1325168 九、發明說明： 【發明所屬之技術領域】 憶媒體 本發明係關於將用於平面顯示器(FPD)之玻璃基板等基板冷 板冷卻裝置、基板冷卻綠、控糖式、電腦可讀取之記 【先前技術】 蚀田tIPD之製造，為了在FPD用玻璃基板上形成電路圖案，係 ，用光微影技*。級影所進行之圖飾成，係關如如下 j進行：於玻璃基板上塗布抗_液而形成抗歸丨膜，並以對 應電路随之对將抗㈣麟光，並對轉進行顯影處理。 ，微影技術-般而言，於抗钱劑膜形成前後或顯影處理後 ^f了提面抗触劑膜固定性，係對玻璃基板施以加熱處理，並 货ΐ*、、、ΐϊ後實施玻璃基板冷卻。玻璃基板冷卻時，係使用冷卻 :支持部’將藉由運送臂所把持運送之玻璃基板予以 持，冷雜’設於此支持部之下侧，將賴基板冷卻； 及可升降之腔室’粒支持於支持部之基板(例如參照專利文獻 置’為了謀求生產量之提高，細覆蓋支躲支持部 =室上升而將支持於支持部之基板藉由冷卻板予;^^$式$ 予以上:=知冷卻裝置，如果將經過加熱之玻璃基板 度分布變得不均勻，玻璃基板會有產生 辰女i涵ff 邁向大型化，甚至出現-邊為2公尺以上的 =卻當玻璃基板變得大型，基板=由n? 與支持。卩之間遞送時之衝擊而致損壞之虞。 [專利文獻1]曰本特開平1〇_229037號公報 【發明内容】 [發明欲解決之問題] t發明係有鑑於該情事而生，目的為提供一種基板冷卻裝 & 板冷部方法、控制程式、電腦可讀取之記憶媒體，即使基 芬二广里的’仍能謀求生產量提高，並且確實地防止基板之應變 及才貝壞。 [解決問題之方式] t了解決上糾題’本發明提供—種基板冷卻裝置，將加熱 sit以冷卻’其特徵在於：具備將加熱後之基板朝-方向 /、it運送通道，及將於前述運送通道運送之基板予以冷卻之A 前述冷卻機構’係沿著前述運送通道從運送方向上游& 預備冷卻部與主冷卻部而成，加Μ之基板於前述 ===，基板之初步散熱後，此基板於前述主冷卻 又 "μ本發明提供—絲板冷卻裝置，將加紐之基板予以A m在於:具備將加熱後之基板朝-方向運送之運送通道 it 送之基板予以冷卻之冷卻機構；及以使基板 的方式控制前述冷卻機構之控制機構;前 ，構’係瞒運送通道從運送方向上游側起依序 主冷ΐί而成，加熱後之基板於前述預備冷卻部冷卻而 構之控制，冷卻至既定的溫度。 丨猎由抓述控制機 位置 號，控 本發明中’前述控制機構’較佳為基於與 對應而設於前述運送通道附近之溫度偵測部之二二 制基板在前述冷卻機構之前述主冷卻部的冷卻^ ，徑 P機構之冷卻流體的 的溫度。此情形中’前述冷卻機構，較佳為於前 板供給冷卻雜縣板冷卻，並且前触伽晴基 偵測部之溫度偵測信號，控制來自於前述冷名，土於4述溫度 =、—者，而使基板成為既定的溫度，前述運送通道1 ，二日兑、+.方向排列多數之滾子構件的旋轉將基板滾子運 ^ m’ + ^ '則迟主冷卻部位置對應之前述滾子構件的至少一部 抖雍夕〜+、、#ϋ。卩度偵指#b ’控制與前述主冷卻部位置 ^應之則賴子構件的至少—部分的溫度，使基板成為既定的溫 度0 袖，提供一種基板冷卻裝置，將加熱後之基板予以冷 將加雛之紐.㈣運狀運送通道； 道運送之基板收容之方式設置的殼體；及於前 …雷土板冷部之冷卻機構；前述冷卻機構，係沿著前述 妨向上游侧祕序配置之預備冷卻部及主冷卻部 ’ tii之基板於前述預備冷卻部冷卻並進行基板之相步 散熱後，此基板於冑述主冷卻部冷卻至既定的溫度。 /、Hff明提供—絲板冷卻裝置，將加織之基板予以冷 lp將於於加熱後之基板朝—方向運送之運送通道； 通道運送之_收容之方式設置的殼體；及於前 冷卻之冷卻機構；及使基板成為既定的溫度 3式=刖述冷卻機構之控制機構；前述冷卻機構，係沿著前 运方向上游側起依序配置之預備冷卻部與主冷卻 成後i基4反於前述預備冷卻部冷卻實施基板之初步散 :'ί、1ϊ基板於前述主冷卻部藉由前述控制機構之控制冷卻至既 疋的溫度。 =明中’前述控制機構，較佳為基於設於與前述主冷卻部 之前述殼體内的溫度偵測部的溫度侧信號，控制基板 ，述^卩機構之前社冷卻部的冷卻域定的溫度。此情形板 中’於别述殼體内’在前述賴冷卻部麟駐冷卻部之間，設 壁’其具有於前述運送通道運送之基板可通過之通過口， 爾述冷卻機構’難為於前社冷卻部對基板供給冷卻流體將基 構，基於_溫賴測部之溫度㈣作 較佳為麵義備冷料，抑狀前賴， 板供給以將基板冷卻。再者，於此j主 卜之周k風體對基 具有設於前賴體之壁父佳為前述預備冷卻部， 。又殼體外之周遭氣體並對基板供^ 本發月Φξ：供一種基板冷卻方法，將、^ 向運送之加熱後的基板，以沿雜骑 :方 :其3在於：將加熱後之基板於前述預備冷卻 卩至岐的溫^ 使電腦㈣處"理以、制^*，其賴在於：於電腦上動作， 便電細控制處理裝置，於執行時實施前述基板冷卻方法。 μ 者ί發明提供—種1腦可讀取之記憶媒體，記财於電腦 理g之丄其特徵在於：前述控制程式，使電腦控制處 理裝置，使執订時貫施前述基板冷卻方法。 [發明之效果] 依照本發明，由於係以將於運送通道以—方向運送 由^卻機構而冷卻之方式構成，因此對於基板不會因為運送而g ，大的衝擊’基板之運送及冷卻能魅行進行，而且，冷卻機構， 係沿著運送通道從運龄向上游顺依祕由麟冷卻部及主冷 部部所構成，加織之基缺前铜備冷卻部冷卻實絲板之^ 步散熱後，使此基板於前述主冷卻部冷卻於既定的溫度之方式構 成，因此，加熱後之基板不會急速冷卻，且能謀求包含運送之處 理時間縮短化。因此，即使基板為大型的，仍能謀求生產量提高， 同時確實地防止基板之應變及損壞。 ° 【實施方式】 1325168 [實施發明之最佳形態] 以工，參照附圖對本發明之實施形態具體説明。圖丨顯示本 $明二實施形態之裝載有基板冷卻裝置、對FPD用玻璃基板(以下 單獨記載為「基板」）形成抗钱劑膜及進行曝光處理後抗钱劑膜之 顯影處理的抗蝕劑塗布顯影處理系統概略平面圖。 、 抗蝕劑塗布顯影處理系統100，具備：匣盒站卜 ϊίί ϊί板G之®盒C ;處理站2，對基板G施以包含抗敍劑 =及顯衫之-連串處理；及界面站4，於與對基板〇施以曝光 處理之曝紐置9之間進行基板G遞送；g盒站〗及界面站4 , ^^長邊為向’於平面上與x方向垂直之方向為 及運ΪίΪΐ!’具^^置台12’可將£盒〇於¥方向並列載置； 處理站2之間進行基板G之搬出〜在載置 Π外部之間進龍盒⑶㈣。設於運縣置n之 方向延伸之引導件1G移動，同時能夠上下動 义後動及水平旋轉，在匣盒c與處理站2之間進行基板g之搬出 =站2 ’在H盒站1與界面站4之間具有於X方向延伸之 2:3ί板G的運送線A、B。運送線A，係藉由滾子i送 It ▼運送等所謂平流運送將基板⑴找盒站1側起朝向界面 式構成，運送㈣，係藉由滾子運送2=運 方式構運达將基板G從界面站4側朝向s盒站1側運送之 於運送線A上’從匣盒站丨側朝向界面站4側，依 照料元(，2卜擦歸洗單元 序元 S ' ΐ?Γ(Α〇)24 ' ^^-(C〇L)25 ^ =9 _料_)27 '力爾科 1325168 準分子UV照射單元(e一uv)21實施將基板G包含之有機物 除去^處理，擦磨清洗單元(SCR)22實施基板G之擦磨清洗處理 及乾燥^理^預熱單元(PH)23實施基板G之加熱處理，黏附單元 (AD)24實施基板G之疏水化處理，於後詳述的冷卻單元(c〇L)25 將基板G冷卻。抗蝕劑塗布單元(CT)26對基板〇上供給抗蝕劑液 =形成抗蝕劑膜，減壓乾燥單元(DP)27，於減壓下將基板G上之 姓劑膜包含的揮發成分蒸發，而使抗姓劑膜乾燥。加熱處理單 π(ΗΤ)28 ’實施基板〇之加熱處理，如麟频冷卻單元 (COL)29，與冷卻單元(COL)25同樣地將基板〇冷卻。 疋運达線B上，從界面站4侧朝向匣盒站1側，依序地排列顯 影單元(DEV)30、加熱處理單元(HT)3卜冷卻單元(又， 冷卻單球OL)32與£盒站！之間，設有檢查裝置((學)，對二 以包含抗巧劑塗布及顯影之一連串處理之基板G進行檢查。 顯影單元(DEV)3G，依序進行縣板G上之顯影液塗布、基 板G之沖洗處理、基板G之乾燥處理。加熱處料 】，盘 力二熱處理單元(HT)28囉地騎紐G之加熱歧 狀 冷卻单元(咖)32’與冷卻單元(C()L)25、29同義板〇冷卻。 罟右：旋轉台雖S)44 ’為基板〇之遞送部，配 盒；及運送臂43，接取在運送線A運 =基板G而運制娜台座(RS)44。運送臂μ，關上 刖後動及水平旋轉，也可接近：與運找43雜設置 9、與運送臂+43及顯影單元(DEV)3〇鄰接設置之具置 置(EE)及印子曝光機(TITLER)的外部褒置區塊9〇。 衣 抗钕劑塗布顯影處縣置⑽，仙與 連接而受控制之方式構成。處理控制請，連^理^ 者，1G2，由製程管理者為了 f理抗侧塗布顯影:裝置= 之各部或各早70而進行指令輸人操作等之鍵盤，或將、 7L之運作狀況可見化表示之顯示料所構成；及記部° | ^ 用以在處雜繼1G1之控制下實_滅魅布理ίί 10 100inff理的控制財紐錄有處辦件資辦3 δ t 並且，視需要以來自於使用春了 ♦王1木仟貝枓荨之配方。 呼叫任意配方，益以處理控制哭者。02之指示等從記憶部1〇3 器101之控制下，在抗蝕劑塗布 執仃，錯此，能於處理控制 又’控制程式或處理條件資料等、配H裝置100進行所望處理。 之記憶媒體，例如CD_R〇M、t 存放於電腦可讀取 利用，或從其他農置，通 更^田f碟、快閃記憶體等之狀態 利用。 U通過例如專用線路隨需要傳送以線上方式 置於Ξίΐΐϊίίϊ，塗布顯影處理裝置⑽中，首先，載 運送線A 之奴線Α之上咖端部，再於 G所含有機物運ί除:射二!，實施將基板 機=f理結束板g，於運魏 tl(SCR)22施以擦磨清洗處理及乾燥處理。 Ά月洗早 美板Ϊί fSCR)22之擦磨清洗處理及乾燥處理結束的 a； · ΪΤί,ίΙ。基板G之冷卻’鋪由後魏子運賴構5，一 面在運达線A上運送一面進行。 /經過於冷巧單元(COL)25冷卻之基板G，在運送線a上運送， 於抗钱劑塗布單元(CT)26形成抗鞋劑膜。於抗钱劑塗布單元 (CT)26之抗蝕劑膜形成，係藉由一面將基板〇在運送線a上運 送’一面對基板G上供給抗蝕劑液來進行。 .’£過於抗钱劑塗布單元(CT)26形成抗银劑膜之基板〇，在運 送線A上運送，於減壓乾燥單元(〇1>)27藉由暴露於減壓周遭氣 體，施以抗#劑膜之乾燥處理。 G5過於減壓乾燥單元(DP)27施以抗蝕劑膜之乾燥處理的基板 ^運送線A上運送，於加熱處理單元(HT)28施以加熱處理， 妗^蝕劑膜包含之溶劑除去。於加熱處理單元(HT)28之加熱處理 的基板G ’在運送線A上運送’於冷卻單元(c〇L)29被冷卻。 j板G之冷卻，係藉由後述滾子運送機構5一面於運送線A上 迗一面進行。 經過於冷卻單元(c〇L)29冷卻之基板G，於運送線A上運送 游側端部後，藉由界面站4之運送臂43運送到旋轉台座 夕η其次，基板G，藉由運送臂43運送到外部裝置區塊90 曝光裝置於周邊曝光裝置㈣施以用以將抗姓劑膜之 周不需要部分)除去之曝光處理。接著，基板G，藉由運送臂 運yj曝光褒置9，對抗钱劑膜施以既定的圖案之曝光處理。 合！，暫時收容於旋轉台座(RS)44上之緩衝昆盒後，有時 5丨^曝光裝置9。曝光處理結束之基板G，藉由運送臂43運 二資之:字曝光機(TITLER) ’以印字曝光機 印字曝，機(TITLER)記錄了既定資訊之基板G，於運送線 夺卢以於顯影單元(DEV)30之顯影液塗布處理、沖 乾德理。顯影液之塗布處理、沖洗處理及乾燥處理， 上運送，-面將顯影液盛液在基 _洗掉，之後， 氣體之步驟。 面運运，一面進行對基板G吹送乾燥 理結3洗i理及乾燥處 以加熱處理’將抗兹劑膜包含之溶二及水理包 元(DEV)3〇與加熱處理單元(1^)3 = ，在頌影單 脱色處师請邮 12 1325168 理結^的絲G ’於運麟B上魏，於冷卻單元⑼卿被冷 基板G之冷卻，係藉碰述滾子運送機構5 —面在運送線b 上連送_ 一面進行。 經過於冷卻單元(C〇L)32冷卻之基板G，於運送線B上 於檢查單元_5進行檢查。通過檢查之基板G，藉由設於^盒站 送裝置11的運送臂lla ’收容於錢於載置台12的既ί的 lx. ° 其次’對於冷卻單元(C〇L)25詳加說明。又，冷卻單 (COL)29、32亦與冷卻單元(COL)25具有完全相同構造。 =為冷轉元(〇)L)25(絲冷卻裝置)之平面方向剖面圖， 圖3為其侧面方向之剖面圖。 冷卻單it(COL)25 ’具備：滾子運送機構5，將基板〇於又 ί 侧?V肅子運送機構5及藉缝子運送機 容之方式設置；及冷卻機構7，將 成體6内猎由滾子運送機構5而滾子運送之基板G Α卻。 滾子運送機構5,於X方向隔著間隔具有多數广具 向延伸之旋轉軸的滾子構件50a(後述預備冷卻 卩室65b内之滾子搆件)。各滾子構= 動圖示，馬達等驅動源直接或間接地連接，藉由驅 ，源之絲峻轉H基板(3在滾子齡 =-侧運❸又，各滾子構件50a、鄕，以絲基 槿i H之方式’碱於γ方向延伸之大糊柱狀。滾子運送機 ，5 ’，、運域道或運送面構成運送線A之_部分。又，於 早兀(COL)29，與冷卻單元(COL)25同樣地，滾子 5 ^ 送通道或魏運躲“―部分，於冷卻^運 滚子運送機構5之運送通道或運送㈣成運送線β之 殼體6，形概收絲板G之_練，沿轉 a配 目ί的各側壁部，具有運送線A上之基板G可通過之於 Y方向延伸的狹縫狀搬入口 61及搬出口 62。滾子運送機構5之各 13 1325168 滾子構件50a、50b，其旋轉軸59以設於在殼體6之γ方向相對 的側壁部的軸承60可旋轉地支持，並配置於殼體6内。於於體6 内之X方向中間部，設有分隔壁64，具有於運送線Α運送 G可通過之通過口 63，藉此，殼體6内.，夾著分隔壁私而八= X方向上游側之預備冷卻室65a及X方向下游側之主冷 冷卻機構7，具備：空氣供給源73a，設於殼體6 =卜°， 對 預備冷卻室65a内供給冷卻流體，例如常溫空氣；嘴嘴，#於 預備冷卻室65a之壁部，與空氣供給源73a連接，將來於 供給源73a之空氣導入預備冷卻室65a内；調溫空氣供衿 設於殼體6外，對主冷卻室65b内供給冷卻流體，例’ 定的溫度之空氣；及噴嘴7lb及供給環71c，設於主冷 壁部，與調溫空氣供給源73b連接，將來自於調溫空氣供终 之空氣導入於主冷卻室65b内。預備冷卻室65a、噴嘴7及而 供給源73a構成預備冷卻部7a，主冷卻室65b、噴嘴7ib、供二二 7lc及調溫空氣供給源73b構成主冷卻部7b。 ^展 、主冷卻室65b内靠近滾子運送機構5之基板G之運 溫度偵測部)105，來自於調溫空氣供給源β 之:。視要求的基板0溫度’藉由接受來自於溫度 (控制部卿控歡方峨。又，㈣，來自; ==制來自於空氣—之空氣的流 Y方二’各在預備冷卻室65a及主冷卻室65b内以於 i方向延伸之方式’設於與賴冷卻165&及 方向相對的側壁部。又，噴嘴71a、71b，各設於 面η ’在x方向排列多^個。藉由 、* 运之基板〇背面側或下側所設置的噴嘴71a、 ，各設於滾子構件5〇彼此之間，藉此能謀求殼體6的之薄型化。 14 1325168 侧的喷ί 71a = 所；表面側及背面 嘴料a、7lb部分之側面方^；^4 基板冷卻裝置之噴 J，，冷卻流體之方式 上游側傾斜之方式，更佳為以3〇 f 3向 :：2a7U；2r：5r〇；r 口 72a 72b與基板G之主面交又之 巧，厂向上_供給。藉此，從供給源7 ί =以良好效率與基板G接觸，同時，能使每單位量 之接觸時間縮短，因此，能防止空氣由於與基觸 而^過’能使基板G有效果地冷卻。又，供接 u^r ;r sinrrΜ ^9 向隔著間隔;成;;二 ^ ,, Pa 71 „1U _ 、X方向相郴的0^嘴71a彼此間、71b iim _ ^方向不同位置地形成。藉此， ^由滚子運域構5所運送的基板G，能跨越大致全面均等曰地冷 主冷上开1成邮為例如具有多數空氣供給孔之網目狀，設於 P 之上土 口卩。又，供給環71c，以將從調严处每根仏、s ί 置之滾子構件5Gb物_，在^ 旋轉接頭舆具二方二=管 將調整為蚊的溫度之崎a内__，够=== 15 1325168 :工以:^二二二通各冷卻至既定的溫度’於 又，於x方6冷部之冷卻機構7的一部分功能。 相反的(夫之構件5%彼此間’冷卻水之流通方向為 ：；^；^ 55Γ™λ ===件50b内循環‘浦 '用以調整二 ’。細視喊疑基板G溫度，轉元翻器⑽ r室—内之滾子構件50a，至少外周面各由樹 月曰4低…傳v性材料形成，不對於基板G造成熱 。 *門及f壁部，具有二重壁構造’“彼此隔著 工間:又置之内壁66料壁67。於内壁66，於γ方向延伸 網目狀排氣口 68a ’於X方向隔著間隔設置多數個，同時'於^卜 壁67设有排氣口 68b，在内壁66與外壁67之間的空間，設 =排氣π 68a及排氣口 68b予以連通之排氣路撕。排氣口 _、 排軋口 68b及排氣路68c，構成用以將殼體6内排氣 於僅以設於底壁部之排氣部即能得取分排氣效 部I以『設置職部’於上壁部設置職部情形，為了提高排 效果，較佳為連接著換氣扇等排氣源68d。 ’、 其次，對於如上所述構成之冷卻單元(c〇L)25進 冷卻處理加以説明。圖6係·在基板冷卻裝置之基 f 於冷卻單元(COL)25，由黏附單元(AD)24(於加埶處 (=)28,3卜各為冷卻單元(COL)29,32)側之運送機構所運送的加埶 過搬人口 61，則遞送到滾子運送機構5，藉由此、 ΐί運構 送’一面於殼體6内藉由冷卻機構7冷卻。 因此’基板之運送及冷卻係並行進行，麟求處理時間縮短化丨。 此時，基板G，首先在預備冷卻室65a藉由來自於噴嘴7ia 16 1325168 之常溫空氣供給，冷卻至常溫左右’進行初步散熱(參照圖 基板G之後通過通過口 63，於主冷卻室65b與由單元控 控制流量及溫度、來自於喷嘴71b及供給環71C的空氣^滾^ 件50b接觸，藉以冷卻至既定的溫度(參照圖6(b》。因此，二 基板G產生應變，同時進行精密的冷卻。又，基板G，= 喷嘴71a、71b、供給環71c及滾子構件50b從兩面側予以 故還能防止躺發生。 、、藉由滾子運送機構5運送之基板G—通過搬出〇 62 达到抗蝕劑塗布單元(CT)26(於冷卻單元(c〇L)29,32，各為界面站 4、心查單元(IP)35)側之運送機構，藉由此運送機構於運送^線a 上運送。因此，冷卻時及冷卻前後之基板〇運送，利用 運送機構5等之所謂平流式，為安全的。 /、」用展于 其次’對於預備冷卻部7a及主冷卻部7b之變更例加以説明。 圖7顯示設於基板冷卻裝置之預備冷卻部7a及主冷卻 的 更例。 預備冷卻部7a，如圖7(a)所示，亦可將空氣供給源73a及喷 ，71a取代為設於預備冷卻室65a之上壁部、具有風扇、及過滤 器75b之風扇過遽單元75。風扇過渡單元75，藉由風扇75&旋轉二 將殼體6外之例如常溫空氣引人並以過濾器75b淨化，並朝向以 滚子運送機構5運送之基板g表面供給。風扇過淚單元75通當為 薄型，且不需要外部的空氣供給源73a，因此能謀^殼體6 化’同時縮小裝置全體佔地面積。風扇過濾單元75，對應於例如 基板G大小而在X方向及γ方向制多數個，以能預備冷卻室 65a跨越基板G表面全體供給空氣。 .主冷部部7b，如圖7(b)所示，可將噴嘴71b及供給環71c取 代為又置與調狐空氣供給源73b連接而設於主冷卻室65¾上壁部 之管2 76的構成。管路76，以於主冷卻冑㈣能跨越基板G表 面^供給空氣之方式’開口部7&漸次擴徑地形成。再者，於 此知形，管路76 ’較佳為以能對基板G表面全體鱗地供給空氣 17 之方式， ‘孔之擴散板76b、或過 渡器，過474T圖置以數供給： 可為ί置不限於上述實施形態，可做各種變形。例如， 可真钟^嘴&及風扇過濾單元75而構成預備冷卻室65a，也 ，嘴71b及管路76而構成主冷卻室65b。又，滾子構件 5Ua亦與滚子構件5〇b ，可為能夠冷卻之構成。 [產業上利用性] ，依照本發明，尤適於像FPD用玻璃基板之基板為大型的情 形，但是不限於玻璃基板，也可廣泛應用在半導體晶圓等其他基 板的加熱處理。 18 -l JZJioo 【圖式簡單說明】 的抗蝕劑塗布顯影處理系統概略平面圖。 ^腠之顯影處理 顯示基板冷卻裝置平面方向之剖面圖。 J 3,示基板冷卻裝置側面方向之剖面圖。 V(a) . 【元件符號之說明】 A運送線 B運送線 C匣盒 EE周邊曝光裝置 G基板 TITLER印字曝光機 Φ 1匣盒站 2處理站 4界面站 5滾子運送機構 * 6殼體 • 7冷卻機構 7a預備冷卻部 7b主冷卻部 9曝光裝置 10引導件 19 1325168 11運送裝置 11a 運送臂 12載置台 21準分子UV照射單元(e-UY) 22擦磨清洗單元(SCR) 23預熱單元(PH) 24黏附單元(AD) 25冷卻單元(COL)(基板冷卻裝置) 26抗蝕劑塗布單元(CT) 27減壓乾燥單元(DP) 28加熱處理單元(HT) 29冷卻單元(COL) 30顯影單元(DEV) 31加熱處理單元(HT) 32冷卻單元(COL) 35檢查單元(IP)(檢查裝置） 43運送臂 44旋轉台座(RS) 50a 滾子構件 50b 滾子構件 51急冷器 52配管 53泵浦 54閥 59旋轉軸 60軸承 61搬入口 62搬出口 63通過口 20 1325168 64分隔壁 65a 預備冷卻室 65b 主冷卻室 66内壁 67外壁 68a 排氣口 68b 排氣口 68c 排氣路 68d 排氣源 71a 喷嘴 71b 喷嘴 71c 供給環 72a 供給口 72b 供給口 73a 空氣供給源 73b 調溫空氣供給源 75風扇過濾單元 75a 風扇 75b 過濾·蒸 76a 開口部 76b 擴散板 90外部裝置區塊 100 抗蝕劑塗布顯影處理系統 101 處理控制器 102 使用者界面 103 記憶部 104 單元控制蒸(控制部） 105 溫度感應器(溫度偵測部） 211325168 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a substrate cold plate cooling device such as a glass substrate used for a flat panel display (FPD), a substrate cooling green, a sugar control type, and a computer readable [Previous Technology] The manufacture of etched tIPD, in order to form a circuit pattern on a glass substrate for FPD, is based on optical micro-image technology*. The figure made by the stage shadow is decorated as follows: the anti-liquid is formed on the glass substrate to form an anti-backing film, and the corresponding circuit is used to resist the (four) lining, and the rotation is developed. . , lithography technology - in general, before and after the formation of the anti-money film, or after the development of the anti-contact agent film, the glass substrate is heat treated, and the goods are *,,, and The glass substrate is cooled. When the glass substrate is cooled, cooling is used: the support portion 'holds the glass substrate carried by the transport arm, and the cold side' is provided on the lower side of the support portion to cool the substrate; and the chamber that can be lifted and lowered' The granules are supported by the substrate of the support portion (for example, referring to the patent document, 'in order to increase the throughput, the fine cover support support portion = the chamber rises and the substrate supported by the support portion is supported by the cooling plate; ^^$ Above: = know the cooling device, if the degree of distribution of the heated glass substrate becomes uneven, the glass substrate will have a large-scale appearance, and even appear - the side is more than 2 meters = but the glass The substrate becomes large, and the substrate is damaged by the impact of the transfer between the ? and the 卩. [Patent Document 1] 曰本特开平1〇_229037号 [Summary of the Invention] [The invention is to be solved The problem is that the invention is based on the fact that the purpose is to provide a substrate cooling device & plate cold section method, control program, computer readable memory media, even if the basics of the Kfiff Erguangli can still achieve production Improve, and indeed The strain on the substrate and the damage to the substrate are solved. [The solution to the problem] t solves the problem of the problem. The present invention provides a substrate cooling device that heats the sink to cool. The feature is that the substrate is heated toward the - direction. /, it transport channel, and the substrate transported by the transport channel is cooled A. The cooling mechanism is formed along the transport path from the transport direction upstream & the preliminary cooling portion and the main cooling portion, and the substrate is twisted The above ===, after the initial heat dissipation of the substrate, the substrate is provided in the above-mentioned main cooling, and the invention provides a silk plate cooling device, and the substrate of the New Zealand is provided with: the substrate is heated to be transported in the - direction a cooling mechanism for the substrate to be cooled by the transport channel; and a control mechanism for controlling the cooling mechanism by means of a substrate; the front structure is configured to be cooled from the upstream side in the transport direction, and heated. The substrate is cooled by the preliminary cooling unit and cooled to a predetermined temperature. The hunting is controlled by the position number of the control unit, and the 'control mechanism' in the present invention is controlled. The temperature of the cooling fluid of the cooling device and the diameter P mechanism of the second cooling plate of the cooling mechanism based on the temperature detecting portion provided in the vicinity of the conveying path, in which case the cooling is performed. Preferably, the mechanism supplies cooling of the front plate to the cooling zone plate, and the temperature detecting signal of the front touch-sensitive gamma-based detecting portion is controlled by the cold name, and the soil is at the temperature of 4, and the substrate is At a predetermined temperature, the rotation of the roller member in the transport path 1 and the two-day and +. directions causes the substrate roller to be transported, and the position of the roller member corresponding to the position of the late main cooling portion is at least A 雍 雍 〜 ~ +, , # ϋ 卩 侦 侦 # # # b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b b a substrate cooling device, which cools the heated substrate, and (4) a transport path; a housing provided by the substrate for transporting the substrate; and a cooling mechanism of the front portion of the thunder plate; the cooling Institution After cooling the pre-cooling section and the main portion of the nuisance disposed to the upstream side secret sequence 'tii portion of the pre-cooling the substrate and the cooling phase in step of cooling the substrate, the substrate is cooled to a predetermined temperature to said helmet main cooling portion. /, Hff Ming provides - silk plate cooling device, the woven substrate is cooled lp will be transported in the direction of the substrate after heating; the channel is transported in the way of housing; and before cooling a cooling mechanism; and a control unit for causing the substrate to have a predetermined temperature; a cooling mechanism, wherein the cooling mechanism is arranged in a pre-cooling direction along the upstream side of the forward direction, and the main cooling unit is The pre-cooling of the substrate is performed by the preliminary cooling unit: 'ί, the substrate is cooled to the temperature of the substrate by the control of the control unit. Preferably, the control unit is configured to control a substrate based on a temperature side signal of a temperature detecting unit provided in the housing of the main cooling unit, and to determine a cooling region of the cooling unit before the mechanism temperature. In this case, the 'inside the housing' is disposed between the cooling unit and the cooling unit. The wall is provided with a passage through which the substrate conveyed by the conveying path can pass, and the cooling mechanism is difficult to The cooling unit supplies the cooling fluid to the substrate, and based on the temperature (4) of the temperature measuring unit, it is preferably a surface-prepared cold material, and the plate is supplied to cool the substrate. Further, in this case, the wind body of the main body of the j main body has a wall provided on the front body, and the parent is preferably the preliminary cooling unit. And the surrounding gas outside the casing and the substrate are supplied with the ξ ξ: for a substrate cooling method, the heated substrate is transported, and the substrate is heated along the side: the third is: the heated substrate is The pre-cooling of the enthalpy to the temperature of the ^ 使 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑 电脑The invention provides a memory medium that can be read by the brain, and is characterized by the fact that the control program allows the computer to control the processing device to apply the substrate cooling method at the time of binding. [Effects of the Invention] According to the present invention, since the transport path is configured to be cooled by the transport mechanism in the direction of the transport path, the substrate is not transported by the g, and the large impact 'substrate transport and cooling energy The fascination is carried out, and the cooling mechanism is formed by the lining cooling section and the main cold section according to the transportation passage from the transportation age to the upstream, and the woven base is short before the copper cooling part cools the solid silk plate. After the heat is radiated, the substrate is configured such that the main cooling unit is cooled to a predetermined temperature. Therefore, the substrate after heating is not rapidly cooled, and the processing time including transportation can be shortened. Therefore, even if the substrate is large, the throughput can be improved, and the strain and damage of the substrate can be surely prevented. [Embodiment] 1325168 [Best Mode for Carrying Out the Invention] The embodiments of the present invention will be specifically described with reference to the drawings. In the embodiment of the present invention, the substrate-cooling device is mounted, and the resist film is formed on the glass substrate for FPD (hereinafter referred to as "substrate" alone), and the resist film is developed after exposure treatment. A schematic plan view of the agent coating development processing system. The resist coating and developing treatment system 100 is provided with: a box C of a box G; a processing station 2, and a series of processing including a resisting agent = and a shirt; and an interface At the station 4, the substrate G is delivered between the exposure button 9 and the exposure substrate 9; the g box station and the interface station 4, ^^ the long side is the direction perpendicular to the x direction on the plane And Ϊ Ϊ Ϊΐ ' ' ' ' ^ ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ^ ^ ^ ^ ^ ^ ^ ' ' ' ' ' ' ' ' ' ^ ^ ' ' ' The guide 1G, which is extended in the direction of Yunxian, is moved, and can be moved up and down and horizontally rotated, and the substrate g is carried out between the cassette c and the processing station 2 = station 2 ' at the H box station 1 There is a transport line A, B between the interface station 4 and a 2:3 板 plate G extending in the X direction. The transport line A is configured by means of a so-called advection transport such as a roller to send It ▼ to transport the substrate (1) to the box station 1 side, and to transport (4) by means of roller transport 2 = transport. G is transported from the interface station 4 side toward the s box station 1 side on the transport line A. 'From the side of the cassette station side toward the interface station 4 side, according to the element (2) wipe back to the wash unit sequence S ' ΐ? (Α〇)24 ' ^^-(C〇L)25 ^ =9 _ material_)27 'Lilco 1325168 excimer UV irradiation unit (e-uv) 21 is carried out to remove the organic matter contained in the substrate G, The scrubbing cleaning unit (SCR) 22 performs the rubbing cleaning process of the substrate G and the drying process, and the preheating unit (PH) 23 performs the heat treatment of the substrate G, and the adhesion unit (AD) 24 performs the hydrophobization treatment of the substrate G. The cooling unit (c〇L) 25, which will be described later, cools the substrate G. A resist coating unit (CT) 26 supplies a resist liquid to the substrate crucible = a resist film is formed, and a decompression drying unit (DP) 27 is used to decompose the volatile component contained in the surname film on the substrate G under reduced pressure. Evaporate and dry the anti-surname film. The substrate 〇 is heated by a heat treatment of π(ΗΤ)28', and the substrate 〇 is cooled by a nucleus cooling unit (COL) 29 in the same manner as the cooling unit (COL) 25. On the transport line B, from the interface station 4 side toward the cassette station 1 side, the developing unit (DEV) 30, the heat treatment unit (HT) 3, the cooling unit (again, the cooling single ball OL) 32 are sequentially arranged. £ box station! Between the two, an inspection device ((School)) is used to inspect the substrate G including a series of treatments including application and development of the anti-agent. The developing unit (DEV) 3G sequentially applies the developer on the plate G, The rinsing process of the substrate G, the drying process of the substrate G. The heating material], the disk force two heat treatment unit (HT) 28 骑 骑 骑 之 heating 歧 cooling cooling unit (coffee) 32' and the cooling unit (C () L 25, 29 synonym plate 〇 cooling. 罟Right: Rotary table S) 44 ' is the delivery part of the substrate 配, the box; and the transport arm 43, pick up in the transport line A transport = the base G and transport the pedestal ( RS) 44. The transport arm μ, close the 刖 and then the horizontal rotation, can also be approached: with the installation of the miscellaneous settings 9, with the transport arm +43 and the development unit (DEV) 3 〇 set with the placement (EE) and the printer exposure machine ( The external device block of TITLER) is 9〇. The anti-caries agent is applied to the county (10), and the stalk is connected to and controlled. For the processing control, please contact the controller, 1G2, for the process manager to perform the anti-side coating development: the device = each part or each of the 70 early command input operation, etc., or the operation status of 7L can be seen The display material is composed of the display; and the recording unit ° | ^ is used in the control of the 1G1 under the control of the 1G1 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ According to the need, it comes from the use of spring ♦ Wang 1 wood 仟 枓荨 枓荨 recipe. Call any formula to benefit the control of the cryer. The instruction of 02 or the like is performed under the control of the memory unit 101, and the resist application is performed. In this case, the H device 100 can perform the desired processing in the process control and control program or processing condition data. The memory media, such as CD_R〇M, t, can be stored in a computer for reading and use, or from other agricultural settings, through the use of the field, the disk, flash memory, etc. U is placed in the coating and developing device (10) by, for example, a dedicated line as needed to be transported in an on-line manner. First, the slave end of the transport line A is placed on the top end of the coffee line, and then the machine contained in the G is removed. !, the substrate machine = the end plate g is applied, and the wiping cleaning process and the drying process are applied to the Yun T1 (SCR) 22. Άί, Ι 美 美 洗 f f f f f f f fSCR) 22 rubbing cleaning treatment and drying treatment ended a; · ΪΤί, Ι Ι. The cooling of the substrate G is carried out by the post-Wei Ziyun Lai 5, one side of which is transported on the delivery line A. The substrate G cooled by the cold unit (COL) 25 is transported on the transport line a to form an anti-shoe film on the anti-drug coating unit (CT) 26. The resist film formed on the anti-money coating unit (CT) 26 is formed by transporting the substrate onto the transport line a while supplying the resist liquid on the substrate G. 'The over-anti-drug coating unit (CT) 26 forms a substrate 抗 of the anti-silver film, which is transported on the transport line A, and is exposed to a decompressed ambient gas by a vacuum drying unit (〇1>) Dry treatment with anti-# film. G5 is carried out on the substrate transport line A which is subjected to the drying process of the resist film by the decompression drying unit (DP) 27, and is subjected to heat treatment in the heat treatment unit (HT) 28, and the solvent is contained in the film of the etching agent. . The heat-treated substrate G' of the heat treatment unit (HT) 28 is transported on the transport line A to be cooled by the cooling unit (c〇L) 29. The cooling of the j-plate G is performed on the transport line A by the roller transport mechanism 5 which will be described later. After passing through the substrate G cooled by the cooling unit (c〇L) 29, the traveling side end portion is transported on the transport line A, and then transported to the rotating pedestal by the transport arm 43 of the interface station 4, and the substrate G is transported. The arm 43 is transported to the external device block 90. The exposure device is subjected to an exposure process in which the peripheral exposure device (4) is applied to remove unnecessary portions of the anti-surname film. Next, the substrate G is transported by the transport arm 9 to expose the film to a predetermined pattern. Hey! After temporarily accommodating the buffer box on the rotating pedestal (RS) 44, the exposure device 9 is sometimes turned on. The substrate G after the exposure processing is transported by the transport arm 43: the word exposure machine (TITLER) is printed by the printing exposure machine, and the machine (TITLER) records the substrate G of the predetermined information. The developing solution coating process of the developing unit (DEV) 30 is performed. The coating treatment, the rinsing treatment, and the drying treatment of the developer are carried out, and the steps of transporting the developer liquid on the substrate are carried out, followed by the gas. In the case of surface transportation, the substrate G is blown and dried, and the surface is dried and heated to treat the solution 2 and the water treatment element (DEV) 3〇 and the heat treatment unit (1^). 3 = , in the shadow of the single color off the division, please mail 12 1325168 to tie the wire of the wire G ' Yu Yunlin B Wei, in the cooling unit (9) Qing by the cold substrate G cooling, by means of the roller conveyor mechanism 5 - The surface is sent on the transport line b. The substrate G cooled by the cooling unit (C〇L) 32 is inspected on the transport line B by the inspection unit_5. The substrate G to be inspected is stored in the transport unit 11a' of the cassette transporting device 11 at a temperature lx. ° of the mounting table 12. Next, the cooling unit (C〇L) 25 will be described in detail. Further, the cooling sheets (COL) 29, 32 have the same configuration as the cooling unit (COL) 25. = is a cross-sectional view in the plane direction of the cold transfer element (〇) L) 25 (wire cooling device), and Fig. 3 is a cross-sectional view in the side direction. The cooling unit it (COL) 25' is provided with: a roller transport mechanism 5, which is disposed on the side of the substrate, the V-sub-transport mechanism 5, and the submerged transporter; and the cooling mechanism 7, which is an integrated body 6 The substrate G that is transported by the roller transport mechanism 5 and the roller is hunted. The roller transport mechanism 5 has a roller member 50a (a roller member in the preliminary cooling chamber 65b which will be described later) having a plurality of rotating shafts extending in the X direction at intervals. Each roller structure is shown in the figure, and the driving source such as a motor is directly or indirectly connected. By driving, the source wire is swung to the H substrate (3 in the roller age = - side transport, and each roller member 50a, 鄕In the form of silk-based 槿i H, the base is elongated in the γ direction. The roller conveyor, 5', the transport path or the transport surface constitutes the part of the transport line A. COL) 29, in the same manner as the cooling unit (COL) 25, the roller 5 ^ is sent to the channel or Wei Yun hides the "part", the cooling passage of the roller transport mechanism 5 or the transport (four) into the housing of the transport line β 6, the shape of the wire receiving plate G, the side wall portion of the transfer line A, the substrate G on the transport line A can pass through the slit-like carry-in port 61 and the carry-out port 62 extending in the Y direction. Each of the 13 1325168 roller members 50a and 50b of the roller transport mechanism 5 has its rotating shaft 59 rotatably supported by a bearing 60 provided on a side wall portion facing the γ direction of the casing 6, and is disposed in the casing 6. In the middle portion of the body 6 in the X direction, a partition wall 64 is provided, which has a passage 63 through which the transport line G can pass, whereby the casing 6 is sandwiched by the partition wall. The preliminary cooling chamber 65a on the upstream side of the eight-X direction and the main cold-cooling mechanism 7 on the downstream side in the X direction are provided with an air supply source 73a, which is provided in the casing 6 and supplies cooling fluid to the preliminary cooling chamber 65a. For example, the normal temperature air; the nozzle, # is in the wall portion of the preliminary cooling chamber 65a, and is connected to the air supply source 73a, and the air from the supply source 73a is introduced into the preliminary cooling chamber 65a; the temperature-regulated air supply is provided outside the casing 6, The cooling fluid is supplied into the main cooling chamber 65b, for example, the air of a predetermined temperature; and the nozzles 7lb and the supply ring 71c are provided in the main cold wall portion, and are connected to the temperature-regulating air supply source 73b, and are supplied from the temperature-regulating air. The air is introduced into the main cooling chamber 65b. The preliminary cooling chamber 65a, the nozzle 7 and the supply source 73a constitute a preliminary cooling unit 7a, and the main cooling chamber 65b, the nozzle 7ib, the supply 22c, and the tempered air supply source 73b constitute main cooling. The portion 7b, the temperature detecting portion 105 of the substrate G in the main cooling chamber 65b adjacent to the roller transport mechanism 5, is derived from the temperature-adjusting air supply source β: by the required substrate 0 temperature 'by accepting From the temperature (the control department Qing Huan Fang. (4) From; == The flow of air from the air - Y 2' each in the preliminary cooling chamber 65a and the main cooling chamber 65b extending in the i direction is set to be opposite to the cooling 165 & Further, the nozzles 71a and 71b are respectively disposed on the surface η' in the x direction. The nozzles 71a provided on the back side or the lower side of the substrate 设 are provided in the roller members. 5 〇 between each other, thereby making it possible to reduce the thickness of the casing 6. 14 1325168 side of the spray ί 71a =; surface side and back mouth a, 7lb part of the side of the ^ ^ 4 spray cooling of the substrate J, the way of cooling the fluid on the upstream side is preferably 3 〇f 3 :: 2a7U; 2r: 5r 〇; r port 72a 72b and the main surface of the substrate G are handy, the factory is _ supply . Thereby, the contact with the substrate G is supplied from the supply source 7 ί = with good efficiency, and at the same time, the contact time per unit amount can be shortened, thereby preventing the air from being cooled effectively by the substrate due to the contact with the base. . Further, the connection u^r;r sinrrΜ ^9 is spaced apart; into;; 2^,, Pa 71 „1U _ , the X nozzles 71a in the X direction are opposite each other, and the 71b iim _ ^ direction is differently Thus, the substrate G transported by the roller transport mechanism 5 can be opened over a substantially uniform uniform cold main cold, for example, a mesh having a plurality of air supply holes, and is disposed above P In addition, the supply ring 71c is adjusted to the temperature of the mosquitoes by the roller member 5Gb of each 仏 s s 将从 , 在 在 在 在 在 在 ^ ^ a __, enough === 15 1325168: work to: ^ 22 two cooling each cooling to a given temperature 'in another, in the x square 6 cold part of the cooling mechanism 7 part of the function. The opposite 5% of each other 'cooling water circulation direction is:; ^; ^ 55 Γ TM λ === part 50b loop 'pu' to adjust two '. Look at the substrate G temperature, turn the yuan (10) r room - The inner roller member 50a, at least the outer peripheral surface is formed of a low-velocity material, which does not cause heat to the substrate G. * The door and the f-wall portion have a double-wall structure '" :also The inner wall 66 is a material wall 67. On the inner wall 66, a mesh-shaped exhaust port 68a' extending in the γ direction is provided at a plurality of intervals in the X direction, and the exhaust wall 68b is provided on the inner wall 66. The space between the outer walls 67 is provided by the exhaust passages that are connected to the exhaust gas π 68a and the exhaust port 68b. The exhaust port _, the discharge port 68b and the exhaust path 68c are configured to align the inner casing 6 In the exhaust portion provided only in the bottom wall portion, the exhaust gas effect portion I can be used to set the position in the upper wall portion of the "installation department", and in order to improve the discharge effect, it is preferable to connect the ventilation fan or the like. Exhaust gas source 68d. ', Next, the cooling unit (c〇L) 25 configured as described above is subjected to cooling treatment. Fig. 6 is based on the base unit of the substrate cooling device, and is adhered to the cooling unit (COL) 25. The unit (AD) 24 (the twisted and transported population 61 carried by the transport mechanism on the side of the twisting (=) 28, 3 each of the cooling units (COL) 29, 32) is delivered to the roller transport mechanism 5 By means of this, the structure is cooled by the cooling mechanism 7 in the casing 6. Therefore, the transportation and cooling of the substrate are performed in parallel. At this time, the substrate G is first cooled in the preliminary cooling chamber 65a by the normal temperature air supply from the nozzles 7ia 16 1325168, and is cooled to a normal temperature or so to perform preliminary heat dissipation (refer to the substrate G and then through the passage 63). The main cooling chamber 65b is in contact with the air flow control member 50b from the nozzle 71b and the supply ring 71C by the unit control flow rate and temperature, thereby cooling to a predetermined temperature (refer to Fig. 6(b). Therefore, the two substrates G are generated. Strain while performing precise cooling. Further, the substrate G, the nozzles 71a and 71b, the supply ring 71c, and the roller member 50b can prevent the occurrence of lying on both sides. The substrate G transported by the roller transport mechanism 5 reaches the resist coating unit (CT) 26 by the carry-out 〇 62 (in the cooling unit (c〇L) 29, 32, each of which is the interface station 4, the heart check unit (IP) 35) The transport mechanism on the side is transported by the transport mechanism on the transport line a. Therefore, the substrate transport at the time of cooling and before and after cooling is safe by the so-called advection type of the transport mechanism 5 or the like. The description of the modification of the preliminary cooling unit 7a and the main cooling unit 7b will be described. Fig. 7 shows a further example of the preliminary cooling unit 7a and the main cooling provided in the substrate cooling device. As shown in Fig. 7(a), the preliminary cooling unit 7a may be replaced by a fan supply unit 73a and a spray 71a instead of a fan passing unit provided in the upper wall portion of the preliminary cooling chamber 65a and having a fan and a filter 75b. 75. The fan transition unit 75 introduces, for example, room temperature air outside the casing 6 by the fan 75 & rotation 2 and purifies it with the filter 75b, and supplies it to the surface of the substrate g transported by the roller transport mechanism 5. Since the fan tearing unit 75 is thin and does not require an external air supply source 73a, it is possible to reduce the overall footprint of the apparatus. The fan filter unit 75 is provided in a plurality of X directions and γ directions in accordance with, for example, the size of the substrate G, so that the preliminary cooling chamber 65a can supply air across the entire surface of the substrate G. As shown in Fig. 7(b), the main cold portion 7b can replace the nozzle 71b and the supply ring 71c with the tube 2 76 which is connected to the damper air supply source 73b and is provided on the upper wall portion of the main cooling chamber 653a. Composition. The line 76 is formed such that the main cooling crucible (4) can supply air to the surface of the substrate G, and the opening portion 7 & is gradually expanded. Further, in this case, the pipe 76' is preferably provided so that the air 17 can be supplied to the entire surface of the substrate G, and the diffuser plate 76b or the transition device of the hole is provided in a number of 474T. The present invention is not limited to the above embodiment, and various modifications can be made. For example, the pre-cooling chamber 65a and the nozzle 71b and the duct 76 may constitute the main cooling chamber 65b. Further, the roller member 5Ua and the roller member 5〇b may be configured to be coolable. [Industrial Applicability] According to the present invention, a substrate such as a glass substrate for FPD is particularly large. However, the substrate is not limited to a glass substrate, and can be widely applied to heat treatment of other substrates such as semiconductor wafers. 18 -l JZJioo [Simplified illustration of the drawings] A schematic plan view of a resist coating development processing system. ^Development processing A cross-sectional view showing the planar direction of the substrate cooling device. J 3 is a cross-sectional view showing the side direction of the substrate cooling device. V(a) . [Description of component symbols] A transport line B transport line C cassette EE peripheral exposure device G substrate TITLER print exposure machine Φ 1 cassette station 2 processing station 4 interface station 5 roller transport mechanism * 6 housing • 7 cooling mechanism 7a preparatory cooling unit 7b main cooling unit 9 exposure device 10 guide 19 1325168 11 transport device 11a transport arm 12 mounting table 21 excimer UV irradiation unit (e-UY) 22 scrub cleaning unit (SCR) 23 pre Thermal unit (PH) 24 Adhesion unit (AD) 25 Cooling unit (COL) (substrate cooling unit) 26 Resin coating unit (CT) 27 Vacuum drying unit (DP) 28 Heat treatment unit (HT) 29 Cooling unit ( COL) 30 developing unit (DEV) 31 heat treatment unit (HT) 32 cooling unit (COL) 35 inspection unit (IP) (inspection device) 43 transport arm 44 rotating pedestal (RS) 50a roller member 50b roller member 51 quenching 52 pipe 53 pump 54 valve 59 rotating shaft 60 bearing 61 carrying inlet 62 carrying port 63 passing port 20 1325168 64 partition wall 65a preliminary cooling chamber 65b main cooling chamber 66 inner wall 67 outer wall 68a exhaust port 68b exhaust port 68c exhaust Road 68d exhaust source 71a nozzle 71b nozzle 71c supply ring 72a supply port 72b supply port 73a air supply source 73b tempering air supply source 75 fan filter unit 75a fan 75b filtration/steaming 76a opening portion 76b diffusing plate 90 external device block 100 resist coating development processing system 101 processing controller 102 user interface 103 Memory unit 104 Unit control steaming (control unit) 105 Temperature sensor (temperature detecting unit) 21