1337704 099年10月19日梭正替換頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別係指一種對電子裝置散 熱之散熱裝置。 【先前技術】 [0002] 隨著電子技術之不斷發展，顯卡等電子元件集成度較高 之電子裝置在運行時會產生大量之熱量，該等熱量如果 不能被有效地散去，將直接導致溫度急劇上升，而嚴重 影響到電子裝置之工作效率。為此，通常在電子裝置上 安裝散熱裝置來進行散熱。 [0003] 中國大陸專利第200620041 362. 6號揭示了 一種散熱裝置 ，其包括一安裝於顯卡上之散熱器及安裝於該散熱器附 近之一風扇。為了提升風扇氣流之利用率，還在散熱器 上加裝一導風罩，以將風扇所產生之氣流集中地引導至 散熱器，使散熱器迅速與外界換熱，進而使顯卡能獲得 較高之散熱效率。但是，顯卡附近還存在其他熱源，比 如安裝於顯卡上方之硬碟，該種導風罩所引導之氣流僅 能對顯卡進行散熱，而無法吹至硬碟，使其熱量得不到 及時地散發，從而影響工作效率。 【發明内容】 [0004] 有鑒於此，實有必要提供一能同時對多個電子裝置散熱 之散熱裝置。 [0005] 一種散熱裝置，其包括一底部與一電子裝置接觸之散熱 器及一安裝於散熱器上之導風板，該導風板包括一結合 096137438 至散熱器頂部之底板及由該底板傾斜延伸之一側板，該 表單編號A0101 第3頁/共13頁 0993374746-0 1337704 099年10月19日 側板用於將氣流傾斜地引導至位於該電子裝置上方之另 一電子裝置。 [0006] 與習知技術相比，本發明散熱裝置之散熱器可對一電子 裝置進行散熱，導風板則將氣流引導至另一電子裝置而 對其進行散熱，故該散熱裝置可同時冷卻複數電子裝置 ，使該等電子裝置之熱量得到及時散發，從而確保其正 常運作。 【實施方式】 [0007] 如圖1及3所示，本發明之散熱裝置用於同時對多個電子 裝置進行散熱，其包括一與一顯卡（圖未示）接觸之散 熱器10及一安裝於散熱器1 0:土4^導風ο V 一風扇4〇安 裝於靠近散熱器10右側之位^且:其出風口朝向散熱器i 〇 。一硬碟30安裝於顯卡上方且與所述散熱器1〇隔開一段 距離。 [0008] 請參閱圖2，所述散熱器1〇用於固定至所述顯卡上，其包 括一基座12、複數自基座12向上延伸出之相互間隔之鰭 片14 '及貫穿該等鰭片η且結合至基座12之二熱管“。 所述基座12由熱導性良好之金屬材料製成，其下表面垂 直向下凸出一矩形之吸熱部122，用於與顯卡接觸而將其 所產生之熱量均勻地傳導至基座12上；其上表面之中部 開設二平行之凹槽124，其中每一凹槽124之橫截面均呈 半圓形，用於嵌入熱管1 6 »四螺絲5〇分別穿過所述基座 12之四角處而螺鎖於顯卡内，以將散熱器1〇固定至顯卡 上。由於該等螺絲5 〇佔據了基座12上之不同空間，為避 免鰭片14與螺絲50發生干涉，故而處於基座12不同位置 096137438 表單編號A0101 笫4頁/共13頁 0993374746-0 1337704 099年10月19日後正替換頁j 之韓片14之構造也有所不同：座落於基座i2前部之鲜片 η為第m4〇 ’其位於二前方之螺糊之間，且每一 第—轉片140均具有一三角形之構造；座落於基座12中部 之鯖片14為第二縛片142，其位於二前方之螺絲5〇及二後 方之螺絲50之間，其中每一第二韓片142均呈矩形且其 面積大於所述每-第_14Q之面積；座落於基座_ 後部之轉片14為第三雜片144，其夾置於二後方之螺絲5〇 之間’其中每一第三館片144亦均呈矩形其面積大於所 述每一第一鰭片14〇之面積且小於前述每—第二鰭片Μ〗 之面積；座落於基座12後部之鰭片ϊ4為第四鰭片丨46，其 位於一後方之螺絲之後，其中每一第四韓片146也均呈 矩形，其面積與所述每一第二鰭片142之面積大致相等。 每一鰭片14之下邊緣水平彎折出一下折邊141，其中每一 下折邊141均與相鄰之下折邊丨41相連接而形成一平整之 表面’進而焊接至基座12上表面而將转片14固定至基座 12上，每一鰭片14之上邊緣水平彆折出二上折邊143，其 申每一上折邊143與相應之上折邊143相扣合，從而共同 形成二平坦之結合部18，供導風板20結合。每一第二、 第三、及第四鰭片142、144、146之底部開設二半圓形 之缺口（圖未標）？其中每一缺口均與相應之缺口對齊 且與每一凹槽124相對應，由此，該等缺口與二凹槽124 共同圍設出二圓筒形之通道，供熱管16之相應部分穿設 ;每一第二、第三、及第四鰭片142 '144、146之頂部 開設二分別位於二上折邊143之兩侧之通孔（圖未標）， 該二通孔間之距離大於二缺口間之距離，其中每一通孔 均與相應一側之通孔對齊，由此，每一侧之通孔共同組 096137438 表單編號A0101 第5頁/共13頁 0993374746-0 m?704 099年10月19日修正替换頁 成另一通道，供熱管16之相應部分穿設。所述每一熱管 16均呈“ΙΓ形，其具有一平直之蒸發段（圖未標）、一 平行于蒸發段之平直之冷凝段（圖未標）及一連接蒸發 段和冷凝段之弧形之絕熱段（圖未標）。該二熱管16相 對傾斜地結合至基座12，其二蒸發段分別穿入位於散熱 器10下部之二通道内，其二冷凝段分別穿入位於散熱器 10上部之二另一通道内，其二絕熱段則位於第二鰭片142 前方且共同央置第一鰭片140。 [0009] 所述導風板20固定至散熱器10頂部，其包括一矩形之底 板22及一自底板22 —側傾斜向上延伸之矩形側板24，其 中該側板24與該底板22間形赛之妁角為角。所述底 板22沿散熱器10每一結合部本8之難伸方向身定至二結合 部18，從而將導風板20安裝於散熱器10上。一片體240 自側板24—端之中部豎直向上延伸而出，以方便用戶操 作該導風板20。 [0010] 請一併參閱圖3，使用該散熱裝置時，由於風扇40輪轂（ 圖未示）之轉動，其附近之空氣被擾動而產生氣流。下 部之氣流直接穿過散熱器1 0鰭片14間之間隙而帶走散熱 器10自顯卡所吸收之熱量，進而對顯卡進行散熱；上部 之氣流則被導風板20所牽引，其沿導風板20之側板24之 寬度方向傾斜向上流經硬碟30，進而對硬碟30進行散熱 。由此，本發明之散熱裝置可同時冷卻複數電子裝置， 使該等電子裝置之熱量得到及時散發，從而確保其正常 運作。 [0011] 綜上所述，本發明確已符合發明專利之要件，遂依法提 096137438 表單編號A0101 第6頁/共13頁 0993374746-0 1337704 099年10月19日核正替换頁 出專利申請。惟，以上所述者僅為本發明之較.佳實施例 ，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0012] 圖1係本發明實施例之散熱裝置之立體組裝圖。 [0013] 圖2係圖1之立體分解圖。 [0014] 圖3係圖1之散熱裝置之氣流走向圖，此時一風扇及一硬 碟位於散熱裝置附近。 【主要元件符號說明】 [0015] 散熱器：10 [0016] 基座：12 [0017] 吸熱部：122 [0018] 凹槽：124 [0019] 鰭片：14 [0020] 第一鰭片：140 [0021] 下折邊：141 [0022] 第二鰭片：142 [0023] 上折邊：143 [0024] 第三鰭片：144 [0025] 第四鰭片：146 096137438 表單編號A0101 第7頁/共13頁 0993374746-0 1337704 099年10月19日修正替換π [0026] 熱管‘ ：1 6 [0027] 結合部：18 [0028] 導風板：20 [0029] 底板：22 [0030] 側板：24 [0031] 片體：240 [0032] 硬碟：30 [0033] 風扇：40 [0034] 螺絲：50 096137438 表單編號Α0101 第8頁/共13頁 0993374746-01337704 October 19, 2010, the replacement of the shuttle page 6. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat from an electronic device. [Prior Art] [0002] With the continuous development of electronic technology, electronic devices with high integration of electronic components such as video cards generate a large amount of heat during operation. If such heat cannot be effectively dissipated, it will directly cause temperature. It has risen sharply, which seriously affects the working efficiency of electronic devices. For this reason, a heat sink is usually mounted on the electronic device for heat dissipation. [0003] Chinese Patent No. 200620041 362. 6 discloses a heat sink comprising a heat sink mounted on a graphics card and a fan mounted adjacent to the heat sink. In order to improve the utilization of the fan airflow, an air hood is further installed on the radiator to centrally guide the airflow generated by the fan to the radiator, so that the radiator quickly exchanges heat with the outside, thereby enabling the graphics card to obtain higher Heat dissipation efficiency. However, there are other heat sources in the vicinity of the graphics card, such as a hard disk mounted on the top of the graphics card. The airflow guided by the air hood can only dissipate heat from the graphics card, and cannot be blown to the hard disk, so that the heat cannot be dissipated in time. , thus affecting work efficiency. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink capable of dissipating heat to a plurality of electronic devices at the same time. [0005] A heat dissipating device includes a heat sink in contact with an electronic device at the bottom and a wind deflector mounted on the heat sink, the air deflector including a bottom plate combined with 096137438 to the top of the heat sink and inclined by the bottom plate Extending one of the side panels, the form number A0101, page 3/13, 0993374746-0 1337704 The side panel of October 19, 099 is used to direct the airflow obliquely to another electronic device located above the electronic device. Compared with the prior art, the heat sink of the heat sink of the present invention can dissipate heat to an electronic device, and the air deflector guides the airflow to another electronic device to dissipate heat, so that the heat sink can be simultaneously cooled. The plurality of electronic devices enable the heat of the electronic devices to be dissipated in time to ensure their normal operation. [Embodiment] As shown in FIGS. 1 and 3, the heat dissipating device of the present invention is used for simultaneously dissipating heat from a plurality of electronic devices, and includes a heat sink 10 and an installation in contact with a graphics card (not shown). In the radiator 10 0: soil 4 ^ wind guide ο V a fan 4 〇 installed near the right side of the radiator 10 ^ and its air outlet toward the radiator i 〇. A hard disk 30 is mounted above the graphics card and spaced apart from the heat sink 1〇. [0008] Referring to FIG. 2, the heat sink 1 is fixed to the graphics card, and includes a base 12, a plurality of mutually spaced fins 14' extending upward from the base 12, and the like. The fins η are coupled to the two heat pipes of the susceptor 12. The susceptor 12 is made of a metal material having good thermal conductivity, and a lower surface of the lower surface protrudes downwardly from a rectangular heat absorbing portion 122 for contact with the graphics card. The heat generated by the heat is evenly transmitted to the susceptor 12; two parallel grooves 124 are formed in the upper portion of the upper surface, wherein each of the grooves 124 has a semicircular cross section for embedding the heat pipe 16 » Four screws 5〇 are respectively screwed into the four corners of the base 12 and screwed into the graphics card to fix the heat sink 1〇 to the graphics card. Since the screws 5 〇 occupy different spaces on the base 12, In order to prevent the fins 14 from interfering with the screws 50, the susceptor 12 is in a different position 096137438. Form number A0101 笫4 pages/total 13 pages 0993374746-0 1337704 After October 19, 1999, the structure of the Korean film 14 is being replaced. Different: The fresh piece η located at the front of the base i2 is the m4〇' which is located at the second Between the square spirals, and each of the first-rotating fins 140 has a triangular configuration; the cymbal 14 seated in the middle of the base 12 is a second binding piece 142, which is located at the front of the screw 5 〇 and two Between the rear screws 50, each of the second Korean sheets 142 has a rectangular shape and an area larger than the area of each of the -14Q; the rotating piece 14 seated at the rear of the base_ is a third piece 144. The third louver 144 is also rectangular in shape, and the area of each of the third louvers 144 is larger than the area of each of the first fins 14 且 and smaller than the aforementioned each of the second fins Μ The area of the fins 4 located at the rear of the base 12 is a fourth fin 46, which is located behind a rear screw, wherein each of the fourth Korean sheets 146 is also rectangular, with an area and each The area of a second fin 142 is substantially equal. The lower edge of each fin 14 is horizontally bent with a lower flange 141, wherein each lower flange 141 is connected with the adjacent lower flange 41 to form a flat surface. The surface 'further welded to the upper surface of the base 12 to fix the rotor 14 to the base 12, and the upper edge of each fin 14 is horizontally folded. Two upper folding edges 143 are formed, and each upper folding edge 143 is engaged with the corresponding upper folding edge 143 to jointly form two flat joint portions 18 for the wind deflecting plate 20 to be combined. Each second and third And the bottom of the fourth fins 142, 144, 146 are provided with two semi-circular notches (not shown), wherein each of the notches is aligned with the corresponding notch and corresponds to each of the grooves 124, thereby The equal gap and the two recesses 124 define a two-cylindrical channel, and the corresponding portion of the heat pipe 16 is disposed; the tops of each of the second, third, and fourth fins 142'144, 146 are respectively opened. a through hole (not shown) on both sides of the upper flange 143, the distance between the two through holes is greater than the distance between the two notches, wherein each of the through holes is aligned with the through hole of the corresponding side, thereby each One side of the through hole common group 096137438 Form No. A0101 Page 5 / Total 13 page 0993374746-0 m? 704 On October 19, 099, the replacement page was replaced by another passage, and the corresponding portion of the heat pipe 16 was pierced. Each of the heat pipes 16 has a "ΙΓ shape, which has a flat evaporation section (not shown), a flat condensation section parallel to the evaporation section (not shown), and an arc connecting the evaporation section and the condensation section. The two heat pipes 16 are relatively obliquely coupled to the base 12, and the two evaporation sections are respectively inserted into the two passages located at the lower portion of the heat sink 10, and the two condensation sections are respectively penetrated into the heat sink 10 In the other channel of the upper part, the two adiabatic sections are located in front of the second fin 142 and collectively disposed on the first fin 140. [0009] The air deflector 20 is fixed to the top of the heat sink 10, and includes a rectangle. The bottom plate 22 and a rectangular side plate 24 extending obliquely upward from the bottom plate 22, wherein the side plate 24 and the bottom plate 22 are at an angle of a corner. The bottom plate 22 is along each joint portion of the heat sink 10. The air deflector 20 is mounted on the heat sink 10. The body 240 extends vertically upward from the middle end of the side panel 24 to facilitate the user to operate the wind deflector 20 [0010] Please refer to FIG. 3 together, when using the heat sink, The rotation of the fan 40 (not shown) causes the air in the vicinity to be disturbed to generate airflow. The lower airflow directly passes through the gap between the fins of the heat sink 10 to take away the heat absorbed by the heat sink 10 from the graphics card. Further, the graphics card is cooled; the upper airflow is drawn by the air deflector 20, and flows obliquely upward through the hard disk 30 along the width direction of the side panel 24 of the wind deflector 20, thereby dissipating heat to the hard disk 30. The heat dissipating device of the invention can simultaneously cool the plurality of electronic devices, so that the heat of the electronic devices can be dissipated in time to ensure the normal operation of the electronic devices. [0011] In summary, the present invention has indeed met the requirements of the invention patent, and 遂 096137438 Form No. A0101 Page 6 / Total 13 Pages 0993374746-0 1337704 On October 19, 1999, the nuclear replacement page is issued. However, the above is only a preferred embodiment of the present invention, which cannot be limited by this. The scope of the patent application in this case. Any equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the scope of the following patent application. 1 is a perspective assembled view of a heat dissipating device according to an embodiment of the present invention. [0013] FIG. 2 is an exploded perspective view of FIG. 1. [0014] FIG. 3 is a flow diagram of the air dissipating device of FIG. The fan and a hard disk are located near the heat sink. [Main component symbol description] [0015] Heat sink: 10 [0016] Base: 12 [0017] Heat sink: 122 [0018] Groove: 124 [0019] Fin: [0020] First fin: 140 [0021] Lower flange: 141 [0022] Second fin: 142 [0023] Upper flange: 143 [0024] Third fin: 144 [0025] Fourth fin Film: 146 096137438 Form No. A0101 Page 7 / Total 13 Page 0993374746-0 1337704 October 19, 1999 Correction Replacement π [0026] Heat Pipe ' :1 6 [0027] Joint: 18 [0028] Air deflector: 20 Base plate: 22 [0030] Side plate: 24 [0031] Body: 240 [0032] Hard disk: 30 [0033] Fan: 40 [0034] Screw: 50 096137438 Form number Α 0101 Page 8 / Total 13 page 0993374746 -0