l^Z/885 九、發明說明： 【發明所屬之技術領域】 造二發明涉及一種電子裳置殼體及該電子襄置殼體之製 【先前技術】 隨著移動通訊技術之發展，各式各樣之電子裝置如" 等競相渴現’令消費者可隨時隨地充 “ 費者所青睞。一電子裝置愈來愈為廣大消 殼體係電子裝置主要零元件之_，其廣泛用於電每、 電腦、遊戲機等電子裝置上。目前電子裝置之殼體常見一 為塑膠殼體、合金殼體等，殼體上常常伴隨有文字或圖 =。該等文字或圖形一般通過油墨印刷於其上，文字或； 形之党度、清晰度及持久性都不夠理想。而今 現一種新殼體，其由一透明 上出 膠基體構成。 還月之相層、一電子油墨層及塑 來之子油墨層中電子油墨為隨著電子技術發展而 嚢槿洛由墨，電子油墨由數百萬個尺寸極小之微膠 與頭髮絲相當，每一個微膠囊中含有白色和 极^帶有正電荷與負電荷’正、負電微粒子都 刀佈，微膠囊内透明之液體當中。這些粒子由電場定位控 觀荠者-吾目夕電琢後’▼正電之白微粒子聚集在朝 負；尸：’嫌名—面’這一點顯示為白色；當微膠囊置人 而電之黑微粒子聚集在朝觀察者能看見之一 面，廷一點顯示為黑色。 1327885 習知技術中，該種具有電子油墨層之殼體制作過程 為·首先，將電子油墨均句地印刷到能導電之透明薄膜層 上，即先將微膠囊粒子分散在液體中形成通常意義上之油 墨，再用絲網印刷方法將該種帶有微膠囊粒子之油墨印刷 到透明薄膜層上。與透明薄膜層—樣，如玻璃、紙等都可 以作為電子油墨之基材，以形成不同材料之殼體。然後， 將=有電子油墨之薄膜層㈣到—張底板上。枯貼時，先 在薄膜層之電子油墨面上塗布―層膠枯劑，然後使該薄膜 層枯接於底板上’再用—㈣輥礙壓，讓薄膜層均勾地與 底板枯緊。則帶有電子油墨之殼體制作完成。採用該種方 法製作帶有電子油墨之殼體，生產效率不高，且通過礙壓 輥碾壓使之粘接牢固之方法，由於碾壓難於保證碾壓均 2，如此將致使殼體表面平整度不高，影響殼體外觀品質。 【發明内容】 、 。繁於以上所述’有必要提供—種表面平整度高且外觀 口口貝較高之電子裝置殼體。 另卜有必要提供一種可提高生產效率之所述電子裝 置喊體之製造方法。 + -種電子裝置殼體’包括一裝飾層及一塑膠層，其中 二匕括—電子油墨層及-薄臈層，該裝飾層與塑膠 形成所述殼體，該電子油墨層為含帶有電荷之 戈電子油墨層具有文字或圖形，所述文字 或圖：糟由電場控制油墨微粒之排列而形成。 種電子裳置殼體之製造方法，該電子裝置殼體之製 1327885 造方法，包括以下步驟： 提供-裝傅層，該袭飾層包括一電子油墨層及一薄膜 層，該電子油墨層為含帶有電荷之油墨微粒之塗層，電子 具有文字或圖形，所述文字或圖形藉由電場控制油 墨微粒之排列而形成； 提供主射核具，該注射模具包括一母模及一盘該母 模配$之:公模’該母模開設—模穴，該公模有一模芯， 遠公板之模芯開設-與該裝饰層形狀和尺寸相當之凹槽； 將該裝飾層置於所述公模之凹槽内； 曰 將該母模與該公模合模，該母模之模穴與該公模之模 芯構成-模腔’該模腔與該電子裝置殼體之形狀和尺寸對 應； 於上述模腔内注射溶融之熱塑性塑膠，塑膠與電子油 墨層接合，則塑膠與裝飾層接合成型為一體；〃 / 冷邠所述注射模具後開模，將形成之殼體取出，則 %所述電子裝置殼體。 與習知技術相比，所述電子裝置殼體，由於採用模内 注射之方法將該塑膠層與該裝飾層一體成型，避免使用膠 枯劑钻接塑膠層，提高生產效率。同時，可以避免採用礙 壓輥碾壓，從而提高電子裝置殼體之表面平整度，使電子 裝置殼體外觀品質較高。 【實施方式】 請參閱圖1，本發明較佳實施例之電子裝置殼體1〇， 包括一裝飾層12及一塑膠層14’該電子裝置殼體忉由該 1327885 裝飾層12與塑膠層14 一體成型而成。 該裝飾層12設置於所述電子裝置殼體10之外表面， 其包括一薄膜層122及一電子油墨層12心所述薄膜層122 為透明薄膜，如模内疊合（IN MOLDING LAMINATION, IML )成型技術中用到之透明塑膠膜，其亦可由玻璃、纖 維、合金及高分子材料等構成；所述電子油墨層124為含 油墨微粒之塗層，通過油墨微粒之排列，其形成文字或圖 形。所述油墨微粒帶有電荷，其可由電場控制，該種油墨 微粒具有極小之直徑1-2微米，其形成圖像可達比一般油 墨印刷形成之圖案更高之解析度和光滑度，可銳化圖像邊 緣，形成極薄之圖像層。所述電子油墨層124塗附於所述 薄膜層122，形成所述裝飾層12。 所述塑膠層14可選自聚氯乙烯、聚對苯二曱酸乙二醇-酯、丙烯睛-苯乙烯-丁二烯共聚合物、聚碳酸酯、聚醯亞 胺、液晶聚合物、聚醚醯亞胺、聚苯硫、聚颯、聚苯乙烯、 乙二醇改性聚酯及聚丙烯聚合物中之一種或多種構成之熱 塑性樹脂。 本發明較佳實施例之電子裝置殼體10之製造方法包 括如下步驟： 提供一裝飾層12,其包括一薄膜層122及一電子油墨 層124，該電子油墨層124印刷於所述薄膜層122上； 請參閱圖2,提供一注射模具，該注射模具包括一母 模22及一與該母模22配合之一公模24，該母模22開設 一模穴222及一澆道224，該澆道224與所述模穴222相 通，該公模24有一模芯242，該公模之模芯242開設一與 衣飾層12之形狀和尺寸相當之凹槽244 · •茫12置於所述公模24之凹槽施内，且該 • L專膜層122與凹槽244之底面接觸； 與該公2:ΐ該公模24合模’該母模22之模穴222 子裝體1:杈4 242構成一模腔26’該模腔26與該電 卞裒置忒體10之形狀和尺寸對應； 於上述洗道224注射熔融之埶朔，地湖_ ^ ^ 流入到模⑽内，該敎塑二=塑勝’熱塑性塑膠 塑性塑膠充填所述模腔 』膠了“氣乙烯，該熔融熱 PJr'f m. 杈腔26’亚成型成所述塑膠層14,同時 所述裝飾層12與該塑膠層14成型為—體； 门時 體1〇冷取卻/述注射模具㈣模，將該成型好之電子裝置殼 料之_ 244内還可有真空吸盤， 之。244曰广:定於該公模24之凹槽244内。該公模24 子襄』殼體t可開設頂針，以在開模後頂出成型好之電 該電子裂置殼體1G採關内 與所述塑膠層14 —π万謂裝飾層12 Μ與裝飾層12，從而卜^避免使轉_枯接塑膠詹 碾壓輥碾壓，不僅提效率。同時’可以避免採用 ^ 了電子裝置殼體10之表面平整度， 使设體之外觀品質較高，也提高了產品之良率。 將該電子裝置殼體1〇置入 =電場’則電子_ 1〇之電子油墨:= 用下，會形成所需之文字或圖形。 纟“之作 所述塑膠層14亦^~、联埋& 才了選擇導電之塑膠，所述薄膜層122L^Z/885 IX. Description of the invention: [Technical field of invention] The invention relates to an electronic skirt housing and the manufacture of the electronic housing. [Prior Art] With the development of mobile communication technology, various types All kinds of electronic devices such as " etc. are competing for the thirst, so that consumers can be favored by consumers at any time and place. An electronic device is becoming more and more widely used as the main component of the electronic device. Every computer, game machine and other electronic devices. At present, the housing of the electronic device is usually a plastic case, an alloy case, etc., and the case is often accompanied by a text or a picture =. The characters or graphics are generally printed by ink. On the other hand, the word or shape of the party, clarity and durability are not ideal. Nowadays, a new shell is formed, which consists of a transparent upper and lower glue base. The moon phase layer, an electronic ink layer and plastic In the ink layer of the ink, the electronic ink is developed by the development of electronic technology. The electronic ink is composed of millions of tiny micro-gels and hair silk. Each micro-capsule contains white and extremely positive. Charge and negative charge 'positive and negative electric particles are knives, transparent liquid in the microcapsules. These particles are controlled by the electric field to control the - - 吾 吾 吾 吾 吾 吾 吾 ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ ▼ : 'Name-face' is displayed in white; when the microcapsules are placed, the black particles of electricity are concentrated on one side of the viewer, and the point is black. 1327885 In the prior art, the type has electronic ink. The manufacturing process of the shell of the layer is: Firstly, the electronic ink is uniformly printed on the transparent film layer capable of conducting electricity, that is, the microcapsule particles are first dispersed in a liquid to form an ink in a usual sense, and then the screen printing method is used. The ink with microcapsule particles is printed on the transparent film layer, and the transparent film layer, such as glass, paper, etc. can be used as the substrate of the electronic ink to form a shell of different materials. Then, The film layer (4) of the electronic ink is applied to the bottom plate. When the film is pasted, the layer of the rubber is coated on the electronic ink surface of the film layer, and then the film layer is dried on the bottom plate. The film layer is hooked to the bottom plate, and the casing with the electronic ink is completed. The shell with the electronic ink is produced by the method, and the production efficiency is not high, and the pressure roller is pressed and pressed. The method of bonding firmly is difficult to ensure that the rolling pressure is 2, which will result in the flatness of the surface of the casing is not high, which affects the appearance quality of the casing. [Summary] It is necessary to provide the above-mentioned An electronic device housing having a high surface flatness and a high appearance. Further, it is necessary to provide a manufacturing method of the electronic device shattering body which can improve production efficiency. And a plastic layer, wherein the two layers include an electronic ink layer and a thin layer, the decorative layer and the plastic form the casing, and the electronic ink layer has a letter or a graphic with a charged electronic ink layer. The text or figure: The bad is formed by the electric field controlling the arrangement of the ink particles. The manufacturing method of the electronic device housing, the method for manufacturing the electronic device housing, includes the following steps: providing a charging layer, the coating layer comprising an electronic ink layer and a film layer, wherein the electronic ink layer is a coating comprising charged ink particles, the electrons having a text or a pattern formed by an electric field controlling the arrangement of the ink particles; providing a main shot fixture comprising a master mold and a disk The master mold is equipped with: the male mold 'the mother mold is opened--the mold hole, the male mold has a core, and the core of the far-reaching plate is opened - a groove corresponding to the shape and size of the decorative layer; In the recess of the male mold; 合 clamping the female mold with the male mold, the mold cavity of the female mold and the core of the male mold forming a cavity - the cavity and the electronic device housing Corresponding to the shape and size; injecting the melted thermoplastic into the cavity, and bonding the plastic and the electronic ink layer, the plastic and the decorative layer are integrally formed; 〃 / cold-pressing the injection mold, opening the mold, forming the shell Take out, then the electronic device housing. Compared with the prior art, the electronic device casing integrally forms the plastic layer with the decorative layer by in-mold injection, thereby avoiding the use of a binder to drill the plastic layer and improving the production efficiency. At the same time, the pressure roller can be prevented from being crushed, thereby improving the surface flatness of the electronic device casing, and the appearance quality of the electronic device casing is high. Embodiment 1 Referring to FIG. 1 , an electronic device housing 1 较佳 according to a preferred embodiment of the present invention includes a decorative layer 12 and a plastic layer 14 ′. The electronic device housing 忉 is composed of the 1327885 decorative layer 12 and the plastic layer 14 . Made in one piece. The decorative layer 12 is disposed on the outer surface of the electronic device casing 10, and includes a film layer 122 and an electronic ink layer 12. The film layer 122 is a transparent film, such as in-mold overlay (IN MOLDING LAMINATION, IML). a transparent plastic film used in molding technology, which may also be composed of glass, fibers, alloys, and polymer materials; the electronic ink layer 124 is a coating containing ink particles, which is formed by the arrangement of ink particles or Graphics. The ink particles are charged, which can be controlled by an electric field. The ink particles have a very small diameter of 1-2 micrometers, and the image formation can achieve higher resolution and smoothness than the pattern formed by general ink printing. The edges of the image are formed to form a very thin image layer. The electronic ink layer 124 is applied to the film layer 122 to form the decorative layer 12. The plastic layer 14 may be selected from the group consisting of polyvinyl chloride, polyethylene terephthalate, acrylonitrile-styrene-butadiene copolymer, polycarbonate, polyimine, liquid crystal polymer, A thermoplastic resin composed of one or more of polyether oxime imine, polyphenylene sulfide, polyfluorene, polystyrene, ethylene glycol modified polyester, and polypropylene polymer. The manufacturing method of the electronic device casing 10 of the preferred embodiment of the present invention comprises the following steps: providing a decorative layer 12 comprising a film layer 122 and an electronic ink layer 124, the electronic ink layer 124 being printed on the film layer 122 Referring to FIG. 2, an injection mold is provided. The injection mold includes a female mold 22 and a male mold 24 mated with the female mold 22. The female mold 22 defines a cavity 222 and a runner 224. The runner 224 is in communication with the cavity 222. The male die 24 has a core 242. The core 242 of the male die defines a recess 244 corresponding to the shape and size of the garment layer 12. The groove of the male mold 24 is applied, and the L-specific film layer 122 is in contact with the bottom surface of the groove 244; and the male mold 24 is clamped with the mold cavity 222 sub-mount of the female mold 22 1: 杈 4 242 constitutes a cavity 26'. The cavity 26 corresponds to the shape and size of the electric raft body 10; after the above-mentioned wash channel 224 is injected and melted, the ground lake _ ^ ^ flows into the mold (10) Inside, the 敎 plastic two = plastic wins 'thermoplastic plastic plastic plastic filling the cavity cavity』 glued "air ethylene, the heat of fusion PJr'f m. 杈 cavity 26' Yacheng The plastic layer 14 is formed, and the decorative layer 12 and the plastic layer 14 are formed into a body; the door body 1 is cooled and taken/the injection mold (four) mold is formed, and the molded electronic device shell material is _ 244 There may also be a vacuum suction cup, which is 244 inch wide: it is fixed in the groove 244 of the male mold 24. The male mold 24 can be opened with a thimble to open the molded body after the mold is opened. The electronic splicing shell 1G is covered with the plastic layer 14 and the embossed decorative layer 12 Μ and the decorative layer 12, so as to avoid the rolling of the plastic squeezing roller, which not only improves the efficiency. At the same time, the surface flatness of the electronic device casing 10 can be avoided, so that the appearance quality of the installation body is high, and the yield of the product is also improved. The electronic device housing 1 is placed in the electric field and the electron is _ 1〇Electronic ink:= Under the use, it will form the required text or graphics. 纟 “The plastic layer 14 is also used, and the conductive plastic is selected. The film layer 122
I VI 1327885 選擇導電之透明材料且帶有顯示陣列，通過軟體系統控制 該顯示陣列，則所述電子裝置殼體10可顯示相應之圖形或 文字。 【圖式簡單說明】 圖1係本發明電子裝置殼體之組成結構示意圖； 圖2係本發明電子裝置殼體於模具内成型之示意圖。 【主要元件符號說明】 電子裝置殼體 10 公模 24 裝飾層 12 模腔 26 塑料層 14 模穴 222 薄膜層 122 逢道 224 電子油墨層 124 模芯 242 母模 22 凹槽 244 12I VI 1327885 selects a conductive transparent material with a display array that is controlled by a software system, and the electronic device housing 10 can display a corresponding graphic or text. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing the structure of an electronic device casing of the present invention; FIG. 2 is a schematic view showing the molding of an electronic device casing of the present invention in a mold. [Main component symbol description] Electronic device housing 10 Male mold 24 Decorative layer 12 Cavity 26 Plastic layer 14 Cavity 222 Film layer 122 Square 224 Electronic ink layer 124 Core 242 Female mold 22 Groove 244 12