13254871325487
【發明所屬之技術領域】 』也本發明為提供一種以石墨為基底之散熱座及其石墨之 製造方法，尤指利用冷壓熱壓震動將球狀石墨形成塊狀， 並將其浸潰於液界相瀝青中來填補空隙’且再經一次石墨 化，以提高石墨之密度及強度，並可使其具 熱傳導率。 【先前技術】 • 按’隨著高科技的蓬勃 小化’而且單位面積上的密 _不斷增強，在這些因素之下 逐年升高’倘若沒有良好的 生的熱’這些過高的溫度將 熱應力等現象造成整體的穩 本身的壽命，因此如何排除 熱’一直是不容忽視的的問 發展’電子元件的體積趨於微 集度也愈來愈高’其效能更是 ，電子元件的總發熱量則幾乎 散熱方式來排除電子元件所產 $致電子元件產生電子游離與 定性降低，以及縮短電子元件 這些熱量以避免電子元件的過 題。 ‘=，未來的半導體及電子震構將趨向於 更回饴度，相對的，熱的排散即是開發者率及 對的問題，而目前電子元件在 '續必需面 h "…?高密度能量 密度熱，就當前的散熱方式，是 I)所帶來的高 h………熱擴散（ 一步的將熱管（Heat Pi 、广礎材料，或是更進 以加快熱擴散的速度，但此種做 入基礎材料内， 高了許多，且隨著電子元件的進 成本也相對的提 與改良，單位面積上的[Technical Field of the Invention] The present invention also provides a graphite-based heat sink and a method for producing the same, in particular, a spheroidal graphite is formed into a block shape by cold pressing hot pressing vibration, and is immersed in The liquid boundary phase asphalt is used to fill the voids and is once graphitized to increase the density and strength of the graphite and to make it have thermal conductivity. [Prior Art] • According to 'With the boom of high technology' and the density of the unit area is constantly increasing, under these factors, it will increase year by year. 'If there is no good heat, these too high temperatures will be hot. Stress and other phenomena cause the overall stability of its own life, so how to eliminate heat 'has always been a development that cannot be ignored. 'The volume of electronic components tends to be higher and the micro-aggregation is getting higher and higher', and its performance is the total heat of electronic components. The amount is almost heat-dissipating to eliminate the electronic free and qualitative degradation of the electronic components, and to shorten the heat of the electronic components to avoid the problem of electronic components. '=, the future semiconductor and electronic seismic structure will tend to be more resilience. Relatively, the thermal dissipation is the developer rate and the right problem. At present, the electronic components are in the 'required surface h "...? Density energy density heat, the current heat dissipation method, is the high h...Is thermal diffusion (one step heat pipe (Heat Pi, wide base material, or more to speed up the heat diffusion speed, but This kind of material is much higher in the basic materials, and the relative cost of the electronic components is relatively improved and improved.
1325487 五、發明說明（2) 密集度也愈來 而因銅、銘的 m k，在發熱 用，且銅與鋁 2 . 7 g / c 熱裝置組合後 構，進而造成 而，由於 之問題，所以 >環，而目前， 由石墨化處理 石墨（n a t 狀（請參閱第 具有二 0 W/ T h r W/ Μ 並無塊 的熱傳 >狀並運 是 率，並 商所亟 【發明 維（1 Μ - Κ u — t )，所 狀應用 導率， 用於散 以，要 讓垂直 欲研究 内容】 愈高， 導熱係 量不斷 的密度 C )， ’散熱 電子元 銅、在呂 新的散 碳為自 後，可 u r a — 、 一 n - p 〜6 〇 hic 以目前 ’所以 並讓垂 熱裝置 如何使 向熱傳 改善之 使得必須讓敎 "、、 數約為4 〇 〇 升高的電子元 相當高（約為 所以當電子元 裝置的重量往 件的哥命減短 為基礎材質所 熱材料之研發 然界中一種豐 成為良好的電 1 Q r a p 圖所示），經 1 a n e )優 0 W / Μ - Κ k η e s s ) 僅以薄捲材之 ’如可使石墨 直向熱傳導率 中，必可大幅 石墨可保留平 導率提昇，即 方向所在者。 擴散速 Ψ / m 件上， 8 . 5 件與銅 往會破 或損壞 製成之 ，便成 富含量 導體及 hi t 加工滾 良的熱 )，但 該傳導 應用為 可保留 提昇， 提昇散 面向具 為從事 度也隨 k及2 已漸漸 g / c 、铭所 壞電子 0 散熱裝 為非常 的物質 熱導體 e )為 扎成薄 傳導率 在三維 率非常 主，就 平面向 使石墨 熱效果 有良好 此行業 之加快，0 0 W/ 的不敷使 c及 製成之散 元件的結 置有上述 重要的一 ’且碳經 ，而天然 高碳鱗片 捲材後會 (約2 4 ( 低（約6 熱傳遞上 具有良好 可形成塊 〇 的熱傳導 之相關廠1325487 V. INSTRUCTIONS (2) The density is also increasing due to the use of copper and Ming mk in heat generation, and the combination of copper and aluminum 2. 7 g / c thermal devices causes damage due to problems. > ring, and currently, graphitized graphite (nat-like (see the first with 0 W / T hr W / 并无 no block of heat transfer > shape and transport is the rate, and the business 亟 [invention dimension (1 Μ - Κ u — t ), the applied conductivity, for the dispersion, to make the vertical research content] the higher the density of the thermal conduction system C), 'heat dissipation electron element copper, in Lu Xin The carbon is from the back, can be ura — , an n - p ~ 6 〇 hic to the current 'so and let the heat sink to improve the heat transfer so that the 敎 ", the number is about 4 〇〇 rise The electronic element is quite high (so that when the weight of the electronic component device is reduced to the weight of the piece, the material of the thermal material of the basic material is developed into a good electric 1 Q rap diagram), after 1 ane ) excellent 0 W / Μ - Κ k η ess ) only with thin coils Ink vertical thermal conductivity, the graphite will greatly enhance the conductivity may remain flat, i.e. where the persons direction. On the diffusion speed / m parts, 8.5 pieces of copper and copper will be broken or damaged, it will become a rich content of conductors and heat processing), but the conduction application can be retained to enhance the lifting For the degree of engagement also with k and 2 has gradually g / c, Ming bad electronic 0 heat is installed as a very material thermal conductor e) for the thin conductivity in the three-dimensional rate is very dominant, the plane to make the graphite thermal effect is good The acceleration of this industry, 0 0 W / of the inadequacy of the c and the finished components of the assembly of the above-mentioned important one and carbon, and the natural high-carbon scales will be after the film (about 2 4 (low (about 6 Heat transfer related plants with good blockiness for heat transfer
第6頁 1325487 發明說明（3) 故，發明人有鑑於上述之問題與缺失，乃搜集相關資 料，經由多方評估及考量，並以從事於此行業累積之多年 經驗，經由不斷試作及修改，始設計出此種以石墨為基底 之散熱座及其石墨之製造方法的發明專利誕生者。 本發明之主要目的乃在於，利用製程中所使用的球狀 .石墨’並將球狀石墨以冷壓熱壓震動形成塊狀，並將其浸 潰於液界相遞青中來填補空隙，且再經一次石墨化，以提 •高石墨之密度及強度，並可使其具有極佳的三維熱傳導率 • 本發明之次要目的乃在於’利用經浸潰在液界相瀝青 及再一次石墨化的石墨，作為散熱座之基底，並於表面鍍 上金屬面’使其成為一石墨基底散熱座，而此石墨基底散 熱座可迅速的吸收電子元件所發出之熱源，以避免過高的 ’工作溫度使電子元件產生電子游離與熱應力等現象造成整 —體的穩疋性降低，以及縮短電子元件本身的壽命，且石墨 基底散熱座的重量非常輕，而可避免因過大的重量抵壓至 電t凡件上，而破壞電子元件的結構，進而造成電子元件 的壽命減短或損壞。 鲁【實施方式】 其構ί達成上述目的及功效，本發明所採用之技術手段及 ^ 從繪圖就本發明之較佳實施例詳加說明其特徵與 功成=下’俾利完全瞭解。 圖，明參閱第三圖所示’係為本發明之石墨製造方法流程 由圖中可清楚得知，當利用本發明製造塊狀石墨時，Page 6 1325487 Description of Invention (3) Therefore, inventors have collected relevant information in view of the above-mentioned problems and deficiencies, and through multiple assessments and considerations, and through years of experience in the industry, through continuous trials and revisions, The birth of the patent for the invention of such a graphite-based heat sink and its graphite manufacturing method was designed. The main purpose of the present invention is to utilize the spherical graphite "used in the process" and form the spheroidal graphite into a block shape by cold pressing and hot pressing, and to immerse it in the liquid boundary phase to fill the gap. And once again graphitized to increase the density and strength of high graphite, and can make it have excellent three-dimensional thermal conductivity. The secondary purpose of the present invention is to 'use the impregnated asphalt in the liquid boundary and once again Graphitized graphite, as the base of the heat sink, is plated with a metal surface to make it a graphite substrate heat sink, and the graphite substrate heat sink can quickly absorb the heat source emitted by the electronic components to avoid excessive 'The working temperature causes the electronic components to generate electron detachment and thermal stress, which causes the stability of the whole body to be reduced, and shortens the life of the electronic component itself. The weight of the graphite substrate heat sink is very light, and the excessive weight can be avoided. Pressing on the electrical component, destroying the structure of the electronic component, thereby causing the life of the electronic component to be shortened or damaged. Lu [Embodiment] The above-mentioned objects and effects are achieved by the present invention, and the technical means and the advantages of the present invention are fully described in the preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a flow chart of a graphite manufacturing method of the present invention. It is clear from the drawings that when the bulk graphite is produced by the present invention,
!32548?_ 广說明⑷ 神依下列步驟進行： (1 0 0 )粉碎：將天然石墨粉碎成粒度為微米的粗子。 (1 1 0 )混捏：將粒度為微米的粒子混合黏著劑，且黏 著劑可為瀝青或介相瀝青。 (1 2 〇 )融合造粒：將混合黏著劑的粗子進行再次粉碎 ，讓石墨粉體平均打散，以得到球 - 狀石墨（如第四圖所示）。 (1 3 0)壓力成型：將球狀石墨利用高壓、冷壓熱壓震 動形成塊狀。 (1 4 0 )培燒：將塊狀石墨浸潰於液界相瀝青中來填補 • 空隙，以提高密度及強度。 (1 5 0 )石墨化：利用分段加熱使其石墨化，而其時間 約為一個月，且加熱溫度約為3 2 〇 0 ec，進而可得到具三維高熱傳導效 能之石墨。 而利用此方法所得到之塊狀石墨其密度相當的高（ 愤麥閱第五、六圖所示）’且此即可使其三維的熱傳導率 約 <達到9 1 OW/M— K，而可讓石墨之整體導熱速率 嶒加’且其之密度為1 · 2g/cc〜2 . 2g/cc。 # 請參閱第七圖所示，係為本發明石墨基底散熱座之侧 祝阖’由圖中可清楚看出，利用上述之石墨製造方法所製 邊出來的石墨1 ’因其本身是良好的導體，而可輕易的於 石墨1表面鍍上金屬面2，使其成為一石墨基底散熱座， 並可於金屬面2表面以焊接方式連接鰭片組3來增加散熱!32548?_广说明(4) God proceeds according to the following steps: (1 0 0 ) Crushing: The natural graphite is pulverized into coarse particles having a particle size of micron. (1 1 0) Kneading: The particles having a particle size of micron are mixed with an adhesive, and the adhesive may be asphalt or mesophagous. (1 2 〇 ) Fusion granulation: The coarse particles of the mixed adhesive are pulverized again, and the graphite powder is evenly dispersed to obtain spherical graphite (as shown in the fourth figure). (1 3 0) Pressure forming: The spheroidal graphite is shaken by high pressure and cold pressing to form a block. (1 4 0) Burning: The block graphite is immersed in the liquid boundary phase asphalt to fill the voids to increase the density and strength. (1 50) Graphitization: It is graphitized by segment heating, and the time is about one month, and the heating temperature is about 3 2 〇 0 ec, thereby obtaining graphite having three-dimensional high heat conduction performance. The bulk graphite obtained by this method has a relatively high density (indicated in the fifth and sixth figures of the angered wheat) and the three-dimensional thermal conductivity is about < 9 1 OW/M-K, It can increase the overall thermal conductivity of graphite and its density is 1 · 2g / cc ~ 2 . 2g / cc. # Please refer to the seventh figure, which is the side of the graphite substrate heat sink of the present invention. As can be clearly seen from the figure, the graphite 1' produced by the above graphite manufacturing method is good by itself. The conductor can be easily plated with the metal surface 2 on the surface of the graphite 1, so that it becomes a graphite substrate heat sink, and the fin group 3 can be soldered to the surface of the metal surface 2 to increase heat dissipation.
第8頁 j〇487Page 8 j〇487
(5) 積，而當 他J所設置 4所發出 至石墨1 熱源散去 作，以避免 力等現象造 身的壽命， 量下降，以 鲁壞電子元件 損壞。 件 傳 將 上述之石 之抵持面 之熱源， ’再藉由 ，以確保 過高的溫 成整體的 且因石墨 避免因過 4的結構 墨基底 1 1抵 可因石 金屬面 電子元 度使電 穩定性 1的密 大的重 ，進而 散熱座 持於電 墨1的 2所連 件4可 子元件 降低， 度非常 量抵壓 造成電 於使用 子元件 高熱傳 接之錯 在容許 4產生 以及縮 的低， 至電子 子元件 時，係 4上， 導速率 片組3 的溫度 電子游 短電子 進而使 元件4 4的壽 將石墨1 使電子元 而迅速的 ，快速的 範圍下工 離與熱應 元件4本 整體的重 上，而破 命減短或 再者，該 鍍等方式鍍於 石墨 石墨 1表面之金屬面2為可以電鑛或真空蒸 1表面，且金屬面2可為銅、錄或其合 、土 疋以’本發明之以石墨為基底之散熱座及其石墨之製 法為可改善習用之技術關鍵在於； 本發明為利用製程中所使用的球狀石墨，並將球狀石 $以冷壓熱壓震動形成塊狀，並將其浸潰於液界相瀝 • 月中來填補空隙，且再經一次石墨化，以提高石墨之 密度及強度’並可使其具有極佳的三維熱傳導率。 (二）本發明為利用經浸潰在液界相瀝青及再一次石墨化的 石墨’作為散熱座之基底，並於表面鍍上金屬面，使 其成為一石墨基底散熱座，而此石墨基底散熱座為可 抵持於電子元件’使電子元件所發出之熱源可迅速的(5) Accumulate, and when his J set 4 issued to the graphite 1 heat source to disperse, to avoid the life of the body and other phenomena, the amount of decline, to damage the electronic components. The heat source of the stone that resists the above-mentioned stone is passed, 'again, to ensure that the temperature is too high and that the graphite avoids the structure of the ink substrate 1 due to the structure of the metal. The dense weight of the electrical stability 1 and the heat dissipation of the two connected components of the electro-ink 1 can reduce the sub-components, and the degree of pressure is excessively pressed to cause the high-heat transfer of the sub-components to be allowed in the fourth generation and The shrinkage is low, when the electronic sub-element is on the system 4, the temperature of the rate-changing sheet group 3 is short-lived by the electrons, so that the material of the element 4 is made of graphite 1 and the electrons are quickly and quickly separated and heated. The element 4 should be heavy on the whole body, and the life is shortened or the plating surface or the like is plated on the surface of the graphite graphite 1 and the metal surface 2 can be electro-mine or vacuum-vaporized, and the metal surface 2 can be copper. The key to the technique of improving the conventional use of the graphite-based heat sink and the graphite of the present invention is that the spheroidal graphite used in the process is used and the spherical shape is used. Stone $ with cold pressure and heat shock Form a block, and is impregnated in the liquid phase boundary to fill the gap leaching • months, and then by once graphitization of graphite to increase the density and strength of 'three-dimensional and it has excellent thermal conductivity. (2) The present invention utilizes a graphite which is impregnated in liquid boundary phase pitch and once graphitized as a base of the heat sink, and is plated with a metal surface to form a graphite substrate heat sink, and the graphite substrate The heat sink is resistant to the electronic components' so that the heat source emitted by the electronic components can be quickly
