1330205 六、發明說明 【發明所屬之技術領域】 [0001] 本發明係關於一種濺鍍裝置，尤指一種模仁端面濺射鍍 膜時使用之濺鍍裝置。 【先前技術】 [〇〇〇2] 模造玻璃的核心技術在於模仁與模具的製作❶由於玻填 熔解的溫度較高，並且模仁需要承受模造過程中的模壓 力，因而製造模仁時需要考慮下列幾點：（1)離型性，以 避免與玻璃發生反應、黏附現象；（2)足夠的硬度及機械 強度，以利成形玻璃及避免表面到傷；（3)耐熱衝擊性， 以承受模造過程中的熱循環。為使.模仁遠到上述要求’ 通常需在模仁的表面進行鍍膜，因此鍍膜技術不僅是模 具與模仁的關鍵技術，更是影響模造玻璃良率高低的關 鍵。 [0003] 濺射鍍膜（簡稱“濺鍍”）是庳用相當廣泛的鍍膜技術， 如第一圖所示，其為習知濺鍍#行濺鍍時的示意圖。 職鑛機4具有真空室4〇、乾赛Μ、基體（即被滅鑛 物）43、底座44及電源45。真空室40具有充氣口 46與抽 氣口 47 ’分別連接充氣及抽氣系統（圖未示）。電源^連 接把41與真空室4〇 ’從而以乾41作為陰極，放置基體43 的底座44作為陽極。底座44與真空_的壁、充氣及抽 氣系統等同時接地，而在作為陰極㈣41上加負高壓》 备真空室4G内抽至真空後，充人賤射氣體（通常為六小 調節電源45的電壓’開始_。先在擋板42與祕之間 形成放電，清除乾41表面的污染物後，移開擔板42，在 094112992 表單編號A0101 第3頁/共14頁 0993214375-0 [0004] [0005] [0006] [0007] 094112992 0993214375-0 靶41 I 099年06月18日修正替換頁 /、作為陽極的底座44之間發生輝光 向作為陰極的靶41並轟擊靶41，結果— 子^ 射， 果方面產生電子發 生陽極使之發生電離則續放電，另—方面產 極==的躁射’濺射出來的金屬原子等飛向置於陽 面2=上。同時底座44保持自轉’從而在基體43表 X上tb較均勻的膜。 然而，士妖 於基體43的幾何形狀對膜均白 若形狀，則表…地受響 差。而:!=面，則由於幾何效應將會使膜均勻性較 仁高宽比==作3體在幾射錢膜時，由於模 距離44傘甚:多‘，;使得模仁至純的 =輝光遠較底座上方之輝光強的情況，再加上底座44 轉^ W物物㈣定的現象， 進而導致膜的均勻性較差。 【發明内容】 有鑑於此，有必要提供一，膜均勾之魏袭置。 -種賴裝置，包括治具及模仁，治具包括至少一通孔 及一表面’模仁係一階梯狀的軸並具有端面及至少一么 階面。該通孔係1孔。觀孔具有—台階面。該壯 之台階面被沉孔之台階面止擋。模仁經通孔可分離地裝 入治具中後’模仁的端面與治具的表面平齊β 上述濺鍍裝置之進—牛并治法 遲步改食為：減鐘裝置進一步包括陶 莞罩，該《罩包括隔板、至少_開設在隔板上的孔、 從孔的邊緣控向擴張一段距離 表單編號圃 第4頁/共=之位置向隔板下方延伸而 099年06月18日修正替換頁 1330205 成的管以及自隔板邊緣向隔板下方延伸而成的側壁。 [0008] 與習知技術相比，所述之濺鍍裝置由於模仁的端面與治 具的表面平齊，這使得待鍍膜的端面與治具的表面整體 上形成較大面積之平面，克服模仁高寬比較大且突出底 座甚多而產生的鍍膜幾何效應，使得膜均勻性得到較大 程度的改善。 [0009] 進一步地，所述之激鍍裝置由於陶曼罩將模仁的台階面 與治具絕緣隔離，可防止台階面附近出現電弧放電現象 ，從而確保鍍膜質量。 【實施方式】 .[Technical Field] [0001] The present invention relates to a sputtering apparatus, and more particularly to a sputtering apparatus used for a sputtering process of a mold end face. [Prior Art] [〇〇〇2] The core technology of molded glass lies in the production of mold core and mold. Because the temperature of glass filling is high, and the mold core needs to withstand the mold pressure during the molding process, it is necessary to manufacture the mold. Consider the following points: (1) release property to avoid reaction with glass, adhesion; (2) sufficient hardness and mechanical strength to facilitate forming glass and avoid surface damage; (3) thermal shock resistance, Understand the thermal cycle during the molding process. In order to make the mold far beyond the above requirements, it is usually necessary to coat the surface of the mold. Therefore, the coating technology is not only the key technology of the mold and the mold, but also the key to the high yield of the mold glass. [0003] Sputter coating (abbreviated as "sputtering") is a widely used coating technique, as shown in the first figure, which is a schematic diagram of conventional sputtering #row sputtering. The mining machine 4 has a vacuum chamber 4, a dry cell, a substrate (i.e., a mineral ore) 43, a base 44, and a power source 45. The vacuum chamber 40 has an inflation port 46 and an air suction port 47' which are respectively connected to an inflation and suction system (not shown). The power source is connected to the vacuum chamber 4'' so that the stem 41 serves as the cathode, and the base 44 of the substrate 43 is placed as the anode. The base 44 is grounded at the same time as the vacuum _ wall, the inflation and the pumping system, and is pumped to the vacuum in the vacuum chamber 4G as the cathode (four) 41, and is filled with a squirting gas (usually six small regulating power sources 45). The voltage 'starts'. First, a discharge is formed