1325967 九、發明說明： 【發明所屬之技術領域】 本發明係為一種導電粒子壓痕之檢測裝置及方法，特 別是有關於一種顯示器之異方性導電膠的導電粒子壓痕之 檢測裝置及方法。 【先前技術】1325967 IX. Description of the invention: The present invention relates to a device and method for detecting conductive particle indentation, and more particularly to a device and method for detecting conductive particle indentation of an anisotropic conductive paste of a display . [Prior Art]
液晶顯示器目前廣泛應用於液晶電視、筆記型電腦、 手機、數位相機、PDA等電子產品，而舉凡捲帶封裝Tcp (tape carrier package ; TCP )/ 薄膜覆晶封裝 c〇F ( chip ⑽ film; COF)封裝時連接至液晶顯示器的外部引腳焊接〇LB (outer lead bonding ; OLB )、驅動晶片接著於 TCP/COF 載 板的内部引腳焊接ILB ( inner lead bonding ; ILB )製程、 玻璃覆晶封裝COG ( chip on glass ; COG)封裝時驅動晶片 與玻璃基板接合之製程、將晶片直接黏在電路板製程方式 (chip on board; C〇B)等，多以異方性導電膠（anis〇tr〇pic conductive film ; ACF )進行，以避免高溫焊接的製程。 異方性導電膠由導電粒子與絕緣膠材所組成，其特殊 構造使其兼具導電、隔絕和黏著的功能。一般而言，將異 方性導電膠貼附以及在上方物件與下方板材精準對位與壓 合後，經加熱及加壓一段時間後使絕緣膠材固化，即可形 成垂直導通、橫向絕緣的穩定結構。 然而’當異方性導電膠受壓時’壓力不均或壓力不足 會導致兩金屬墊間可導通的變形導電粒子數目不足，而使 1325967 • 傳導性不佳；抑或當導電粒子密度分佈不均時，也會使得 . 傳導性不佳。 因此’為了避免上述狀況發生，以異方性導電膠進行 - 黏著時’通常需檢測導電粒子壓痕的狀態、數目及分佈， • 以確定導電性的狀況。 然而’目前隨著細微間距（fine pitch)潮流的推動下，非 常容易誤判導電粒子壓痕數目與其分佈，其將影響機台判 φ 定的可靠度。 【發明内容】 有鑑於此’為了解決上述問題，本發明之—目的係提 • 供一種導電粒子壓痕之檢測裝置及方法，藉由位於非訊號 傳輸區之測試墊與測試條之間導電粒子壓痕狀態，來決定 讯號傳輸區之金屬墊間導電粒子的壓痕狀態。 為了達成上述目的，本發明之一技術樣態係關於一種 • 檢測裝置，用以檢測導電粒子壓痕狀態，包括第一基板、 多個第一金屬墊、至少一個測試墊、第二基板、多個第二 金屬墊、測試條與異方性導電膠。第一基板具有訊號傳輸 區及非訊號傳輸區，而多個第一金屬墊位於訊號傳輸區， 且至少一個測試墊位於非訊號傳輸區。多個第二金屬墊位 於第二基板且對應第一金屬墊，且測試條位於第二基板且 - 對應至少一個測試墊，而異方性導電膠位於第一金屬墊與 帛二金屬墊之間，且位於至少個-測試墊與測試條之間。 本發明之另一技術態樣係關於一種導電粒子壓痕狀態 ^0967 之檢測方法，其利用上述之檢測裝置，根據位於非訊號傳 輸區之至少一測試墊與測試條之間的導電粒子壓痕狀態， 以決定位於訊號傳輸區之第一金屬墊與第二金屬墊之間的 導電粒子壓痕狀態。 ‘為了讓本發明之上述目的、特徵及優點能更明顯易 懂’下文特舉較佳實施例，並配合所附圖式，做詳細說明 如下： 【實施方式】 參照第1A圖，其係繪示第一基板結構示意圖。第一基 板100可為玻璃基板或是電路板。第一基板100包含訊號 傳輸區100a與非訊號傳輸1〇〇b。多個第一金屬墊u〇位於 訊號傳輸區100a，且至少一個測試墊13〇位於非訊號傳輸 區100b。在較佳實施例中，第一金屬墊11〇與測試墊 係在同一製程中形成。 如第1A圖所示，多個第一金屬墊11〇彼此之間相互平 行配置，而當測離130為兩個以上，測試塾13〇彼此亦 可相互平行配置；本發明不以上述配置方式為限。 第一基板100可包含至少一個延伸金屬墊150，其可位 於非訊號傳輸1 1_。延伸金屬^5G可用來檢測阻抗或 相關電性性質。延伸金屬墊15〇亦可與測試墊13〇相互平 行配置。在較佳實施例中，延伸金屬整 ⑽以及測試墊⑽係在㈣料形成。^金屬塾 參照第1B圖，其係繪示第二基板結構示意圖。第二基 1325967 板200可為可撓性電路 第一基板2〇〇包含多個第二金 廣整1〇與測式條23〇。在較佳 金 與測試條咖係在同-製程中形成。帛一金屬塾210 如第1B圖所开》，梦— 配置，測試條二:第金^^ 明不以上述配置m 墊210平行配置；本發 的寬度wm 較佳實施例中，測試條230 又’、於第二金屬墊210的寬度W2 0 圖^::^圖’其係繪示導電粒子壓痕檢測裝置示意 ^厂錢檢測裝置_仙膠_著第—基板⑽: 在較佳實施例t，此膠體為異方性導電膠。、= 來說：夕個第-金屬塾11〇對應多個第二金屬塾21〇，二者 2以異方性導電膠黏著，達到電性連結以傳輸訊號。測 130對應到測試條23〇,二者之間亦以異方性導電膠黏 者0 在較佳實施例中’測試墊13〇與測試條23〇彼此大致 垂直。測試墊13〇與測試條23〇其中之一重疊區别之長 度U與寬度W3較佳地大於第一金屬墊ιι〇與第二金屬墊 210其中之一重疊區310之寬度W4。 測試條230亦可與延伸金屬墊15〇重疊’並利用異方 性導電膠黏著。在較佳實施例中，延伸金屬墊15〇與測試 條230其中之一重疊區350之長度L2與寬度W5係大於第 一金屬墊110與第二金屬墊21〇其中之一重疊區31〇之寬 度W4 〇 根據測試墊130與測試條230之間的導電粒子壓痕狀 1325967 態’可判斷第—金屬塾110與第二金屬塾210之間的導電 粒子壓痕狀態’例如以導電粒子壓痕數目來決定兩金屬塾 之間導電flb力’或以導電粒子分佈狀沉來決定兩金屬塾之 間壓口平坦度。第一基1〇〇若包含至少一個延伸金屬塾 150 ’則延伸金屬墊15〇與測試條23〇之間的導電粒子壓痕 狀L、亦可、·内入考量，藉以決定第一金屬塾11〇與第二金屬 墊210之間的導電粒子壓痕狀態。 參照第2圖，其係繪示導電粒子壓痕檢測裝置分布示 意圖。壓痕檢測裝置300可視為一個獨立壓痕檢測單元， 用來決疋壓痕檢測裝置3〇〇區域内導電粒子壓痕狀態。第 一基板100亦可包含多個壓痕檢測裝置300，用來決定第一 基板100整體導電粒子壓痕狀態。換言之，利用多個適當 配置於第一基板100上的壓痕檢測裝置3〇〇,即可由各個壓 痕檢測裝置300的導電粒子壓痕分佈或深淺來決定第一基 板100與多個第二基板200之間整體的接合面是否平坦。 壓痕檢測裝置3 0 0可以對稱或平行方式排列，但本發明不 受此限’亦可依實際需求排列。 因此’本發明之導電粒子壓痕檢測裝置及方法能有效 地判斷導電粒子壓痕狀態’且即使在顯示器之細微間距之 應用，仍可降低導電粒子壓痕數目與其分佈的誤判率。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1A圖是本發明之導電粒子壓痕檢測裝置之第一基 板結構示意圖。 第圖是本發明之導電粒子壓痕檢測裝置之第二基 板結構示意圖。 第ic圖是第一基板與第二基板組合後之導電粒子壓 痕檢測裝置示意圖。 第2圖是第一基板上的導電粒子壓痕檢測裝置分布示 思圖。 【主要元件符號說明】 第一基板 l〇〇a :訊號傳輸區 lt)Qb :非訊號傳輸區 110 :第一金屬墊 130 :測試墊 150:延伸金屬塾 200:第二基板 210 :第二金屬墊 230:測試條 300 :壓痕檢測裝置 3 1 〇 :重疊區 330 :重疊區 350 :重疊區 W1 :測試條寬度 W2 :第二金屬墊寬度 W3 :重疊區寬度 W4 :重疊區寬度 W5 :重疊區寬度 L1 :重疊區長度 L2 ·重疊區長度Liquid crystal displays are widely used in LCD TVs, notebook computers, mobile phones, digital cameras, PDAs and other electronic products, and Tcp (tape carrier package; TCP) / film flip chip package c〇F (chip (10) film; COF The external lead bonding LB (OLB) connected to the liquid crystal display during packaging, the driver chip is then soldered to the internal lead bonding of the TCP/COF carrier, ILB (inner lead bonding; ILB) process, glass flip chip package In the COG (chip on glass; COG) package, the process of bonding the wafer to the glass substrate is performed, and the wafer is directly adhered to the circuit board manufacturing method (chip on board; C〇B), etc., and the anisotropic conductive adhesive (anis〇tr) 〇pic conductive film; ACF) is performed to avoid high temperature soldering processes. The anisotropic conductive adhesive consists of conductive particles and insulating rubber. Its special structure makes it conductive, isolated and adhesive. Generally speaking, after the anisotropic conductive adhesive is attached and the upper and lower plates are precisely aligned and pressed, after the heating and pressing for a period of time, the insulating rubber is cured to form a vertical conduction and a lateral insulation. Stable structure. However, 'when the anisotropic conductive adhesive is under pressure', the pressure unevenness or insufficient pressure will cause the number of conductive particles that can be turned on between the two metal pads to be insufficient, so that 1325967 • poor conductivity; or when the density of conductive particles is unevenly distributed At the same time, it will also make the conductivity poor. Therefore, in order to avoid the above-mentioned situation, it is usually necessary to detect the state, the number and distribution of the indentations of the conductive particles by the anisotropic conductive paste - when it is adhered. However, with the current trend of fine pitch, it is very easy to misjudge the number of conductive particles and their distribution, which will affect the reliability of the machine. SUMMARY OF THE INVENTION In view of the above, in order to solve the above problems, the present invention provides an apparatus and method for detecting a conductive particle indentation by using conductive particles between a test pad and a test strip located in a non-signal transmission region. The indentation state determines the indentation state of the conductive particles between the metal pads of the signal transmission area. In order to achieve the above object, a technical aspect of the present invention relates to a detecting device for detecting a state of indentation of a conductive particle, including a first substrate, a plurality of first metal pads, at least one test pad, a second substrate, and more A second metal pad, a test strip and an anisotropic conductive paste. The first substrate has a signal transmission area and a non-signal transmission area, and the plurality of first metal pads are located in the signal transmission area, and the at least one test pad is located in the non-signal transmission area. The plurality of second metal pads are located on the second substrate and correspond to the first metal pads, and the test strips are located on the second substrate and correspond to at least one test pad, and the anisotropic conductive adhesive is located between the first metal pads and the second metal pads And located between at least one test pad and the test strip. Another aspect of the present invention relates to a method for detecting an indentation state of a conductive particle ^0967, which utilizes the above-described detecting means for inducing a conductive particle between at least one test pad and a test strip located in a non-signal transmission region a state to determine a state of indentation of the conductive particles between the first metal pad and the second metal pad located in the signal transmission region. The above-mentioned objects, features and advantages of the present invention will become more apparent and understood. The following detailed description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] Referring to Figure 1A, A schematic diagram of the structure of the first substrate is shown. The first substrate 100 can be a glass substrate or a circuit board. The first substrate 100 includes a signal transmission area 100a and a non-signal transmission 1B. A plurality of first metal pads u are located in the signal transmission area 100a, and at least one test pad 13 is located in the non-signal transmission area 100b. In the preferred embodiment, the first metal pad 11 is formed in the same process as the test pad. As shown in FIG. 1A, the plurality of first metal pads 11 〇 are arranged in parallel with each other, and when the distances 130 are two or more, the test 塾 13 〇 can also be arranged parallel to each other; the present invention is not in the above configuration manner. Limited. The first substrate 100 can include at least one extended metal pad 150 that can be positioned for non-signal transmission 1 1_. The extension metal ^5G can be used to detect impedance or related electrical properties. The extension metal pad 15〇 can also be arranged in parallel with the test pad 13〇. In the preferred embodiment, the extended metal monolith (10) and the test pad (10) are formed in a (four) material. ^ Metal 塾 Referring to Figure 1B, it is a schematic view of the structure of the second substrate. The second base 1325967 board 200 can be a flexible circuit. The first substrate 2 includes a plurality of second gold and a plurality of strips. The preferred gold is formed in the same process as the test strip.帛一金属塾210, as shown in Fig. 1B, dream-configuration, test strip 2: the first gold ^^ is not arranged in parallel with the above configuration m pad 210; the width wm of the present invention, in the preferred embodiment, the test strip 230 ', the width of the second metal pad 210 W2 0 Figure:: ^ Figure' is a schematic diagram showing the conductive particle indentation detecting device ^ factory money detecting device _ Xianjiao _ the first substrate (10): in the preferred implementation In example t, the colloid is an anisotropic conductive paste. , = For example: the first - metal 塾 11 〇 corresponds to a plurality of second metal 塾 21 〇, the two 2 are anisotropic conductive adhesive, electrically connected to transmit signals. The test 130 corresponds to the test strip 23, and the anisotropic conductive adhesive between the two is 0. In the preferred embodiment, the test pad 13A and the test strip 23 are substantially perpendicular to each other. The length U and the width W3 of the test pad 13 重叠 and one of the test strips 23 are preferably greater than the width W4 of the overlap region 310 of the first metal pad and the second metal pad 210. The test strip 230 can also be overlapped with the extended metal pad 15' and adhered with an anisotropic conductive adhesive. In a preferred embodiment, the length L2 and the width W5 of the overlap region 350 of the extended metal pad 15 and the test strip 230 are greater than the overlap region 31 of the first metal pad 110 and the second metal pad 21 The width W4 〇 can be judged according to the state of the conductive particle indentation between the test pad 130 and the test strip 230, and the state of the conductive particles between the first metal crucible 110 and the second metal crucible 210 can be judged, for example, by the conductive particle indentation. The number determines the conductive flb force between the two metal crucibles or the deposition of the conductive particles determines the flatness between the two metal crucibles. If the first base 1 includes at least one extended metal crucible 150 ′, the conductive particles between the extended metal pad 15 〇 and the test strip 23 压 may be indented, or may be taken into consideration, thereby determining the first metal 塾The state of the conductive particles indented between the 11 〇 and the second metal pad 210. Referring to Fig. 2, there is shown a distribution of conductive particle indentation detecting means. The indentation detecting device 300 can be regarded as an independent indentation detecting unit for judging the indentation state of the conductive particles in the region of the indentation detecting device. The first substrate 100 may also include a plurality of indentation detecting devices 300 for determining the indentation state of the conductive particles of the first substrate 100 as a whole. In other words, the first substrate 100 and the plurality of second substrates can be determined by the distribution or depth of the conductive particles of the respective indentation detecting devices 300 by using a plurality of indentation detecting devices 3 适当 appropriately disposed on the first substrate 100. Whether the overall joint between the two is flat. The indentation detecting means 300 may be arranged in a symmetrical or parallel manner, but the present invention is not limited thereto. Therefore, the conductive particle indentation detecting apparatus and method of the present invention can effectively judge the indentation state of the conductive particles' and can reduce the false positive rate of the number of conductive particle indentations and the distribution thereof even in the application of the fine pitch of the display. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a schematic view showing the structure of a first substrate of the conductive particle indentation detecting device of the present invention. The figure is a schematic view showing the structure of the second substrate of the conductive particle indentation detecting device of the present invention. The ic diagram is a schematic diagram of a conductive particle indentation detecting device after the first substrate and the second substrate are combined. Fig. 2 is a distribution diagram of a conductive particle indentation detecting device on the first substrate. [Description of main component symbols] First substrate l〇〇a: signal transmission region lt) Qb: non-signal transmission region 110: first metal pad 130: test pad 150: extension metal 塾 200: second substrate 210: second metal Pad 230: Test strip 300: Indentation detecting device 3 1 〇: overlap region 330: overlap region 350: overlap region W1: test strip width W2: second metal pad width W3: overlap region width W4: overlap region width W5: overlap Area width L1: overlap area length L2 · overlap area length