第9頁 1325487 五、發明說明（6) 免過高的工作溫度使電 等現象造成整體的穩定 身的壽命，且石墨基底 免因過大的重量抵壓至 的結構，進而造成電子 種較佳之可行實施例說 本發明之申請專利範圍 藝精神下所完成之均等 明所涵蓋之專利範圍中 傳導至石墨基底散熱座，以避 子元件產生電子游離與熱應力 性降低，以及縮短電子元件本 散熱座的重量非常輕，而可避 電子元件上，而破壞電子元件 元件的壽命減短或損壞。 上述詳細說明為針對本發明一 •明而已，惟該實施例並非用以限定 ’凡其它未脫離本發明所揭示之技 變化與修飾變更’均應包含於本發 综上所述’本發明一錄里灰— 墨之劁種以石墨為基底之散熱座及其石 性、創作性及進步性之專利nΓ 戒付《祈穎 審委早…仓太垒件，羑依法提出申請，盼 局有任何㈣，缚之辛苦發明，倘若鈞 實或德便。 S 來函指不，發明人定當竭力配合，Page 9 1325487 V. INSTRUCTIONS (6) Excessively high operating temperature causes electrical and other phenomena to cause an overall stable life, and the graphite substrate is protected from excessive weight due to the structure, thereby making the electronic species better. The embodiment is said to be conducted to the graphite substrate heat sink in the scope of the patents covered by the genius of the invention, to reduce the electron detachment and thermal stress of the component, and to shorten the heat sink of the electronic component. The weight is very light, and it can avoid electronic components, and the life of the electronic component is broken or damaged. The above detailed description is intended to be illustrative of the present invention, and is not intended to be limited to the details of the present invention. Recorded ash - Ink of the graphite-based heat sink and its stone, creative and progressive patents nΓ 付 《 祈 祈 祈 祈 祈 祈 祈 祈 早 早 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓 仓Any (4), the hard work of the bond, if it is rude or German. S letter means no, the inventor will try his best to cooperate,
第10頁 1325487 圖式簡單說明 【圖式簡單說明】 第一圖 係為天然石墨之顯微組織圖（一）。 第二圖 係為天然石墨之顯微組織圖（二）。 第三圖 係為本發明之石墨製造方法流程圖。 第四圖 係為球狀石墨之示意圖。 第五圖 係為本發明之石墨顯微組織圖（一）。 -第六圖 係為本發明之石墨顯微組織圖（二）。 第七圖 係為本發明石墨基底散熱座之侧視圖。 【主要元件符號說明】 1 、石墨 1 1 、抵持面 2、金屬面 3 、鰭片組 • 4、電子元件Page 10 1325487 Simple description of the diagram [Simple description of the diagram] The first diagram is the microstructure diagram of natural graphite (1). The second figure is the microstructure of natural graphite (2). The third figure is a flow chart of the graphite manufacturing method of the present invention. The fourth figure is a schematic diagram of spheroidal graphite. The fifth figure is a graphite microstructure diagram (1) of the present invention. - Figure 6 is a graphite microstructure diagram (2) of the present invention. Figure 7 is a side view of the graphite substrate heat sink of the present invention. [Main component symbol description] 1. Graphite 1 1 , resisting surface 2, metal surface 3 , fin group • 4, electronic components