099年08月03日修正替換頁 、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種成型模具及製造該成型模具之方法， 尤其關於一種模造玻璃之成型模具及製造該模具之方法 〇 【先前技#ί】 [0002] 模具是工業生產的基礎工藝裝備，被稱為“工業之母” ，它的生產技術水平的高低，已成為衡量一個國家產品 製造水平高低的重要標誌。75%的粗加工工業產品零件及 50%的精加工零件皆藉由模具成型，並且絕大部分塑膠製 品也藉由模具成型。作為國民經濟的基礎工業，模具涉 及機械、汽車、輕工、電子、化工、冶金、建材等各個 行業，應用範圍十分廣泛。 [0003] 模具通常在高溫高壓環境下工作，由於模具成型面與被 成型原材料之間的各種物理特性和化學特性等因素，通 常情況下模具成型面與被成型原材料之間的介面會出現 很多問題。如：成型材料在高溫下加壓成型黏著於模具 之成型面上，反覆冷卻脫模對成型面施加較大作用力等 。故，對於成型面而言，一方面要求其與被成型材料之 間易於分離，即具有良好的離形性；另一方面，要求其 在高溫下不易與空氣中的氧氣發生反應。此外，由於模 具使用頻率高，模具成型面在多次合模/開模過程中，以 及與成型產品接觸之過程中極易壞損。故，成型面還需 要具有高硬度，以抵抗模具合模時的鎖模力及高頻率作 業。 表單編號Α0101 第3頁/共15頁 0993278011-0 1337126 099年08月03日梭正替換頁 [0004] 通常，模具成型面會另外鍍上一層薄膜鍍層，其主要目 的有二：一是防止模具底材與被成形體間發生黏著現象 (即不易脫模）；二則是防止成形時周圍氣體中的氧氣 作用而使模具底材性能惡化。好的鍍層不僅能增加模具 使用壽命，還可強化模具表面質量，並提高產品表面性 能。 [0005] 通常鍍層以含有貴重金屬材料製成，如：铂銥合金（Pt-Ir)等，該合金雖可提高模具之表面性能，改善成品質 量。然，使用該模具鍍層不但其成本高昂，且損壞後修 復成本亦過高。 【發明内容】 [0006] 有鑒於此，有必要提供一種製造成本及修復成本較低之 成型模具。 [0007] 同理，有必要提供一種製造上述成型模具之方法。 [0008] 一種成型模具，該成型模具包括一用於成型產品形狀之 模仁，該模仁具有一基底層及一保護層，該保護層被覆 於該基底層上且定義出成型件之形狀。該保護層係添加 氮化二鉻之銥銖系列合金或銥釕系列合金材質，該保護 層中銥銶或銥釕之成分比為1 : 4〜4 : 1。 [0009] 一種成型模具之製造方法，包括以下步驟：將該基底層 放入磁控濺鍍機之腔體中抽真空至10_6托以下；以添加 氮化二鉻且銥銖或銥釕之成分比為1 : 4〜4 : 1之銥銶系列 合金或銥釕系列合金靶作為靶材，在偏壓範圍0伏〜-50 伏條件下，濺鍍形成保護層。 094131026 表單編號A0101 第4頁/共15頁 0993278011-0 1337126 099年08月03日街E替換頁 [0010] 與習知技術相比，所述之成型模具使用銥銖系列合金或 銥釕系列合金材質，降低成型模具的製造成本和修復成 本此外，添加氮化二鉻改善保護層之硬度及耐腐蚀性 能，増加保護層之壽命。 【實施方式】 [0011] [0012] 如第一圖所示，其為本發明之一實施方式成型模具1〇〇之 示意圖，該成型模具1〇〇用於成型一成型胚料4。成型模 具1〇〇包括一下模仁1、一上模仁2及一襯套3。下模仁1與 上模仁2合模形成玻璃元件之形狀，襯套3導向下模仁1與 上模仁2之開模/合模運動。 該下模仁1與上模仁2分別具有一基底層10、2〇及一保護 層12、22。該基底層10、20為下模仁1與上模仁2之主要 部分，其上分別被覆有一保護層12、22。保護層12、22 之模造面14、24定義出玻璃元件之輪廓。 [0013] 該基底層10、20之材質為使用如以碳化鎮（wc)為主要 成分之硬質合金。該保護層12、22之材質係使用銥銖系 列合金（Ir-Re)或銥釕系列合金（Ir_Ru)。實驗證明 ，I r : Re或I r : Ru成分比例僅在約為4 : 1時，保護層12 、22同時表現出與成型胚料4之間的良好離形性及與基底 層10、20之間的優良附著性。為增加保護層12、22中卜 :Re或Ir : Ru成分比例範圍，可添加含鉻化合物，如氮 化二鉻（Cr2N)的银銖合金或銀釕合金，即：cr n_ Ir-Re ’ Cr^-Ir-Ru。添加Cr2N後，ΙΓ : “或卜：肋成 分比例範圍可擴大至1 : 4〜4 : 1 ’同時其與成型胚料4之 間的良好離形性及與基底層10、20之間的優良附著性亦 094131026 表單編號Α0101 第5頁/共15頁 0993278011-0 1337126 099年 08月 03 日 ， 付以維持。添加CrJ相較於添加CrN而言，由於Cr2N擁有 IxXrN更向之硬度及更好之耐腐蝕性能，因此— ir-Re 或 Cr2N-Ir-Ru 較CrN-Ir-Re 或 CrN-Ir-Ru擁有更 尚之壽命。該保護層12、22之厚度在5奈米〜20奈米（nm )範圍内選取。 [0014] 如第二圖所示，其為發明之另一實施方式，該成型模具 200用於成型一成型胚料8。該成型模具包括一下模仁 5、一上模仁6及一襯套7。下模仁5與上模仁6合模形成玻 璃元件之形狀，襯套7導向下模仁5與上模仁6之開模/合 模運動·》 [0015] [0016] 該下模仁5與上模仁6分別具有一基底層5〇、6〇，一中介 層52、62及一保護層54、64。該中介層52、62及該保護 層54、64分別順次被覆於基底層50、6〇上。該基底層5〇 、60為下模仁5與上模仁6之主要部分，其上之保護層54 、64之模造面56、66定義出玻璃元件之輪廓。 該基底層50、60之材質為使用如以WC為主要成分之硬質 合金。該中介層52、62之材質係使用金屬物質，如銥銖 合金（Ir-Re)或銀銖合金（Ir-Ru)，添加其他金屬之 Ir-Re合金或Ir-Ru合金，如添加鎳之ir_Re合金（ir_ Re-Ni)或Ir-Ru合金（Ir-Re-Ni)等。添加中介層52 、62之目的在於增加基底層50、60與保護層54、64之間 之附者性。中介層52、62之厚度在50nm~200nm範圍内選 取0 [0017] 本實施方式中，該保護層54、64可選用第一實施方式令 094131026 表單編號A0101 第6頁/共15頁 0993278011-0 099年08月03日修正替换頁 保護層12、22之材質’其厚度亦可在5nm〜2〇nm範圍内選 取。 如第三圖所示，本發明成型模具之第一實施方式之成型 模具1 0 0可採用以下之製程實現。 首先，步驟101將基底層10、20放入丙酮溶液中以超音波 震盈20分鐘。然，後’進入步驟1〇2,將基底層1〇、2〇放 入乙醇溶液中以超音波震盪1〇分鐘。步驟1〇2完成後，步 驟103以氮氣搶噴乾基底層1〇、2〇。隨後，步驟1〇4將基 底層10、20放入磁控濺鍍機之腔體令柚真空至托（ torr)以下《向磁控濺鍍機之腔體内通入氬（Ar)氣體 使腔體壓力達到2〜7毫托（mtorr)後，步驟105以 100~300伏（V)之偏壓利用電漿清洗基底層丨0、2〇表面 3分鐘以上’去除基底層1〇、2〇表面發生變化之表層。最 後，進行步驟106 ’在偏壓範圍〇V〜-50V條件下，濺鍍 保護層12、22至5nm〜20nm之厚度。 經由上述製程處理後，下模仁1與上模仁2之基底層1〇、 20上分別覆蓋一保護層12、22。上述工藝中之Ar氣體主 要利用其化學穩定性，即不易於與周圍物質發生反應》 故’ Ar氣體可用其他惰性氣體代替，如氦氣體等。步驟 106中，濺鍍之靶材根據選定之保護層12、22之材質而相 應改變。 如第四圖所示，本發明成型模具之第二實施方式之成型 模具2 00可採用以下之製程實現。 首先，步驟201將基底層50、60放入丙酮溶液中以超音波 表單編號A0101 第7頁/共15頁 0993278011-0 1337126 [0023] [0024] [0025] 094131026 099年月03日修正頁| 震盪20分鐘。然後，進入步驟202，將基底層50、60放 入乙醇溶液中以超音波震盪1〇分鐘。步驟2〇2元成後，步 驟203以氮氣搶喷乾基底層50、60。隨後，步驟204將基 底層50、60放入磁控濺鍍機之腔體中抽真空至10 t〇rr 以下。向磁控濺鍍機之腔體内通入灶氣體使腔體壓力達 到2〜7mtorr後，步驟205以100〜300V之偏壓利用電漿 清洗基底層50 ' 60面12表面3分鐘以上’去除基底層50 、60表面發生變化之表層。之後進行步驟206 ’滅鍍中介 層52、62至50nm〜200nm之厚度。最後，進行步驟207， 在偏壓範圍0V〜-50V條件下，濺鍍保護層54、64至 5nm~20nm之厚度。 同樣，步驟206及步驟207中，濺鍍之耙村分別根據選定 之中介層52、62及保護層54、64之材質而相應改變。 本發明所採用之保護層在成本上較貴金屬（如Pt-Ir合金 等）保護層低，同時降低成型模具的製造成本及其修復 成本。被覆後，成型模具之 模仁具有良好的機械強度 '熱穩定性及抗熱衝擊性。同 時，本發明之成型模具亦具有良好的離形性及與基底層 之間的附著性’適宜用於製造對成型件表面要求較高之 產品，如製造玻螭元件等尤為適合。 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟’以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在依本案發明精神所作之等效修 飾或變化，皆應包含於以下之巾請專利範圍内。 【圖式簡單說明】 表單編號A0101 笫8頁/共15頁 0993278011-0 1337126 099年08月03日修正替换頁 [0026] 第一圖係本發明成型模具之第一實施方式之剖視圖。 [0027] 第二圖係本發明成型模具之第二實施方式之剖視圖。 [0028] 第三圖係製造第一圖中成型模具之方法之示意圖。 [0029] 第四圖係製造第二圖中成型模具之方法之示意圖。 【主要元件符號說明】BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding die and a method of manufacturing the same, and more particularly to a molding die for molding glass and manufacturing the same Method 〇【前技术#ί】 [0002] Mold is the basic process equipment for industrial production, known as the “mother of industry”. Its level of production technology has become an important indicator to measure the level of product manufacturing in a country. . 75% of roughing industrial product parts and 50% of finished parts are molded by mould, and most plastic products are also molded by mould. As a basic industry of the national economy, molds cover a wide range of industries, including machinery, automobiles, light industry, electronics, chemicals, metallurgy, and building materials. [0003] Molds usually work in a high temperature and high pressure environment. Due to various physical and chemical characteristics between the molding surface of the mold and the material to be formed, there are many problems in the interface between the molding surface of the mold and the material to be formed. . For example, the molding material is pressure-molded and adhered to the molding surface of the mold at a high temperature, and the cooling and releasing mold exerts a large force on the molding surface. Therefore, for the molding surface, on the one hand, it is required to be easily separated from the material to be molded, that is, it has good mold release property; on the other hand, it is required to be difficult to react with oxygen in the air at a high temperature. In addition, due to the high frequency of use of the mold, the mold forming surface is extremely susceptible to damage during multiple mold clamping/opening processes and in contact with the molded product. Therefore, the molding surface also needs to have high hardness to resist the clamping force and high frequency of the mold clamping. Form No. 1010101 Page 3 of 15 0993278011-0 1337126 On August 03, 2008, the shuttle is replacing the page [0004] Usually, the mold forming surface is additionally coated with a thin film coating, the main purpose of which is two: one is to prevent the mold Adhesion occurs between the substrate and the formed body (ie, it is not easy to release the mold); the second is to prevent the oxygen in the surrounding gas during the forming process from deteriorating the performance of the mold substrate. Good plating not only increases the life of the mold, but also enhances the surface quality of the mold and improves the surface properties of the product. [0005] Usually, the plating layer is made of a material containing a precious metal such as a platinum-rhodium alloy (Pt-Ir), which can improve the surface properties of the mold and improve the quality. However, the use of the mold coating is not only costly, but also the cost of repair after damage is too high. SUMMARY OF THE INVENTION [0006] In view of the above, it is necessary to provide a molding die having a low manufacturing cost and a low repair cost. [0007] By the same token, it is necessary to provide a method of manufacturing the above-described molding die. A molding die comprising a mold core for molding a shape of a product, the mold core having a base layer and a protective layer, the protective layer being coated on the base layer and defining a shape of the molded piece. The protective layer is made of a tantalum nitride-based alloy or a tantalum alloy, and the composition ratio of tantalum or niobium in the protective layer is 1:4 to 4:1. [0009] A method for manufacturing a molding die, comprising the steps of: placing the substrate layer in a cavity of a magnetron sputtering machine to evacuate to a temperature below 10_6 Torr; adding a chromium nitride and a composition of cerium or lanthanum The ratio is 1:4~4: 1 铱銶 series alloy or bismuth series alloy target is used as a target, and a protective layer is formed by sputtering under a bias voltage range of 0 volt to -50 volt. 094131026 Form No. A0101 Page 4 / Total 15 Page 0993278011-0 1337126 Street E Replacement Page on August 03, 099 [0010] Compared with the prior art, the forming mold uses a series of alloys or tantalum alloys. Material, reduce the manufacturing cost and repair cost of the molding die In addition, the addition of chrome nitride improves the hardness and corrosion resistance of the protective layer, and increases the life of the protective layer. [Embodiment] [0012] As shown in the first figure, which is a schematic view of a molding die 1 according to an embodiment of the present invention, the molding die 1 is used for molding a molding blank 4. The molding die 1 includes a lower mold core 1, an upper mold core 2, and a bushing 3. The lower mold core 1 and the upper mold core 2 are molded to form a glass member, and the bushing 3 is guided to the mold opening/closing movement of the lower mold core 1 and the upper mold core 2. The lower mold core 1 and the upper mold core 2 have a base layer 10, 2, and a protective layer 12, 22, respectively. The base layers 10, 20 are the main portions of the lower mold core 1 and the upper mold core 2, and are respectively covered with a protective layer 12, 22. The molded faces 14, 24 of the protective layers 12, 22 define the contour of the glass element. [0013] The base layer 10, 20 is made of a cemented carbide such as carbonized town (wc) as a main component. The material of the protective layers 12 and 22 is a bismuth series alloy (Ir-Re) or a bismuth series alloy (Ir_Ru). Experiments have shown that when the ratio of I r : Re or Ir : Ru is only about 4: 1, the protective layers 12 and 22 simultaneously exhibit good peeling property with the formed blank 4 and with the base layer 10, 20 Excellent adhesion between. In order to increase the ratio of the ratio of the Re:Ir or Ir:Ru component in the protective layer 12, 22, a chromium-containing compound such as a silver-rhenium alloy or a silver-antimony alloy of chromium (Cr2N) may be added, ie: cr n_ Ir-Re ' Cr^-Ir-Ru. After the addition of Cr2N, ΙΓ: "or: the rib component ratio range can be expanded to 1: 4 to 4: 1 ' at the same time, it has good peeling property with the formed blank 4 and excellent with the base layer 10, 20 Adhesion 094131026 Form No. 1010101 Page 5 of 15 0993278011-0 1337126 August 03, 099, to maintain. Add CrJ compared to adding CrN, because Cr2N has IxXrN more hardness and better Corrosion resistance, therefore, ir-Re or Cr2N-Ir-Ru has a longer life than CrN-Ir-Re or CrN-Ir-Ru. The thickness of the protective layer 12, 22 is between 5 nm and 20 nm ( [0014] As shown in the second figure, which is another embodiment of the invention, the molding die 200 is used for molding a molding blank 8. The molding die includes a lower mold core 5 and an upper mold. The core 6 and a bushing 7. The lower mold core 5 and the upper mold core 6 are molded to form the shape of the glass element, and the bushing 7 is guided to the mold opening/closing movement of the lower mold core 5 and the upper mold core 6] [0015] [0016] The lower mold core 5 and the upper mold core 6 respectively have a base layer 5〇, 6〇, an intermediate layer 52, 62 and a protective layer 54, 64. The intermediate layer 52, 62 And the protective layers 54, 64 are sequentially coated on the base layers 50, 6 respectively. The base layers 5, 60 are the main portions of the lower mold core 5 and the upper mold core 6, and the protective layers 54 and 64 are molded thereon. The surface of the base layer 50, 60 is made of a hard alloy such as WC. The material of the intermediate layer 52, 62 is made of a metal material such as a bismuth alloy (Ir). -Re) or silver-iridium alloy (Ir-Ru), adding Ir-Re alloy or Ir-Ru alloy of other metals, such as ir_Re alloy (ir_Re-Ni) or Ir-Ru alloy (Ir-Re-Ni) The purpose of adding the interposer 52, 62 is to increase the attachment between the underlying layers 50, 60 and the protective layers 54, 64. The thickness of the interposer 52, 62 is selected from the range of 50 nm to 200 nm [0017] In an embodiment, the protective layer 54 and 64 may be modified by the first embodiment 094131026, the form number A0101, the sixth page, the total 15 pages, the 0993278011-0, the August 03, 099, the material of the protective layer 12, 22 is replaced. It can also be selected in the range of 5 nm to 2 〇 nm. As shown in the third figure, the molding die 1 of the first embodiment of the molding die of the present invention 0 0 can be achieved by the following process: First, step 101 puts the base layer 10, 20 into an acetone solution to ultrasonically vibrate for 20 minutes. Then, after 'going to step 1〇2, the base layer 1〇, 2〇 Place in an ethanol solution and vortex for 1 minute. After step 1〇2 is completed, step 103 is used to dry the base layer 1 〇, 2 以 with nitrogen. Subsequently, in step 1〇4, the substrate layers 10, 20 are placed in the cavity of the magnetron sputtering machine to make the pomelo vacuum to the following torr. "The argon (Ar) gas is introduced into the cavity of the magnetron sputtering machine. After the cavity pressure reaches 2~7 millitorr (mtorr), the step 105 is used to clean the base layer 丨0, 2〇 surface for 3 minutes or more with a bias of 100~300 volts (V) to remove the base layer 1〇, 2 The surface layer on which the surface of the crucible changes. Finally, step 106' is performed to sputter the thickness of the protective layer 12, 22 to 5 nm to 20 nm under the bias voltage range 〇V~-50V. After the above process, the underlying layers 1 and 20 of the lower mold core 1 and the upper mold core 2 are respectively covered with a protective layer 12, 22. The Ar gas in the above process mainly utilizes its chemical stability, that is, it is not easy to react with surrounding substances. Therefore, the Ar gas can be replaced by other inert gases, such as helium gas. In step 106, the sputtered target changes correspondingly to the material of the selected protective layer 12, 22. As shown in the fourth figure, the molding die 2 of the second embodiment of the molding die of the present invention can be realized by the following process. First, in step 201, the base layers 50, 60 are placed in an acetone solution to be supersonic form number A0101. Page 7 of 15 pages 0993278011-0 1337126 [0023] [0025] 094131026 099 month 03 revision page| Shock for 20 minutes. Then, proceeding to step 202, the substrate layers 50, 60 are placed in an ethanol solution and