between the baffle 42 and the secret, and after removing the contaminants on the surface of the dry 41, the support plate 42 is removed, at 094112992, Form No. A0101, Page 3 of 14 0993214375-0 [0004 [0005] [0006] [0007] 094112992 0993214375-0 Target 41 I On June 18, 099, the replacement page/, the base 44 as the anode, glows to the target 41 as the cathode and bombards the target 41, and the result - When the electron is generated, the electron is generated by the anode to cause ionization, and the discharge is continued. On the other hand, the cathode of the emitter == 'sprayed metal atoms and the like are placed on the male surface 2=. At the same time, the base 44 remains. Rotating 'and thus a more uniform film of tb on the base X of the base 43. However, the geometry of the stagflies on the base 43 is white if the film is white, and the surface is affected by the difference. And:! = face, due to geometric effects Will make the film uniformity higher than the aspect ratio == for 3 body in several shots, by The distance of the mold is 44 umbrellas: more ',; the mold is pure to the pure = the glow is far stronger than the glow above the base, coupled with the phenomenon that the base 44 turns the object (four), which leads to poor uniformity of the film. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a film that is hooked to the device. The device includes a fixture and a mold core, and the fixture includes at least one through hole and a surface of the mold. The shaft has an end surface and at least one step surface. The through hole is a hole. The observation hole has a step surface. The strong step surface is stopped by the stepped surface of the counterbore. The mold core is detachably mounted through the through hole. After the middle part, the end face of the mold core is flush with the surface of the jig. The above-mentioned sputtering device is advanced into the method of reducing the clock to further include a pottery cover, the cover includes a partition, at least _ Opening the hole in the partition, from the edge of the hole to control the expansion of a distance from the form number 圃 page 4 / total = position to extend below the partition and on June 18, 099, replace the replacement page 1330205 into the tube and a side wall extending from the edge of the partition to the lower side of the partition. [0008] Compared with the prior art The sputtering device is flush with the end surface of the mold and the surface of the jig, so that the end surface of the film to be coated and the surface of the jig are formed into a plane of a large area as a whole, and the height and width of the mold are relatively large and the base is protruded. The coating geometrical effect is greatly improved, so that the film uniformity is improved to a large extent. [0009] Further, the electroplating device can prevent the step surface of the mold core from being insulated from the jig due to the Tauman cover. An arc discharge phenomenon occurs near the step surface to ensure the quality of the coating.
[0010] 請參閱第二圖，其為本發明第一具體實例.之濺鍍裝置 100，該濺鍍裝置100包括由金屬製成〆治具1及模仁2。 治具1具有至少一通孔10(本實施例中為四通孔）及表面12 。通孔10係一沉孔，具有台階面14。模仁2係一階梯狀的 軸，其具有兩台階面22、24。治真1的高i與模仁2相等 ，如此當模仁2裝入治具1沾通孔10中時，模仁2的端面20 與治具1的表面12平齊，台階省24被治具1的台階面14止 檔。 [0011] 請一併參閱第一圖，在對模仁2的端面20進行濺鍍操作時 ，將安裝好模仁2的治具1通過習知方式安裝到底座44上 。由於模仁2的端面20與治具1的表面12平齊，這使得待 鍍膜的端面20與治具1的表面12整體上形成較大面積之平 面，克服模仁高寬比較大且突出底座44甚多而產生的鍍 ‘膜幾何效應，使得膜均勻性得到較大程度的改善。 094112992 表單編號A0101 第5頁/共14頁 0993214375-0 1330205 099年06月18日修正替換頁 [0012] 請一併參閱第三、四及五圖，其為本發明提供第二具體 實施例之濺鍍裝置100’ 。該濺鍍裝置100’包括治具1、 模仁2及陶瓷罩3。治具1、模仁2與前述基本相同，僅治 具1上的通孔10的直徑略作擴大，故不再贅述。陶瓷罩3 係一體成型之殼狀結構，其具有隔板30、開設在隔板30 上的至少一孔32(本實施例中為對應治具1而設置四孔）、 從孔32邊緣徑向擴張一段距離之位置向下延伸而成的管 34以及自隔板30邊緣向上下兩側延伸而成的端緣36、側 壁38。孔32的直徑小於模仁中部直徑而略大於模仁2的端 面20的直徑。管34的外直徑等於或略小於通孔10的直徑 ，管34的内直徑等於或略大.、恭模仁2的^@|5-直徑，並且管 34的長度僅及於治具1的台階I面1:4入姜.¾時.，先以陶瓷罩 « ν f >. « ·/ · * , * ' / s , 3之管34對應嵌入治具1之通孔10内，再#入模仁2。 [0013] 請一併參閱第一圖，在對模仁2的端面20進行濺鍍操作時 ，將濺鍍裝置100’通過習知方式安裝到底座44上。因陶 瓷罩3具有絕緣特性，故其可將模仁2的台階面22與治具1 .......... ; 絕緣隔離，從而防止台階面22附近的可能產生之電弧放 電現象，確保鍍膜質量之穩定。在完成鍍膜時，由於陶 瓷罩3以其隔板30支承治具1，治具1台階面14止擋模仁2 ，因而將濺鍍裝置100’反轉後，可作為承載器具使用， 此時，陶瓷罩3的端緣36可防止模仁2的端面20與其它表 面如地面等相觸碰而破壞鍍膜。 [0014] 可以理解地，治具1不僅可利用金屬材料製成，亦可利用 陶瓷等絕緣材料製成；陶瓷罩3亦可為利用其它絕緣材料 製成。 094112992 表單編號Α0101 第6頁/共14頁 0993214375-0 1330205 099年06月18日修正替换頁 [0015] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本發明技藝之人士，在援依本發明精神所作之等效 修飾或變化，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 [0016] 第一圖係習知濺鍍機示意圖。 [0017] 第二圖係本發明第一實施例之濺鍍裝置組合示意圖。 [0018] 第三圖係本發明第二實施例之濺鍍裝置之陶瓷罩示意圖 〇 [0019] 第四圖係第三圖之陶瓷罩另一方向之示意圖。 [0020] 第五圖係本發明第二實施例之滅錢裝置.組裝示意圖。 【主要元件符號說明】 [0021] 治具：1 [0022] 通孔：10 [0023] 表面：12 [0024] 台階面：14、22、24 [0025] 模仁：2 [0026] 端面：20 [0027] 陶瓷罩：3 [0028] 隔板：30 [0029] 孑L : 32 094112992 表單編號A0101 第7頁/共14頁 0993214375-0 1330205 [0030] [0031] [0032] [0033] 管：34 端緣：36 側壁：38 濺鍍裝置：100 100, 099年06月18日梭正替換頁 094112992 表單編號A0101 第8頁/共14頁 0993214375-0[0010] Please refer to the second figure, which is a first embodiment of the present invention. The sputtering apparatus 100 includes a crucible 1 and a mold 2 made of metal. The jig 1 has at least one through hole 10 (four through holes in this embodiment) and a surface 12. The through hole 10 is a counterbore having a stepped surface 14. The mold core 2 is a stepped shaft having two step faces 22, 24. The height i of the rule 1 is equal to the mold core 2, so that when the mold core 2 is loaded into the jig 1 through the hole 10, the end face 20 of the mold 2 is flush with the surface 12 of the jig 1 and the step is 24 The step surface 14 with 1 stops. [0011] Referring to the first figure together, when the end face 20 of the mold core 2 is subjected to a sputtering operation, the jig 1 to which the mold core 2 is mounted is attached to the base 44 by a conventional means. Since the end surface 20 of the mold core 2 is flush with the surface 12 of the jig 1, the end surface 20 of the film to be coated and the surface 12 of the jig 1 form a plane of a large area as a whole, and the height and width of the mold core are relatively large and the base is protruded. The resulting plated film geometry effect of a large number of 44 results in a greater degree of film uniformity. 094112992 Form No. A0101 Page 5 of 14 0993214375-0 1330205 Correction Replacement Page of June 18, 2017 [0012] Please refer to the third, fourth and fifth figures together, which provides a second embodiment of the present invention. Sputtering device 100'. The sputtering apparatus 100' includes a jig 1, a mold core 2, and a ceramic cover 3. The jig 1 and the mold core 2 are basically the same as those described above, and only the diameter of the through hole 10 in the jig 1 is slightly enlarged, so that it will not be described again. The ceramic cover 3 is an integrally formed shell-like structure having a partition 30, at least one hole 32 formed in the partition 