TWI315897B - Method and system for inspecting the image on a wafer - Google Patents

Method and system for inspecting the image on a wafer

Info

Publication number
TWI315897B
TWI315897B TW94129060A TW94129060A TWI315897B TW I315897 B TWI315897 B TW I315897B TW 94129060 A TW94129060 A TW 94129060A TW 94129060 A TW94129060 A TW 94129060A TW I315897 B TWI315897 B TW I315897B
Authority
TW
Taiwan
Prior art keywords
inspecting
wafer
image
Prior art date
Application number
TW94129060A
Other languages
Chinese (zh)
Other versions
TW200709318A (en
Inventor
Kuang-Wen Cheng
Original Assignee
King Yuan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by King Yuan Electronics Co Ltd filed Critical King Yuan Electronics Co Ltd
Priority to TW94129060A priority Critical patent/TWI315897B/en
Priority to JP2005317074A priority patent/JP2007059858A/en
Publication of TW200709318A publication Critical patent/TW200709318A/en
Application granted granted Critical
Publication of TWI315897B publication Critical patent/TWI315897B/en

Links

TW94129060A 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer TWI315897B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW94129060A TWI315897B (en) 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer
JP2005317074A JP2007059858A (en) 2005-08-25 2005-10-31 Chip image inspection method and its system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94129060A TWI315897B (en) 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer

Publications (2)

Publication Number Publication Date
TW200709318A TW200709318A (en) 2007-03-01
TWI315897B true TWI315897B (en) 2009-10-11

Family

ID=37923036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94129060A TWI315897B (en) 2005-08-25 2005-08-25 Method and system for inspecting the image on a wafer

Country Status (2)

Country Link
JP (1) JP2007059858A (en)
TW (1) TWI315897B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014132358A1 (en) * 2013-02-27 2014-09-04 富士機械製造株式会社 Defective member determination device and defective member determination method
CN110085545B (en) * 2019-03-26 2021-07-23 上海华力微电子有限公司 Auxiliary alignment method and system
CN116298811B (en) * 2023-03-31 2024-04-02 上海威固信息技术股份有限公司 Chip packaging detection system based on FPGA and packaging method thereof

Also Published As

Publication number Publication date
JP2007059858A (en) 2007-03-08
TW200709318A (en) 2007-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees