1325793 • « 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種流體喷射裝置，尤其涉及一種通過改 良的結構，引導流體朝垂直方向喷射，使得流體能夠喷射 在基板的整個表面上，從而提高對基板的處理效率之流體 - 喷射裴置。 【先前技術】 通常，流體喷射裝置是在基板表面噴射藥液等流體的 • 裝置。這種流體噴射裝置根據其用途可應用在不同的領 域。 即，可應用於在基板上塗敷藥液以形成塗層的塗敷裝 置或者可應用在通過喷射清洗液以去除基板上雜質的清 洗裝置等各種裝置上。 圖1是習知流體噴射裝置中喷嘴結構示意圖。 如圖1所示，流體喷射裝置的噴嘴尺設置在基板^的 上。卩。並且，通過喷嘴κ向基板^的上面喷射流體w。 因此，可通過從所述喷嘴κ喷射出的流體w，對基板 G進行清洗作業或塗敷作業等。 但是，習知的流體喷射裝置，當通過喷嘴κ喷射出流 體時，由於組成流體的分子之間的引力而産生表面張力， - 從而導致流體向基板内側方向傾斜一定角度0的現象。 因此，習知技術存在流體無法噴射到基板邊緣部Ε的 門題。而爲了解決這一問題，需要加長流體喷射裝置的噴 嘴長度。 5 卜S ) 1325793 - . · 【發明内容】 本發明馨於上述問題而作，其目的在於提供一種通 過改良流體喷射裝置的喷嘴結構，以使從噴嘴噴射出的 流體朝垂直方向均勻喷射的流體喷射裝置。 本發明的另一目的在於，提供一種能夠向基板垂直 噴射流體，且具有和基板長度相對應的喷嘴長度的流體 喷射裝置，從而縮小喷嘴尺寸。 爲實現上述目的’本發明提供一種流體喷射裝置， 其包括： 噴嘴’其具有用於向基板吐出流體的吐出口；導向 裝置其3又在所述喷嘴的吐出口兩側端部，用於引導由 所述吐出口喷射出的流體，使其能夠均勻地噴射在基板 的整個表面上。 本發明的流體喷射裝置具有如下效果。 第一，由於在流體喷射裝置的喷嘴吐出口兩端設置 導向裝置，可以使由吐出口喷射出的流體能夠垂直喷射 在基板上。因此，可防止基板邊緣部分未被處理的現象。 第二，由於可垂直噴射流體，喷嘴也可具有與基板 相應的長度，因此可達到縮小喷嘴尺寸的效果。 【實施方式】 下面，參照附圖詳細說明本發明流體喷射裝置的結 構。 首先’圖2是本發明一較佳實施例的流體噴射裝置 的喷嘴立體圖，圖3是顯示圖2所示流體噴射裝置中噴 1325793 嘴底部結構的不意圖，圖4是由圖2所示噴嘴所噴射的 流體狀態示意圖。 如圖2所示，本發明的流體噴射裝置丨可設置在由 輸送輥R輸送的基板G的上方。 所述流體噴射裝置1包括：喷嘴2’其具有用於向 基板G上面喷射流體W的吐出口 5;導向裝置，其設在 所述喷嘴2的吐出口 5兩端，用於引導流體的喷射方向，1325793 • « Nine, the invention relates to: [Technical field] The present invention relates to a fluid ejection device, and more particularly to an improved structure for guiding a fluid to be sprayed in a vertical direction so that a fluid can be sprayed on the entire surface of the substrate, thereby A fluid-injection device that increases the efficiency of processing the substrate. [Prior Art] Generally, a fluid ejecting apparatus is a device that ejects a fluid such as a chemical liquid on the surface of a substrate. Such a fluid ejection device can be applied in different fields depending on its use. Namely, it can be applied to a coating device which applies a chemical liquid on a substrate to form a coating layer or can be applied to various devices such as a cleaning device which sprays a cleaning liquid to remove impurities on the substrate. 1 is a schematic view showing the structure of a nozzle in a conventional fluid ejecting apparatus. As shown in Fig. 1, the nozzle tip of the fluid ejecting apparatus is disposed on the substrate. Hey. Then, the fluid w is ejected onto the upper surface of the substrate by the nozzle κ. Therefore, the substrate G can be subjected to a cleaning operation, a coating operation, or the like by the fluid w ejected from the nozzle κ. However, the conventional fluid ejecting apparatus generates a surface tension due to the attraction between the molecules constituting the fluid when the fluid is ejected through the nozzle κ, thereby causing the fluid to incline at a certain angle of 0 toward the inner side of the substrate. Therefore, the prior art has a problem that fluid cannot be ejected to the edge portion of the substrate. In order to solve this problem, it is necessary to lengthen the nozzle length of the fluid ejecting apparatus. 5(S) 1325793 - . . . SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a fluid which is uniformly sprayed in a vertical direction by a nozzle structure of a fluid ejecting apparatus. Spray device. Another object of the present invention is to provide a fluid ejecting apparatus capable of ejecting a fluid perpendicularly to a substrate and having a nozzle length corresponding to the length of the substrate, thereby reducing the nozzle size. In order to achieve the above object, the present invention provides a fluid ejecting apparatus comprising: a nozzle having a discharge port for discharging a fluid to a substrate; and a guide 3 which is at both ends of the discharge port of the nozzle for guiding The fluid ejected from the discharge port is capable of being uniformly sprayed on the entire surface of the substrate. The fluid ejection device of the present invention has the following effects. First, since the guide means is provided at both ends of the nozzle discharge port of the fluid ejecting apparatus, the fluid ejected from the discharge port can be vertically ejected onto the substrate. Therefore, the phenomenon that the edge portion of the substrate is not treated can be prevented. Second, since the fluid can be ejected vertically, the nozzle can also have a length corresponding to the substrate, so that the effect of reducing the size of the nozzle can be achieved. [Embodiment] Hereinafter, the structure of a fluid ejection device of the present invention will be described in detail with reference to the accompanying drawings. 1 is a perspective view of a nozzle of a fluid ejecting apparatus according to a preferred embodiment of the present invention, FIG. 3 is a schematic view showing a structure of a bottom portion of a nozzle 1257793 in the fluid ejecting apparatus shown in FIG. 2, and FIG. 4 is a nozzle shown in FIG. A schematic representation of the state of the fluid being ejected. As shown in Fig. 2, the fluid ejecting apparatus 本 of the present invention can be disposed above the substrate G conveyed by the conveying roller R. The fluid ejecting apparatus 1 includes a nozzle 2' having a discharge port 5 for ejecting a fluid W onto a substrate G, and a guide device provided at both ends of the discharge port 5 of the nozzle 2 for guiding the ejection of the fluid direction,
使得由所述吐出口 5噴射出的流體w均勻喷射在所述基 板G的整個表面上。 在具有這種結構的流體喷射裝置中，所述吐出口 5 沿著喷嘴2的長度方向形成在喷嘴2的底部其用於將 通過喷嘴2内部的流體W喷射到基板〇上。 而且，所述吐出口 5的兩端設有導向裝置，其用於 向垂直方向均勻噴射 使由吐出口 5喷射出的流體w 明一較佳實施例所涉及的 5 —端的第一流量集 另—端的第二流量集中槽 如圖2及圖3所示，本發 向裝置包括，形成於所述吐出 槽7及形成於所述吐出口 5 較佳地，所述第一流量集中槽7 及第二流量集中槽 9的寬度t2比所述吐出口 5的寬度tl审 文買》。 更具體而言’如圖4所示，所谈势 疋第一流量集中槽 7 及第二流量集中槽9的單位長度D] '、 山 所對應的面積比吐 出口 5的單位長度D2所對應的面穑 只尺大，因此冬咱射 流體W時，相較於所述吐出口 5，後 〜體會相對集中通過 7 所述第一流量 W2) 耒中槽7及第二流量集中槽9喷射（W1、 即，由笛 φ ^ ^ ^ ;第〜流量集中槽7及第二流量集中槽9集 τ賀射流體W，m pe 3I L 因此由吐出口 5噴射出的流體的分子之 間弓丨力與由所、+、 哈^ 、 遗第一流量集中槽7及第二流量集中槽9 赁射出的流體 ,^ 的刀子之間引力相比，後者的分子之間引 刀吏大。 因此，由、_μ 々迷吐出口 5喷射出的流體w的分子在引 力作用下姑πΒ pi 集 弓丨到由所述第一流量集中槽7及第二流量 :g 9噴射出的流體分子處，從而可防止由吐出口 5 噴射出的流體w向基板内侧傾斜的現象。The fluid w ejected from the discharge port 5 is uniformly sprayed on the entire surface of the substrate G. In the fluid ejecting apparatus having such a structure, the discharge port 5 is formed at the bottom of the nozzle 2 along the longitudinal direction of the nozzle 2 for ejecting the fluid W passing through the inside of the nozzle 2 onto the substrate stack. Further, both ends of the discharge port 5 are provided with guide means for uniformly injecting the fluid ejected from the discharge port 5 in the vertical direction, and the first flow rate of the 5-end of the preferred embodiment is further described. As shown in FIG. 2 and FIG. 3, the present invention includes, for example, a discharge device 7 formed in the discharge slot 7 and formed in the discharge port 5, preferably the first flow concentration slot 7 and The width t2 of the second flow concentration groove 9 is compared with the width tl of the discharge port 5. More specifically, as shown in FIG. 4, the unit length D] ' of the first flow concentration groove 7 and the second flow concentration groove 9 and the area corresponding to the mountain correspond to the unit length D2 of the discharge port 5 The fascia is only large in size, so when the winter squirting fluid W is compared to the venting opening 5, the rear concentrating body is relatively concentrated through 7 the first flow rate W2) 耒 middle groove 7 and second flow concentrating groove 9 (W1, that is, by the flute φ ^ ^ ^; the first flow concentration groove 7 and the second flow concentration groove 9 are set τ the white fluid W, m pe 3I L thus the molecules of the fluid ejected by the discharge port 5丨 与 与 与 与 + + + + + + + + + + + + + + + + + + + + + + + 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此 因此The molecules of the fluid w ejected by the _μ 々 々 出口 outlet 5 are gravitationally pulled by the first flow concentrating groove 7 and the second flow rate: g 9 . Therefore, the phenomenon that the fluid w ejected from the discharge port 5 is inclined toward the inner side of the substrate can be prevented.
P 士曰 ’如圖3所示，本發明的較佳實施例中的第一 表曰木中槽7及第二流量集中槽9爲方形結構，但是本 發明並不局限於此，只要形成較大的吐出面積，從而使 經過該部分的流體量相較於經過吐出口的流體量更爲集 中’任何形狀的結構均可采用。 雖然未圖示，本發明較佳實施例的流體噴射裝置， 其各流量集中槽還可以是向基板的外側方向傾斜的形 狀。 即，如果改變由所述各流量集中槽喷射出的流體方 向’使之向基板的外側方向噴射，就能取得比上述實施 例更好的效果。 圖5及圖6是本發明另一實施例的示意圖。其中， 圖5是本發明另〆實施例的噴嘴結構示意圖，圖6是由 1325793 圖5所示噴嘴所喷射的流體狀態示意圖。 本發明的較佳實施例提出作爲導向裝置増加吐出口 兩端的面積，從而使流量集中在兩侧端部的結構，而本 發明的另一實施例卻提出雖然其結構與上述流體喷射裝 置基本相同，但作爲導向裝置另設置導向部件的結構， 而這一點就是與上述實施例不同之處。 即，如圖5所示，本發明另一實施例所涉及的流體 喷射裝置，在吐出口 14兩端設有導向裝置。 即’本實施例的流體喷射裝置1 〇之導向裝置包括， 設置在所述吐出口 14 一端的第一導向裝置11及設置在 另一端的第二導向裝置13。 其中’第一導向裝置11及第二導向裝置13可包括， 分別設置並固定在所述吐出口 1 4兩側端部的第一固定單 元15及第二固定單元18;分別從所述第一固定單元15 及第二固定單元18的一端向下垂直延伸，用於朝垂直方 向引導流體W的第一導向單元17及第二導向單元19。 其中’所述第一導向裝置11及第二導向裝置13可 與喷嘴12形成一體，也可以單獨形成並結合在喷嘴12。 因此’由所述喷嘴12的吐出口 14所喷射的流體W， 可在其兩側與所述第一導向單元17及第二導向單元19 相接觸的狀態下喷射。 此時，由所述吐出口 14噴射的流體w與第一導向 單元17及第一導向單元19之間産生張力，而所述張力 大於流體W的分子之間的表面張力。 1325793 因此，通過所述第一導向單元17及第二導向單元 19，可防止由所述喷嘴12的吐出口 14噴射出的流體w 向基板内側傾斜的現象，從而在基板G在寬度L方向上 的整個區域上可均勻地喷射流體。 以上對本發明的較佳實施例進行了說明，對於所屬 領域的技術人員來說，應該理解在不脫離本發明精神的 範圍内，可作出各種修飾及變更。因此，凡在本發明的 權利要求範圍内所作的各種修改及變更，均屬於本發 的保護範圍。 【圖式簡單說明】 圖1是習知流體喷射裝置中喷嘴結構示意圖。 圖2疋本發明一較佳實施例的流體噴射裝置中 體圖》 圖 示意圖 3疋顯不圖2所示流體喷射裝置中喷嘴底部結構的 _ 圖4是由圖2所示噴嘴所喷射的流體狀態示意圖。 _圖5是本發明另一實施例的流體喷射裝置中噴嘴結構 圖6是由圖5所示噴嘴所喷射的流體狀態示意圖 【主要元件符號說明】 I ' 1〇 流體噴射裝置 II 第一導向裝置 13 第二導向裝置 K ' 2 ' 12 喷嘴 1325793As shown in FIG. 3, the first table rafter 7 and the second flow concentrating groove 9 in the preferred embodiment of the present invention have a square structure, but the present invention is not limited thereto, as long as the formation is The large discharge area allows the amount of fluid passing through the portion to be more concentrated than the amount of fluid passing through the discharge port. Any structure of any shape can be employed. Although not shown, in the fluid ejecting apparatus according to the preferred embodiment of the present invention, each of the flow rate concentrating grooves may have a shape inclined toward the outer side of the substrate. That is, if the direction of the fluid ejected by the respective flow concentration grooves is changed to be ejected toward the outer side of the substrate, a better effect than the above embodiment can be obtained. 5 and 6 are schematic views of another embodiment of the present invention. 5 is a schematic view showing the structure of a nozzle according to another embodiment of the present invention, and FIG. 6 is a schematic view showing the state of the fluid ejected by the nozzle shown in FIG. The preferred embodiment of the present invention proposes a structure in which the both ends of the discharge port are added as guide means to concentrate the flow rate at the both end portions, and another embodiment of the present invention proposes that the structure is substantially the same as that of the above fluid ejecting apparatus. However, the structure of the guide member is additionally provided as the guide means, and this is different from the above embodiment. That is, as shown in Fig. 5, in the fluid ejecting apparatus according to another embodiment of the present invention, guide means are provided at both ends of the discharge port 14. Namely, the guiding means of the fluid ejecting apparatus 1 of the present embodiment includes the first guiding means 11 provided at one end of the discharge port 14, and the second guiding means 13 provided at the other end. The first guiding device 11 and the second guiding device 13 may include a first fixing unit 15 and a second fixing unit 18 respectively disposed at the ends of the discharge port 14; respectively, from the first One ends of the fixing unit 15 and the second fixing unit 18 extend vertically downward for guiding the first guiding unit 17 and the second guiding unit 19 of the fluid W in the vertical direction. The first guiding device 11 and the second guiding device 13 may be integrally formed with the nozzle 12 or may be separately formed and coupled to the nozzle 12. Therefore, the fluid W ejected from the discharge port 14 of the nozzle 12 can be ejected in a state where both sides thereof are in contact with the first guide unit 17 and the second guide unit 19. At this time, tension is generated between the fluid w ejected from the discharge port 14 and the first guiding unit 17 and the first guiding unit 19, and the tension is larger than the surface tension between the molecules of the fluid W. 1325793 Therefore, by the first guiding unit 17 and the second guiding unit 19, the phenomenon that the fluid w ejected from the discharge port 14 of the nozzle 12 is inclined toward the inner side of the substrate can be prevented, so that the substrate G is in the width L direction. The fluid can be uniformly sprayed over the entire area. The present invention has been described with reference to the preferred embodiments of the present invention. It is understood that various modifications and changes can be made without departing from the spirit of the invention. Accordingly, various modifications and changes may be made within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a nozzle in a conventional fluid ejecting apparatus. Figure 2 is a perspective view of a fluid ejecting apparatus according to a preferred embodiment of the present invention. Figure 3 is a view showing a nozzle bottom structure of the fluid ejecting apparatus shown in Figure 2. Figure 4 is a fluid ejected by the nozzle shown in Figure 2. State diagram. 5 is a nozzle structure in a fluid ejection device according to another embodiment of the present invention. FIG. 6 is a schematic view of a fluid state ejected from the nozzle shown in FIG. 5. [Main element symbol description] I '1〇 Fluid ejection device II First guiding device 13 second guide K ' 2 ' 12 nozzle 1325793
E 邊緣部 W 流體 G 基板 Θ 角度 R 輸送輥 5、14 吐出口 7 第一流量集中槽 9 第二流量集中槽 tl、t2 寬度 D1 ' D2 單位長度 15 第一固定單元 18 第二固定單元 17 第一導向單元 19 第二導向單元 L 寬度E Edge portion W Fluid G Substrate 角度 Angle R Conveying roller 5, 14 Discharge port 7 First flow concentration groove 9 Second flow concentration groove t1, t2 Width D1 'D2 Unit length 15 First fixing unit 18 Second fixing unit 17 a guiding unit 19 second guiding unit L width