movable panels 405 to move it in the direction of the black arrow in the figure. Because of the movement of the movable plate 405, the curl at the front end thereof is pushed to the reed 307 on the bottom surface of the frame 3 to be lifted up, and the triangular protrusion 205 on the SFp transceiver module 2 is Released from the reed 3〇7 of the frame 300, the reed 401 will push the SFP transceiver module outward, and the user can pull the module out of the frame by holding the handle 403. Referring to Fig. 5a, which is a perspective view of an extension connecting device according to an embodiment of the present invention, the extension connecting device 5 is composed of three parts: a frame 5〇1, an insert 5〇2, and a circuit board structure 503. In this embodiment, the size and detail of the frame 501 are the same as those of the frame 3 described above, and therefore will not be described herein. The frame 5〇1 can be fixed to the circuit board structure 5〇3 by soldering or pressing it by the lower end pins 5〇4. Figure 5b is a top view of the extension connecting device 5 with the frame 5〇丨 removed in the embodiment of the present invention. It can be seen that a circuit socket 506 is disposed on the front surface of the circuit board 5〇3. Adhesively soldered to the circuit board 5〇3, the circuit insert 13394462 slot 506 is designed to correspond to the SFP specification, and can be coupled with the circuit contact end of the SFp transceiver module to create a circuit connection. Referring to FIG. 5c, which is a bottom view of the extension connecting device 5〇〇 in the embodiment of the present invention, the range enclosed by the thick black line in the figure is the part of the circuit board 5〇3 in the connecting device, which can be seen. The circuit board 503 is distributed not only below the SFP housing 501, but also through the interior of the card portion 502 to the trailing end 5〇7 of the extension connector, as shown in Figure 5c. The rear end 5〇7 of the circuit board 503 is partially provided with a circuit contact end 508. The design and the number of pins are the same as the circuit contact end 204 on the SFP transceiver module, so the standard plug-in of the SFP module specification is Rong. The plug-in portion 5〇2 of the extension connector 500 is designed to be inserted into a slot (or frame) of the SFp specification standard, and has the same size and shape as the SFP transceiver module 200 of FIGS. 2a and 2b. . The plug-in terminal 5〇2 has the same circuit contact end 5〇8 as the SFP transceiver module 2〇〇, which can be inserted into the frame of the host device end 100. Referring again to Figure VII. FIG. 7 is a schematic diagram of the SFP transceiver module 200 and the extension connection device 5〇〇 connected to the host circuit board 601. First, the SFp transceiver module 200 is inserted into the frame 501 of the extension connecting device 500 from the open end 5〇8 of the extension connecting device 5〇〇. After the insertion, the circuit contact end 2〇4 inside the SFp transceiver module 200 is electrically coupled to the circuit socket 506 inside the casing 5〇1. Thereafter, the extension connector 5, together with the SFP transceiver module 200 thereon, is inserted into the housing 605 on the host circuit board 6〇1 from its card insertion portion 5〇2. After the insertion, the circuit contact end 5〇8 at the end of the extension connector 5, the plug-in portion 502, is electrically coupled to the circuit socket 6 〇3 inside the p-frame 6〇5. As shown in Fig. 7 , the extension connection device 5 339 〇 12 1339462 serves as a connection medium between the SFP transceiver module 200 and the host device end 1 . Therefore, as described above, the data cable 107 can transmit the data signal of the external device to the SFP transceiver module 200, and the SFP transceiver module 2 will transmit the data signal information information of the data cable 107. Convert to electronic signal form. The data in the form of electronic signals is transmitted to the circuit contact terminals 2〇4 at the end of the module through the circuit wiring inside the SFP transceiver module 200. The circuit contact end 204 is connected to the circuit socket 506 inside the extension connector housing 501, and the electronic signal can be transmitted into the circuit board structure 503 inside the extension connector 5. Similarly, the circuit routing on board structure 5〇3 will pass the electronic signal to circuit contact 508 at the end of the extension connector. Then, the circuit contact terminal 5〇8 is connected to the circuit socket 603 of the host circuit board 6〇1, so that the electronic signal on the circuit board 503 can be transmitted into the host circuit board, so that the host device 100 can receive the external input. Optical information. On the contrary, the host device 100 can also convert the internal electronic signal into an optical form and transmit it to the external device in the opposite way. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be physically presented in some parts and configurations. Preferred embodiments thereof will be described and illustrated in detail in the specification, wherein: FIG. 1 is generally various types of SFPs. The transceiver module and its accommodating frame are not intended. FIG. 1a is a front perspective view of an SFP transceiver module. Figure 2b is a perspective view of the reverse side of the SFP transceiver module of Figure 2a. Figure 3a is a front perspective view of an SFP housing frame. 13 1339462 b is the reverse side of the SFp accommodating frame in Figure 3a. The circle is similar to that of the SFp 久 〇 〇 〇 Figure 4 is the reverse view of the SFP transceiver for the module and the SFp accommodating frame. Figure 5a is a diagram of an embodiment of the present invention. Front three-dimensional extension of the connecting device
圖五b為本發明實施例中一延伸連接裝置之頂視圖。 圖五c為本發明實施例中一延伸連接裝置之底視圖。 圖，、a為本發明實施例中主機設備的連接端之 路板頂視圖’其上的SFp容納框體被移除。 圖六b為本發明實施例中 路板頂視圖。 主機設備的SFP連接端之電 圖七為本發日月訾^ / 貫知例中SFP收發器模組 伸連接裝置與主機電政μ ^# '包略板部位連接後之示意 、延 圖 。Figure 5b is a top plan view of an extended connection device in accordance with an embodiment of the present invention. Figure 5c is a bottom view of an extended connection device in accordance with an embodiment of the present invention. Figure, a is a top view of the board of the connection end of the host device in the embodiment of the present invention, and the SFp accommodation frame thereon is removed. Figure 6b is a top view of the road board in the embodiment of the present invention. Figure 7 shows the schematic diagram and extension of the SFP connector of the host device.
【主要元件符號說明】 〜 100 主機設備 204 101 SFP收發器模組 205 102 SFP收發器模組 206 103 SFP收發器模組 300 104 開口 301 105 框體 302 200 SFP收發器模組 303 201 開口 304 202 尾端 305 203 把手 306 電路接觸端 三角形凸起 簧片 框體 開口 三角形開口 接地凸片 通氣孔 開口 接合引腳 1339462 307 箐片 504 接合引腳 401 推出簧片 505 孔洞 402 軸桿 506 電路插槽 403 把手 507 接腳 404 突起端 601 主機電路板 500 延伸連接裝置 602 長方形部位 501 框體 603 電路插槽 502 插件部位 604 孔洞 503 電路板結構 605 框體 15[Main component symbol description] ~ 100 host device 204 101 SFP transceiver module 205 102 SFP transceiver module 206 103 SFP transceiver module 300 104 opening 301 105 frame 302 200 SFP transceiver module 303 201 opening 304 202 Tail end 305 203 handle 306 circuit contact end triangular convex spring frame opening triangular opening grounding tab vent opening engagement pin 13394462 307 504 504 bonding pin 401 pushing reed 505 hole 402 shaft 506 circuit slot 403 Handle 507 pin 404 protruding end 601 main circuit board 500 extension connecting device 602 rectangular portion 501 frame 603 circuit slot 502 plug-in portion 604 hole 503 circuit board structure 605 frame 15