oscillated by ultrasonic waves for 1 minute. After the step 2 is completed, in step 203, the base layers 50, 60 are blasted by nitrogen. Subsequently, step 204 places the substrate 50, 60 in a cavity of the magnetron sputtering machine to evacuate below 10 t rrrr. After the gas is introduced into the cavity of the magnetron sputtering machine to bring the pressure of the cavity to 2 to 7 mtorr, the step 205 is performed by plasma cleaning with a bias of 100 to 300 V to clean the surface of the substrate 50' 60 face 12 for more than 3 minutes. The surface layer of the surface of the base layer 50, 60 changes. Thereafter, step 206' is performed to extinguish the interposer 52, 62 to a thickness of 50 nm to 200 nm. Finally, in step 207, the protective layers 54 and 64 are sputtered to a thickness of 5 nm to 20 nm under a bias voltage range of 0 V to -50 V. Similarly, in steps 206 and 207, the sputtered villages are respectively changed according to the materials of the selected interposers 52, 62 and the protective layers 54, 64. The protective layer used in the present invention is lower in cost than the noble metal (e.g., Pt-Ir alloy) protective layer, and at the same time reduces the manufacturing cost of the molding die and the repair cost thereof. After coating, the mold of the molding die has good mechanical strength 'thermal stability and thermal shock resistance. At the same time, the molding die of the present invention also has good mold release property and adhesion to the substrate layer. It is suitable for the production of a product having a high surface requirement for a molded article, such as a glassy member. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following claims. [Simple description of the drawing] Form No. A0101 笫8 pages/total 15 pages 0993278011-0 1337126 Correction replacement page of August 03, 099 [0026] The first drawing is a cross-sectional view of the first embodiment of the molding die of the present invention. [0027] The second drawing is a cross-sectional view of a second embodiment of the molding die of the present invention. [0028] The third figure is a schematic view of a method of manufacturing a molding die in the first drawing. [0029] The fourth figure is a schematic view of a method of manufacturing a molding die in the second drawing. [Main component symbol description]
[0030] 下模仁：1、5 [0031] 上模仁：2、6 [0032] 襯套：3、7 [0033] 成型胚料：4、8 [0034] 基底層：10、20 '50 '60 [0035] 保護層：12、22 '54 '64 [0036] 中介層：52、62 [0037] 模造面：14、24 '56 '66 [0038] 成型模具：100、 200 [0039] 步驟：101-106 、 201 -207 094131026 表單編號A0101 第9頁/共15頁 0993278011-0[0030] Lower mold core: 1, 5 [0031] Upper mold core: 2, 6 [0032] Bushing: 3, 7 [0033] Molded billet: 4, 8 [0034] Base layer: 10, 20 '50 '60 [0035] Protective layer: 12, 22 '54 '64 [0036] Interposer: 52, 62 [0037] Molded surface: 14, 24 '56 '66 [0038] Molding mold: 100, 200 [0039] :101-106, 201 -207 094131026 Form No. A0101 Page 9 of 15 0993278011-0