TWI319964B - - Google Patents
Info
- Publication number
- TWI319964B TWI319964B TW92118833A TW92118833A TWI319964B TW I319964 B TWI319964 B TW I319964B TW 92118833 A TW92118833 A TW 92118833A TW 92118833 A TW92118833 A TW 92118833A TW I319964 B TWI319964 B TW I319964B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002219967A JP4034612B2 (en) | 2002-07-29 | 2002-07-29 | Blind hole machining method for multilayer circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200402256A TW200402256A (en) | 2004-02-01 |
TWI319964B true TWI319964B (en) | 2010-01-21 |
Family
ID=31940739
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92118833A TW200402256A (en) | 2002-07-29 | 2003-07-10 | Multi-layered circuit board, detector for measurement, processing apparatus for blind through hole and processing method for blind through hole |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4034612B2 (en) |
CN (1) | CN100469499C (en) |
TW (1) | TW200402256A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4611010B2 (en) * | 2004-12-10 | 2011-01-12 | 日立ビアメカニクス株式会社 | Multilayer circuit board manufacturing method |
CN101537505B (en) * | 2008-12-30 | 2011-05-25 | 南京依利安达电子有限公司 | Small-aperture high-density drilling method of printed circuit board |
CN102069209B (en) * | 2010-12-22 | 2012-11-14 | 北京控制工程研究所 | Micropore drilling machining method of copper alloy and copper alloy parts |
CN102319976B (en) * | 2011-06-03 | 2012-12-26 | 哈尔滨飞机工业集团有限责任公司 | Method for processing locating hole of product locating piece in forming mould |
DE102013004679B4 (en) * | 2013-03-19 | 2017-11-23 | Skybrain Vermögensverwaltung GmbH | Apparatus and method for processing printed circuit boards |
TW201605315A (en) * | 2014-02-21 | 2016-02-01 | 維亞機械股份有限公司 | Backdrilling method, and backdrilling apparatus |
JP7054587B2 (en) * | 2016-11-25 | 2022-04-14 | ビアメカニクス株式会社 | Drilling equipment and drilling method |
CN106932709A (en) * | 2017-02-17 | 2017-07-07 | 李培培 | A kind of multilayer circuit board energization observation debugging apparatus |
JP6861581B2 (en) * | 2017-06-09 | 2021-04-21 | 三菱電機株式会社 | Multilayer board signal acquisition structure, signal acquisition device and electronic device |
-
2002
- 2002-07-29 JP JP2002219967A patent/JP4034612B2/en not_active Expired - Lifetime
-
2003
- 2003-07-10 TW TW92118833A patent/TW200402256A/en not_active IP Right Cessation
- 2003-07-24 CN CNB031503357A patent/CN100469499C/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN100469499C (en) | 2009-03-18 |
JP2004063771A (en) | 2004-02-26 |
TW200402256A (en) | 2004-02-01 |
JP4034612B2 (en) | 2008-01-16 |
CN1478626A (en) | 2004-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |