九、發明說明： 【發明所屬之技術領域】 本發明與電子裝置的靜電防護有關，特別是—種容易製造租 裝且開發成本低廉之靜電防護結構。 【先前技術】 為了符合使用者的需求，許多電子產品都朝著輕巧且功能強 大的目標發展’但是隨㈣子產品H積稍地縮小，也正代 電子產品内部所能提供的空間越來越有限。在這種情況下，電子 產品中的印刷電路板只能以縮小面積來應對，而且印刷路 =體電路也必須以更高的鮮來提昇資料處理速度，種種因素 二:吏:印刷:路板上因電磁效應而產生的電磁干擾現象陶 二…另-方面’因為印刷電路板上的電路配置更 =印刷板表面與錢互相摩擦喊生靜電的情況也常常發 生1磁干擾及靜電現象皆可能影_電路板上電路的運作，導 子統不穩或當機。此外，電磁干擾及靜電現象所產 電路板上的電路。持，，累積’則會不慎電傷使用者或損傷 ⑽二此目則在電子產品的印刷電路板上都會設置有靜電防護 m她L姻，靖__電路l磁干誠靜電效應 的電何導出，使印刷電路板上的電路維持在正常運作 =電的情秘生。如「第】圖」所示，即為一種常見用以 U接地彈片10 ’其係由一金屬彈片彎折而成，並且具有 :::部11及一接觸部12。焊接部11係利用焊接於電子產。的 P刷電路板上’而接觸部12則與—可魏元件( 產4 屬機殼健接，使印刷電路板與可導電祕達成電性 引出印刷電路板上產生之電荷，以達到靜電防 ;;?_之結構上並無法承受突然的衝擊力二::電 。。不㈣洛地面時’其金屬機殼會給予接轉4 姆細㈣_壞，而‘ 又如中華民_型專利购5· #，其縣了— ^品^變形接地彈片，以解決前述接地彈片]0不耐衝擊之缺 么但疋M29S836案中之接地彈片與前述之接地彈片1〇都是由 多次彎折而成，就其加工製造方面而言，不但手續相當複 更。而且技兩種彈片都須要針對印刷電路板與可導電元件的 間=重新開模設計’使開發產品的時間及人力成本大增，再加上 電子產品對於以被置的要求祕，於靜電防魏計上往往 ”有指當難度。以上幾點都使得應獅針之接地彈片與前述 之接地彈片1〇無法符合時下電子產品快速更替的開發需求。 【發明内容】 θ有鑒於先前技術中接地彈片製造方式複雜及開發成本過高的 門題’本發明之目的在於提供—種靜電防護結構，以解決習知接 地彈片長久以來所存在的問題。 為解决Θ述之問題，本發明係提供—種靜電防護結構，包含 二=二：合部以及一連接部。此種靜電防護結構係 中導並且設置於，板及-導電體間，其 Μ線材可為-金屬線材。結合部係延伸於壓縮彈性部之一 —而由上述導電線材在平面上捲繞形成—第_接觸面 其第一接觸面焊接至電路板、’ 彈性邱之1 連接部係延伸於璧縮 觸面導電線材在平面上捲燒形成-第二接 …。。相月對’並且以其第二接觸面電性連接至 。 ==_上貼附有一高分子材料製成的薄膜片，以在 吸 邮成一吸附平面，供執行表面黏著製程之機台 。*轉性較由前料電線材捲繞而成，肋被壓縮而 "彈性力推抵連接部之第二接觸面常態地接觸導電體，使連 姆以寸、.’'與導電體保持電性連接。藉以電性連接電路板與導電 虹’亚對於魏板進行靜電防護。 、發$之功效在於’靜電防護結構係由導電線材(金屬線材) 妒H,使其可由—彈簧製造機台來完成各種需要的尺寸與外 y 2且靜電防護結構因具有壓縮彈性部可配合裝設空間進行彈 it伸縮’不僅有效地節省開發成本及_，也可以承受突然的外 力衝擊而轉靜電防護之效果。 —以下在貫施方式中詳細敘述本發明之詳細特徵以及優點，其 &足以使任何热習相關技藝者了解本發明之技術内容並據以實 施，且根攄太句nFt本 ' ^ ^ 兄明書所揭露之内容、申請專利範圍及圖式，任何 Λ相關技勢者可輕易地理解本發明相關之目的及優點。 '上之關於本發明内容之說明及之 以示範與轉树批原理，並域供本剌之專射請範= 進一步之解釋。 【實施方式】 ” 2使對本發明的目的、構造、特徵、及其功能有進一步的瞭 解’炫配合實施例詳細說明如下。 ,、 抵φ Ί第2圖」、「第3圖」及「第4圖」所示，為本發明 右構之第—實施例，®巾本發明之靜電防護結構2〇包含 賴以及—壓縮彈性部23。此種靜電防 一，·“ 、導電線材捲繞成型，用以設置於一電路板30及 =體叫使電路板3〇與導電體31達成電性連接，其中前 述¥電線材可為但不舰於—金屬線材。 電路板30可以是電子產品内部之印刷電路板，用以承 ==峨路晶片.·.等等。導電體31則可以是電子產品之 門靜雷材貝的部位’以藉由靜電防護結構2〇電性連接於兩者 二護結構2〇用以隨時將電路板30 .上因電磁干擾 =觀導引至導電體31上，再糊料體3i_ ^夕餘電何’以避免多餘電荷不斷累積在電 電路板3〇 4子元件的正料作。 而〜.到 結合部21延伸於壓縮彈性部23之 在平面上捲繞形成圓形板狀，而形成-第—接觸面 1323153 」糸以其第一接觸面211焊接至電路板30，其中結合部21係經 狀面轉技術(SMT，surface m_ techn〇1〇gy)與電路板3〇焊接 道° ° ’使結合部21電性連接至電路板3G。又，因結合部21係由 ^材捲繞_ ’料_嶋娜，峨之焊料 断生入_騎巾，進*增加結合部21與電路㈣結合之穩IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to electrostatic protection of electronic devices, and more particularly to an electrostatic protection structure which is easy to manufacture and which is inexpensive to develop. [Prior Art] In order to meet the needs of users, many electronic products are developing toward a light and powerful target. However, with the (four) sub-products, the H product is slightly smaller, and the space available inside the electronic products is becoming more and more. limited. In this case, the printed circuit board in the electronic product can only deal with the reduced area, and the printed circuit = body circuit must also increase the data processing speed with a higher freshness, various factors two: 吏: printing: road board Electromagnetic interference caused by electromagnetic effect Tao 2...other-side 'because the circuit configuration on the printed circuit board is more = the surface of the printed board and the money rub each other and shouting static electricity often occurs 1 magnetic interference and static phenomenon are possible Shadow_The operation of the circuit on the circuit board, the conductor is unstable or down. In addition, electromagnetic interference and static electricity are generated on the circuit board. Holding, accumulating 'will accidentally damage the user or damage (10) This is the case on the printed circuit board of electronic products will be equipped with electrostatic protection m her marriage, Jing __ circuit l magnetic dry electrostatic effect of electricity How to export, so that the circuit on the printed circuit board is maintained in normal operation = electricity. As shown in the "figure", it is a common U-grounded spring 10' which is bent from a metal dome and has a ::: portion 11 and a contact portion 12. The welded portion 11 is welded to the electronic product. On the P-brush board, the contact part 12 is connected to the -week component (the 4th-generator case is connected, so that the printed circuit board and the conductive layer can electrically lead to the electric charge generated on the printed circuit board to achieve electrostatic protection. ;;? _ The structure can not withstand the sudden impact of the force 2:: electricity.. (4) Luo when the ground 'the metal casing will be given 4 fine (four) _ bad, and 'also like the Chinese people _ type patent Purchase 5· #, the county has a ^ deformation ^ grounding shrapnel to solve the above-mentioned grounding shrapnel] 0 is not resistant to shocks, but the grounding shrapnel in the M29S836 case and the aforementioned grounding shrapnel 1〇 are made by multiple bends In terms of its manufacturing and manufacturing, not only the procedures are quite complicated, but also the two kinds of shrapnel need to be designed for the between the printed circuit board and the conductive components = re-opening design to make the development of products time and labor costs Adding, plus the electronic products for the secret of being placed, in the static anti-wet meter often "has pointed out the difficulty. The above points make the grounding shrapnel of the lion needle and the aforementioned grounding shrapnel 1〇 can not meet the current electronic Development needs for rapid product replacement. Contents θ In view of the complicated method of manufacturing grounding shrapnel in the prior art and the problem of high development cost, the object of the present invention is to provide an electrostatic protection structure to solve the problem that the conventional grounding shrapnel has been in existence for a long time. The present invention provides an electrostatic protection structure comprising two=two: a joint and a joint. The electrostatic protection structure is guided and disposed between the plate and the conductor, and the wire can be a metal wire. The joint extends over one of the compression elastic portions - and is formed by winding the conductive wire on a plane - the first contact surface of the first contact surface is welded to the circuit board, and the elastic portion is connected to the circuit board. The conductive wire of the contraction surface is formed by calcination on a flat surface - the second phase is ... and the phase contact is electrically connected to the second contact surface. The film is made of a polymer material attached to the ==_ The film is used to perform the surface adhesion process on the adsorption plane. The rotation is more than that of the front material wire, and the rib is compressed and the elastic force pushes against the second contact surface of the connection portion. often The ground contacts the electric conductor, so that the electric wire is electrically connected to the electric conductor by the inch, .'', thereby electrically connecting the circuit board and the conductive rainbow 'Asia to electrostatically protect the Wei board. The effect of the hair is the 'electrostatic protection structure It is made of conductive wire (metal wire) 妒H, which can be used to make various required sizes and outer y 2 from the spring manufacturing machine. The electrostatic protection structure can be flexibly stretched by the installation space with the compression elastic part. It can save the development cost and _, and can also withstand the effects of sudden external force shock and turn the static electricity protection. - The detailed features and advantages of the present invention are described in detail below, which is sufficient for any interested person to understand The technical content of the present invention is implemented according to the contents of the invention, and the scope and schema of the patent application, and any related art can easily understand the related purposes of the present invention. And advantages. 'About the description of the contents of the present invention and the principle of the demonstration and transfer of the batch, and the domain for the special shot of the 请 = = further explanation. [Embodiment] "2" A further understanding of the object, structure, features, and functions of the present invention will be described in detail as follows: ", 抵 Ί Ί 2", "3" and " 4 is a first embodiment of the present invention. The electrostatic protection structure 2 of the present invention comprises a Lai and a compression elastic portion 23. Such a static electricity prevention, "", the conductive wire is wound and formed, and is disposed on a circuit board 30 and the body is called to electrically connect the circuit board 3〇 with the electric conductor 31, wherein the foregoing electric wire material can be but not The ship board is a metal wire. The circuit board 30 can be a printed circuit board inside the electronic product, which can be used to support the chip, etc. The conductor 31 can be the part of the door of the electronic product. The electrical protection structure 2 is electrically connected to the two protection structures 2〇 for guiding the circuit board 30 to the electric conductor 31 at any time, and then the paste body 3i_^ What's to avoid the accumulation of excess charge on the electrical circuit board 3〇4 sub-components. And ~ to the joint portion 21 extends over the compression elastic portion 23 in a plane to form a circular plate shape, and form - The first contact surface 1323153 is soldered to the circuit board 30 with its first contact surface 211, wherein the joint portion 21 is a surface-turning technique (SMT, surface m_techn〇1〇gy) and the circuit board 3〇 is soldered. 'The bonding portion 21 is electrically connected to the circuit board 3G. Further, since the joint portion 21 is wound by the material _ _ _ 嶋 峨, the solder of the 峨 is broken into the _ riding towel, and the addition of the joint portion 21 and the circuit (four) is stabilized.
連接部22延伸於壓縮彈性部23之另一側，並由上述導電線 材在平面上捲繞成圓形板狀，而形成一第二接觸面221，直中第 二接觸面221與結合部21之第一接觸面如相背對。連接部22 係以其第二接觸面加電性連接至導電體31，例如利用第二接觸 面功直接貼附接觸導電體31。又，因執行表面黏著製程之機台 -般都以真空吸附之方式吸取欲焊接之物件，所以連接部^上貼 附有-由高分子材_如驗购贿飛材嫌成的薄膜片 24 ’以在連接部22 一側形成一吸附平面241。吸附平面如可提 供執行表面黏著製程之機台吸附靜電防護結構2㈣，而當結合部 21焊接至電路板30完成後即將薄膜片24移除。 壓縮彈性部23是由—彈簧製造機台將上述導電線材捲繞成 一立體螺旋狀之壓縮彈簧’使壓轉性部23具有彈性而可被壓 縮。壓縮彈性部23係連接於結合部21與連接部22兩者之間，其 中結合部21、連接部22及壓縮部23係由前述之導電線材一 體成型。如此，當結合部^焊接至魏板％的同時，也代表著 連接部22亦與電路板30達成電性連接，使電路板％上的多餘電 9 荷即可透過結合部21與壓縮彈性部23順利地導引至連接部22 上。 "月再參閱「第4圖」及「第5圖」所示，於組農電路板％、 導電體31與靜電防護結構20時’壓縮彈性部23可被擠壓而縮短 其導電線材之螺距，即彈性靜電防護結構2〇之長度由原長度 L1(如「第4圖」所示)壓縮成壓縮長度L2(如「第5圖」所示）。 如此，壓縮彈性部23可配合電路板30與導電體31之實際間距進 行微量調整，而且可以透過壓縮彈性部23變形產生之彈性力，推 抵連接部22之第二接觸面221常態地與導電體31保持接觸，藉 以電性連接電路板30與導電體31。是以，電路板3〇上的多餘電 荷即可透過靜電防護結構20順利地導引至導電體31上，以對於 電路板30進行靜電防護。此外，當導電體31不慎受到外力衝擊 時，壓縮彈性部23也可以藉由壓縮變形來適時吸收衝擊的能量， 並於外力衝擊過後保持導電體31與電路板3〇間電性連接的關係。 又如「第6圖」及「第7圖」所示，為本發明靜電防護結構 之第二實施例，其具體實施方式與本發明之第一實施例相同，而 兩者的差異之處僅在於結合部21與連接部23捲繞之外型。第二 貫％例中結合部21與連接部23皆由導電線材在平面上捲繞成矩 形板狀，當然也可以是其他如三角形或不規則之型態，或者是將 結合部21與連接部23捲繞成不同外形。但是，結合部21與連接 部23之型態並不以此為限，只要是可以在靜電防護結構如兩側 形成與電路板30及導電體31(如「第4圖」所示)接觸之平面即可， 1323153 以配合電子元件内部實際裝設之環 又如「㈣」所示’為本發明靜=電防護之功效。 其具體魏枝結叙第三實施例， 僅在屢縮彈性部23係呈直線之型熊，、、,，7而兩者的差異之處 21虚連接邱29 ^亚且以其兩端連接至結合部 ”抓卩22 ’使靜獅構Μ切依 及靜電防護之功效。 …、了以拎供壓鈿受形 本發明所提供之靜電防護結構 糊捲繞成型，可由一彈#製造㈣㈣广條導電線材(金屬 形，以供應各種電路板30所需之雜H各種需要的尺寸與外 可配合其裝設空間進行彈性伸縮，：：僅’=也=结構20本身 間’也可《峨姉卜力獅嶋物H發成本及時 雖然本發明以前述之實施例揭露如上，然 發明。在不聽本發明之精神和顧内，所為 ^ 屬本發明之專利保護範圍。關於本發明所界定之保:二 所附之ΐ請專利翻。 【圖式簡單說明】 第1圖為習知接地彈片之立體示意圖。 第2圖為本發明第一實施例中彈性靜電防護結構與 立體不意圖。 圖 第3圖為本剌第_實_中彈性靜電防騎構之立體示 意 第4圖為本發明中彈性靜電防護結構、電路板與導電體組裝 11 1323153 前之平面示意圖。 第5圖為本發明中彈性靜電防護結構、電路板與導電體組裝 後之平面示意圖。 第6圖為本發明第二實施例中彈性靜電防護結構與薄膜片之 立體示意圖。 第7圖為本發明第二實施例中彈性靜電防護結構之立體示意 圖。 第8圖為本發明第三實施例中彈性靜電防護結構之立體示意 圖。 【主要元件符號說明】 - 10.............................接地彈片 11 .............................焊接部 12 .............................接觸部 ^ 20.............................靜電防護結構 21 .............................結合部 211...........................第一接觸面 22 .............................連接部 221...........................第二接觸面 23 .............................壓縮彈性部 24 .............................薄膜片 241...........................吸附平面 12 1323153 30 .............................電路板 31 .............................導電體 L1.............................原長度 L2.............................壓縮長度 13The connecting portion 22 extends on the other side of the compressive elastic portion 23, and is wound into a circular plate shape on the plane by the conductive wire to form a second contact surface 221, and the second contact surface 221 and the joint portion 21 are directly connected. The first contact surface is opposite to each other. The connecting portion 22 is electrically connected to the electric conductor 31 with its second contact surface, for example, directly attached to the contact electric conductor 31 by the second contact surface work. Moreover, since the machine for performing the surface adhesion process generally picks up the object to be welded by vacuum adsorption, the connection portion is attached with a film sheet 24 which is suspected of being a polymer material. 'An adsorption plane 241 is formed on the side of the connecting portion 22. The adsorption plane can provide an electrostatic protection structure 2 (4) for performing a surface adhesion process, and the film sheet 24 is removed when the bonding portion 21 is soldered to the circuit board 30. The compression elastic portion 23 is a compression spring that winds the above-mentioned conductive wire into a three-dimensional spiral shape by a spring manufacturing machine, so that the pressure-sensitive portion 23 has elasticity and can be compressed. The compression elastic portion 23 is connected between the joint portion 21 and the joint portion 22, and the joint portion 21, the joint portion 22, and the compression portion 23 are integrally molded from the above-described conductive wire. In this way, when the bonding portion is soldered to the core board, it also means that the connecting portion 22 is also electrically connected to the circuit board 30, so that the excess power of the circuit board can pass through the bonding portion 21 and the compression elastic portion. 23 is smoothly guided to the connecting portion 22. "Monthly, as shown in Figure 4 and Figure 5, the compression elastic portion 23 can be squeezed to shorten the conductive wire when the group board circuit board %, the conductor 31 and the static electricity protection structure 20 are used. The pitch, that is, the length of the elastic static protection structure 2〇 is compressed by the original length L1 (as shown in Fig. 4) into a compression length L2 (as shown in Fig. 5). In this way, the compression elastic portion 23 can be slightly adjusted in accordance with the actual pitch of the circuit board 30 and the conductor 31, and can be transmitted through the elastic force generated by the deformation of the compression elastic portion 23, and the second contact surface 221 of the connection portion 22 is normally and electrically conductive. The body 31 is kept in contact to electrically connect the circuit board 30 and the conductor 31. Therefore, the excess charge on the circuit board 3 can be smoothly guided to the conductor 31 through the electrostatic protection structure 20 to electrostatically protect the circuit board 30. In addition, when the electric conductor 31 is inadvertently subjected to an external force, the compression elastic portion 23 can also absorb the energy of the impact by compressive deformation, and maintain the electrical connection between the electric conductor 31 and the circuit board 3 after the external force is impacted. . Further, as shown in FIG. 6 and FIG. 7, a second embodiment of the electrostatic protection structure of the present invention is the same as the first embodiment of the present invention, and the difference between the two is only The joint portion 21 and the joint portion 23 are wound into a shape. In the second example, the joint portion 21 and the connecting portion 23 are all wound into a rectangular plate shape by a conductive wire on a plane, and of course, other shapes such as a triangle or an irregular shape, or the joint portion 21 and the joint portion may be used. 23 is wound into different shapes. However, the shape of the joint portion 21 and the connecting portion 23 is not limited thereto, as long as it can be formed in contact with the circuit board 30 and the conductor 31 (as shown in FIG. 4) on both sides of the electrostatic protection structure. The plane can be used, 1323153 to match the actual installation of the inner ring of the electronic component as shown in "(4)" is the effect of the static electricity protection of the present invention. The third embodiment of the specific Weizhi knot is only in the case where the contractile elastic portion 23 is a straight line type bear, ,,, and 7 and the difference between the two is 21 virtual connection and is connected at both ends thereof. To the joint part "grab 22" to make the static lion structure cut and the effect of static electricity protection. ..., the 静电 拎 钿 钿 钿 本 本 本 本 本 本 本 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电Wide strip of conductive wire (metal shape, to meet the various required sizes of the various circuit boards 30, and the outer space can be elastically stretched with the installation space:: only '= also = structure 20 itself' can also be The present invention is disclosed in the foregoing embodiments, and the invention is not limited to the spirit and scope of the present invention. The definition of the protection: the second attached to the patent to turn over. [Simple diagram of the diagram] Figure 1 is a schematic perspective view of a conventional grounding shrapnel. Figure 2 is a first embodiment of the present invention in the elastic electrostatic protection structure and three-dimensional Figure 3 is the first _ real _ medium elastic static 3 is a schematic plan view of the elastic static protection structure, the circuit board and the electrical conductor assembly 11 1323153. The fifth figure is the elastic static protection structure, the circuit board and the electric conductor assembled in the invention. Figure 6 is a perspective view of an elastic electrostatic protection structure and a film sheet according to a second embodiment of the present invention. Figure 7 is a perspective view showing an elastic electrostatic protection structure according to a second embodiment of the present invention. Stereoscopic view of the elastic electrostatic protection structure in the third embodiment. [Explanation of main component symbols] - 10............................. Grounding shrapnel 11 .............................welding section 12 ............... ..............Contacts ^ 20............................. Electrostatic protection structure 21 .............................Combination 211................ ..........first contact surface 22 .............................Connecting portion 221... ........................Second contact surface 23 ..................... ........Compressed elastic portion 24 .............................film sheet 241... .......... ...........Adsorption plane 12 1323153 30 ................................. Board 31 .. ...........................Conductor L1.................... .........original length L2.............................Compressed length 13