丄义上551 九、發明說明： 【發明所屬之技術領域】 本發明係有關於使玻璃基板均勻薄化之蝕刻技 術’特別係有關於一種高密度浸蝕之玻璃基板均勻薄化 裝置。 【先前技術】 以往的平面顯示器會使用到玻璃基板，在製程中均勻 薄化玻璃基板的技術是相當重要，已知可行的方法皆 是以濕式蝕刻達成。 如我國專利公告第543 1 13號「TFT LCD用玻璃基板的自 動敍刻裝置及钱刻方法」所揭示技術者，在姓刻槽内部設置 有一多孔性起泡裝置，並在起泡裝置上側設有一擊板裝置， 通入許多氮氣（NO氣泡以攪動氫氟酸（HF)蝕刻液，這種方式 觉到流體力學物理現象影響，無法產生理想流場，且會有 HF軋化量增加的問題。因此，在蝕刻時為了避免具有毒性 之HF氣體向外散發而安裝了氣體帷幕（Air curtain)裝置，雖 有氣體帷幕（Air curtain)裝置隔絕外面環境，仍無法解決機 器金屬構件被HF腐蝕問體，以及造成嚴重人體危害 '工安 與環保問題。 此外，該氮氣氣體起泡裝置（N2 buble)及導流裝置僅考慮 流暢特性’尚未考慮到玻璃基板被HF蝕刻後，是否有足夠 及完全的流體剪力及慣性力’可移除玻璃基板表面殘留及析 出之氟矽酸根顆粒，此顆粒殘留在玻璃基板表面，不只會影 響姓刻速度，也會影響餘刻之均勻性。 5 1321551 【發明内容】 為了解決上述之問冑，本發明之主I目的係在於提 供-種玻璃基板均句薄化裝i，能移除坡璃基板表面 殘留與析出的氟石夕酸根顆粒，可在槽内密集排列玻璃 基板並且達到更均勻的表面蝕刻之功效。此外，可減BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching technique for uniformly thinning a glass substrate. In particular, it relates to a glass substrate uniform thinning apparatus for high-density etching. [Prior Art] In the conventional flat panel display, a glass substrate is used, and the technique of uniformly thinning the glass substrate in the process is very important, and it is known that a feasible method is achieved by wet etching. For example, in the technique disclosed in Chinese Patent Publication No. 543 1 13 "Automatic sculpt device for glass substrate for TFT LCD and money engraving method", a porous bubbling device is disposed inside the surname groove, and is disposed on the bubbling device side. There is a plate-carrying device that introduces a lot of nitrogen (NO bubbles to agitate the hydrofluoric acid (HF) etching solution. This way, the hydrodynamic physical phenomenon is felt, and the ideal flow field cannot be produced, and there is a problem that the amount of HF rolling increases. Therefore, in order to avoid the outward emission of toxic HF gas during etching, a gas curtain device is installed, and although the air curtain device is insulated from the outside environment, the metal component of the machine cannot be solved by HF corrosion. Body, and cause serious human hazard 'work safety and environmental protection issues. In addition, the nitrogen gas bubbling device (N2 buble) and the flow guiding device only consider the smooth characteristics 'has not considered whether the glass substrate is HF etched, whether it is sufficient and complete Fluid shear and inertial force' removes residual and precipitated fluoroantimonate particles on the surface of the glass substrate. This particle remains on the surface of the glass substrate, not only In order to solve the above problems, the main purpose of the present invention is to provide a glass substrate with a thinner sentence i, which can remove the slope. Residual and precipitated fluorite particles on the surface of the glass substrate can densely arrange the glass substrate in the groove and achieve a more uniform surface etching effect.
本發明之次一目的係在於提供一種玻璃基板均勻 薄化裝置，能夠調整到最佳的柏努利振盪動作，以均勻 姓刻每一片玻璃基板之表面。 本發明的目的及解決其技術問題是採用以下技術 方案來實現的。本發明揭示一種玻璃基板均勻薄化裝 置’該玻璃基板均勻薄化裝置係包含一蝕刻循環槽、 一基板固定機構以及一柏努利振盪機構（Bernoulli’ £A second object of the present invention is to provide a glass substrate uniform thinning device capable of adjusting to an optimum Bernoulli oscillation action to evenly engrave the surface of each glass substrate. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a glass substrate uniform thinning device. The glass substrate uniform thinning device comprises an etching circulation groove, a substrate fixing mechanism and a Bernoulli's oscillation mechanism (Bernoulli' £
少氫氟酸（HF)的氣化量，避免氫說酸之氣體（即氟化氫） 向外發散、蒸發與氣化，導致腐蝕機器金屬構件之問 題並避免其毒性對人體的危害。 oscillatory mechanism)。該蝕刻循環槽係用以容納與 更新玻璃蝕刻液。該基板固定機構係用以固定複數個 玻璃基板於該姓刻循環槽内。該柏努利振盪機構係連 接該基板固定機構，以使在該蝕刻循環槽内之破璃基 板作振蘯動作。 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 在前述的玻璃基板均勻薄化裝置中，前述的振盪動 作係為上下、左右、圓周或上述任意組合之動作。 6 在前述的玻璃基板均勻薄化裝置中，該柏努利振盪 機構係包含有一振盪方向改變機構與一振盪驅動馬達。 在前述的玻璃基板均勻薄化裝置中，前述的振盪動 作係為間歇性。 在前述的玻璃基板均勻薄化裝置中，該基板固定機 構係由一基板儲槽與一儲槽連結機構所組成。 在前述的玻璃基板均勻薄化裝置中，該些玻璃基板 係平行儲放至該基板儲槽内’前述的振盪動作係平行於該些 玻璃基板。 在前述的玻璃基板均勻薄化裝置中，該触刻循環槽 係設有一向上流之循環機構。 在前述的玻璃基板均勻薄化裝置中，該蝕刻循環槽 係連接有一循環管路進流與至少一循環管路迴流，該循 環管路進流係設於該蝕刻循環槽之底部中央。 在前述的玻璃基板均勻薄化裝置中，該蝕刻循環槽 係設有一層流分配板（laminar flow distribution plate) 【實施方式】 在本發明之一具體實施例中，第1圖係為一種玻璃 基板均勻薄化裝置1 〇〇之側視示意圖《第2圖係為該 玻璃基板均勻薄化裝置1〇0之底視示意圖。 如第1及2圖所示，該玻璃基板均勻薄化裝置100 主要包含一蝕刻循環槽11〇、一基板固定機構120以 及一柏努利振盪機構1 3 〇。該姓刻循環槽1 1 〇係用以 容納與更新玻璃蝕刻液。如第1圖所示，在本實施例 7 1321551 中，其係以氫氟酸（hf)作為玻璃#刻液’氫氟酸經由 一循環管路進流111導入該蝕刻循環槽110，並可將槽 内的氫氟酸由至少一循環管路迴流112導出再進入該 循瓖管路進流111，使得在該蝕刻循環槽11 〇内的氫氟 酸有著循環流動的效果。較佳地，該循環管路進流111 係設於該蝕刻循環槽 11 〇之底部中央，以形成一向上 流之循環機構。而該循環管路迴流1 1 2可設於該蝕刻循 環槽1 1 0之底部側緣或側向，該蝕刻循環槽1 1 〇之槽 肉另可設有一層流分配板（laminar flow distribution plate，圖未繪出），以確保向上流之循環功效。 此外’可於該蝕刻循環槽1 1 〇外裝HF濃度控制單 元與溫度控制單元（圖未繪出），能適時補充4 9 %濃度 HF新鮮液’以保持槽中HF濃度。 該基板固定機構120係用以固定複數個玻璃基板 10於該蝕刻循環槽110内。如第3圖所示’在本實施 例中’該基板固定機構12〇係可由一基板儲槽121與 一儲槽連結機構1 22所組成。如第1及4圖所示，該 基板儲槽121可平行置放複數個密集排列之破璃基板 10，例如可同時置放28片玻璃基板1〇，該些玻璃基 板1 〇之間隔係可不超過丨0mm，更可控制在不超過 5 m m為較佳。 亥柏努利振盪機構13〇係連接該基板固定機構 之該儲槽連結機構122，以使在該钮刻循環槽ΐι〇内 之玻璃基板1 0作振盪動作，藉此瞬間加快蝕刻液在該 8 1321551 些玻璃基板1 0之間的有限間隙内的流速。如第5圖所 示，柏努利振盪方向可在該些玻璃基板1〇之平行面 上。在本實施例中，該柏努利振盪機構丨3〇係包含有 一振盪方向改變機構131、一振盪驅動馬達132與適 當的傳導移動機構。較佳地，前述的振盪動作係為上 下、左右、圓周或上述任意組合之動作，能夠調整到 最佳的柏努利振堡動作，以均勻蝕刻每—片玻璃基板 1 〇之表面。如第6 Α圖所示，一種柏努利振盪動作係可 使玻璃基板U)左右振如第6B圖所示，—種柏努利 j蓋動作係可使玻璃基板10上下振蘯；如第6C圖所示， —種柏努利振盪動作係可使玻璃基板10順時針圓周振 盪，如第6D圖所示，一種柏努利振盪動作係可使玻璃基 板1〇逆時針圓周振盪。更理想的是，該柏努利振盪機構 1 3 0所提供的振盪動作係可為間歇性，故可藉由間歇 性控制振盈機構之振動及靜置時間交替，獲得最好蝕 刻效果°在本實施例中，達到柏努利流速增益的間歇 振盈頰率可設定在每分鐘五至三十次。相關試驗數 據如附表： 玻璃減薄實驗數據 溫度（。〇 HF濃度 蝕刻時間 蝕刻厚度 蝕刻迷率 均勻度 上下振盪 23 15% 50分 450μιη 9μιη/ιηίη 99% 左右振盪 23 ------ 15% 50分 450μιη 9μηι/πιΐη 99% 圆周振盪 ^-----J __23 15% 50分 450μιη 9μιη/πιΐη 99% 9 1321551 氮氣起泡 23 15% 50分 400μηι 8μιη/ηιίη ——-Ί 75%一 備註： 1 ·敍刻厚度量測設備··雷射干射儀。 2·姓刻速率=(蝕刻前厚度_蝕刻後厚度）+蝕刻時間。 (最大蝕刻厚度-最小蝕刻厚+平均蝕刻厚度。_^ 因此’該柏努利振蘆機構130可以產生該些玻璃基 板10相對於姓刻液的足夠剪力，讓該些玻璃基板1〇 在姓刻時表面殘留與析出的氟矽酸根顆粒能被慣性力 及向上流帶走，達到可在槽内密集排列玻璃基板且更 均勻的表面姓刻之功效。 以上所述’僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制’雖然本發明已以較佳實 施例揭露如上，然而並非用以限定本發明，任何熟悉 本項技術者，在不脫離本發明之技術範圍内，所作的 任何簡單修改、等效性變化與修飾，均仍屬於本發明 的技術範圍内。 【圖式簡單說明】 第1圖：依據本發明之一具體實施例，一種玻璃基板 均勻薄化裝置之側視示意圖。 第2圖：依據本發明之一具體實施例，該玻璃基板均 勻薄化裝置之底視示意圖。 第3圖：依據本發明之一具體實施例，該玻璃基板均 勻薄化裝置之基板固定機構之底視示意圖。 1321551 第4圖：依據本發明之一具體實施例，該玻璃基板均 勻薄化裝置之基板固定機構之前視示意圖。 第5圖：繪示使用本發明之裝置使玻璃基板緊密排列 並柏努利振盪之俯視示意圖。 第6A至6D圖：繪示使用本發明之裝置使玻璃基板可 在不同方向柏努利振盪之前視示意圖。 【主要元件符號說明】 1 〇玻璃基板 100玻璃基板均勻薄化裝置 1 1 0蝕刻循環槽 1 1 1循環管路進流 1 1 2循環管路迴流 120基板固定機構 1 2 1基板儲槽 122儲槽連結機構 1 3 0柏努利振盪機構 131 振盪方向改變機構 132振盪驅動馬達 11The amount of hydrogenation of less hydrofluoric acid (HF) prevents the hydrogen gas (ie, hydrogen fluoride) from diverging, evaporating, and vaporizing outward, causing corrosion of the metal components of the machine and avoiding the toxicity of the human body. Oscillator mechanism). The etch cycle is used to accommodate and renew the glass etchant. The substrate fixing mechanism is configured to fix a plurality of glass substrates in the circulation groove of the surname. The Bernoulli oscillating mechanism connects the substrate fixing mechanism to vibrate the glass substrate in the etching cycle. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the above-described glass substrate uniform thinning apparatus, the above-described oscillation operation is an operation of up, down, left and right, circumference, or any combination of the above. 6 In the aforementioned glass substrate uniform thinning apparatus, the Bernoulli oscillation mechanism includes an oscillation direction changing mechanism and an oscillation driving motor. In the above-described glass substrate uniform thinning apparatus, the aforementioned oscillating action is intermittent. In the above-described glass substrate uniform thinning device, the substrate fixing mechanism is composed of a substrate storage tank and a storage tank coupling mechanism. In the above-described glass substrate uniform thinning apparatus, the glass substrates are stored in parallel in the substrate storage tank. The aforementioned oscillation operation is parallel to the glass substrates. In the above-described glass substrate uniform thinning apparatus, the etch cycle groove is provided with an upward flow circulation mechanism. In the above-mentioned glass substrate uniform thinning apparatus, the etching circulation tank is connected with a circulation line inflow and at least one circulation line reflow, and the circulation line inflow is disposed at the center of the bottom of the etching circulation tank. In the above-mentioned glass substrate uniform thinning device, the etching cycle groove is provided with a laminar flow distribution plate. [Embodiment] In one embodiment of the present invention, FIG. 1 is a glass substrate. Side view of the uniform thinning device 1 《 "Fig. 2 is a bottom view of the glass substrate uniform thinning device 1 〇 0. As shown in Figs. 1 and 2, the glass substrate uniform thinning apparatus 100 mainly includes an etching cycle groove 11, a substrate fixing mechanism 120, and a Bernoulli oscillation mechanism 13 3 . The surname engraved groove 1 1 is used to accommodate and renew the glass etchant. As shown in Fig. 1, in the embodiment 7 1321551, the hydrofluoric acid (hf) is used as the glass #刻液' hydrofluoric acid is introduced into the etching cycle tank 110 through a circulation line inflow 111, and The hydrofluoric acid in the tank is led out from at least one circulation line reflux 112 and then into the circulation line inlet 111, so that the hydrofluoric acid in the etching circulation tank 11 has a circulating flow effect. Preferably, the circulation line inflow 111 is disposed at the center of the bottom of the etching circulation tank 11 to form an upward circulation mechanism. The circulation line recirculation 1 1 2 can be disposed at the bottom side edge or the lateral direction of the etching circulation tank 110, and the etching circulation tank 1 1 槽 can be provided with a laminar flow distribution plate. , the figure is not drawn) to ensure the circulation of the upward flow. Further, an HF concentration control unit and a temperature control unit (not shown) may be externally attached to the etching cycle tank 1 1 , and a 49 % concentration HF fresh liquid may be replenished in time to maintain the HF concentration in the tank. The substrate fixing mechanism 120 is for fixing a plurality of glass substrates 10 in the etching cycle groove 110. As shown in Fig. 3, in the present embodiment, the substrate holding mechanism 12 can be composed of a substrate reservoir 121 and a reservoir coupling mechanism 1 22. As shown in the first and fourth figures, the substrate storage tank 121 can be arranged in parallel with a plurality of densely arranged glass substrates 10, for example, 28 glass substrates can be placed at the same time, and the spacing of the glass substrates 1 can be More than 丨0mm, it is better to control no more than 5mm. The Hebronus oscillating mechanism 13 is connected to the sump coupling mechanism 122 of the substrate fixing mechanism to oscillate the glass substrate 10 in the reticle groove ,, thereby instantaneously accelerating the etchant 8 1321551 Flow rate in a limited gap between glass substrates 10 . As shown in Fig. 5, the Bernoulli oscillation direction can be on the parallel faces of the glass substrates 1''. In the present embodiment, the Bernoulli oscillating mechanism 包含3 includes an oscillating direction changing mechanism 131, an oscillating drive motor 132, and an appropriate conductive moving mechanism. Preferably, the aforementioned oscillating action is an action of up, down, left and right, circumference or any combination of the above, and the optimum Bernoulli vibration action can be adjusted to uniformly etch the surface of each of the glass substrates. As shown in Fig. 6, a Bernoulli oscillating action system can vibrate the glass substrate U) to the left and right as shown in Fig. 6B, and the Bernoulli j cover action system can vibrate the glass substrate 10 up and down; As shown in Fig. 6C, the Bernoulli oscillation operation causes the glass substrate 10 to oscillate clockwise. As shown in Fig. 6D, a Bernoulli oscillation operation causes the glass substrate 1 to oscillate counterclockwise. More preferably, the oscillating action provided by the Bernoulli oscillating mechanism 130 can be intermittent, so that the vibration of the vibration mechanism and the rest time can be alternately controlled to obtain the best etching effect. In this embodiment, the intermittent vibration rate of the Bernoulli flow rate gain can be set to five to thirty times per minute. Relevant test data such as the attached table: Glass thinning experimental data temperature (. 〇 HF concentration etching time etching thickness etching rate uniformity up and down oscillation 23 15% 50 minutes 450μιη 9μιη / ιηίη 99% oscillation 23 ------ 15 % 50分450μιη 9μηι/πιΐη 99% Circumferential oscillation ^-----J __23 15% 50 minutes 450μιη 9μιη/πιΐη 99% 9 1321551 Nitrogen foaming 23 15% 50 minutes 400μηι 8μιη/ηιίη ——-Ί 75% one Remarks: 1 · Describe the thickness measurement equipment · · Laser dry scatterer 2 · Surname rate = (thickness before etching _ thickness after etching) + etching time (maximum etching thickness - minimum etching thickness + average etching thickness. ^ Therefore, the Bernoulli hoist mechanism 130 can generate sufficient shear force of the glass substrate 10 relative to the surname of the engraved liquid, so that the surface of the glass substrate 1 can be left and precipitated at the time of surname The inertial force and the upward flow take away to achieve the effect of densely arranging the glass substrate in the groove and more uniform surface surname. The above description is only a preferred embodiment of the present invention, and does not form any form on the present invention. limit The present invention has been disclosed in the above preferred embodiments, but is not intended to limit the present invention, and any simple modifications, equivalent changes and modifications made by those skilled in the art without departing from the scope of the invention. It is still within the technical scope of the present invention. [Simplified description of the drawings] Fig. 1 is a side view showing a glass substrate uniform thinning device according to an embodiment of the present invention. Fig. 2: According to the present invention A bottom view of the glass substrate uniform thinning device according to a specific embodiment. FIG. 3 is a bottom view of the substrate fixing mechanism of the glass substrate uniform thinning device according to an embodiment of the present invention. 1321551 According to an embodiment of the present invention, a substrate fixing mechanism of the glass substrate uniform thinning device is front view. Fig. 5 is a schematic plan view showing the glass substrate being closely arranged and Bernoulli oscillation using the device of the present invention. 6A to 6D are diagrams showing the front view of the glass substrate which can be oscillated in different directions using the device of the present invention. Description of the symbols] 1 〇 glass substrate 100 glass substrate uniform thinning device 1 1 0 etching circulation tank 1 1 1 circulation line inflow 1 1 2 circulation line reflow 120 substrate fixing mechanism 1 2 1 substrate storage tank 122 storage connection Mechanism 1 30 0 Bernoulli oscillation mechanism 131 oscillation direction changing mechanism 132 oscillates the drive motor 11