TWI320514B - Negative photosensitive composition and lithography process thereof - Google Patents
Negative photosensitive composition and lithography process thereofInfo
- Publication number
- TWI320514B TWI320514B TW95110684A TW95110684A TWI320514B TW I320514 B TWI320514 B TW I320514B TW 95110684 A TW95110684 A TW 95110684A TW 95110684 A TW95110684 A TW 95110684A TW I320514 B TWI320514 B TW I320514B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive composition
- lithography process
- negative photosensitive
- negative
- lithography
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95110684A TWI320514B (en) | 2006-03-28 | 2006-03-28 | Negative photosensitive composition and lithography process thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95110684A TWI320514B (en) | 2006-03-28 | 2006-03-28 | Negative photosensitive composition and lithography process thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200736833A TW200736833A (en) | 2007-10-01 |
TWI320514B true TWI320514B (en) | 2010-02-11 |
Family
ID=45073751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95110684A TWI320514B (en) | 2006-03-28 | 2006-03-28 | Negative photosensitive composition and lithography process thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI320514B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9285680B2 (en) | 2014-07-16 | 2016-03-15 | Taiflex Scientific Co., Ltd. | Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition |
CN107203099A (en) * | 2016-03-18 | 2017-09-26 | 台湾积体电路制造股份有限公司 | Semiconductor devices and its manufacture method |
TWI725496B (en) * | 2018-12-21 | 2021-04-21 | 南韓商Lg化學股份有限公司 | Cross-linking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113867104A (en) * | 2021-09-01 | 2021-12-31 | 安徽光智科技有限公司 | Preparation method of photoresist structure for Lift-off |
-
2006
- 2006-03-28 TW TW95110684A patent/TWI320514B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9285680B2 (en) | 2014-07-16 | 2016-03-15 | Taiflex Scientific Co., Ltd. | Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition |
CN107203099A (en) * | 2016-03-18 | 2017-09-26 | 台湾积体电路制造股份有限公司 | Semiconductor devices and its manufacture method |
TWI725496B (en) * | 2018-12-21 | 2021-04-21 | 南韓商Lg化學股份有限公司 | Cross-linking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
US11754921B2 (en) | 2018-12-21 | 2023-09-12 | Lg Chem, Ltd. | Crosslinking agent compound, photosensitive composition comprising the same, and photosensitive material using the same |
Also Published As
Publication number | Publication date |
---|---|
TW200736833A (en) | 2007-10-01 |
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