1338106 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種燈具，特別是指一種散熱良好之 高功率發光二極體燈具。 【先前技術】 如圖1、2所示，習知之高功率發光二極體1338106 IX. Description of the Invention: [Technical Field] The present invention relates to a luminaire, and more particularly to a high-power illuminating diode lamp with good heat dissipation. [Prior Art] As shown in Figs. 1 and 2, a conventional high power light-emitting diode
Emitting Diode，LED)照明裝置包含一燈杯i及一發光二極 體單元2，該燈杯1由金屬材質所製成，並具有一固定壁“ 並開設有穿孔110,且於該穿孔1Η)周圍形成有一固定壁接 觸面112、一連接於該固定壁u的圍繞壁12，及一設置於 該圍繞壁12端緣之鏡片13，該固定壁u具有一固定壁接 觸面112，該圍繞壁12之外側面形成有複數個散熱片i2i， 而該圍繞壁12之内側面則鍍有反射鍍膜114。該固定壁n 、該圍繞壁12,及該鏡片13三者相互配合地界定出一容置 空間14。 。亥發光一極體單兀2具有一由可導熱材質所製成的基 板21 固疋於该基板21上的高功率發光二極體晶片22 複數^ °亥同功率發光二極體晶片22電連接的接腳23，及 -用於控制驅動該高功率發光二極體晶片22之電路板24， 該基板21具有一基板接觸面211。 〇亥心光—極體單元2之高功率發光二極體晶片22可經 由。玄固定壁11之穿孔110而伸入該容置空間14中，且令該 發光二極體單元2鎖固於該固定壁u上，並使該發光二極 體單元2之該基板接觸面211與該固定壁丨〗之固定壁接觸 5 1338106 面112緊密貼合。當該高功率發光二極體晶片 時，所放射出的光線大部分經由該鏡片13發射出去，少部 分散射於該圍繞壁12内側面上的光線，則可藉由其上之反 射鍵膜m反射’再藉由該㈣13投射出，進而達到發光The Emitting Diode (LED) lighting device comprises a lamp cup i and a light emitting diode unit 2, the lamp cup 1 is made of metal material and has a fixed wall “and a through hole 110 is opened, and the through hole is 1”) A fixed wall contact surface 112 is formed around, a surrounding wall 12 connected to the fixed wall u, and a lens 13 disposed at an end edge of the surrounding wall 12. The fixed wall u has a fixed wall contact surface 112. The surrounding wall A plurality of fins i2i are formed on the outer side of the 12, and the inner side of the surrounding wall 12 is plated with a reflective coating 114. The fixed wall n, the surrounding wall 12, and the lens 13 define a mutual fit The space 14 is provided with a substrate 21 made of a heat conductive material, and a high-power light-emitting diode chip 22 fixed on the substrate 21; a pin 23 electrically connected to the body wafer 22, and a circuit board 24 for driving the high-power LED chip 22, the substrate 21 having a substrate contact surface 211. 〇海心光-polar body unit 2 The high power light emitting diode chip 22 can be worn through the mysterious fixed wall 11 And extending into the accommodating space 14 and locking the illuminating diode unit 2 on the fixed wall u, and the substrate contact surface 211 of the illuminating diode unit 2 and the fixed wall 丨The fixed wall contact 5 1338106 surface 112 is in close contact. When the high power light emitting diode chip, most of the light emitted is emitted through the lens 13 and a small part is scattered on the inner side of the surrounding wall 12 , can be reflected by the reflective key film m on it and then projected by the (four) 13 to achieve illumination
此類照明裝置大#是被應用於高照度照明設備中（例如 投射燈等）’使用的高功率發光二極體晶片22多為高功率之 咼功率發光二極體晶片22，而運作中的高功率發光二極體 晶片22會產生高熱，所以散熱的設計是很重要的一環。在 習知中，散熱是藉由該基板21之基板接觸面211與該固定 壁11之固定壁接觸面112緊密貼合’進而將熱能傳導至該 固定壁11以及連接於該固定壁u之圍繞壁12，再藉由該 固定壁11、圍繞壁12,及散熱片121將熱能傳導至週遭空 氣中以達到散熱之目的。Such a lighting device is a high-power light-emitting diode chip 22 that is used in high-illuminance lighting devices (such as a projection lamp, etc.), and is a high-power, power-emitting diode chip 22, and is in operation. The high power LED chip 22 generates high heat, so the heat dissipation design is an important part. In the prior art, heat is radiated by the substrate contact surface 211 of the substrate 21 and the fixed wall contact surface 112 of the fixed wall 11 to conduct heat energy to the fixed wall 11 and to the fixed wall u. The wall 12, through the fixed wall 11, the surrounding wall 12, and the heat sink 121, conducts heat energy into the surrounding air for heat dissipation.
22通電導通 照明之目的。 如圖2所示，在安全性的考量下，習知之發光二極體 裝置更具有一卡合固定於該燈杯丨上，且用於封閉該發光 二極體單元2之電路板24的塑膠殼體3，並藉此使該電路 板24之電子元件不會曝露在外而造成危險，但由於塑膠材 料並不能很有效地傳導熱能，所以並不具散熱功效，進而 致使容納該電路板24之容置空間内的溫度升高，如溫度超 過该電路板24上電子元件的正常工作溫度範圍，很容易導 致該等電子元件運作不正常，甚至損壞。 由於發光二極體的發光度並不如傳統燈泡，當應用於 同照射度的照明設備時，則會需要採用多個該發光二極體 6 1338106 > , '，，、月#置以達到所需要的發光度，而像這樣多組式的配置 彳式則會需要對每一發光二極體照明裝置之光型及聚焦角 ^ 度進仃調整。因為該鏡片13是固定地黏設於該圍繞壁12 .、’之端緣’且該鏡片13為一平面鏡片，其聚焦角度及投射出 的光型必須在該發光二極體照明袭置的設計階段時就預先 a定好，如在成品出廠後要調整其光型及聚焦角度則會非 书不谷易甚至可此必須進行破壞性的改裝，相當不利於 應用在多組式的模組上，進而降低其實用性。 • 士。該多組式發光二極體裝置是被用於室外，每一發光 一極體照明裝置則必須加裝一定位接合件（如圖2中虛線所 示）以將《膠殼體3定位於該燈杯i上，再藉由該定位接 合件將該發光二極體照明裝置螺接在一載具3丨上。但是， 裝設有多個發光二極體照明裝置之載具31必須多加裝一防 水罩體4,以將該等發光二極體裝置完全封閉以達到防水之 目的，如此一來，每一發光二極體裝置之固定壁u、圍繞 壁12，及散熱片121所散發出的熱能即被侷限在一相當有 限的密閉空間内，如欲使在該密閉空間的熱空氣能與外界 空氣對流以助散熱，唯有在防水罩體上開設一進氣口及加 裝一風扇，才能將熱空氣抽出並與外界形成對流，此不僅 會提高運作成本，也會增加整體的安裝複雜度。如不去考 慮密閉空間的散熱，在空氣不流通的情況下，該空間内的 溫度會很快地提高，進而大幅度的阻礙到該發光二極體裝 置的散熱，使得該發光二極體裝置中的電子元件更容易因 過熱而損壞。 7 【發明内容】 因此，本新型之目的，即在提供一種散熱良好 防水及投射光型調整功能之發光二極體燈具。 於是’本新型之發光二極體燈具，包含—金屬燈杯 一電路基座、一透鏡座、一發光裝置，及一外鏡片。 S亥金屬燈杯具有一固定壁，及由該固定壁周緣八別幸 遠離且相反方向延伸之第一圍繞壁與第二圍繞壁，該第— 圍繞壁與該固定壁相互配合界定出一第一容署办 罝二間，而該 第二圍繞壁與該固定壁相互配合界定出一分隔於該第_容 置空間的第二容置空間，該第一圍繞壁之外側面形成有相 間隔之複數散熱槽，該固定壁具有至少一穿孔。 該電路基座是由金屬材質構成，並可拆卸地與於該金 屬燈杯之第二圍繞壁相接合，且可封閉該第二容置空間， 該電路基座具有一第一基壁，以及一於該第一基壁周緣向 遠離該第一基壁方向延伸之第三圍繞壁。 該透鏡座是由金屬材質構成，並可拆卸地與該金屬燈 杯之第一圍繞壁相接合，且可封閉該第一容置空間，該透鏡 座具有一第二基壁，以及一於該第二基壁周緣向遠離該第二 基壁方向延伸之第四圍繞壁’該第二基壁形成有一貫穿之透 視孔。 該發光裝置具有一發光二極體單元及一用於驅動及控 制該發光二極體單元之電路板，該發光二極體單元是置於 έ玄金屬燈杯之第一容置空間内，並具有一可導熱之基板及 一固定於該基板上之高功率發光二極體晶片，該發光二極 1338106 體單元疋藉由S亥基板將其固定於該固定壁上，該電路板是 置於燈杯之第二容置空間内，並與該高功率發光二極體晶 片電連接。 该外鏡片是夾設於該透鏡座之第二基壁與該金屬燈杯 之第一圍繞壁的之間，且封閉該金屬燈杯之第一容置空間 ，並使該發光裝置之高功率發光二極體晶片所發出之光線 透過該外鏡片於該透鏡座之透視孔散出。 本新型之功效在於利用該發光二極體單元上的基板來 增加與該金屬燈杯之固定壁的接觸面積，以幫助加快熱能 之傳導，且該透鏡座及電路基座皆由金屬構成且緊密地接 合於該金屬燈杯，有助於熱能傳導，再配合形成於金屬燈 杯圍繞壁上的複數散熱槽來增加整體散熱面積，更能有效 地將熱能散佈至週遭環境中，進而達到散熱之目的。 【實施方式】 有關本新型之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中將可 清楚的呈現。 如圖3、4所示，本新型發光二極體燈具之較佳實施例 包含一金屬燈杯5、一電路基座6、一透鏡座7、一發光裝 置8、一外鏡片9,及二密封件5〇。 該金屬燈杯5是由導熱良好的鋁所製成，具有一固定 壁51，及由該固定㉟51肖緣分別朝遠離且相反方向延伸之 第-圍繞壁52與第二圍繞壁53，該第一圍繞壁52與該固 疋壁51相互配合界定出—第一容置空間54,而該第二圍繞 9 1338106 壁53與該固定壁51相互配合界定出—分隔於該第一容置 空間54的第二容置空間55，該第_圍繞壁52之外側面形 成有相間隔之複數散熱槽521。在本實施例中，該固定壁 51形成有三穿孔512，但開孔之數量也可僅為—了其2量 可因不同需要而做相對應之改變，所以不應以本實施例^ 限。該第-圍繞壁52的内側面鍍有反射鍍膜％，可用來反 射該發光裝置8所放射出之光線。該第一圍繞壁52及第二 圍繞壁53之外側面分別形成有外螺紋1〇。 一 該電路基座6是由鋁所構成，該電路 方向延伸之第三圍繞壁62 ’及-束線件63。該第一基壁61 上形成有-接合部6U，該接合部611上形成有内螺紋1〇, ’枝線# 63上形成有外载1〇，並與該接合部6ι 唾合之内螺紋H)，將該束線件63螺接於該接合部川上。 =線件63本身㈣為其將穿過物體束緊之雜而具防水 …玄接° 611相螺接之螺接面也貼有防水膠帶， 使，、更具防水效果。值彳I 1 < Μ β H说 付注思的疋，如該發光二極體燈具 疋在至内使用，防水則非第一 束線件63。 件戶斤以可考慮不裝設該 〜壁Μ的内側面形成有内螺紋1〇，，並可配 二:=杯5之第二圍繞壁53上一^ 將4 4金屬燈杯5盥唁雷其 ，且可封閉該第二容置空二π 相螺合 ，該第一基…該全7二為了：強封閉及_ 、，屬燈杯5之第二圍繞壁53的端面 10 间灭戎有一密封件 ,^ ϋ遭受夾緊擠壓時 填滿週遭之微小縫隙，進而讓封_ ^ 易進水。 不一夺置 … 所構成，該透鏡座7具有-第 —基壁71，以及一於哕坌肚 丹韦弟 71 一土土 71周緣向遠離該第二基壁 广延伸之第四圍繞壁72,該第二基壁Μ形成㈠光22 power on the purpose of lighting. As shown in FIG. 2, under the consideration of safety, the conventional LED device has a plastic which is fixedly attached to the lamp cup and used to close the circuit board 24 of the LED unit 2. The housing 3, and thereby the electronic components of the circuit board 24 are not exposed to the danger, but since the plastic material does not conduct heat energy very effectively, it does not have a heat dissipation effect, thereby causing the capacity of the circuit board 24 to be accommodated. The temperature rise in the space, such as the temperature exceeding the normal operating temperature range of the electronic components on the circuit board 24, can easily cause the electronic components to operate abnormally or even be damaged. Since the illuminance of the light-emitting diode is not as good as that of the conventional light bulb, when applied to the illumination device of the same illumination degree, it is necessary to use a plurality of the light-emitting diodes 6 1338106 >, ',,, and ## to achieve The required luminosity, and a multi-group configuration like this would require adjustment of the light type and focus angle of each of the light-emitting diode illumination devices. Because the lens 13 is fixedly attached to the surrounding wall 12, the 'end edge' and the lens 13 is a flat lens, the focus angle and the projected light pattern must be in the illumination of the LED. In the design stage, the pre-a is fixed. If the light type and the focusing angle are adjusted after the finished product leaves the factory, it will not be easy to change or even destructively modify, which is not conducive to application on multi-group modules. , thereby reducing its practicability. • Shishi. The multi-group light-emitting diode device is used for outdoor use, and each of the light-emitting one-pole illumination devices must be provided with a positioning joint member (shown by a broken line in FIG. 2) to position the plastic shell 3 at the same. On the lamp cup i, the light-emitting diode lighting device is screwed onto a carrier 3 by the positioning joint. However, the carrier 31 equipped with a plurality of light-emitting diode lighting devices must be additionally equipped with a waterproof cover 4 to completely close the light-emitting diode devices for waterproofing purposes, so that each The fixed wall u of the light-emitting diode device, the surrounding wall 12, and the heat energy radiated from the heat sink 121 are confined in a relatively limited closed space, such that the hot air in the closed space can convect with the outside air. In order to help dissipate heat, only by opening an air inlet on the waterproof cover and installing a fan, the hot air can be extracted and convected with the outside world, which not only increases the operating cost, but also increases the overall installation complexity. If the heat dissipation in the confined space is not considered, the temperature in the space will be rapidly increased when the air is not circulated, thereby greatly hindering the heat dissipation of the illuminating diode device, so that the illuminating diode device Electronic components are more susceptible to damage due to overheating. [Explanation] Therefore, the object of the present invention is to provide a light-emitting diode lamp with good heat dissipation and projection light adjustment function. Thus, the light-emitting diode lamp of the present invention comprises a metal lamp cup, a circuit base, a lens holder, a light-emitting device, and an outer lens. The S-shaped metal lamp cup has a fixed wall, and a first surrounding wall and a second surrounding wall which are separated from each other by the peripheral edge of the fixed wall, and the first surrounding wall and the fixed wall cooperate to define a first The second surrounding wall and the fixed wall cooperate to define a second accommodating space partitioned from the first accommodating space, and the outer side of the first surrounding wall is formed with a space a plurality of heat sinks, the fixed wall having at least one perforation. The circuit base is made of a metal material and detachably engages with the second surrounding wall of the metal lamp cup, and can close the second accommodating space, the circuit base has a first base wall, and And a third surrounding wall extending away from the first base wall at a periphery of the first base wall. The lens holder is made of a metal material and detachably engages with the first surrounding wall of the metal lamp cup, and can close the first accommodating space, the lens holder has a second base wall, and A second surrounding wall of the second base wall extends away from the second base wall. The second base wall defines a through hole therethrough. The illuminating device has a light-emitting diode unit and a circuit board for driving and controlling the light-emitting diode unit, and the light-emitting diode unit is placed in the first accommodating space of the έXuan metal lamp cup, and Having a heat-conducting substrate and a high-power light-emitting diode chip fixed on the substrate, the light-emitting diode 1338106 body unit is fixed to the fixed wall by a S-substrate, the circuit board is placed The second housing space of the lamp cup is electrically connected to the high power LED chip. The outer lens is sandwiched between the second base wall of the lens holder and the first surrounding wall of the metal lamp cup, and closes the first accommodating space of the metal lamp cup, and the high power of the illuminating device Light emitted by the LED chip is transmitted through the outer lens to the see-through hole of the lens holder. The utility model has the advantages that the substrate on the light-emitting diode unit is used to increase the contact area with the fixed wall of the metal lamp cup to help accelerate the conduction of thermal energy, and the lens holder and the circuit base are made of metal and compact. The ground is bonded to the metal lamp cup to facilitate heat conduction, and the plurality of heat dissipation grooves formed on the wall surrounding the metal lamp cup are combined to increase the overall heat dissipation area, and the heat energy can be effectively distributed to the surrounding environment to achieve heat dissipation. purpose. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. As shown in FIGS. 3 and 4, the preferred embodiment of the novel LED lamp includes a metal lamp cup 5, a circuit base 6, a lens holder 7, a light-emitting device 8, an outer lens 9, and two Seal 5〇. The metal lamp cup 5 is made of aluminum with good heat conductivity, has a fixed wall 51, and a first surrounding wall 52 and a second surrounding wall 53 extending away from the opposite direction by the fixed edge of the fixed 3551, the first A surrounding wall 52 and the fixed wall 51 cooperate to define a first accommodating space 54 , and the second surrounding 9 1 338 106 wall 53 and the fixed wall 51 cooperate to define a partitioning space 54 from the first accommodating space 54 The second accommodating space 55 is formed with a plurality of spaced heat dissipation grooves 521 on the outer side surface of the first surrounding wall 52. In the present embodiment, the fixed wall 51 is formed with three through holes 512, but the number of the openings may be only - the amount of the two may be changed correspondingly according to different needs, and therefore should not be limited by this embodiment. The inner side of the first surrounding wall 52 is plated with a % of reflective coating which can be used to reflect the light emitted by the illuminating device 8. The first surrounding wall 52 and the outer side of the second surrounding wall 53 are respectively formed with external threads 1〇. A circuit base 6 is constructed of aluminum, the third surrounding wall 62' and the wire member 63 extending in the direction of the circuit. The first base wall 61 is formed with a joint portion 6U having an internal thread 1 〇 formed thereon, and an 'outer load 1 上 is formed on the branch line # 63 and is internally threaded with the joint portion 6 H), the wire harness 63 is screwed onto the joint portion. = The wire member 63 itself (4) is waterproof for its tight meshing through the object... The splicing surface of the 611 phase screwing is also affixed with waterproof tape to make it more waterproof. The value 彳I 1 < Μ β H says that the light-emitting diode lamp is used internally, and the water-repellent is not the first wire-wound member 63. The inner side of the wall is formed with an internal thread 1〇, and can be equipped with two: = the second surrounding wall 53 of the cup 5, a 4 4 metal lamp cup 5盥唁Leiqi, and can close the second accommodating air π phase screwing, the first base...the whole 7 ii is for: strong sealing and _, the end surface 10 of the second surrounding wall 53 of the lamp cup 5 is extinguished戎 There is a seal, ^ ϋ is filled with small gaps around the clamp when squeezed, so that the seal _ ^ easy to enter the water. The lens holder 7 has a -first base wall 71, and a fourth surrounding wall 72 extending far from the second base wall at a circumference of the earthen 71. The second base wall is formed with (a) light
線透出之透視孔7n。該第四圍 '、 1Λ， ^ 、堇72的内側面形成有内 螺、·文Η) ’並可配合形成於該金屬燈杯5之第_圍繞壁U 上之相喃合的外螺'纹1〇,將該該金屬燈杯5與該透鏡座7 可拆卸地相螺合’且可封閉該第一容置空Μ 5心該第四圍 繞壁72之外側面同樣地也形成有外螺紋1〇。The through hole 7n is seen through the line. The inner side of the fourth circumference ', 1 Λ, ^, 堇 72 is formed with an inner snail, and the snail can be matched with the outer snail formed on the _ surrounding wall U of the metal cup 5 The metal lamp cup 5 is detachably coupled to the lens holder 7 and can close the first accommodation space 5, and the outer surface of the fourth surrounding wall 72 is also formed externally. Thread 1〇.
5〇為一橡膠 則會變形並 空間55不 該發光裝置8具有-發光二極體單元81，及_用於觸 ，及控制該發光二極體單元81之電路板82。該電路板82 是設置於該金屬燈杯5之第二容置空間55内並具有二穿 過該電路基座6之束線件63的第一導電件821，而該等第 導電件821為電線，是與外界電源規線相電連接以提供 驅動該發光裝置8所需要的能源。 s亥發光二極體單元81是設置於該金屬燈杯5之第一容 置空間54内，並具有一可導熱之基板812、一設置於該基 板812上的高功率發光二極體晶片811，及一包覆該高功率 發光二極體晶片811之内透鏡814。 該發光二極體單元81是藉由該基板812將其固定於該 固定壁51上，並藉由捆束成一電纜狀的二電線穿過該金屬 Λ杯5固定壁51之其中一穿孔512地與該電路板82電連 :°亥基板812是藉由二螺絲將其鎖設於該金屬燈杯5固 疋土 51之另外二穿孔512，且在鎖設後該基板Μ?是緊密 地貼合在該固定壁51上，藉此增加熱能傳導之面積。 。亥外鏡片9是可拆卸地夾設於該透鏡座7之第二基壁 二，該金屬燈杯5之第一圍繞壁52的外端面之間，且配合 密封件50(在本實施例中為一 〇形環）將該第一容置空間5〇 is a rubber and deforms and the space 55 does not. The light-emitting device 8 has a light-emitting diode unit 81, and a circuit board 82 for touching and controlling the light-emitting diode unit 81. The circuit board 82 is disposed in the second accommodating space 55 of the metal lamp cup 5 and has two first conductive members 821 passing through the wire harness 63 of the circuit base 6, and the first conductive members 821 are The electric wires are electrically connected to the external power supply line to provide the energy required to drive the illuminating device 8. The s-light emitting diode unit 81 is disposed in the first accommodating space 54 of the metal lamp cup 5, and has a heat-conducting substrate 812 and a high-power light-emitting diode chip 811 disposed on the substrate 812. And an inner lens 814 encapsulating the high power light emitting diode chip 811. The LED unit 81 is fixed to the fixed wall 51 by the substrate 812, and passes through one of the through holes 512 of the fixing wall 51 of the metal cup 5 by two wires bundled into a cable shape. Electrically connected to the circuit board 82: The bottom substrate 812 is locked by two screws to the other two through holes 512 of the solid earth cup 51 of the metal lamp cup 5, and the substrate is tightly attached after being locked. It is fitted to the fixed wall 51, thereby increasing the area of thermal energy conduction. . The outer lens 9 is detachably interposed between the second base wall 2 of the lens holder 7, between the outer end faces of the first surrounding wall 52 of the metal lamp cup 5, and is fitted with the sealing member 50 (in this embodiment The first accommodating space
4封閉，並使該發光裝置8之高功率發光二極體晶片 所發出之光線透過該外鏡片9於該透視孔711散出。在本實 轭例中，§亥外鏡片9為一凸透鏡，但也可因不同的需要而 更換該外鏡片9之種類（例如凹透鏡或平面鏡等）以取得所需 要之光型，所以並不應以本實施例之說明為限。而在更換 °亥外鏡片時僅需旋開該透鏡座後即可進行更換，使用上相 當方便。4 is closed, and light emitted by the high-power light-emitting diode chip of the light-emitting device 8 is transmitted through the outer lens 9 to the see-through hole 711. In the embodiment of the present invention, the outer lens 9 is a convex lens, but the type of the outer lens 9 (for example, a concave lens or a plane mirror) may be replaced for different needs to obtain a desired light type, so It is limited to the description of the embodiment. When the lens is replaced, it is only necessary to unscrew the lens holder and then replace it. It is convenient to use.
當該發光二極體燈具在使用時，該發光二極體單元81 在運作時所發出的熱能即藉由可導熱之基板812傳導至整 個該金屬燈杯5，由於該高功率發光二極體晶片811是裝設 於该基板812之其中一面，而其另一接觸面則可如上述般 元王地緊在·•地貼合在§亥金屬燈杯5之固定壁51上，並不合 如習知般因其發光二極體晶片之所在位置而犧牲了可供^ 能傳導至另一散熱表面之面積，使熱能傳導更為快速。更 由於該透鏡座7及電路基座6皆是由具有良好導熱特性的 鋁所製成，熱能會進一步傳導至螺接於該金屬燈杯5上的 該透鏡座7及電路基座6，再配合形成於該金屬燈杯5之第 12 1338106 一圍繞壁52上的散熱槽521，進而能將熱能排散至週遭空 間的整體散熱面積增加。 如圖5所示，本實施例可藉由形成於其透鏡座7之第 四圍繞壁72之外側面的外螺紋1〇與—具有貫穿之螺孔的 載具（圖中虛線所示）相螺合，而形成—提供高照明度的多組 式的發光二極體燈具模組。由於每一裝設於位於該载具上 的高功率發光二極體燈具自身已具防水功能，並不需如習 知般再加裝一防水罩體，所以能直接與外界空氣接觸，熱 能也可較輕易的散出。 、 歸納上述，本新型之發光二極體燈具，利用皆為鋁製 之金屬燈杯5、該電路基座6,及該透鏡座7，再配合型於 該金屬燈杯5上的散熱槽521，藉此増加散熱面積以幫助散 熱，且該電路基座6及該透鏡座7皆是緊密地螺接於該金 屬燈杯5上，加上該等密封件5〇的輔助’即能有效地防水 ，而該外鏡片9在旋開該透鏡座7後即可更換成所需要的 鏡型以調整投射出之光型及聚焦角度’故磘實能達到本新 型之有效散熱，防水，光型調整之目的。 惟以上所述者，僅為本新型之較佳實施例而已，當不 能以此限定本新型實施之範圍，即大凡依本新型申請專利 範圍及新型說明内容所作之簡單的等效變化與修飾，皆仍 屬本新型專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明習知之發光二極體照明裝 置； 13 1338106 圖2是一剖面圖，說明羽Λ v 口 凡明習知發光二極體照明裴置加裝 一塑膠殼體及一防水罩體； 圖3是一立體分解圖，說明本新型發光二極體燈具之 較佳實施例； 圖4是一剖面圖，說明該較佳實施例之各構件組合後 之狀態；及 圖5是一使用示意圖，說明該較佳實施例與一載具之 組合狀態。When the LED device is in use, the thermal energy emitted by the LED unit 81 during operation is conducted to the entire metal cup 5 by the thermally conductive substrate 812 due to the high power LED The wafer 811 is mounted on one side of the substrate 812, and the other contact surface is attached to the fixed wall 51 of the metal cup 5 as described above. Conventionally, the area where the light-emitting diode wafer is located sacrifices the area that can be conducted to the other heat-dissipating surface, so that the heat energy is transmitted more quickly. Moreover, since the lens holder 7 and the circuit base 6 are made of aluminum having good thermal conductivity, the thermal energy is further transmitted to the lens holder 7 and the circuit base 6 screwed to the metal lamp cup 5, and then The heat dissipating groove 521 formed on the surrounding wall 52 of the 12 1338106 of the metal lamp cup 5 is combined to further increase the heat dissipation area of the surrounding space. As shown in FIG. 5, the present embodiment can be formed by an external thread 1〇 formed on the outer side of the fourth surrounding wall 72 of the lens holder 7 and a carrier having a through-hole (shown by a broken line in the figure). Spiral, forming a multi-group LED luminaire module that provides high illumination. Since each of the high-power light-emitting diode lamps mounted on the carrier has a waterproof function, it is not necessary to add a waterproof cover as is conventionally known, so that it can directly contact the outside air, and the heat energy is also Can be easily released. In summary, the light-emitting diode lamp of the present invention utilizes a metal lamp cup 5 made of aluminum, the circuit base 6 , and the lens holder 7 , and is coupled with a heat dissipation groove 521 of the metal lamp cup 5 . Thereby, the heat dissipating area is added to help dissipate heat, and the circuit base 6 and the lens holder 7 are tightly screwed to the metal lamp cup 5, and the auxiliary of the sealing member 5〇 can effectively Waterproof, and the outer lens 9 can be replaced with the required mirror shape after the lens holder 7 is unscrewed to adjust the projected light type and the focusing angle, so that the effective heat dissipation, waterproof and light type of the present invention can be achieved. The purpose of the adjustment. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent change and modification made by the novel patent application scope and the novel description content, All remain within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a conventional illuminating diode illuminating device; 13 1338106 FIG. 2 is a cross-sectional view showing a Λ Λ 口 习 习 习 发光 发光 发光 发光 发光 发光FIG. 3 is an exploded perspective view showing a preferred embodiment of the novel light-emitting diode lamp; FIG. 4 is a cross-sectional view showing the components of the preferred embodiment. The state after that; and FIG. 5 is a schematic diagram showing the combined state of the preferred embodiment and a carrier.
14 1338106 【主要元件符號說明】 5 ....... …·金屬燈杯 71…… …第二基壁 50…… …密封件 711 ··· …透視孔 51…… …·固定壁 72…… …第四圍繞壁 512… …·穿孔 8 ....... …發光裝置 52…… …·第一圍繞壁 81…… …發光二極體單 521 ··· •…散熱槽 元 53…… …·第二圍繞壁 811 ‘… …咼功率發光一 54…… •…第一容置空間 極體晶 片 55…… •…第二容置空間 812 ···· …基板 56••… •…反射鍍膜 814 ‘… …内透鏡 6…… •…電路基座 82…… …電路板 61 ••… •…第一基壁 821 ···· …第 導電件 611 ··· •…接合部 9 ....... …外鏡片 62••… •…第三圍繞壁 10…… …外螺紋 63···.. …·束線件 10, …内螺紋 7…… •…透鏡座 1514 1338106 [Description of main component symbols] 5 ................... Metal lamp cup 71 ... ... second base wall 50 ... ... seal 711 · · · ... see through hole 51 ... ... · fixed wall 72 ......4th surrounding wall 512...·Perforation 8.......lighting device 52.........first surrounding wall 81...light emitting diode single 521 ···•... 53... The second surrounding wall 811 '... 咼 power illuminates a 54... • The first accommodating space pole body wafer 55... • The second accommodating space 812 ····...substrate 56•• ... .... reflective coating 814 '... inner lens 6... • ... circuit base 82 ... ... circuit board 61 • •... • first base wall 821 ···· ... first conductive member 611 ··· •... Joint portion 9 . . . outer lens 62 ••... • third surrounding wall 10 ... external thread 63 ····.··beaming member 10, ... internal thread 7... Lens holder 15