1316835 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於一種使焊粉僅限制性地附著至電子電路 板（包括印刷繞線板）之經暴露的精細金屬表面的方法， 一種使焊粉熔化且使焊粉層形成在經暴露之金屬表面的方 法’爲要安裝電子零件在電子電路板上，以及一種具有焊 粉預塗層形成在其上之電子電路板。 【先前技術】 近年來，已發展電子電路板，例如具有電子電路圖形 形成在絕緣基板，例如塑膠基板（可能包括膜）、陶瓷基 板或塗覆以塑膠材料之金屬基板的電子電板，且已廣泛地 採用各種藉焊接電子零件例如1C裝置、半導體晶片、電 阻器及電容器在分配平面上以構成電子電路的手段。 在此情況中，使電子零件之鉛末端黏合至一特定電路 ® 圖形之指定的部份上一般是藉以下步驟來達成：預先使焊 粉預塗層形成在電子電路板之經暴露的導電性電路電極 (金屬）表面上，將焊粉膏或助熔劑印刷於其上，使指定 之電子零件固定在適合位置上，隨後令焊粉預塗層單獨地 或與焊粉膏一同再流動，藉此焊接相關之元件。 近來，電子產品變小之趨勢已促使電子電路使用精細 之間距。精細間距之零件例如使用0.3毫米間距之QFP (四角形平封裝）-型LSI及CSP (晶片尺寸封裝），使 用0.15毫米間距之FC (倒裝晶片），MCM (多重晶片模 (2) 1316835 式），sip (封裝中之系統），P〇P (封裝上之封裝）及 3 DP (3維封裝）已多量地安裝在小面積內。因此，電子 電路板需要具有符合此種精細間距之限定的焊接電路圖 形。 爲了形成焊劑預塗層在電子電路板上，遵循電鍍方 法，HAL (熱空氣勻平劑）方法，或包含印刷焊粉膏且使 所產製之印刷物再流動之步驟的方法。然而，藉電鍍技術 • 產製焊劑電路的方法在使焊劑層有所需厚度方面有困難 性。HAL方法及依靠印刷焊劑膏的方法則受適應精細間距 圖形的困難性。 因此，至於形成焊劑預塗層在電子電路板卻不需麻煩 操作例如電路排列的方法，已揭示一種方法，其包含令膠 黏劑化合物與電子電路板之導電性電路電極表面反應，藉 此賦予表面膠黏性；使焊粉附著至所形成之膠黏部份；而 後加熱電子電路板，藉此熔化焊劑且形成焊劑預塗層（例 # 如，參考 JP-AHEI7-7244)。 依JP-A HEI 7-7244所揭示之方法，現在已可能藉簡 單操作以令焊劑預塗層形成在限定之電子電路圖上且因此 提供高可靠性之電子電路板。然而此方法需要一種防止靜 電累積的方法，因爲彼將乾的焊粉附著至電子電路板且結 果無法避免地使粉末黏附至未預定之部份而非所需之部 份’且也過度地黏附至電子電路板之經暴露之金屬表面。 藉乾技術附著焊劑會令粉末擴散且阻礙精細間距使用於電 子電路板。過度附著焊粉不容易藉乾處理回收的事實阻礙 -5- (3) 1316835 焊粉之有效利用。當使用之焊粉是微粉末時，此問題特別 顯著。 在一種藉使用膠黏劑化合物處理電子電路板之經暴露 的金屬表面（導電性電路電極表面）以將膠黏性賦予金屬 表面’令焊粉附著至所得之膠黏部份，而後加熱電子電路 板以熔化焊劑且形成焊劑預塗層的產製電子電路板方法 中’本發明是要提供一種在實施抗靜電方法後強烈附著焊 • 劑至膠黏部份的方法，一種使定量之欲被附著的焊粉可被 添加的方法，一種附著焊粉之方法以令電路圖形可以更限 定地完成，一種在起初附著後再使用沒有明顯變質之焊粉 的方法’及當焊劑尙未充分地附著時，一種校正焊粉附著 至電子電路板的方法。 在企圖解決上述問題所作之用心努力後，本發明人完 成本發明。 •【發明內容】 本發明之第一方面提供一種附著焊粉之方法，其包含 用膠黏劑化合物處理電子電路板之經暴露之金屬表面以將 膠黏性賦予金屬表面而形成膠黏部份且將懸浮在液體中之 焊粉漿供應給膠黏部份以使焊粉附著。 本發明之第二方面提供列於第一方面之方法，其中用 於焊粉漿之液體是脫氧化之水或添加抗腐蝕劑之水。 本發明之第三方面提供一種藉第一或第二方面所列之 附著焊粉之方法所預先附著之焊粉的除去方法，其包含使 -6- (4) 1316835 電子電路板浸於液體中或用液體噴灑以除去過度附著之焊 粉。 本發明之第四方面提供列於第三方面之方法’其中焊 粉除去期間所用之液體是脫氧化之水或添加抗腐蝕劑之 水。 本發明之第五方面提供列於第三或四方面之方法，其 中過度附著之焊粉藉著震動電子電路板或供彼之浸漬所用 # 之液體而除去。 本發明之第六方面提供列於第五方面之方法，其中除 去過度附著之焊粉的期間所用之震動源自電子電路板所受 之超音波震動或已受超音波震動之液體。 本發明之第七方面提供一種附著焊粉之方法，其包含 以下步驟：回收藉著第三至六方面中所列之焊粉除去方法 所除去之漿形式焊粉；且將回收之漿形式焊粉供應給電子 電路板之膠黏部份。 ® 本發明之第八方面提供一種產製經焊接之電子電路板 的方法，其包括以下步驟··用膠黏劑化合物處理電子電路 板之經暴露的金屬表面，以使金屬表面有膠黏性以形成膠 黏部份；供應懸浮於液體中之焊粉漿給該膠黏部份，以使 焊粉附著；以及熱熔化經附著之焊粉以形成電路。 本發明之第九方面提供一種經焊接之電子電路板’其 係藉第八方面所列之產製經焊接之電子電路板的方法所製 造。 本發明之第十方面提供一種使焊粉附著之方法，其包 (5) 1316835 括以下步驟：用膠黏劑化合物處理電子電路板之經暴露的 金屬表面，以使金屬表面有膠黏性以形成膠黏部份；供應 懸浮於液體中之焊粉漿給該膠黏部份，以使焊粉附著；且 在所形成之電子電路板有全無焊粉附著之部份發生時，將 焊粉漿供應給該部份以使焊粉附著至此。 藉本發明之使焊粉附著之方法以及使用彼以製造電子 電路板的方法，可能藉簡單之操作形成一種限定的焊接電 路圖形，卻絕對無衍生自靜電之麻煩且顯出高強度之焊粉 附著且使經回收之焊粉可再使用。特別地，即使在限定電 路圖形的情況中，它們可以產生減低鄰近電路途徑間之焊 接金屬之短路的效果，且顯注加強電子電路板之可靠性。 再者，藉本發明之製造電子電路板之方法，已可能實現具 有電子零件安裝其上之電子電路板的縮小化及授與高度可 靠性且使具有優越特性之電子裝置的提供成爲可能。 本發明之以上及其他目的、特性及優點經由下文所給 之描述且參考所附之圖示對於精於此技藝之人士而言是明 顯的。 【實施方式】 實施本發明之最佳模式 構成本發明之標的的電子電路板是單側電子電路板、 雙側電子電路板、多層電子電路板及可撓電子電路板’其 具有由金屬或其他導電物質所形成之電路圖形在塑膠基 板、塑膠膜基板、玻璃織物基板、紙基質環氧樹脂基板、 -8 - (6) 1316835 具有金屬板堆積在膠片上的基板或具有塗覆例如塑膠或陶 瓷物質的金屬基質的絕緣基板上。 本發明係關於一種附著焊粉之方法，其係藉著用膠黏 劑化合物處理電子電路板之導電性電路電極表面，使焊粉 附著至所得之膠黏部份，且使焊粉確實附著成限定的圖 形’同時完全避免因靜電所造成之麻煩，且增加焊粉附著 至膠黏部份的強度；以及關於一種產製焊接電子電路板的 # 方法，其係藉安置具有焊粉附著其上的電子電路板於液體 中’以使焊粉不附著至非預定部份或不過度附著，且隨後 加熱電子電路板以熔化所附著之焊粉且形成焊接電路。 雖然在大部份情況中使用銅做爲預定形成電路的經暴 露的導電性物質，本發明不需將此物質限制於銅，但此物 質僅需是導電性金屬而能藉膠黏劑化合物在表面上有膠黏 性，該膠黏劑化合物將特別描述於下文中。關於此描述之 物質的實例，可以提及鎳、錫、鎳-金及包括焊劑合金之 鲁金屬。 關於較佳可用於本發明之膠黏劑化合物，可以提及在 JP-A HEI 7-7244中所述之基於萘並***之衍生物，基於 苯並***之衍生物，基於咪唑之衍生物，基於苯並咪唑之 衍生物，基於氫硫基苯並噻唑之衍生物及苯並噻唑硫基脂 肪酸。雖然這些膠黏劑化合物特別對於銅有強的效果，它 們也能對其他導電性物質賦予膠黏性。 在將膠黏性賦予電子電路板上之導電性電路電極表面 之前，本發明選擇至少一種上列膠黏劑化合物，將彼溶於 -9 - 1316835 ⑺ 水’且調整所得溶液酸鹼値至約3至4之微酸性以利使 用。關於調整酸鹼値所用之物質的實例，可以提及無機酸 例如氫氯酸、硫酸、硝酸及磷酸，因爲導電性電路電極是 金屬製。也可以使用之有機酸是甲酸、乙酸、丙酸、蘋果 酸、草酸、丁二酸及酒石酸。雖然膠黏劑化合物之濃度並 不嚴格限制，彼較佳被調整以適於化合物之溶解性及使用 條件。整體而言，0.05質量％至20質量％範圍內之濃度可 # 容易使用。若彼低於此範圍之下限，則此短缺會使膠黏膜 不會充分地形成，此事實會破壞效能。 因形成速度及膠黏膜形成量之故，處理溫度較佳稍微 高於室溫。雖然彼並不限制且隨膠黏劑化合物濃度及金屬 種類而變化，彼通常適合在30 °C至60 °C之約略範圍內。 雖然處理時間並不限制，但因操作效率之故，有利地是要 調節酸鹼値，膠黏劑化合物濃度，處理溫度，及其他條件 以致使處理時間可在5秒至5分鐘之範圍內。 • 附帶地，在此情況下在溶液中以100至lOOOppm離子 濃度存在之銅（單價或二價）有利於加強膠黏膜之形成例 如形成速度及形成量。 在不需焊接之導電性電路部份而非欲被焊接在電子電 路板上之導電性電路電極表面部份已被阻障物塗覆且僅電 路圖形之導電性電路電部份（曝於基板上之金屬表面）已 被暴露後，欲被處理之電子電路板較佳用膠黏劑化合物溶 液來處理。 在此時，當帶有阻障物之電子電路板浸入膠黏劑化合 -10- (8) 1316835 物之溶液中或電子電路板用此溶液塗覆或噴灑時，將膠 性賦予導電性電路之電極表面。 關於欲被用於本發明之電子電路板產製方法的焊粉 金屬組成物的實例，被述及爲基於錫-鉛、基於錫-鉛 銀、基於錫一鉛一鉍、基於錫一鉛-鉍—銀、及基於錫 鉛-鎘之組成物。鑒於現今由工業廢棄物中排除鉛之 點，不含銻之基於錫一銦、基於錫一鉍、基於銦一銀、 φ 於銦-鉍、基於錫-鋅、基於錫-銀、基於錫-銅、基 錫一銻、基於錫一金、基於錫一鉍一銀一銅、基於錫 鍺、基於錫一鉍一銅、基於錫一銅—銻—銀、基於錫一 一鋅、基於錫—銅一銀 '基於錫一鉍一銻、基於錫一鉍 銻一鋅、基於錫—鉍一銅—鋅、基於錫一銀一銻、基於 一銀—銻—鋅、基於錫_銀—銅_鋅及基於錫-鋅一鉍 組成物證明是特佳的。 當使用選自不含鉛之焊劑的合金組成物，尤其是上 • 之不同種類組成物之焊粉，特佳是含錫與鋅或錫、鋅與 或錫與銀或錫、銀與銅以製造本發明之電子電路板時， 被安裝在板上之部份能有較長之使用壽命及多樣性。 至於焊粉之粒子直徑，日本工業標準（JIS)明示 至22微米、45至22微米、及38至22微米範圍，如篩 所測定者。爲要測定本發明之焊粉的平均粒子直徑，普 可以使用利用Π S所設定之標準篩及平衡的方法。此外 用顯微鏡之影像分析及依照電區（electrozone )法之寇 計數器也可用來測定。寇特計數器一其原則顯示於 黏 之 觀 基 於 銀 錫 之 列 祕 欲 5 3 遍 ， 特 -11 - (9) 13168351316835 (1) IX. INSTRUCTIONS OF THE INVENTION [Technical Field] The present invention relates to a method of attaching solder powder only to a restricted fine metal surface of an electronic circuit board (including a printed wiring board), The method of melting the solder powder and forming the solder powder layer on the exposed metal surface is to mount the electronic component on the electronic circuit board, and an electronic circuit board having the solder powder precoat formed thereon. [Prior Art] In recent years, electronic circuit boards have been developed, for example, electronic boards having electronic circuit patterns formed on an insulating substrate such as a plastic substrate (possibly including a film), a ceramic substrate, or a metal substrate coated with a plastic material, and A variety of means for soldering electronic components such as 1C devices, semiconductor wafers, resistors, and capacitors on a distribution plane to form an electronic circuit are widely employed. In this case, the bonding of the lead ends of the electronic components to the designated portions of a particular circuit® pattern is generally accomplished by the following steps: pre-forming the solder powder pre-coating to the exposed conductivity of the electronic circuit board. On the surface of the circuit electrode (metal), a solder paste or flux is printed thereon to fix the specified electronic component in a suitable position, and then the solder powder pre-coating is re-flowed separately or together with the solder paste. This welding related component. Recently, the trend toward smaller electronic products has led to the use of fine pitches in electronic circuits. Fine-pitch parts such as QFP (Quad Flat Package) with a 0.3 mm pitch - Type LSI and CSP (Chip Size Package), FC (Flip Chip) with 0.15 mm pitch, MCM (Multi Chip Die (2) 1316835) , sip (system in package), P〇P (package on package) and 3 DP (3D package) have been installed in a small area. Therefore, the electronic circuit board needs to have a soldering circuit pattern that conforms to the definition of such fine pitch. In order to form a flux precoat on an electronic circuit board, an electroplating method, a HAL (Hot Air Leveler) method, or a method including a step of printing a solder paste and reflowing the printed matter produced is followed. However, by electroplating technology, the method of producing a solder circuit has difficulty in making the solder layer have a desired thickness. The HAL method and the method of relying on a printed solder paste are difficult to adapt to fine pitch patterns. Therefore, as a method of forming a flux precoat layer on an electronic circuit board without cumbersome operation such as circuit arrangement, a method has been disclosed which comprises reacting an adhesive compound with a surface of a conductive circuit electrode of an electronic circuit board, thereby imparting Surface adhesiveness; adhesion of solder powder to the formed adhesive portion; and subsequent heating of the electronic circuit board, thereby melting the flux and forming a flux precoat (eg, refer to JP-AHEI 7-7244). According to the method disclosed in JP-A HEI 7-7244, it is now possible to carry out a simple operation to form a flux precoat layer on a defined electronic circuit diagram and thus provide a highly reliable electronic circuit board. However, this method requires a method of preventing static electricity accumulation because it attaches dry solder powder to an electronic circuit board and as a result inadvertently adheres the powder to an unpredetermined portion rather than a desired portion' and also excessively adheres. To the exposed metal surface of the electronic circuit board. Adhesive flux by dry technology can cause the powder to diffuse and prevent fine pitches from being applied to the electronic circuit board. The fact that over-adhesive solder powder is not easily recovered by dry processing is hindered by the effective use of -5- (3) 1316835 solder powder. This problem is particularly remarkable when the solder powder used is a fine powder. The method of treating an exposed metal surface (electroconductive circuit electrode surface) of an electronic circuit board by using an adhesive compound to impart adhesiveness to the metal surface to adhere the solder powder to the obtained adhesive portion, and then heating the electronic circuit In the method of producing an electronic circuit board for melting a flux and forming a flux precoating, the present invention provides a method for strongly adhering a soldering agent to an adhesive portion after performing an antistatic method, and a method for making a quantitative amount A method in which an attached solder powder can be added, a method of attaching a solder powder to make the circuit pattern more restrictive, a method of using a solder powder having no significant deterioration after initial attachment, and when the flux is not sufficiently adhered A method of correcting adhesion of solder powder to an electronic circuit board. The inventors have invented the invention after attempting to solve the above problems. • SUMMARY OF THE INVENTION A first aspect of the invention provides a method of adhering solder powder comprising treating an exposed metal surface of an electronic circuit board with an adhesive compound to impart adhesiveness to the metal surface to form a tacky portion The solder paste suspended in the liquid is supplied to the adhesive portion to adhere the solder powder. A second aspect of the invention provides the method of the first aspect, wherein the liquid used for the solder paste is deoxidized water or water added with an anticorrosive agent. A third aspect of the present invention provides a method for removing solder powder pre-attached by the method of adhering solder powder according to the first or second aspect, which comprises immersing a -6-(4) 1316835 electronic circuit board in a liquid Or spray with liquid to remove over-adhesive solder powder. A fourth aspect of the invention provides the method of the third aspect, wherein the liquid used during the removal of the solder powder is deoxidized water or water to which an anti-corrosion agent is added. A fifth aspect of the invention provides the method of the third or fourth aspect, wherein the excessively attached solder powder is removed by shaking the electronic circuit board or the liquid used for impregnation. A sixth aspect of the invention provides the method of the fifth aspect, wherein the vibration used during the solder paste attached to the degree of adhesion is derived from ultrasonic vibrations of the electronic circuit board or liquids which have been subjected to ultrasonic vibration. A seventh aspect of the present invention provides a method of adhering a solder powder, comprising the steps of: recovering a solder powder in the form of a slurry removed by the solder powder removing method listed in the third to sixth aspects; and welding the recovered slurry form The powder is supplied to the adhesive portion of the electronic circuit board. The eighth aspect of the present invention provides a method of producing a soldered electronic circuit board comprising the steps of: treating an exposed metal surface of an electronic circuit board with an adhesive compound to make the metal surface adhesive To form an adhesive portion; a solder paste suspended in the liquid is supplied to the adhesive portion to adhere the solder powder; and the adhered solder powder is thermally melted to form an electric circuit. A ninth aspect of the invention provides a soldered electronic circuit board which is manufactured by the method of producing a soldered electronic circuit board as set forth in the eighth aspect. A tenth aspect of the present invention provides a method of attaching solder powder, the package (5) 1316835 comprising the steps of: treating an exposed metal surface of an electronic circuit board with an adhesive compound to make the metal surface adhesive; Forming an adhesive portion; supplying a solder paste suspended in the liquid to the adhesive portion to adhere the solder powder; and welding when the formed electronic circuit board has a portion where no solder powder adheres The slurry is supplied to the portion to allow the solder powder to adhere thereto. By the method for adhering the solder powder of the present invention and the method for manufacturing the electronic circuit board, it is possible to form a limited soldering circuit pattern by a simple operation, but there is absolutely no trouble caused by static electricity and high-strength solder powder. Attached and reusable recycled solder powder. In particular, even in the case of defining a circuit pattern, they can produce an effect of reducing the short circuit of the solder metal between adjacent circuit paths, and significantly enhance the reliability of the electronic circuit board. Furthermore, with the method of manufacturing an electronic circuit board of the present invention, it has been possible to achieve downsizing and high reliability of an electronic circuit board on which an electronic component is mounted, and to provide an electronic device having superior characteristics. The above and other objects, features and advantages of the present invention will become apparent to those skilled in the <RTIgt [Embodiment] The best mode for carrying out the invention constitutes an electronic circuit board of the present invention, which is a single-sided electronic circuit board, a double-sided electronic circuit board, a multilayer electronic circuit board, and a flexible electronic circuit board, which has a metal or other The circuit pattern formed by the conductive material is on a plastic substrate, a plastic film substrate, a glass fabric substrate, a paper matrix epoxy substrate, a substrate having a metal plate deposited on the film or having a coating such as plastic or ceramic The metal substrate of the substance is on the insulating substrate. The invention relates to a method for attaching a solder powder by treating an electrode surface of a conductive circuit of an electronic circuit board with an adhesive compound, so that the solder powder adheres to the obtained adhesive portion, and the solder powder is surely attached thereto. The defined pattern 'at the same time completely avoids the trouble caused by static electricity and increases the strength of the solder powder adhering to the adhesive portion; and the # method for producing a soldered electronic circuit board, which is attached by having a solder powder attached thereto The electronic circuit board is in the liquid 'so that the solder powder does not adhere to an unintended portion or is not excessively attached, and then the electronic circuit board is heated to melt the attached solder powder and form a soldering circuit. Although copper is used in most cases as an exposed conductive material intended to form a circuit, the present invention does not need to limit this material to copper, but this material only needs to be a conductive metal and can be used as an adhesive compound. The surface is tacky and the adhesive compound will be specifically described below. As examples of the materials described herein, mention may be made of nickel, tin, nickel-gold and ruthenium metals including flux alloys. With respect to the adhesive compound preferably used in the present invention, a naphthotriazole-based derivative described in JP-A HEI 7-7244, a derivative based on benzotriazole, and an imidazole-based derivative may be mentioned. a derivative based on benzimidazole, a derivative based on thiothiabenzothiazole and a benzothiazolethio fatty acid. Although these adhesive compounds have a strong effect especially on copper, they can also impart adhesiveness to other conductive materials. Prior to imparting adhesion to the surface of the conductive circuit electrode on the electronic circuit board, the present invention selects at least one of the above listed adhesive compounds, dissolving it in -9 - 1316835 (7) water' and adjusting the resulting solution to a pH of about 3 to 4 is slightly acidic for use. As examples of the substance used for adjusting the acid and alkali hydrazine, inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid may be mentioned because the conductive circuit electrode is made of metal. Organic acids which may also be used are formic acid, acetic acid, propionic acid, malic acid, oxalic acid, succinic acid and tartaric acid. Although the concentration of the adhesive compound is not critical, it is preferably adjusted to suit the solubility and use conditions of the compound. Overall, the concentration in the range of 0.05% by mass to 20% by mass can be easily used. If it is below the lower limit of this range, this shortage will cause the adhesive film to not form sufficiently, which may impair the performance. The processing temperature is preferably slightly higher than room temperature due to the formation speed and the amount of the adhesive film formed. Although it is not limited and varies with the concentration of the adhesive compound and the type of metal, it is usually suitable for an approximate range of 30 ° C to 60 ° C. Although the treatment time is not limited, it is advantageous to adjust the pH, the viscosity of the adhesive compound, the treatment temperature, and other conditions due to the operational efficiency so that the treatment time can be in the range of 5 seconds to 5 minutes. • Incidentally, copper (monovalent or divalent) present in the solution at an ion concentration of 100 to 1000 ppm in the solution is advantageous for enhancing the formation of the adhesive film such as the formation speed and the amount of formation. The portion of the conductive circuit that does not need to be soldered, and the portion of the surface of the conductive circuit electrode to be soldered on the electronic circuit board has been coated with the barrier and only the conductive portion of the circuit pattern is exposed (subject to the substrate) After the metal surface has been exposed, the electronic circuit board to be processed is preferably treated with an adhesive compound solution. At this time, when the electronic circuit board with the barrier is immersed in the solution of the adhesive compound-10-(8) 1316835 or the electronic circuit board is coated or sprayed with the solution, the glue is imparted to the conductive circuit. The electrode surface. An example of a solder metal composition to be used in the electronic circuit board production method of the present invention is described as being based on tin-lead, tin-lead-based silver, tin-lead-based, tin-lead-based铋-silver, and a composition based on tin-lead-cadmium. In view of the current point of exclusion of lead from industrial waste, it is based on tin-indium, tin-based, indium-silver-based, φ-in-indium-based, tin-zinc-based, tin-silver-based, tin-based. Copper, base tin, tin-based gold, tin-based silver-based copper, tin-based, tin-based-copper-based, tin-copper-silver-based, tin-based-zinc-based, tin-based Copper-silver 'based on tin, one tin, one tin, one zinc, one tin, one copper, one zinc, one tin, one silver, one silver, one zinc, one tin, one silver Zinc and tin-zinc-based compositions have proven to be particularly good. When using alloy compositions selected from lead-free fluxes, especially solder powders of different types of compositions, it is particularly preferred to contain tin and zinc or tin, zinc and or tin and silver or tin, silver and copper. When the electronic circuit board of the present invention is manufactured, the portion mounted on the board can have a long service life and diversity. As for the particle diameter of the solder powder, Japanese Industrial Standard (JIS) is clearly indicated to be 22 μm, 45 to 22 μm, and 38 to 22 μm, as measured by a sieve. In order to determine the average particle diameter of the solder powder of the present invention, a standard sieve and a balance method set by Π S can be used. In addition, image analysis using a microscope and a counter in accordance with the electrozone method can also be used for measurement. The 计数器 counter is based on the principle that it is based on the silver tin. The secret is 5 3 times, special -11 - (9) 1316835
Powder Technology Handbook“ ( the Society o Technology所編輯’日本，第二版i9_2〇頁）， 下步驟以用來測定特定粉末之粒子直徑分布：令 分散於其中之溶液通過一個分配壁中開放的孔且 相反側的電阻變化。彼能高度再現性地測定粒子 比例。藉使用上述方法可以決定本發明之焊粉平 徑。 φ 在本發明中’藉供應懸浮於液體中之焊粉漿 路板之已賦予膠黏性之表面，以使焊粉附著至預 黏性之電子電路板，而避免靜電所引起之麻煩。 中，不限制焊粉漿對電子電路板之已賦予膠黏性 供應方向。 然而，爲了增加焊粉之附著厚度以及增加此 度，漿較佳約垂直供應至電子電路板之已賦予膠 面。圖1槪略地說明依本發明之使焊粉附著的方 • 確地，藉著使電子電路板3之已賦與膠黏性之表 上且選擇性地使用類似滴液漏斗之裝置由上方供 2，可以實施此供應。據推斷：焊粉垂直供應至 且能強烈地接觸膠黏部份。當然，即使與電子電 賦與膠黏性之表面平行地供應焊粉漿，也可令焊 膠黏部份達所需之程度。然而，在此情況中，此 度與漿垂直供應之情況相比是較低的。 附帶地，在圖1中雖然使用類似滴液漏斗的 應該漿，可以使用噴嘴自儲存槽連續供應在電子 f Powder 企圖藉以 具有粉末 測量孔之 直徑數目 均粒子直 給電子電 先提供膠 在此情況 之表面的 附著之強 黏性之表 法。爲明 面4轉向 應焊粉漿 膠黏部份 路板之已 粉附著至 附著之強 裝置來供 電路板之 -12- (10) 1316835 已賦予膠黏性之表面上。在焊粉附著期間或其附著後，較 佳地給予電子電路板0.1Hz至數百Hz範圍內或數百kHz 至數千kHz範圍內之震動。 漿液中焊粉之濃度較佳與焊粉仍保持流態之允許範圍 內一樣高。爲了使焊粉容易地沉積且避免結塊，欲被使用 之濃度有利地是受限於流體化之濃度（臨界濃度），即 8 0%以下且較佳地約30至50%。因爲臨界濃度大致隨著焊 劑粒子之形狀及尺寸，漿流速，液體黏度及震動運用而變 化且可以容易地被測試，使用條件下之臨界濃度需被確認 且易於引起結塊之濃度需預先被確認。 藉著使具有焊粉附著之電子電路板隨後受到液體中過 多焊粉之除去處理，可能防止除去期間焊粉因靜電而附著 至無膠黏之部份或防止焊粉因靜電而凝結且使精細間距之 電路板或焊劑微粉可被使用。 當藉乾技術實施焊粉之附著步驟時，使用例如塑膠基 板且要施加靜電的電子電路板企圖要產生靜電，同時其塑 膠表面在使焊粉附著至此之後用刷子來擦拭以除去過多之 焊粉。當焊粉是焊劑微粉時，彼甚至易於附著至已避免賦 予膠黏性之部份。結果’焊粉附著至非所要之部份且在電 路圖形中接鄰之電路線間引起短路。藉除去液體中之過多 焊粉’本發明已解決此問題，亦即靜電所引起之麻煩。 爲了防止靜電造成麻煩’本發明可以使用水或水與水 溶性低沸點有機溶劑之混合溶劑作爲供焊粉漿所用之液 體。考慮例如環境污染之問題時，水被證明是較佳的。在 -13 - (11) 1316835 此情況中，爲了防止焊粉被液體中溶解之氧所氧化’水較 佳是脫氧化之水的形式或添加有抗腐蝕劑之普通的水。 特別當預期有焊粉循環時，因要防止焊粉被液體中溶 解之氧所氧化，脫氧化之水及/或添加有抗腐蝕劑之普通 的水被證明是有利的。關於脫氧化之水，可以使用加熱脫 氣之水或充入惰性氣體例如二氧化碳氣體、氮氣或氬氣的 氣泡的水。當使用脫氧化的水及/或添加有抗腐蝕劑之水 時，爲了循環焊粉，此被證明是方便的，因爲除去焊粉之 表面處於防止被氧化的狀態。因爲抗腐蝕劑之使用在隨後 需要用水來清洗，簡單脫氧化之水的使用被證明是特佳 的。 本發明使得過多焊粉之除去可藉電子電路板浸於液體 中或噴灑以液體而實施。雖然可以藉著在液體中用刷子溫 和刷動電子電路板之表面以除去過多焊粉，但較佳對電子 電路板或除去焊劑之液體施以較佳在0.1HZ至數百Hz範 圍間或在數百kHz至數千kHz範圍間之震動以實施。在液 體中焊劑除去期間，因爲移入除去焊劑之液體中的焊劑容 易沉澱，故彼很容易回收，卻不引起擴散現象。 爲了防止本發明所用之焊粉被氧化，焊粉表面之塗覆 也證明是一較佳方法。關於用於焊粉之塗覆劑，較佳使用 至少一種選自苯並噻唑衍生物，具有4至10個碳原子數 之烷基的胺類，硫脲，甲矽烷偶合劑，鉛，錫，金，無機 酸鹽類’及有機酸鹽類者。關於有機酸鹽，較佳使用至少 —種選自月桂酸、肉豆蔻酸、棕櫚酸、及硬脂酸者。 -14- (12) 1316835 本發明之處理方法可以有效地被使用以形成***塊 (bump s) ’其不僅作爲上述之預先塗覆焊劑之電路板的 結合成份，也作爲 BGACSP ( Ball Grid Array Chip Size Package)及FC的結合成份。這些裝置自然被涵蓋在本發 明之電子電路板內。 已排除過多焊粉且已附著焊粉至其膠黏部份之電子電 路板而後被乾燥且隨後受到再流動步驟以加熱且熔化所附 φ 著之焊粉且得到焊接之電子電路板。因爲此加熱僅需熔化 附著至膠黏部份的焊粉，故藉著考慮焊粉之熔點即可容易 地決定處理溫度及處理時間。 因爲在液體中，自電子電路板所除去之過多焊粉可以 容易地與焊劑除去液體分離，它可被收集且回收且直接 (亦即不需乾燥）用來作爲焊粉漿以供附著焊粉之步驟之 用。 附帶地，焊粉漿用幫浦來排出且藉使用例如將來自底 # 部之焊粉流化直至其溢流之供應裝置，而將其用於焊粉之 一般附著步驟。關於供應裝置，也可以使用小尺寸形式之 滴液漏斗裝置。 .當沒有焊劑附著之部份發生在電子電路板已進行一般 焊接處理之後，該部份藉著用膠黏劑化合物處理而被提供 膠黏性且所得之膠黏部份藉使用供應裝置例如滴液漏斗來 供應焊粉漿。當沒有焊劑附著之部份發生在電子電路板已 藉膠黏劑處理而被提供膠黏性且焊粉已附著至所得之膠黏 部份之後，藉使用小尺寸滴液漏斗型式的供應裝置來將焊 -15- (13) 1316835 粉漿供應給彼。這些裝置可以用來製備 藉本發明所製造之焊接電子電路板 裝電子零件之方法，該方法包含將電子 著使焊粉再流動而黏合電子零件。例如 發明形成在電子電路板之電極上，焊劑 至此’電子零件（例如晶片部份，C S P 上，且再流動熱源被啓動以正確地進行 • 流動熱源，可以利用熱空氣爐 '紅外加 置、光束焊接裝置及類似者。 在電極恰巧使用太精細之間距以致 劑膏的情況中，電子零件結合至電路板 成：藉印刷膠黏助熔劑在預先提供有焊 且安裝電子零件（例如半導體晶片）在 熔劑至電子零件上之***物，安裝電子 焊劑預塗層之電極上，隨後使相關之介 • 再者，也有效地使用安裝半導體晶 種包含以下步驟之方法：形成金***物 半導體晶片電極上且藉施加壓力及熱以 電路板之電極上的金***物及焊劑預塗 包含以下步驟之方法：供應膏狀或片形 電路板上且藉施加壓力及熱以使具有金 上之半導體晶片進行熱加壓黏合至該樹 本發明所預期之再流動方法隨著焊 化。在基於錫-鋅之合金例如9 1錫/9 ^ 且校正焊接電路。 可以有利地用於安 零件安置定位且藉 ，焊劑預塗層藉本 膏藉印刷技術供應 等）安裝在焊劑膏 焊接黏合。關於再 熱爐、凝結焊接裝 不能藉印刷塗覆焊 可以藉以下步驟完 劑預塗層之電極上 其上或供應膠黏助 零件在預先提供有 質再流動。 片的方法，例如一 (螺栓***物）在 將這些形成在電子 層黏合；以及一種 之非導電性樹脂在 ***物形成在電極 脂。 接合金之組成而變 痒、89錫/ 8鋅/3鉍 -16- (14) 1316835 及8 6錫/8鋅/6鉍的情況中，此方法較佳用二步驟，亦 預先加熱及再流動來完成。關於此二步驟之條件，預先 熱之溫度是在130至180 °C ’較佳是13〇至150 °C範 內；預先加熱時間是在60至120秒，較佳是在60至 秒範圍內；再流動溫度是在21〇至23〇°c，較佳是210 220°C範圍內；且再流動時間是在30至60秒，較佳是 3 0至4 0秒範圍間。在其他合金系統中再流動溫度，與 • 用之合金的熔點相差+20至+50°C，較佳是+20至+30°C 圍間。其他預先加熱溫度，預先加熱時間及再流動時間 是在上述相同範圍間。 再流動方法可以在氮氣或空氣中進行。在氮氣再流 之情況中，當氧濃度調節至5表觀體積％或以下，較 0.5表觀體積％或以下時，與開放之空氣再流動情況 比，處理可被安定化，因爲由焊劑對焊接電路板所顯示 潤濕性質被加強且焊劑球之發生率減低。 實例1 : 製造具有5 0微米之極小電極間隔的印刷繞線板。 用銅作爲導電性電路。至於膠黏劑化合物溶液，可以使 以乙酸調至酸鹼値約4之2質量％之以下通式（1 )所示 基於咪唑化合物的水溶液： 即 加 圍 90 至 在 所 範 則 動 佳 相 之 使 用 之 • * _ (1) (15) • * _ (1) (15)Powder Technology Handbook" (edited by the Society o Technology 'Japan, Second Edition i9_2 〇 page), the next step is to determine the particle diameter distribution of a specific powder: the solution dispersed therein passes through an open hole in a distribution wall and The resistance change on the opposite side. The height ratio of the powder can be determined reproducibly. The diameter of the solder powder of the present invention can be determined by the above method. φ In the present invention, by using a solder paste slurry board suspended in a liquid. The adhesive surface is imparted to adhere the solder powder to the pre-adhesive electronic circuit board to avoid the trouble caused by static electricity. However, the solder paste is not limited to the adhesive supply direction of the electronic circuit board. In order to increase the adhesion thickness of the solder powder and increase the degree, the slurry is preferably supplied perpendicularly to the rubberized surface of the electronic circuit board. FIG. 1 schematically illustrates the method of attaching the solder powder according to the present invention. This supply can be carried out by placing the electronic circuit board 3 on the surface of the adhesive and selectively using a device similar to a dropping funnel from above. It is inferred that: Supply and strong contact with the adhesive part. Of course, even if the solder paste is supplied in parallel with the surface of the electronically-adhesive and adhesive, the adhesive can be glued to the required extent. However, here In the case, this degree is lower compared to the case where the slurry is supplied vertically. Incidentally, although a slurry similar to a dropping funnel is used in Fig. 1, a nozzle can be continuously supplied from the storage tank in an electronic f powder in an attempt to have The number of diameters of the powder measuring holes is the same as the strong adhesion of the surface of the powder to the surface of the rubber in the case of the surface of the powder. A strong adhesion device is provided on the surface of the board -12-(10) 1316835 that has been imparted to the adhesive. During the adhesion of the solder powder or after its attachment, the electronic circuit board is preferably given in the range of 0.1 Hz to several hundred Hz. Or vibrations in the range of hundreds of kHz to several thousand kHz. The concentration of the solder powder in the slurry is preferably as high as the allowable range in which the solder powder remains fluid. In order to allow the solder powder to be easily deposited and avoid agglomeration, it is intended to be used. Concentrated Limited to fluidized concentration (critical concentration), ie below 80% and preferably from about 30 to 50%. Because the critical concentration varies approximately with the shape and size of the flux particles, slurry flow rate, liquid viscosity and vibration application. And can be easily tested, the critical concentration under the conditions of use needs to be confirmed and the concentration of the agglomerate is easily confirmed in advance. By the electronic circuit board with the solder powder attached is subsequently subjected to the removal of excess solder powder in the liquid, It is possible to prevent the solder powder from adhering to the non-adhesive portion due to static electricity during the removal or to prevent the solder powder from condensing due to static electricity and to allow a fine pitch of the circuit board or the fine powder of the solder to be used. When the soldering powder attachment step is performed by the dry technique An electronic circuit board using, for example, a plastic substrate and applying static electricity is attempted to generate static electricity, and its plastic surface is wiped with a brush to remove excess solder powder after the solder powder is attached thereto. When the solder powder is a flux micropowder, it is even easier to adhere to the part that has been prevented from imparting adhesiveness. As a result, the solder powder adhered to an undesired portion and caused a short circuit between adjacent circuit lines in the circuit pattern. By removing excess solder powder from the liquid, the present invention has solved this problem, that is, the trouble caused by static electricity. In order to prevent the trouble of static electricity, the present invention can use water or a mixed solvent of water and a water-soluble low-boiling organic solvent as a liquid for the solder paste. Water has proven to be preferred when considering issues such as environmental pollution. In the case of -13 - (11) 1316835, in order to prevent the solder powder from being oxidized by the dissolved oxygen in the liquid, the water is preferably in the form of deoxidized water or ordinary water to which an anticorrosive agent is added. Particularly when solder powder circulation is expected, it is proved to be advantageous to prevent the solder powder from being oxidized by the dissolved oxygen in the liquid, and deoxidized water and/or ordinary water to which an anticorrosive agent is added has proven to be advantageous. As the deoxidized water, water heated by degassing or water filled with an inert gas such as carbon dioxide gas, nitrogen gas or argon gas may be used. When deoxidized water and/or water to which an anticorrosive agent is added, this has proven to be convenient for circulating the solder powder because the surface on which the solder powder is removed is in a state of preventing oxidation. Since the use of corrosion inhibitors requires subsequent cleaning with water, the use of simple deoxidized water has proven to be particularly good. The present invention allows the removal of excess solder powder to be carried out by immersing the electronic circuit board in a liquid or spraying it with a liquid. Although it is possible to remove the excessive solder powder by gently brushing the surface of the electronic circuit board with a brush in the liquid, it is preferred to apply the electronic circuit board or the flux-removing liquid preferably in the range of 0.1 Hz to several hundreds Hz or Vibrations in the range of hundreds of kHz to several thousand kHz are implemented. During the removal of the flux in the liquid, since the flux transferred into the flux-removing liquid is easily precipitated, it is easy to recover without causing diffusion. In order to prevent the solder powder used in the present invention from being oxidized, the coating of the surface of the solder powder has also proved to be a preferred method. As the coating agent for solder powder, it is preferred to use at least one amine selected from the group consisting of benzothiazole derivatives, an alkyl group having 4 to 10 carbon atoms, thiourea, a decane coupling agent, lead, tin, Gold, inorganic acid salts' and organic acid salts. As the organic acid salt, at least one selected from the group consisting of lauric acid, myristic acid, palmitic acid, and stearic acid is preferably used. -14- (12) 1316835 The treatment method of the present invention can be effectively used to form a bump s which not only serves as a combination of the above-mentioned pre-coated solder circuit board, but also as a BGACSP (Ball Grid Array Chip). Size Package) and the combination of FC. These devices are naturally encompassed within the electronic circuit board of the present invention. Excessive solder powder has been removed and the solder powder has been attached to the electronic circuit board of its adhesive portion and then dried and subsequently subjected to a reflow step to heat and melt the attached solder powder and obtain a soldered electronic circuit board. Since this heating only needs to melt the solder powder attached to the adhesive portion, the processing temperature and the processing time can be easily determined by considering the melting point of the solder powder. Because in the liquid, too much solder powder removed from the electronic circuit board can be easily separated from the flux removal liquid, it can be collected and recovered and used directly (ie, without drying) as a solder paste for attaching solder powder. The steps are used. Incidentally, the solder paste is discharged by a pump and used for a general attachment step of the solder powder by using, for example, a supply device for fluidizing the solder powder from the bottom portion until it overflows. As for the supply device, a small-sized drip funnel device can also be used. When no solder adhesion occurs after the electronic circuit board has been subjected to general soldering treatment, the portion is provided with adhesiveness by treatment with an adhesive compound and the resulting adhesive portion is supplied by a supply device such as a drop. The liquid funnel supplies the solder paste. When the portion where no solder is attached occurs after the electronic circuit board has been treated with an adhesive to provide adhesiveness and the solder powder has adhered to the obtained adhesive portion, a small-sized dropping funnel type supply device is used. Supply the welding -15- (13) 1316835 slurry to him. These devices can be used to prepare electronic components for soldering electronic circuit boards fabricated by the present invention, which comprise electron re-flowing solder powder to bond electronic components. For example, the invention is formed on the electrodes of the electronic circuit board, the flux is here to the 'electronic parts (such as the wafer part, the CSP, and the reflow heat source is activated to perform correctly • the flow heat source can be utilized by the hot air furnace 'infrared addition, beam Soldering devices and the like. In the case where the electrodes happen to use too fine a distance between the pastes, the electronic components are bonded to the board: by printing the adhesive flux in advance with solder and mounting electronic parts (such as semiconductor wafers) The flux is applied to the bump on the electronic component, and the electrode of the electronic solder pre-coat is mounted, and then the related matter is further used. Further, the method of mounting the semiconductor seed crystal is also used to include the following steps: forming a gold bump semiconductor wafer electrode And pre-coating the gold bumps and solder on the electrodes of the circuit board by applying pressure and heat, comprising the steps of: supplying a paste or a chip board and applying pressure and heat to cause the semiconductor wafer having gold to be processed. Thermal compression bonding to the tree The reflow method contemplated by the present invention follows soldering. Based on tin-zinc combination For example, 91 tin / solder 9 ^ and correction circuit can advantageously be used by security part is disposed and positioned, solder paste is pre-coated by a printing technique by the present supply, etc.) mounted on the solder paste solder bonding. About Reheating Furnace, Condensation Welding Cannot be coated by welding. The following steps can be used to complete the pre-coated electrode or supply the adhesive auxiliary parts in advance to provide a reflow. The sheet method, for example, a (bolt bump) is formed by bonding these to the electron layer; and a non-conductive resin is formed on the bump in the bump. In the case where the composition of the gold is itch, 89 tin / 8 zinc / 3 铋 -16 - (14) 1316835 and 8 6 tin / 8 zinc / 6 铋, this method is preferably carried out in two steps, also preheated and then Flow to complete. With regard to the conditions of the two steps, the preheating temperature is in the range of 130 to 180 ° C', preferably 13 to 150 ° C; the preheating time is in the range of 60 to 120 seconds, preferably in the range of 60 to 2 seconds. The reflow temperature is in the range of 21 Torr to 23 ° C, preferably 210 220 ° C; and the reflow time is in the range of 30 to 60 seconds, preferably 30 to 40 seconds. The reflow temperature in other alloy systems differs from the melting point of the alloy used by +20 to +50 ° C, preferably between +20 and +30 ° C. Other preheating temperatures, preheating times, and reflow times are between the same ranges as described above. The reflow method can be carried out in nitrogen or air. In the case of nitrogen reflow, when the oxygen concentration is adjusted to 5% by volume or less, compared to 0.5% by volume or less, the treatment can be stabilized compared to the open air reflow condition because of the flux pair The wettability of the soldered circuit board is enhanced and the incidence of solder balls is reduced. Example 1: A printed wire wound plate having a very small electrode spacing of 50 microns was fabricated. Copper is used as the conductive circuit. As for the solution of the adhesive compound, an aqueous solution of the imidazole compound represented by the following formula (1) represented by the following formula (1) adjusted to about 2% by mass of the acid-base hydrazine can be adjusted by the acetic acid: Use • * _ (1) (15) • * _ (1) (15)
13168351316835
HC-NHHC-NH
C 水溶液加熱至40 °C。在經加熱之水溶液中，用氫 水溶液預先處理之印刷繞線板浸漬3分鐘以在銅電路 形成膠黏物質。 而後，藉分散具有約20微米平均粒子直徑的96. /3 .5銀之焊粉於脫氧化之水所形成50體積％之漿使用 所示之裝置以供應在印刷繞線板上，同時印刷繞線板 50Hz之震動以使焊粉附著至此板。在印刷繞線板於 化之水中稍微震動且洗出之後，因此具有焊粉附著的 繞線板被乾燥。 在藉噴灑供應助熔劑後，印刷繞線板置於240°C 且在其中加熱以熔化焊粉且形成具有約20微米厚之 錫/3.5銀之焊劑預塗層在銅電路之經暴露之部份上。 地，焊粉之平均粒子直徑使用MICROTRAC®來測定。 製之焊接電路絕對無橋。 實例2: 製造一個印刷繞線板，其提供使用70微米電極 及60微米電極間隔的區陣（area array)。銅用作導 電路。 關於膠黏劑化合物溶液，使用如實例1中所用之 氯酸 表面 5錫 圖1 曝於 脫氧 印刷 爐中 96.5 附帶 所產 直徑 電性 2質 -18- (16) 1316835 量％之相同之基於咪唑化合物的水溶液且用乙酸調節酸鹼 値至約4。水溶液加熱至40°C。在經加熱之水溶液中，用 氫氯酸水溶液預先處理之印刷繞線板浸漬3分鐘以使膠黏 物質形成在銅電路表面。 而後，藉分散具有約60微米平均粒子直徑的96.5錫 /3.5銀之焊粉於脫氧化之水所形成50體積％之漿使用圖1 中所示之裝置以供應在印刷繞線板上，同時印刷繞線板曝 φ 於50Hz之震動。在印刷繞線板於脫氧化之水中稍微震動 且洗出之後，所得之具有焊粉附著的印刷繞線板被乾燥。 在藉噴灑供應助熔劑後，印刷繞線板置於240 °C爐中 且在其中加熱以熔化焊粉。 形成具有約40微米厚之96.5錫/3.5銀之焊劑***物 在銅電路之經暴露之部份上。 優越之***物形成在焊接電路上且一點也沒有形成缺 點例如橋及避開***物之部份。 工業應用性： 在電極上提供有焊劑預塗層之焊接電子電路板的產製 方法是藉著對基板上經暴露之金屬部份賦予膠黏性，焊粉 附著至所形成之膠黏部份，而後除去液體中過度附著之焊 粉，加熱已除去過度附著之焊粉之電子電路板以熔化焊 粉，此產製方法即使在精細電路圖形之情況中達成鄰近電 路線間焊接金屬之短路減低效果且使顯著加強可靠性之焊 接電子電路板可被產製。 **19- (17) 1316835 結果，以下已變爲可能：實現其上安裝有精細電路圖 形之電子零件且富有可靠性之電路板的縮小化；提供一種 電子電路，一種能實現高度可靠性及高度安裝密度的安裝 有電子零件的電路板，以及一種具有優越特性之電子裝 置；且使本發明方法能應用於電子裝置之產製。 可以加強焊粉之利用因數，因爲經回收之過多的焊粉 可被回收且循環於焊粉附著步驟中。 【圖式簡單說明】 圖1是說明本發明所預期之焊粉附著方法的槪略圖。 【主要元件符號說明】 1 :滴液漏斗 2 :漿 3 :電子電路板 4:已賦予膠黏性之表面 -20-The C aqueous solution is heated to 40 °C. In the heated aqueous solution, the printed wiring board pretreated with an aqueous hydrogen solution was immersed for 3 minutes to form a sticky substance in the copper circuit. Then, 50% by volume of the slurry formed by dispersing the 96. /3.5 silver solder powder having an average particle diameter of about 20 μm in deoxidized water was used to supply the printed wiring board while printing. Winding the board at 50 Hz to attach the solder powder to the board. After slightly vibrating and washing out of the water in which the printed bobbin is varnished, the bobbin having the adhesion of the solder powder is dried. After the flux is supplied by spraying, the printed wiring board is placed at 240 ° C and heated therein to melt the solder powder and form a solder precoat having a tin/3.5 silver thickness of about 20 μm in the exposed portion of the copper circuit. Share. Ground, the average particle diameter of the solder powder is measured using MICROTRAC®. The welding circuit is absolutely bridgeless. Example 2: A printed bobbin was fabricated which provided an area array using 70 micron electrodes and 60 micron electrode spacing. Copper is used as a conductive circuit. For the adhesive compound solution, use the chloric acid surface as shown in Example 1 5 tin Figure 1 exposed to a deoxygenation printing furnace 96.5 with the diameter of the produced material 2 -18- (16) 1316835% by weight of the same imidazole An aqueous solution of the compound is adjusted to about 4 with acetic acid. The aqueous solution was heated to 40 °C. In the heated aqueous solution, the printed wiring board pretreated with an aqueous hydrochloric acid solution was immersed for 3 minutes to form an adhesive substance on the surface of the copper circuit. Then, a 50% by volume slurry formed by dispersing 96.5 tin/3.5 silver solder powder having an average particle diameter of about 60 μm in deoxidized water was used to supply the printed wiring board while using the apparatus shown in FIG. The printed bobbin is exposed to a vibration of 50 Hz. After the printed wiring board is slightly shaken in the deoxidized water and washed out, the resulting printed wiring board with solder powder adhesion is dried. After the flux is supplied by spraying, the printed bobbin is placed in a 240 ° C oven and heated therein to melt the solder powder. A flux bump of 96.5 tin/3.5 silver having a thickness of about 40 microns is formed over the exposed portion of the copper circuit. The superior bumps are formed on the soldering circuit and do not form defects such as bridges and portions that avoid the bumps. Industrial Applicability: A soldered electronic circuit board provided with a flux precoat on the electrode is produced by imparting adhesiveness to the exposed metal portion of the substrate, and the solder powder is adhered to the formed adhesive portion. And then removing the excessively adhered solder powder in the liquid, heating the electronic circuit board from which the excessively attached solder powder has been removed to melt the solder powder, and the production method achieves a short circuit of the solder metal between adjacent circuit lines even in the case of a fine circuit pattern. A soldered electronic circuit board that is effective and that significantly enhances reliability can be produced. **19- (17) 1316835 As a result, it has become possible to achieve a reduction in the reliability of a circuit board on which electronic components with fine circuit patterns are mounted, and an electronic circuit capable of achieving high reliability and A highly mounted density circuit board mounted with electronic components, and an electronic device having superior characteristics; and the method of the present invention can be applied to the production of electronic devices. The utilization factor of the solder powder can be enhanced because the excessively recovered solder powder can be recovered and recycled in the solder powder attaching step. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a solder powder attaching method contemplated by the present invention. [Explanation of main component symbols] 1 : Dropping funnel 2 : Pulp 3 : Electronic circuit board 4: Surface that has been given adhesiveness -20-