TWI320421B - Epoxy resin composition and semiconductor device - Google Patents
Epoxy resin composition and semiconductor device Download PDFInfo
- Publication number
- TWI320421B TWI320421B TW093103542A TW93103542A TWI320421B TW I320421 B TWI320421 B TW I320421B TW 093103542 A TW093103542 A TW 093103542A TW 93103542 A TW93103542 A TW 93103542A TW I320421 B TWI320421 B TW I320421B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- resin composition
- epoxy resin
- coupling agent
- formula
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000007822 coupling agent Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
- C08L2666/72—Fillers; Inorganic pigments; Reinforcing additives
Description
第93103542號專利申請案 中文說明書更正頁 民國99年7月Μ日修正Patent Application No. 93103542 Chinese Correction Page Corrected the following day of July 1999
1320421 (10) 成型’注射成型之成型方法進行硬化成型即可。 以下代表本發明實施例,惟,本發明並未. 配合比例爲重量份者。 又,有關使用實施例及比較例之偶合劑及^ 下所示。 偶合劑1 :式(7 )所示偶合劑(信越化學 ’ ΚΒΜ - 573 ) NH-(CH2)3 — Si(OCH3)3 偶合劑2 :式(8 )所示偶合劑(信越化學 ,X 1 2 - 806 ) CH3(CH2)3 -NH-(CH2)3-Si(OCH3)3 偶合劑3 :式(9 )所示之偶合劑(信越化 製,KBM - 8 03 ) HS-(CH2)3-Si(OCH3)3 (9) 偶合劑4 :式(10 )所示之偶合劑(信越 )製,KBM-403) g限於此, 匕合物者如 (股份)製 (7) 〔股份)製 (8) $ (股份) ;學(股份1320421 (10) Molding 'Injection molding method can be hardened. The following are representative of the examples of the present invention, but the present invention is not. The blending ratio is in parts by weight. Further, the coupling agents of the examples and the comparative examples were used. Coupling agent 1: coupling agent represented by formula (7) (Shin-Etsu Chemical ' ΚΒΜ - 573 ) NH-(CH2) 3 - Si(OCH3) 3 coupling agent 2 : coupling agent represented by formula (8) (Xin Yue Chemical, X 1 2 - 806 ) CH3(CH2)3 -NH-(CH2)3-Si(OCH3)3 coupling agent 3: coupling agent represented by formula (9) (manufactured by Shin-Etsu Chemical Co., Ltd., KBM - 8 03 ) HS-(CH2) 3-Si(OCH3)3 (9) Coupling agent 4: The coupling agent (Shin-Etsu) of the formula (10), KBM-403) g is limited to this, and the compound of the compound such as (share) (7) [shares System (8) $ (shares); learning (shares
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003039620 | 2003-02-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200420658A TW200420658A (en) | 2004-10-16 |
TWI320421B true TWI320421B (en) | 2010-02-11 |
Family
ID=32905179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093103542A TWI320421B (en) | 2003-02-18 | 2004-02-13 | Epoxy resin composition and semiconductor device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4692885B2 (en) |
KR (1) | KR100982123B1 (en) |
CN (1) | CN1315905C (en) |
MY (1) | MY146460A (en) |
TW (1) | TWI320421B (en) |
WO (1) | WO2004074344A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006206696A (en) * | 2005-01-26 | 2006-08-10 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2006328360A (en) * | 2005-04-28 | 2006-12-07 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP5062714B2 (en) * | 2006-01-19 | 2012-10-31 | 日本化薬株式会社 | Active energy ray-curable resin composition and use thereof |
KR100699191B1 (en) * | 2006-03-13 | 2007-03-23 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and the semiconductor device using thereof |
JP4984722B2 (en) * | 2006-07-28 | 2012-07-25 | 住友ベークライト株式会社 | Epoxy resin composition, epoxy resin molding material and semiconductor device |
KR100834351B1 (en) * | 2006-11-24 | 2008-06-02 | 제일모직주식회사 | Epoxy Resin Composition for Encapsulating Multichip?Package and the Multichip?Package using the same |
KR100798675B1 (en) | 2006-12-12 | 2008-01-28 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor device and the semiconductor device using the??same |
JP5473196B2 (en) * | 2007-05-16 | 2014-04-16 | 東レ・ダウコーニング株式会社 | Curable epoxy resin composition and cured product thereof |
KR100934558B1 (en) * | 2007-10-08 | 2009-12-29 | 제일모직주식회사 | Adhesive film composition for semiconductor assembly comprising phenol type curable resin reacted with silane coupling agent and adhesive film |
KR101023241B1 (en) * | 2009-12-28 | 2011-03-21 | 제일모직주식회사 | Adhensive composition for semiconductor device and adhensive film using the same |
JP5423402B2 (en) * | 2010-01-06 | 2014-02-19 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
CN102372899A (en) * | 2010-08-11 | 2012-03-14 | 江苏中鹏新材料股份有限公司 | Flame-retarding green epoxy molding compound |
CN101962466B (en) * | 2010-09-25 | 2012-01-04 | 江苏中鹏新材料股份有限公司 | Intrinsic flame-retardant epoxy resin composition for semiconductor package |
CN101967266A (en) * | 2010-09-25 | 2011-02-09 | 江苏中鹏新材料股份有限公司 | Halogen-free fire-retarding epoxy resin composition |
JP2013108024A (en) * | 2011-11-24 | 2013-06-06 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing and electronic component device |
US20150130318A1 (en) * | 2012-03-01 | 2015-05-14 | Sumitomo Bakelite Co., Ltd. | Resin composition for rotor fixing, rotor, and automotive vehicle |
JP2013234303A (en) * | 2012-05-11 | 2013-11-21 | Panasonic Corp | Epoxy resin composition for sealing semiconductor and semiconductor device |
JP5949674B2 (en) | 2013-06-12 | 2016-07-13 | 信越化学工業株式会社 | Novel organosilicon compound, process for producing the same and adhesion improver |
CN106592281B (en) * | 2016-12-15 | 2019-05-28 | 武汉纺织大学 | A method of improving coating and is impregnated with efficiency |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3192953B2 (en) * | 1995-12-27 | 2001-07-30 | 住友ベークライト株式会社 | Epoxy resin molding material for semiconductor encapsulation and method for producing the same |
JP3267144B2 (en) * | 1996-03-22 | 2002-03-18 | 松下電工株式会社 | Epoxy resin composition for sealing material and semiconductor device using the same |
JPH11140277A (en) * | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device produced by using the composition |
JPH11140166A (en) * | 1997-11-11 | 1999-05-25 | Shin Etsu Chem Co Ltd | Epoxy resin composition for semiconductor sealing and semiconductor device |
JP3582576B2 (en) * | 1998-05-15 | 2004-10-27 | 信越化学工業株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
JP2000281751A (en) * | 1999-03-31 | 2000-10-10 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2001040186A (en) * | 1999-08-03 | 2001-02-13 | Nitto Denko Corp | Epoxy resin composition for sealing semiconductor and semiconductor apparatus using the same |
JP2001207031A (en) * | 2000-01-28 | 2001-07-31 | Nitto Denko Corp | Resin composition for semiconductor sealing and semiconductor device |
JP2001213942A (en) * | 2000-02-03 | 2001-08-07 | Nec Corp | Flame-retardant epoxy resin composition |
JP2002012742A (en) * | 2000-06-28 | 2002-01-15 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP4568985B2 (en) * | 2000-10-31 | 2010-10-27 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
JP2002179882A (en) * | 2000-12-07 | 2002-06-26 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2002220511A (en) * | 2001-01-25 | 2002-08-09 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing and semiconductor device |
JP4734731B2 (en) * | 2001-02-23 | 2011-07-27 | パナソニック電工株式会社 | Method for producing epoxy resin composition for semiconductor encapsulation |
JP2002317102A (en) * | 2001-04-20 | 2002-10-31 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP4849290B2 (en) * | 2001-06-26 | 2012-01-11 | 日立化成工業株式会社 | Epoxy resin molding material for sealing and electronic component device |
JP2003082068A (en) * | 2001-06-29 | 2003-03-19 | Toray Ind Inc | Epoxy resin composition and semiconductor device using the same |
JP5098125B2 (en) * | 2001-07-30 | 2012-12-12 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
JP2003252961A (en) * | 2002-03-05 | 2003-09-10 | Toray Ind Inc | Epoxy-based resin composition and semiconductor device using the composition |
-
2004
- 2004-02-13 JP JP2005502690A patent/JP4692885B2/en not_active Expired - Fee Related
- 2004-02-13 WO PCT/JP2004/001569 patent/WO2004074344A1/en active Application Filing
- 2004-02-13 TW TW093103542A patent/TWI320421B/en not_active IP Right Cessation
- 2004-02-13 KR KR1020057014583A patent/KR100982123B1/en active IP Right Grant
- 2004-02-13 CN CNB2004800030641A patent/CN1315905C/en not_active Expired - Fee Related
- 2004-02-14 MY MYPI20040483A patent/MY146460A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW200420658A (en) | 2004-10-16 |
KR100982123B1 (en) | 2010-09-14 |
WO2004074344A1 (en) | 2004-09-02 |
JP4692885B2 (en) | 2011-06-01 |
CN1745119A (en) | 2006-03-08 |
MY146460A (en) | 2012-08-15 |
KR20050107416A (en) | 2005-11-11 |
CN1315905C (en) | 2007-05-16 |
JPWO2004074344A1 (en) | 2006-06-01 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |