九、發明說明： 【發明所屬之技術領域】 發明係關於-種具環氧樹脂層披覆的基材 /，特別是指具環氧樹脂層的基材置於化學溶液琿产 由於環氧樹脂層殘留會影響後續回收製程，且脫=中’ 附著的環氧樹脂層材料是分離技術關鍵所在，利用上 液酸、鹼、鹽和有機溶劑脫附環氧樹脂 化予溶 步分Ψ %氧樹脂，不需要長時間加熱基板以去除環氧樹脂， 水對基材性質影響小，故可減少基板的材質劣化如:上 可大幅增加分離效率，且有助於回收高品質基板材料2方 法者。本發明可以完整徹底且快速的去除，有利於量產， 具有快速、簡單和低成本的優點。 【先前技術】 目前材料披覆薄膜的目的可在於材料表面提供抗紫外 線處理、耐磨硬化處理、防起霧處理、抗反射（防眩）處 理、抗靜電處理等’藉以增加功能美觀，且補償材料的缺 點’賦予特殊的性質’提高製品之耐熱性，耐候性，抗幅 ㈣♦日已有大量塑膠披覆薄膜產品^ 用在電子、汽車、家庭用品等工業上。 例如紫外光固化材料可用於木材、金屬、塑料、紙張 、鍍膜、無機材料的塗料，在信息技術的應用包括光纖塗 料、光纖著色和光介料，環氧樹脂為紫外光固化材料之 一種。 現行的覆膜塑膠都具備,成任何一種塑谬的主體之基 1324621 L_ 補玉 材和金屬溥犋層；該基材為結構支撐用材料’例如由聚碳 酸酉曰樹知，或丙烯酸樹酯、或聚烯系樹酯，或環氧樹脂等 形成，針對上述環氧樹脂產品的回收問題，可見國内之相 關的論文資料；例如熔鹽法處理廢印刷電路板技術開發一 固相生成物之研究分析（黃國哲，屏東科技大學環境工程 與科學系85年碩士學位論文，89年碩士論文）和觸媒對印 刷電路板在裂解過程中催化作用之研究（方宏達，中山大IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a substrate coated with an epoxy resin layer, in particular, a substrate having an epoxy resin layer is placed in a chemical solution, which is produced by an epoxy resin. Residues of the layer will affect the subsequent recycling process, and the epoxy resin layer material that is attached to the middle is the key to the separation technology. The epoxy resin is desorbed by the upper liquid acid, alkali, salt and organic solvent to dissolve the enthalpy. Resin, it is not necessary to heat the substrate for a long time to remove the epoxy resin, and the influence of water on the properties of the substrate is small, so that the deterioration of the material of the substrate can be reduced, such as: the method of greatly increasing the separation efficiency and helping to recover the high-quality substrate material 2 . The invention can be completely and completely removed, is advantageous for mass production, and has the advantages of quickness, simplicity and low cost. [Prior Art] At present, the purpose of the material coating film may be to provide anti-ultraviolet treatment, wear-resistant hardening treatment, anti-fogging treatment, anti-reflection (anti-glare treatment), antistatic treatment, etc. on the surface of the material to enhance the appearance and compensation. The shortcomings of the material 'giving special properties' improve the heat resistance, weather resistance and resistance of the product (4) ♦ There are a large number of plastic coated film products on the day ^ used in electronics, automotive, household goods and other industries. For example, UV-curable materials can be used in wood, metal, plastic, paper, coating, and inorganic materials. Applications in information technology include fiber coating, fiber coloring, and photo-blocking. Epoxy is one of UV-curable materials. The current coated plastics are provided as a base of any plastic body, 1346221 L_a jade material and a metal enamel layer; the substrate is a structural support material 'for example, from a polycarbonate tree, or an acrylic resin Or a polyene resin, or an epoxy resin, etc., for the recovery of the above epoxy resin product, the relevant domestic paper materials can be seen; for example, the molten salt method for processing waste printed circuit board technology develops a solid phase product Research and Analysis (Huang Guozhe, 85-year master's thesis, Department of Environmental Engineering and Science, Pingtung University of Science and Technology, 89-year master's thesis) and the catalytic effect of catalysts on the cracking process of printed circuit boards (Fang Hongda, Zhongshan University)
學裱境工程研究所，90年碩士論文）都以環氧樹脂塊材為 研究對象。 至於覆膜塑膠部分’例如中華民國專利公告第162116 號「非破壞性塑膠鍍層剝離技術」，係使用於塑膠電鍍後 之不良品、廢棄後之電鍍塑膠回收品等表面金屬鍍層的回 收，其特徵係在於：回收時，先以機械方法喷擊而剝除佔 塑膠表面積95%以上的金屬鍍層，然後將該塑膠浸入氣化 銅或氯化鐵溶液中約20〜40分鐘左右，即可完全除去殘餘 φ 的金屬鍵層者。 歸納而言，是採機械外力先將薄膜材料層刮除，續以 化學溶液去除，但機械方法進行噴擊過程時造成基材電鍍 '面粗糙化，難以重新電鍍再使用，且喷擊有其死角，加上 •回收所得微粒中混有金屬、研磨粒和高分子，造成後續的 解離問題或二次污染，回收所得塑膠無法使用在高價的原 用途’在處理過程中容易使基材表面材料產生物性變化， 難以確保回收基材的預期品質’窄化循環使用基材材料的 範圍’降低其再利用的價值，只能淪為低價的回收塑膠料 6 然而’該等公報中所記載的處理方法，只適用於破壞 金屬膜二至於具彈性的高分子膜層則完全失效，因此，: 何去除问刀子臈層，減少製程時間更重要的待解決問題 t於減少目收製程對高分子基材之傷害，藉以提高回收高 分子基材的回收價值，目前並未提出相關專利。 【發明内容】 本發明係關於—種具環氧樹脂層披覆的基材回收分離 方法，特別是指具環氧樹脂層的高分子材置於化學溶液環 境中，由於環氧樹脂層殘留會影響後續回收製程，且脫除 基材上附著的環氧樹脂層材料是分離技術關鍵所在，利用 化學溶液酸、鹼、鹽和有機溶劑脫附環氧樹脂層，不需要 長時間加熱基板以去除環氧樹脂，加上水對基材性質影響 小，故可減少基板的材質劣化，如此，可大幅增加分離欵 率’且有助於回收高品質基板材料之方法。本發明可以完 整徹底且快速的去除，有利於量產，具有快速、簡單和= 成本的優點。 - 【實施方式】 —接著，k列舉一些具體實施例，詳細介紹本發明之内 谷及其所能達成之功效： 以下為其可行步驟之一： & 1、分類：將各式覆膜材料依覆層材f歸類。例如環 乳樹脂、PU和有機矽等之不同而分類； 2、去除覆層：續將此環氧樹脂覆膜材料置入化學溶 1324621 液中。 一。 _ 3、取出沖洗：即可完全去除覆膜層。 -例如，將待處理環氧樹脂覆膜的PC塑膠置入容器中， .在80°C加溫的條件下，以30〜50wt%氫氧化鈉中浸置，進 行攪拌，或在80°C加溫的條件下’以20〜30wt%氫氧化銨 中浸置，進行攪拌，取出沖洗，即可完全去除覆膜層。 例如，將待處理環氧樹脂覆膜的PC塑膠置入容器中， 在常溫的條件下，以10wt%以上的次氯酸鈉，進行攪拌， ® 取出沖洗，即可完全去除覆膜層。 例如，將待處理環氧樹脂覆膜的PC塑膠置入容器中， 在40°C加溫的條件下，以70〜75wt%硫酸中浸置，或在常 溫的條件下，10wt%以上的硝酸，進行攪拌，取出沖洗， 即可完全去除覆膜層。 例如，將待處理環氧樹脂覆膜的PC塑膠置入容器中， 在常溫的條件下，以二異丁酮、異丁酮、環己酮、乙烯基 φ 甲醚、乙烯基乙曱醚中浸置，取出沖洗，即可完全去除覆 膜層。 亦即可使用的化學藥劑包括酸、鹼、鹽和有機溶劑之 集合。 上述的覆膜材料進入分離程序時，係將待處理之覆膜 材料放置於水溶液中，調整PH值和溶液溫度，配合清洗分 離程序中需要可採取攪動、噴射、循環、加熱和超音波等 方法提高清洗速度和清洗質量。 另外，各類覆膜材料因材質、來源、製作參數和品管 8 1324621 广一 fU修正丨 等差異，可能有夕種覆膜，但需要有分離環氧樹脂覆膜層 製程部分，而有進一步將其它覆膜分離之步驟；即分離環 ‘ 氧樹脂覆膜層可為多道製程之其中一部份。 - 另外，經過化學藥劑預破壞分離之半成品，係可再施 予至少有機械力、電弧、電磁波和超音波中一種方法，以 進一步徹底解離；或者，先予以至少有機械力、電弧、電 磁波和超音波中一種方法部分解離，再續以化學藥劑分離 輔助解離等，有利於完全解離；即化學藥劑溶液分離辅助 琴解離可為多道製程之其中一部份。 另外，各類環氧樹脂覆膜因基地材質、製作參數和品 管等差異，故上段所述之有機械力可包括破碎、研磨和刮 除，化學藥劑可包括酸、鹼、鹽和有機溶劑，電磁波可包 括微波，但其他可產生分層或破壞之電磁波，均屬本設案 可適用的範圍。覆膜材料的型態包括成形零件、粉體和碎 片等。 • 此外，上述基地材質包括金屬、塑膠、陶瓷和複合材 料，製作包括浸鍍、噴塗和塗覆。此環氧樹脂（ep〇xy resin )層的主組成包括：雙酚a環氧丙烯酸酯、酚醛環 . 氧丙烯酸酯、環氧化油丙烯酸酯、酸及酸酐改性環氧丙烯 • 酸酯中至少一種。原料來源包括環氧-U，2]-氣-[3]-丙 烷、雙酚A、脂肪族多醇類和過乙酸氧化的聚稀之集合。 此環氧樹脂層的原料可添加包括：勻泡劑、固化劑、擴鏈 劑、溶劑、發泡劑、阻燃劑、中間體、脫模劑、增塑劑、 助劑相關顏料、色漿之集合。 9 j v B s . 、 環氧树爿a覆膜解離時「可體將剝離層移離，如 此可節省分離的時間與能源。 又，有關將環氧樹脂覆臈材料置入化學藥劑環境之方 式，可為下列方式： 1、批次式，環氧樹脂覆膜材料分批進出於化學藥劑 環境； —2、半連續式，環氧樹脂覆膜材料以輸送帶輸送至化 :藥劑％^中’其停止行進接受解離，俟解離完畢再由輪 送帶送離化學藥劑環境； # 3、連續式’軌樹脂覆㈣料以輸送帶輸送至 Γ==其持續進行接收解離，解離完畢時，環氧樹 月Θ覆膜材料適被送離； 雜次式係利用容器盛襄覆膜材料整抵置入 定時間後將其取出，以完成解離 用輸送帶二生逐個固定排列於輸送帶上， 覆膜材料，進定之時間内輸送—定數量 環氧樹脂覆膜材料逐個丄又連續式係 /工白可達到解離目的，皆適於本方法。 不能以作:為,乍之-較佳實施例而已， 加熱、超音波'有機溶劑、真空洗淨:水::機: bli -^ AiJ·.The Institute of Environmental Engineering, 90 years of master's thesis) is based on epoxy resin blocks. As for the plastic part of the film, for example, the "Non-destructive plastic coating peeling technology" of the Republic of China Patent No. 162116 is used for the recovery of surface metal plating such as defective products after plastic plating and recycled plastics after disposal. It is: when recycling, firstly remove the metal plating layer which is more than 95% of the surface area of the plastic by mechanical spraying, and then immerse the plastic in the vaporized copper or ferric chloride solution for about 20~40 minutes to completely remove. The metal bond layer of residual φ. In summary, the mechanical material force first scrapes off the film material layer and continues to remove it with a chemical solution. However, when the mechanical method is used in the spraying process, the substrate plating is roughened, it is difficult to re-plate and then used, and the spray has its effect. Dead corners, plus • The recovered particles are mixed with metals, abrasive particles and macromolecules, causing subsequent dissociation problems or secondary pollution. The recovered plastics cannot be used in high-priced original applications. Producing physical properties, it is difficult to ensure the expected quality of the recycled substrate 'narrowing the range of recycled substrate materials' to reduce the value of its reuse, can only be reduced to low-cost recycled plastic materials 6 However, as described in the Gazette The treatment method is only applicable to the destruction of the metal film. The elastic polymer layer is completely ineffective. Therefore, how to remove the knife layer and reduce the process time is more important to solve the problem. The damage of the substrate is used to improve the recovery value of the recycled polymer substrate, and no related patent has been proposed at present. SUMMARY OF THE INVENTION The present invention relates to a method for recovering and separating a substrate coated with an epoxy resin layer, in particular, a polymer material having an epoxy resin layer is placed in a chemical solution environment, and the epoxy resin layer remains. Affecting the subsequent recycling process, and removing the epoxy layer material attached to the substrate is the key to the separation technology. The chemical solution acid, alkali, salt and organic solvent are used to desorb the epoxy layer, and it is not necessary to heat the substrate for a long time to remove Epoxy resin and water have little effect on the properties of the substrate, so that the deterioration of the material of the substrate can be reduced. Thus, the separation rate can be greatly increased and the method for recovering high-quality substrate materials can be recovered. The present invention can be completely and quickly removed, is advantageous for mass production, and has the advantages of being fast, simple, and cost-effective. - [Embodiment] - Next, k lists some specific examples, detailing the inner valley of the present invention and its achievable effects: The following is one of the feasible steps: & 1. Classification: various types of coating materials According to the cladding material f is classified. For example, ring latex resin, PU and organic germanium are classified as different; 2. Remove the coating: Continue to place the epoxy resin coating material in the chemical solution 1324621. One. _ 3, take out the rinse: you can completely remove the coating layer. - for example, placing the PC plastic of the epoxy resin film to be treated into a container, immersing it in 30~50wt% sodium hydroxide under the condition of heating at 80 ° C, stirring, or at 80 ° C Under the condition of heating, the mixture is immersed in 20 to 30% by weight of ammonium hydroxide, stirred, and taken out and rinsed to completely remove the coating layer. For example, the PC plastic of the epoxy resin film to be treated is placed in a container, and under normal temperature conditions, 10 wt% or more of sodium hypochlorite is stirred, and the rinse is removed to completely remove the coating layer. For example, the PC plastic of the epoxy resin film to be treated is placed in a container, immersed in 70 to 75 wt% sulfuric acid under heating at 40 ° C, or 10 wt% or more of nitric acid under normal temperature conditions. , stir, remove and rinse, and completely remove the coating layer. For example, the PC plastic of the epoxy resin film to be treated is placed in a container, and under normal temperature conditions, diisobutyl ketone, isobutyl ketone, cyclohexanone, vinyl φ methyl ether, vinyl ethoxylate Immerse, remove and rinse, and completely remove the coating. Chemicals that can also be used include a collection of acids, bases, salts, and organic solvents. When the above-mentioned coating material enters the separation process, the coating material to be treated is placed in an aqueous solution to adjust the pH value and the solution temperature, and the method of agitation, spraying, circulation, heating and ultrasonication may be adopted in conjunction with the cleaning separation process. Improve cleaning speed and cleaning quality. In addition, due to differences in materials, sources, manufacturing parameters, and quality control, the various types of coating materials may have a coating of the outer layer, but a part of the process of separating the epoxy resin coating layer is required, and further The step of separating the other coatings; that is, the separation ring 'oxy resin coating layer' can be part of a multi-pass process. - In addition, the semi-finished product that has been pre-destroyed by chemical agents can be further subjected to at least one of mechanical, arc, electromagnetic waves and ultrasonic waves to further dissociate completely; or, at least, mechanical, arc, electromagnetic waves and Partial dissociation of a method in ultrasonic waves, followed by chemical separation to assist dissociation, etc., is conducive to complete dissociation; that is, chemical reagent solution separation assisted piano dissociation can be part of a multi-channel process. In addition, various types of epoxy resin coatings vary in base material, manufacturing parameters, and quality control, so the mechanical forces described in the previous paragraph may include crushing, grinding, and scraping. Chemicals may include acids, bases, salts, and organic solvents. The electromagnetic wave may include microwaves, but other electromagnetic waves which may cause delamination or destruction are within the applicable range of the present invention. The types of coating materials include formed parts, powders and fragments. • In addition, the base materials include metal, plastic, ceramic and composite materials, including immersion plating, spraying and coating. The main composition of the epoxy resin (ep〇xy resin) layer includes: bisphenol a epoxy acrylate, phenolic ring. oxy acrylate, epoxidized oil acrylate, acid and anhydride modified epoxy propylene • acid ester at least One. Sources of raw materials include a collection of epoxy-U,2]-gas-[3]-propane, bisphenol A, aliphatic polyols, and peracetic acid oxidized polysapphire. The raw material of the epoxy resin layer may include: a foam stabilizer, a curing agent, a chain extender, a solvent, a foaming agent, a flame retardant, an intermediate, a mold release agent, a plasticizer, an auxiliary-related pigment, and a color paste. The collection. 9 jv B s . , Epoxy tree 爿 a film dissociation "can remove the peeling layer, so as to save separation time and energy. Also, the way to put epoxy resin coating materials into the chemical environment , can be the following ways: 1, batch type, epoxy resin film material into the chemical environment in batches; 2, semi-continuous, epoxy film coating material transported to the conveyor belt: drug % ^ 'It stops traveling and accepts the dissociation. After the dissociation is completed, it is sent to the chemical environment by the belt. #3. The continuous 'rail resin coating (4) is conveyed by the conveyor belt to the crucible == it continues to receive and dissociate. When the dissociation is completed, Epoxy tree Θ Θ Θ Θ 适 ; 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧, film material, transport in a given time - a certain amount of epoxy resin film material one by one, continuous system / work white can achieve the purpose of dissociation, are suitable for this method. Can not be used as: for, 乍 - better Example, heating, ultrasonic ' Solvent in vacuo washing: water :: machine: bli - ^ AiJ ·.
s 又%-々I 攪動方式可縮短去‘時^尊 本創作專利涵蓋之範'屬可竹之例销 上段所述之有機溶劑，可包括 =互溶，或可以軟化層間強度的軟:::= 軟化溶劑對基材的侵蝕性緩衝助劑，或可二降低 對層狀結構的解離速度之添加促進劑:或== ::著物回沾到基材的情形之添加抗靜心= 法即使用前述之處理製程，則如簡單的處理方 1自廢棄覆膜材料回收未產生變質之基材材料，而 ^回收純度高的基材材料，並使得循環使用成為可能。且 =向效率地實施自廢棄覆膜材料除掉不要的薄層，並回 收基材材料’因此具有可以大幅削減覆膜材料成本之優點 3在實施態樣中，雖以基材層上有環氧樹脂層之覆膜塑 膠做為處理對象，惟在此類覆膜塑膠製造途中產生損傷者 ，或在製造後最終的檢查過程中變成不良品者，或：到水 準後之剩餘庫存品等中之任一種也都可以；易言之，無論 基材層上有何層狀組織，只要具有環氧樹脂層結構都^ 利用和前述相同的處理方法，而確實地實施基材材料之回 收者。 ’ 本發明提供之處理方法適用於從製造過程中發生損傷 的環氧樹脂覆膜塑膠，或在製造後之最終的檢查4程中成 為不良品，或變成剩餘的庫存品等，回收其基材材料並循 1324621 . »·s %-々I The agitation method can shorten the organic solvent described in the above paragraph when the patent is covered by the patent, which may include the mutual solubility, or the softening of the interlayer strength::: = an erosive buffering aid for the softening solvent on the substrate, or an additive accelerator which can reduce the dissociation rate of the layered structure: or == :: Adding anti-static meditation to the substrate By using the above-described treatment process, the substrate material which has not been deteriorated is recovered from the waste coating material as in the simple processing method 1, and the substrate material having high purity is recovered, and recycling is made possible. And = efficiently removing the unnecessary thin layer from the waste coating material and recovering the substrate material', so that it has the advantage of greatly reducing the cost of the coating material. 3 In the embodiment, although there is a ring on the substrate layer The plastic film of the oxygen resin layer is treated as a treatment object, but it may be damaged in the manufacturing process of such a plastic film, or may become a defective product in the final inspection process after manufacture, or: to the remaining inventory after the leveling, etc. Any one of them can be used; in other words, regardless of the layered structure on the substrate layer, as long as the epoxy resin layer structure is used, the same processing method as described above can be used to reliably carry out the recovery of the substrate material. The treatment method provided by the present invention is applicable to an epoxy resin coated plastic which is damaged during the manufacturing process, or becomes a defective product in the final inspection after the manufacture, or becomes a surplus inventory, etc., and recovers the substrate. The material is followed by 1324621 . »·
98.11. 13 補充1 年月日 環使用。由於可以回收純度高碎Ϊ材材料，因此所回收的 基材材料理所當然的可以再用做覆膜塑膠的基材，也可以 與其他材質混摻和膠等廣泛的用途中加以利用，且容易循 環使用為塑膠原料，具有極高經濟效益，並可有效避免覆 膜塑膠於回收處理過程中所造成之材質污染者。98.11. 13 Supplement 1 year, month and day. Since the high-purity coffin material can be recovered, the recovered substrate material can of course be reused as a substrate for a coated plastic, or can be utilized in a wide range of applications such as mixing with other materials and adhesives, and is easy to recycle. The use of plastic raw materials has extremely high economic benefits and can effectively avoid the material pollution caused by the plastic film in the recycling process.
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【圖式簡單說明】| 您if j 第一圖：本發明之流程示意圖 【主要元件符號說明】[Simple description of the schema] | You if j First diagram: Schematic diagram of the process of the present invention [Description of main component symbols]
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