30 (four holes are provided for the jig 1 in this embodiment), and radial from the edge of the hole 32. A tube 34 extending downward from a position at a distance and an end edge 36 and a side wall 38 extending from the edge of the partition 30 to the upper and lower sides. The diameter of the hole 32 is smaller than the diameter of the middle portion of the mold core and slightly larger than the diameter of the end face 20 of the mold core 2. The outer diameter of the tube 34 is equal to or slightly smaller than the diameter of the through hole 10, the inner diameter of the tube 34 is equal to or slightly larger, the ^@|5-diameter of the Gongmin 2, and the length of the tube 34 is only for the jig 1 Step I face 1:4 into ginger. 3⁄4 hours. First, the ceramic cover « ν f >. « · / · * , * ' / s , 3 tube 34 corresponding to the through hole 10 of the jig 1 , and then #入模仁2. [0013] Referring to the first figure, when the end face 20 of the mold core 2 is subjected to a sputtering operation, the sputtering apparatus 100' is mounted to the base 44 by a conventional means. Since the ceramic cover 3 has an insulating property, it can insulate the step surface 22 of the mold core 2 from the jig 1 ..... to prevent possible arc discharge near the step surface 22 To ensure the stability of the coating quality. When the coating is completed, since the ceramic cover 3 supports the jig 1 with its partition 30, the step surface 14 of the jig 1 stops the mold 2, so that the sputtering apparatus 100' is reversed and can be used as a carrier. The end edge 36 of the ceramic cover 3 prevents the end face 20 of the mold core 2 from colliding with other surfaces such as the ground to break the coating. [0014] It is to be understood that the jig 1 can be made not only of a metal material but also of an insulating material such as ceramics; and the ceramic cover 3 can also be made of other insulating materials. 094112992 Form No. Α0101 Page 6 of 14 0993214375-0 1330205 Correction Replacement Page, June 18, 2008 [0015] In summary, the present invention complies with the requirements of the invention patent, and patents are filed according to law. It is to be understood that the above-mentioned preferred embodiments of the present invention are intended to be included within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0016] The first figure is a schematic view of a conventional sputtering machine. [0017] The second drawing is a schematic view of the combination of the sputtering apparatus of the first embodiment of the present invention. 3 is a schematic view of a ceramic cover of a sputtering apparatus according to a second embodiment of the present invention. [0019] The fourth drawing is a schematic view of the ceramic cover of the third embodiment in another direction. [0020] The fifth figure is a schematic diagram of the assembly of the money-killing device of the second embodiment of the present invention. [Main component symbol description] [0021] Fixture: 1 [0022] Through hole: 10 [0023] Surface: 12 [0024] Step surface: 14, 22, 24 [0025] Mold: 2 [0026] End face: 20 [0027] Ceramic cover: 3 [0028] Separator: 30 [0029] 孑L: 32 094112992 Form No. A0101 Page 7 / Total 14 Page 0993214375-0 1330205 [0030] [0032] [0033] Tube: 34 End edge: 36 Side wall: 38 Sputtering device: 100 100, June 18, 099 Shuttle replacement page 094112992 Form number A0101 Page 8 of 14 0993214375-0