TWI315898B - Device probing using a matching device - Google Patents

Device probing using a matching device

Info

Publication number
TWI315898B
TWI315898B TW095102079A TW95102079A TWI315898B TW I315898 B TWI315898 B TW I315898B TW 095102079 A TW095102079 A TW 095102079A TW 95102079 A TW95102079 A TW 95102079A TW I315898 B TWI315898 B TW I315898B
Authority
TW
Taiwan
Prior art keywords
probing
matching
matching device
device probing
Prior art date
Application number
TW095102079A
Other languages
English (en)
Other versions
TW200633108A (en
Inventor
Mark L Diorio
Original Assignee
Celerity Res Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celerity Res Inc filed Critical Celerity Res Inc
Publication of TW200633108A publication Critical patent/TW200633108A/zh
Application granted granted Critical
Publication of TWI315898B publication Critical patent/TWI315898B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/44—Modifications of instruments for temperature compensation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095102079A 2003-05-01 2004-04-15 Device probing using a matching device TWI315898B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/428,572 US6984996B2 (en) 2003-05-01 2003-05-01 Wafer probing that conditions devices for flip-chip bonding
US10/718,031 US7405581B2 (en) 2003-05-01 2003-11-19 Probing system uses a probe device including probe tips on a surface of a semiconductor die

Publications (2)

Publication Number Publication Date
TW200633108A TW200633108A (en) 2006-09-16
TWI315898B true TWI315898B (en) 2009-10-11

Family

ID=33310437

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102079A TWI315898B (en) 2003-05-01 2004-04-15 Device probing using a matching device

Country Status (3)

Country Link
US (4) US6984996B2 (zh)
CN (2) CN1798977B (zh)
TW (1) TWI315898B (zh)

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TWI534432B (zh) 2010-09-07 2016-05-21 瓊斯科技國際公司 用於微電路測試器之電氣傳導針腳
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KR101109401B1 (ko) 2010-10-05 2012-01-30 삼성전기주식회사 기판의 코이닝-전기검사 장치
CN102288858A (zh) * 2011-05-19 2011-12-21 昆山鑫立电子科技有限公司 一种用于印制电路板的检测装置
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CN103730376B (zh) * 2012-10-15 2018-04-03 华邦电子股份有限公司 封装测试方法
CN103779250B (zh) * 2012-10-22 2017-02-15 展讯通信（上海）有限公司 用于倒装芯片的电学测试的装置和方法
US9207275B2 (en) * 2012-12-14 2015-12-08 International Business Machines Corporation Interconnect solder bumps for die testing
KR102090578B1 (ko) * 2013-05-06 2020-03-19 삼성디스플레이 주식회사 전자 장치의 기판, 이를 포함하는 전자 장치 및 접속부의 저항 측정 방법
CN103926430B (zh) * 2014-04-23 2016-09-21 华进半导体封装先导技术研发中心有限公司 一种硅通孔转接板测试方法
US20170023617A1 (en) * 2015-06-10 2017-01-26 Translarity, Inc. Shaping of contact structures for semiconductor test, and associated systems and methods
CN104914339A (zh) * 2015-06-10 2015-09-16 中国航天科技集团公司第九研究院第七七一研究所 一种面向ate机台的高速测试***及其加工方法
TWI593982B (zh) * 2016-03-04 2017-08-01 中華精測科技股份有限公司 探針卡檢測設備
US10001508B2 (en) * 2016-06-17 2018-06-19 International Business Machines Corporation Integrated self-coining probe
KR102252595B1 (ko) * 2017-04-18 2021-05-17 삼성전자주식회사 프로브 및 이를 포함하는 프로브 카드
US20180358321A1 (en) * 2017-06-13 2018-12-13 International Business Machines Corporation Pressing solder bumps to match probe profile during wafer level testing
CN109115391B (zh) * 2017-06-26 2024-06-04 华景传感科技（无锡）有限公司 一种mems压力传感器
TWI668058B (zh) * 2017-07-18 2019-08-11 漢民測試系統股份有限公司 探針清潔裝置
US10269611B1 (en) * 2017-11-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for bonding semiconductor devices
CN109900931B (zh) * 2017-12-08 2021-03-30 京元电子股份有限公司 半导体组件测试连接接口
CN110007117A (zh) * 2018-01-05 2019-07-12 旺矽科技股份有限公司 探针卡
KR102457527B1 (ko) * 2018-01-25 2022-10-21 한화정밀기계 주식회사 플립 칩의 플럭스 도포 상태 검사 방법
CN108710009A (zh) * 2018-08-02 2018-10-26 上海泽丰半导体科技有限公司 一种悬臂式探针卡
CN112924844A (zh) * 2019-12-06 2021-06-08 迪科特测试科技(苏州)有限公司 探测装置

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Also Published As

Publication number Publication date
US20040217767A1 (en) 2004-11-04
US20040217769A1 (en) 2004-11-04
US6975127B2 (en) 2005-12-13
US20050231222A1 (en) 2005-10-20
US20040217770A1 (en) 2004-11-04
US6984996B2 (en) 2006-01-10
CN1802775A (zh) 2006-07-12
US7405581B2 (en) 2008-07-29
TW200633108A (en) 2006-09-16
CN1798977A (zh) 2006-07-05
CN100514751C (zh) 2009-07-15
CN1798977B (zh) 2010-06-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees