1313627 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種金屬薄片的薄化方法，特別是關於 一種低熔點合金箔片的薄化方法。 【先前技術】 隨著電子科技的進步，資訊處理晶片朝向電晶體高密 _ 度化、傳輸高速化、整合多功能化以及體積小型化發展。 上述功能的提升衍生出發熱密度愈來愈高，其累積的熱量 將使電子元件的工作溫度增加，而造成熱負荷愈來愈高。 熱負荷的增加將會嚴重的影響晶片等電子元件的使用壽命 及可靠度。若電子散熱的問題無法適當解決，將阻礙晶片 與電子產品的推出及產業發展。因此，如何提升高性能熱 管理材料，已是電子產業一個刻不容緩的課題。 伴隨著晶片及電子元件的散熱需求，刺激了散熱元 • 件、材料等電子散熱產品的多樣化與技術創新。電子散熱 產品主要有散熱裝置(如：熱管、散熱器及風扇..等）與熱 界面材料(Thermal Interface Materials，TIM)兩種類別。 請參照圖一’其係為習知散熱系統示意圖。如圖所示， 此散熱系統10至少包括一電子元件12及一散熱器u。其 中， …、 '1313627 IX. Description of the Invention: [Technical Field] The present invention relates to a method for thinning a metal foil, and more particularly to a method for thinning a low melting point alloy foil. [Prior Art] With the advancement of electronic technology, information processing wafers are moving toward high density of transistors, high speed of transmission, integration of multifunction, and miniaturization of volume. The improvement of the above functions is derived from the increasing heat density, and the accumulated heat will increase the operating temperature of the electronic components, resulting in a higher heat load. The increase in thermal load will seriously affect the service life and reliability of electronic components such as wafers. If the problem of heat dissipation cannot be properly solved, it will hinder the launch of wafers and electronic products and industrial development. Therefore, how to improve high-performance thermal management materials is an urgent task for the electronics industry. Along with the heat dissipation requirements of wafers and electronic components, it has stimulated the diversification and technological innovation of electronic heat dissipation products such as heat dissipation components and materials. Electronic heat dissipation products mainly include heat sinks (such as heat pipes, radiators and fans, etc.) and Thermal Interface Materials (TIM). Please refer to Figure 1 for a schematic diagram of a conventional heat dissipation system. As shown, the heat dissipation system 10 includes at least an electronic component 12 and a heat sink u. among them, …, '
與散熱器11之間。 11之間。詳細地說，熱界面材料14之兩側面分 於電 別接觸於賴H 11的孩面以及電子元件12社表面。 5 .1313627 熱界面材料14是-種使用於晶片構裝、電子元件盘散 熱器之間的導熱介質，其係利用自身可流動或預熱溶融的 特性填補前述元制介_觀隙，藉此減少晶片熱量傳 遞至基板或至散絲置的熱眺，以提高晶錄熱性能。 熱界面材料的性能指標主要有熱傳導率⑼與熱阻抗 (R) ’熱傳導率係指熱量在材料㈣熱料的能力，執阻 抗係指跨越不同材料介_熱傳導之效益一般來說、，、熱 界面材料的熱傳導率⑻愈高、界面接合厚度欲小，則熱^ 面材料之熱阻抗(R)愈低。 消費性電子產品所使㈣熱界面材料主要以散教膏 (thermal grease)和相變化散熱貼片（此狀6 ch^ge thermal pad)為主。但是目前上述兩種熱界面材料之散熱 效能仍為雜，熱料率⑼最錢到7W/mk，敎阻抗⑻ 約為0.25〜(Ucrt/W。糾’散熱膏...等熱界面材料在教 循環(temperature cycling)條件下，賴效财明顯衰退 的情形。因此，在晶片效能不斷增強，熱負荷也隨之增加 的趨勢下，上述熱界面材料之可靠性顯然:不敷未來產業之 應用。 為了因應曰後更加嚴苛的熱管理需求，一種稱為低溶 點合金箔片(Low melting ailoy，LMA)的熱界面材料被開發 出來。低舰合金W具有健點、高鮮、鱗相變化 填補介面微孔_雜，其主要係由必要的銦⑽以及纽 ⑽、錫(Sn)、和鋅（Zn)等元素之部份或全部纟且合而成， 組成元素可為Sn-In、In_Bi-Sn或In-Bi-Sn-Zn。此外，前述 主要組成合金更可包括至少一種非毒害環境元素，例如 6 1313627 5銅鈦、鍺、紹、鈽、鋼或石夕等元素。低熔點合金 /1片24可依上述組成元素的不同而有55。〇至85。〇不等之 熔點變化。 、在，階段的實驗數據中，低溶點合金箱片的變態溫度 約為60 C，熱料领)可達可賴w/mk社，熱阻抗⑻ 小於〇· lcm2K/W °因此’低熔點合金箱片具有極高的散熱效 能。 承上所述’散熱系統中熱阻抗（R)愈低時，散熱效果愈好， 所以^熔齡金㈣厚度愈何，則可具有更佳的散熱效 果。晴參照圖二’其係為習知健：點合金_片_化製作 方法。如圖卿’薄化方式储由-機裝置22在特定條 =下對低魅合金糾24妨反覆地條㈣(RGlling)動 傳統的輥輪軋延製程主要係用來將銅(Cu)、鋁(A1)、 金(Cu)..等具有姉延展性及材料強度的金屬板片，進行 薄化的方式。輥輪軋延的過程中，所使用的初始材料必須 是厚度均句的金屬板#，且厚度約為卜2_。 一般來說’厚度2mm的金屬板片，在輥輪壓下率2〇〇/0 的狀況下’必須要經過13道札延作業，方能薄化至〇 的薄珀片。然而，在同樣的環境條件下，厚度2mm的金 屬板片欲薄化至〇.〇4mm的薄猪片，則需要高達17道的軋 延作業。 因此，利用輥輪軋延製程來薄化金屬板片，可以說是 相當耗時費工。而且，輥壓裝置也必須非常的精密，否則 即使金屬材料的延展性與材料強度俱佳，也相當容易產生 1313627 軋延過程中破損失敗的情形。 在實驗過程中發現，若利用輥輪軋延製程來薄化低熔 點合金箱片(Low melting alloy，LMA)，會有下列的問題產 生。 一、低溶點合金箔片的材料強度並不佳，而親輪軋延 製程必須經過反覆地激烈加工，這將使合金箔片的材料結 構產生變化，而導致加工硬化’使後續軋延作業益形困難。 _ 二、利用輥輪軋延製程所薄化而得的低熔點合金箱 片’在室溫下若經過2〜3個月的存放後，會發生脆化的現 象，亦即所謂的「時效脆化」。 如圖三A所示，經過反覆地激烈加工之低熔點合金箔 片其材料微結構產生變化，而含有大量的大角度(或銳角) 的金屬相。因此，經過一段時間後，在加工殘留應力的作 用下，低熔點合金箔片的龜裂就會由這些尖銳角處產生， 而造成脆化及破裂，如圖三B所示。 _ 目此’ f域純延縣最乡健將麟點合金落片 24的厚度薄化至0.05mm，且很容易出現合金箔片％結構 脆化，甚至破裂的失效情形。 另外，除了輕輪軋延製程之外，亦有一個快速凝固製 程(Rapid Solidification Process，RSP)可用來製作合金箔 片。此製程係將高溫熔解的合金溶液設置於一具有細縫的 溶液槽中。藉由加壓裝置將熔融合金溶液由細縫掩出，，而 形成-「水爆」’接著急速冷卻且貼附在一高逮旋轉且具冷 卻裝置的銅輪上，進而形成一連續的合金箱片。… 8 但疋’低溶點合金箔片（Low melting alloy, LMA)的材 料溶點較一般合金材料低許多，使得在製作過程中無法具 有足夠的溫差’亦即冷卻速率。因此，使用此快速成型製 程所製作出來的低熔點合金箔片會有不連續、易脆、具孔 洞及厚度不均..等問題發生。 因此，如何有效薄化低熔點合金箔片的厚度，且保有 其應有的材料結構及特性，係為當前技術所必需。 【發明内容】 、本發明之一目的係在於藉由本發明之製造方法，使製 造出來的低馳合金則’可達到極薄的厚度，且不會發 生結構脆化或破裂的問題。 *本發明之另-目的係在於制本發明所製造出來的極 薄低溶點合錢有效降低散齡射熱阻抗⑻， 並提升散熱系統的散熱效果。 本發明之另—目的係在於應用本發明所製造出來的極 ft溶點合金糾，可以有效避免低舰合金郎受熱熔 融時，洩漏至散熱系統外的情形。 程传一種倾點合金則之製造方法，製造過 程係藉由-模胁錢行。此 模仁，上模仁具有—平糾下志；句上挨仁與下 上表面且面向二下模仁具有-平坦的 觀廿要t 之下表面，此製造方法包括下列步 rw I 合金材料於下模仁之上表面上方。加執 拉具組，使㈣點合諸料熔融。脑上模仁或下模仁: 1313627 移動’縮減上模仁之下表面與 低魅合金材料被壓合於上模仁===之， 卻模具組，使騎之低崎_频彳咖合=片: 由星ΠίΓ:種低魅合金則之製造方法，其係藉 场仁與―下模仁的—模妝械行。上模仁具 下模仁具有一平坦的上表面且面向上 模仁之下表面，此製造方法包括下列步驟。 縮減鱗齡金賴於下社之上表面上。 人金材料、㈣下φ與下模仁之上表面之間距，使低炫點 :仁與下模仁巧。錄，冷卻模具 、吏溶融之低熔點合金材料形成健點合金落片。 本發明提供-種低熔點合金則之製 ^有-上模㈣-下模㈣-贴絲執行。上模3 t千坦的下表面，下模仁具有—平坦的上表面且面向上 冥仁之下表面’此製造方法包括下列步驟。 • 賴具組置放於一具有炫融之低溶點合金材料之槽 Θ ’贿上壯與下壯d充滿健:點合金材料。縮減 上模仁之下表面與下模仁之上表面之間距，使低熔點合金 材料被壓合於上模仁與下模仁之間。將模具组移至槽外， 並冷卻模具組’使熔融之低溶點合金材料形成低熔點合金 箔片。 關於本發明之優點與精神，以及更詳細的實施方式可 以藉由以下的實施方式以及所附圖式得到進一步的瞭解。 1313627 【實施方式】 睛參照圖四A與圖四B， 片之製造方法示意圖。 如圖W所和舞點合金郎34的製造過程係藉由 ί 32 Ιΐ 仁31具有—平坦的下表面.下模 ，、有平坦的上表面32a，且其面向上模仁31 表面31a。 下Between the heat sink 11. 11 between. In detail, the two sides of the thermal interface material 14 are separated from the surface of the child and the surface of the electronic component 12 which are electrically contacted. 5.1313627 The thermal interface material 14 is a heat-conducting medium used between the wafer assembly and the heat sink of the electronic component, which is filled with the characteristics of its own flowable or preheated melting. Reduce the heat transfer of the wafer heat to the substrate or to the filaments to improve the thermal performance of the crystal. The thermal interface material performance indicators are mainly thermal conductivity (9) and thermal impedance (R) 'thermal conductivity refers to the ability of heat in the material (four) hot material, the impedance refers to the difference between the different materials _ heat conduction benefits, generally, heat The higher the thermal conductivity (8) of the interface material and the smaller the interface bonding thickness, the lower the thermal resistance (R) of the thermal material. Consumer electronics products make (4) thermal interface materials mainly based on thermal grease and phase change heat sink (this shape 6 ch ^ ge thermal pad). However, the heat dissipation performance of the above two kinds of thermal interface materials is still mixed, the hot material rate (9) is the most money to 7W/mk, and the 敎 impedance (8) is about 0.25~(Ucrt/W. Correction 'thermal grease...etc. Under the condition of temperature cycling, Lai Xiaocai is obviously declining. Therefore, under the trend of increasing wafer performance and increasing thermal load, the reliability of the above thermal interface materials is obviously insufficient for future industrial applications. After the more stringent thermal management requirements, a thermal interface material called Low Melting Ailoy (LMA) was developed. Low-ship alloy W has a healthy, high-fresh, scale-change interface. Microporous-hetero, which is mainly composed of a part or all of the necessary indium (10) and elements such as New (10), tin (Sn), and zinc (Zn), and the constituent elements may be Sn-In, In_Bi- Sn or In-Bi-Sn-Zn. In addition, the foregoing main constituent alloy may further comprise at least one non-toxic environmental element, such as element 6 1313627 5 copper-titanium, tantalum, samarium, bismuth, steel or shixi. 1 piece 24 can be 5 depending on the above constituent elements 5. 〇 to 85. 熔点 varies in melting point. In the experimental data of the stage, the metamorphic temperature of the low melting point alloy box is about 60 C, and the hot material collar can reach the w/mk society. The impedance (8) is less than 〇·lcm2K/W ° so the 'low melting point alloy box has a very high heat dissipation efficiency. In the above-mentioned heat dissipation system, the lower the thermal impedance (R), the better the heat dissipation effect, so the more the thickness of the molten gold (4), the better the heat dissipation effect. Refer to Figure 2 for the sake of “Qi Zhijian: Point Alloy _ Sheet _ Chemical Production Method. As shown in the figure, the thinning method is used to transfer copper (Cu), which is mainly used to make copper (Cu), in the case of a special strip======================================================================= Aluminum (A1), gold (Cu), etc., which have a ruthenium ductility and a material strength, and are thinned. During the rolling process of the roller, the initial material used must be the metal plate # of the thickness of the sentence, and the thickness is about 2_. In general, a metal plate having a thickness of 2 mm must be subjected to 13 passes for a rolling reduction of 2 〇〇/0 to thin the slab. However, under the same environmental conditions, a metal sheet having a thickness of 2 mm is required to be thinned to a thin pig piece of 4 mm, and a rolling operation of up to 17 passes is required. Therefore, it is quite time-consuming and labor-intensive to use a roll rolling process to thin the metal sheet. Moreover, the rolling device must also be very precise, otherwise even if the ductility of the metal material and the material strength are good, it is quite easy to cause the failure of the 1313627 rolling process. During the experiment, it was found that if the roll-rolling process was used to thin the low melting alloy (LMA), the following problems were caused. 1. The material strength of the low-melting point alloy foil is not good, and the rolling process must be repeatedly processed repeatedly, which will change the material structure of the alloy foil and cause work hardening to make subsequent rolling operations. It is difficult to shape. _ Second, the low-melting alloy box piece obtained by thinning the roll rolling process can be embrittled after 2~3 months of storage at room temperature, so-called "aging brittleness" "." As shown in Fig. 3A, the low-melting-point alloy foil which is repeatedly subjected to intense processing has a change in the microstructure of the material and contains a large number of large-angle (or acute) metal phases. Therefore, after a period of time, under the action of processing residual stress, the crack of the low-melting alloy foil is generated by these sharp corners, causing embrittlement and cracking, as shown in Fig. 3B. _ 目 目 目 目 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角 角In addition to the light-rolling process, there is also a Rapid Solidification Process (RSP) that can be used to make alloy foils. This process sets the high temperature molten alloy solution in a solution tank with a slit. The molten alloy solution is covered by the slit by the pressing device to form a "water explosion", which is then rapidly cooled and attached to a high-rotation rotating copper wheel with a cooling device to form a continuous alloy tank. sheet. ... 8 However, the low melting point alloy (LMA) has a much lower melting point than the general alloy material, so that there is no sufficient temperature difference during the manufacturing process, that is, the cooling rate. Therefore, the low melting point alloy foil produced by using this rapid prototyping process may have problems such as discontinuity, brittleness, voids, and uneven thickness. Therefore, how to effectively thin the thickness of the low melting point alloy foil and retain its proper material structure and characteristics is necessary for the prior art. SUMMARY OF THE INVENTION One object of the present invention is to provide a method for producing a low-alloy alloy by the manufacturing method of the present invention, which can achieve an extremely thin thickness without causing structural embrittlement or cracking. * Another object of the present invention is to make the extremely thin and low melting point money manufactured by the present invention effective in reducing the thermal impedance of the scattered age (8) and to improve the heat dissipation effect of the heat dissipation system. Another object of the present invention is to solve the problem that the low-alloy alloy lang is leaked to the outside of the heat-dissipating system when the low-alloy alloy is heated and melted by applying the extreme ft-melting point alloy which is manufactured by the present invention. Cheng Chuan is a manufacturing method for pour point alloys, and the manufacturing process is carried out by the model. The mold core, the upper mold core has a flat correction; the upper part of the sentence and the lower upper surface and the second lower mold core have a flat surface to be under the surface, the manufacturing method includes the following steps rw I alloy material Above the upper surface of the lower mold. Add the set of tools to make the (4) points melt. Brain mold or lower mold: 1313627 Move 'reducing the lower surface of the upper mold and the low charm alloy material is pressed against the upper mold ===, but the mold group, so that the riding low _ 彳 彳 = = Film: From the star Π Γ Γ 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 低 低 低 低 低 低 低 低 低 低The upper mold core has a flat upper surface and faces the lower surface of the upper mold core. The manufacturing method includes the following steps. The reduction of the age of the scale depends on the surface of the lower society. The gold material, (4) the distance between the lower φ and the upper surface of the lower mold, so that the low point: the benevolence and the lower mold. Recording, cooling mold, and melting low-melting alloy materials form a fine point alloy drop. The present invention provides a low-melting-point alloy which is produced by the presence-upper (four)-lower (four)-sticking. The lower surface of the upper mold 3 t thousand, the lower mold has a flat upper surface and faces the lower surface of the lower body. This manufacturing method includes the following steps. • The rigging group is placed in a tank with a low melting point alloy material. 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿 贿The distance between the lower surface of the upper mold core and the upper surface of the lower mold core is reduced, so that the low melting point alloy material is pressed between the upper mold core and the lower mold core. The mold set is moved outside the tank and the mold set is cooled to form a molten low melting point alloy material to form a low melting alloy foil. The advantages and spirit of the present invention, as well as the more detailed embodiments, may be further understood by the following embodiments and the accompanying drawings. 1313627 [Embodiment] The eye is shown in Fig. 4A and Fig. 4B, and a schematic diagram of a manufacturing method of the sheet. The manufacturing process of Figure W and the Dancing Point Alloy 34 has a flat lower surface. The lower mold has a flat upper surface 32a and faces the upper mold 31 surface 31a. under
裏造方法至少包括下雕驟。放置低馳合金材料34 一32之上表面32a上方，此步驟中之低炼點合金材 枓34係為-起始材料，可以是固態或液態，而形狀可以是 塊狀、板片狀、粒狀、球狀或滴狀。 接著，加熱模具組30，使低熔點合金材料34熔融。 ^中’在健實補巾，加熱之溫度·約介於低嫁點合 材料34之熔點與上述熔點再加10〜20¾之間。The method of making at least includes the lower carving step. The low-alloy alloy material 34 is a starting material, which may be solid or liquid, and may be in the form of a block, a plate, or a grain. Shape, sphere or drop. Next, the mold set 30 is heated to melt the low melting point alloy material 34. ^中' is a solid towel, the temperature of heating is about between the melting point of the low-margin material 34 and the above melting point plus 10~203⁄4.
其係為本發明低熔點合金箔 、低溶點合金材料34受熱炫融後，藉由上模h 31下移 或下模仁32上移之動作，來縮減上模仁31之下表面灿 下模仁32之上表面32a之間距。目此，低熔點合金材料 34被壓合於上账31與下·ι %社職，如圖四β所 示。由於低炫點合金材料34之上下空間被擠壓而縮減，故 低熔點合金材料34遂向四顺散，有部分甚至流出間隙 外0 上述縮減上模仁31之下表面與下模仁32之上表面之 間距之步_、為所賴麵，此棘之合娜持塵力 約為2〜lOkg/cm2，合模速度為5〜2〇cm/min 〇 11 1313627 、、’里過合模過程後，冷卻模具組3〇與低炫點合金材料 34，使低熔點合金材料34固化成所需之低溶點合金箔片 34。其中，由於上述低熔點合金材料34之上下空間被壓擠 而縮減’所以固化後之低熔點合金箔片34便具有更薄的厚 度。最後，移開上模仁31與下模仁32，以取出所需之低 熔點合金箔片34。 " 上述之低熔點合金箔片34具有低炫點、高熱導、熱熔 相變化填補介面微孔隙的特性，其主要係由必要的姻⑽ > U及棒i)、錫(Sn)、和辞（Zn)等元素之部份或全部組合 而成，組成元素可為Sn-In、In-Bi-Sn或In-Bi-Sn-Zn。此外， 前述主要組成合金更可包括至少一種非毒害環境元素， 例如銀、銅、鈦、鍺、鋁、鈽、鑭或矽等元素。低熔點 合金箔片34可依上述組成元素的不同而有^它至幻它不 等之熔點變化。 另外，值得注意的是，可藉由上模仁31之下表面31a 與下模仁32 ^表面32a之間距的大小來調整所需之低炫 私點合金箔片34的厚度。在較佳實施例中，上述間距可縮減 至0.04刪以下，使低熔點合金箔片34的厚度可薄至 0· 04mm以下，且低熔點合金箔片34仍保有良好的結構特 性，也沒有產生破裂的情形。 本實施例中，在放置低熔點合金材料34於下模仁32 之上表面32a之步驟前，若低炫點合金材料34為一低熔點 合金板片時，可先行利用習知技術之輥壓裝置22對低熔點 合金板片進行軋延動作，以初步降低低熔點合金板片之厚 度。在一實施例中’以不破壞到合金箔片結構為前提，可 12 1313627 初步將低溶點合金板片之厚度輥壓至〇. lmm。上述之初步 棍壓薄化動作’可加速後續的加熱融化低溶點合金板片的 時間。 另外，由於烙融之低熔點合金材料34可能具有沾黏 性，所以模具組30的上模仁31與下模仁32可為抗合金箔 片熱熔沾黏之材質所製成，以防止低熔點合金材料34沾黏 至上、下模仁31、32的表面。或者，亦可選擇性地先於上 模仁31之下表面31a與下模仁32之上表面32a各設置一 抗合金箔片熱熔沾黏之平板結構33後，再進行後續製程。 在另一實施例中，為了有效地固定合金箔片34成形厚 度以及保持厚度的均勻性’在縮減上模仁31之下表面31a 與下模仁32之上表面32a之間距的步驟前，可設置至少一 墊片35於下模仁32之上表面32a上，以限制上述間距。 也就是說，墊片35的設置可防止上述間距過度的縮減，而 將間距的大小控制為墊片35的厚度。當然，墊片35設置 於上模仁31之下表面31a上亦可得到相同的功效。 在上述實施例中’係先放置低熔點合金材料34於下模 仁32之上表面32a，並加熱模具組3〇，使低熔點合金材料 34溶融後，再進行後續的製程步驟。 然而’在實施例巾’可先行將麟齡金材料34 融化’然後直接設置到下模仁32之上表面32a，或者上模 仁31之下表面31a與下模仁&之上表面32a之間。同時 模具組3G持龜加熱，且·組3G福度超過低溶點合 金材料34之熔點，使低熔點合金材料34保持液態。 1313627 著，與上述步驟相似，藉由上模仁31或下模仁32 移動縮減上模仁31之下表面31a與下模仁32之上表 愈32a之間距’使低魅^合金材料％被壓合於上模仁& 下模32之間。最後’冷卻模具组3〇與低溶點合金材 j 34後’使低溶點合金材料34固化成所需之低溶點合金 箔片34。 上述之實施㈣為將讎齡金材料先置放於上模仁 與下模仁之間，再進行合模麼合..等程序。在另—實施例 中亦可直接將模具組置放於一具有熔融之低熔點合金材 料=槽内，使上模仁與下模仁之間充滿低熔點合金材料。 接著，縮減上模仁之下表面與下模仁之上表面之間距，使 低熔點合金材料被壓合於上模仁與下模仁之間。 最後，將模具組移至槽外，並冷卻模具組，使上模仁 與下模仁之間之熔融之低熔點合金材料形成低熔點合金箔 片° 综上所述’本發明之低溶點合金箔片之製造方法具有 下列優點： 一、 本發明之低熔點合金箔片之製造方法可謂一種「液 態壓模薄化製程(Liquid Die-pressing)」，係為直接由液 態的低溶點合金材料作一次性的薄化加工，即可製造出超 薄的低熔點合金箔片，而不須經過多次的製程作業。 二、 與輥輪軋延製程相較，本發明之低炫點合金羯片 之製造方法可大幅縮短作業時間、可達到更薄的厚度(小於 0.04mm)、不易破裂及不會有時效脆化的問題。 14 1313627 * 三、與快速凝固製程(R_ Solidification Process RSP) 她，本伽之製造方法操作更為簡單，且可克服㈣點 合金箱片不連續、厚度不均勾、易脆化、具孔洞·.等缺點。 四本發明之製造方法簡單有效，只要精確地控制合 模靜持塵力、合模速度、模仁間距及冷卻溫度梯度..等， 即可快速地生產出厚度不大於〇· 〇4mm，且厚度均句而完整 的低熔點合金箔片。 /、本發明之製造綠可纽製造__低溶點合 金箔片，以有效降低散熱系統中熱阻抗（R)，並提 系統的散熱效果。 Μ 六、在散熱系統中，當電子元件在作用而發熱時，若 低熔點合金箔片愈薄，則箔片受熱熔融之熔液愈不易過度 流動。因此’藉由本發明之製造方法，可有效薄化低熔點 合金箱片之厚度，以避免低溶點合金箔片受熱熔融時，洩 漏至散熱系統外的情形。 • 本發明雖以較佳實例闡明如上，然其並非用以限定本 發明精神與發明實體僅止於上述實施例爾。對熟悉此項技 術者’當可輕易了解並利用其它元件或方式來產生相同的 功效。是以，在不脫離本發明之精神與範圍内所作之修改， 均應包含在下述之申請專利範圍内。 【圖式簡單說明】 藉由以下詳細之描述結合所附圖示’將可輕易的了解 上述内容及此項發明之諸多優點，其中： 15 1313627 圖一係為習知散熱系統之示意圖； =二係騎知低_合金制之薄化方法示意圖； 成輸一所製 圖；係縣發明健齡金別之薄化方法示意 意 圖 圖四B係為本發明低熔點合金箔片之薄化方法示 【主要元件符號說明】 10 散熱系統 12 電子元件 14 熱界面材料 22 輥壓裝置 31 上模仁 32 下模仁 33 平板結構 11 :散熱器 13 :電路基板 24、34 ·低溶點合金箱片（材料) 30 :模具組 31a :下表面 32a :上表面 35 :墊片After the low melting point alloy foil and the low melting point alloy material 34 of the present invention are heated and slid, the lower surface of the upper mold core 31 is reduced by the action of moving the upper mold h 31 downward or the lower mold core 32 moving up. The distance between the upper surface 32a of the mold core 32. Therefore, the low melting point alloy material 34 is pressed against the upper account 31 and the lower one, as shown in Fig. 4 β. Since the lower space of the low-point alloy material 34 is squeezed and reduced, the low-melting alloy material 34 is scattered toward the fourth portion, and some even flows out of the gap. The above-mentioned surface of the upper mold core 31 and the lower mold core 32 are reduced. The step between the upper surfaces is the _, the surface is the same, the dust holding force of this spine is about 2~lOkg/cm2, the clamping speed is 5~2〇cm/min 〇11 1313627,, After the process, the mold set 3 and the low-point alloy material 34 are cooled to solidify the low-melting alloy material 34 into the desired low-melting point alloy foil 34. Here, since the lower space of the above-mentioned low-melting-point alloy material 34 is crushed and reduced, the cured low-melting alloy foil 34 has a thinner thickness. Finally, the upper mold core 31 and the lower mold core 32 are removed to take out the desired low melting point alloy foil 34. " The above-mentioned low melting point alloy foil 34 has the characteristics of low glare, high thermal conductivity, and hot melt phase change to fill the interface micropores, which are mainly composed of necessary marriages (10) > U and rods i), tin (Sn), And a combination of some or all of elements such as Zn (Zn), the constituent element may be Sn-In, In-Bi-Sn or In-Bi-Sn-Zn. Further, the aforementioned main constituent alloy may further include at least one non-toxic environmental element such as an element such as silver, copper, titanium, ruthenium, aluminum, ruthenium, osmium or iridium. The low melting point alloy foil 34 may vary depending on the above constituent elements. Further, it is to be noted that the thickness of the desired low-spot alloy foil 34 can be adjusted by the distance between the lower surface 31a of the upper die 31 and the lower die 32 surface 32a. In the preferred embodiment, the pitch can be reduced to 0.04 or less, so that the thickness of the low melting point alloy foil 34 can be as thin as 0. 04 mm or less, and the low melting point alloy foil 34 still retains good structural characteristics and does not occur. The situation of rupture. In this embodiment, before the step of placing the low-melting alloy material 34 on the upper surface 32a of the lower mold core 32, if the low-point alloy material 34 is a low-melting alloy sheet, the roll of the prior art can be used first. The device 22 performs a rolling action on the low melting alloy sheet to initially reduce the thickness of the low melting alloy sheet. In an embodiment, the thickness of the low-melting-point alloy sheet is initially rolled to 〇.lmm, without prejudice to the structure of the alloy foil. The preliminary stick thinning action described above accelerates the subsequent heating and melting of the low melting point alloy sheet. In addition, since the molten low melting point alloy material 34 may have adhesiveness, the upper mold core 31 and the lower mold core 32 of the mold set 30 may be made of a material resistant to hot melt adhesion of the alloy foil to prevent low The melting point alloy material 34 is adhered to the surfaces of the upper and lower mold cores 31, 32. Alternatively, a flat plate structure 33 which is resistant to the hot-melt adhesion of the alloy foil may be selectively disposed before the lower surface 31a of the upper mold core 31 and the upper surface 32a of the lower mold core 32, and then the subsequent process may be performed. In another embodiment, in order to effectively fix the forming thickness of the alloy foil 34 and maintain the uniformity of the thickness 'before the step of reducing the distance between the lower surface 31a of the upper mold core 31 and the upper surface 32a of the lower mold core 32, At least one spacer 35 is disposed on the upper surface 32a of the lower mold core 32 to limit the above spacing. That is, the arrangement of the spacers 35 prevents the above-described excessive reduction of the pitch, and controls the size of the pitch to the thickness of the spacer 35. Of course, the spacer 35 is provided on the lower surface 31a of the upper mold core 31 to obtain the same effect. In the above embodiment, the low melting point alloy material 34 is placed on the upper surface 32a of the lower mold core 32, and the mold group 3 is heated to melt the low melting point alloy material 34, and then the subsequent process steps are carried out. However, 'in the embodiment towel', the lining gold material 34 may be first melted' and then directly placed on the upper surface 32a of the lower mold core 32, or the lower surface 31a of the upper mold core 31 and the lower mold surface & upper surface 32a. between. At the same time, the mold group 3G is heated by the turtle, and the group 3G blessing exceeds the melting point of the low-melting point alloy material 34, so that the low-melting alloy material 34 remains in a liquid state. 1313627, similar to the above steps, by moving the upper mold core 31 or the lower mold core 32 to reduce the distance between the lower surface 31a of the upper mold core 31 and the lower mold core 32, the distance between the top and bottom 32a is 'the low charm alloy material% is Pressed between the upper die & lower die 32. Finally, the 'cooling mold set 3〇 and the low-melting point alloy material j 34' are then cured to form the low-melting point alloy material 34 into the desired low-melting point alloy foil 34. The above implementation (4) is to place the ageing gold material between the upper mold core and the lower mold core, and then perform the mold closing process. In another embodiment, the mold set can also be placed directly in a molten low melting point alloy material = groove, so that the upper mold core and the lower mold core are filled with a low melting point alloy material. Next, the distance between the lower surface of the upper mold core and the upper surface of the lower mold core is reduced, so that the low melting point alloy material is pressed between the upper mold core and the lower mold core. Finally, the mold set is moved outside the tank, and the mold set is cooled, so that the molten low-melting alloy material between the upper mold core and the lower mold core forms a low-melting alloy foil. The above-mentioned low-melting point alloy of the present invention The manufacturing method of the foil has the following advantages: 1. The manufacturing method of the low melting point alloy foil of the present invention can be described as a "Liquid Die-pressing", which is a low melting point alloy material directly from a liquid state. By making a one-time thinning process, an ultra-thin low-melting alloy foil can be produced without having to go through multiple process operations. Second, compared with the roller rolling process, the manufacturing method of the low-spot alloy enamel sheet of the invention can greatly shorten the working time, can achieve a thinner thickness (less than 0.04 mm), is not easy to break and does not become cumbersome. The problem. 14 1313627 * Third, and rapid solidification process (R_ Solidification Process RSP) She, Benja's manufacturing method is simpler to operate, and can overcome (four) point alloy box piece discontinuity, thickness uneven hook, easy embrittlement, with holes · And other shortcomings. The manufacturing method of the invention is simple and effective, as long as the mold clamping static holding force, the mold clamping speed, the mold core spacing and the cooling temperature gradient are accurately controlled, etc., the thickness can be quickly produced to be no more than 〇·〇4 mm, and A low-melting alloy foil with a uniform thickness and a complete thickness. /, the manufacture of the invention green 纽 _ _ _ low melting point gold foil, in order to effectively reduce the thermal impedance (R) in the heat dissipation system, and improve the system's heat dissipation. Μ In the heat dissipation system, when the electronic component is heated and acts, if the low-melting alloy foil is thinner, the melt melted by the foil is less likely to flow excessively. Therefore, by the manufacturing method of the present invention, the thickness of the low melting point alloy case piece can be effectively thinned to prevent the low melting point alloy foil from leaking out of the heat dissipation system when it is melted by heat. The present invention has been described above by way of a preferred example, and it is not intended to limit the spirit of the invention and the inventive subject matter. For those skilled in the art, it is easy to understand and utilize other components or means to produce the same effect. Modifications made within the spirit and scope of the invention are intended to be included within the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other advantages of the invention will be readily understood by the following detailed description in conjunction with the accompanying drawings in which: FIG. 1 is a schematic diagram of a conventional heat dissipation system; Schematic diagram of thinning method of alloying low-metal alloy; forming a drawing; forming a thinning method for the invention of Jiannian Jinbian; Figure 4B is a thinning method for the low melting point alloy foil of the present invention. Explanation of main components: 10 Heat dissipation system 12 Electronic components 14 Thermal interface material 22 Rolling device 31 Upper mold core 32 Lower mold core 33 Flat structure 11: Heat sink 13: Circuit board 24, 34 · Low melting point alloy box (material 30: mold set 31a: lower surface 32a: upper surface 35: spacer