TWI313570B - Laser evaporation apparatus and method thereof - Google Patents

Laser evaporation apparatus and method thereof Download PDF

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TWI313570B
TWI313570B TW95116616A TW95116616A TWI313570B TW I313570 B TWI313570 B TW I313570B TW 95116616 A TW95116616 A TW 95116616A TW 95116616 A TW95116616 A TW 95116616A TW I313570 B TWI313570 B TW I313570B
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vapor deposition
laser light
laser
vapor
deposited
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TW95116616A
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TW200743405A (en
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Li-Chen Wei
Pei-Hsun Yeh
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Toppoly Optoelectronics Corp
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1313570 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種蒸鍍裝置及其方法,特別關於一種 雷射蒸鑛裝_置及其方法。 【先前技術】 隨著科技的尚度發展,於許多的顯示技術中,有機發 光二極體(Organic Light Emitting Diode,〇LED)多應用於 矩陣式顯示面板上,故為重要的電子元件之一,有機發光 二極體本身為-電流驅動元件,其發光亮度係依據通過電 流的大小來決定;而相較於其他小尺寸之液晶顯示器產 品,由於有機發光二極體具有自發光性無需背光源、無視 角限制、高對比、高亮度、高發光效率、響應速度快、可 全彩化、工作溫度廣、低耗電、低成本以及面板製程與結 構簡單之優點’故目前已被廣泛的應用於行動電話和攜帶 型資訊終端(PDA)等電子顯示產品上。 對於習知技術之有機發光二極體之製作而言,係藉由 蒸鍍方式,將二種以上之有機材料蒸鍍至一基板上,二 成有機發光二極體;故如圖〗所示,提供—基板21及一7 蒸鑛裝置1,基板21係設置於蒸料置丨上方,而装鑛裝 :二」固以上之㈣u,而每個掛禍u則具有二 ,盖子⑴,盍子上則有許多的小孔112,而各㈣^則 谷置不同的有機材料22,並於各_ u的外部圍敎 圈113 ’·於製作有機發光二極體時,於密閉之蒸鍍裝 1313570 係利用加熱圈113同時將各坩 22之昇華溫度不同而昇華, 加熱’由於各有機材料 透過蓋子hi上之小孔112堝11内之有機材料22, 有機材料22均勻地純於基板=22 _對㈣,以使 當使用加熱圈U3加熱堆抑之蒸鐘 光二極體時,昇華後之有機材料2 飞製作有機發 2大邛伤皆粘附〗暮鍵 裝置1上,而造成有機材料22之使用率降低.m 製作有機競二減所需時隨長,故於錢有=料 時’因各掛禍η中皆容置大量之有機材料22 機材料22财熱性不佳’故於長時間的加熱後,造= 11下方之有機材料22在未昇華前,其材質就已經 甚至造成裂解,而無法使用,由於有機材料22 、 高,故此種蒸鍍方式,不僅降低有機材料 之成本較 J ιτ “之传用率, 且不易控制有機材料22之蒸鍍,更加浪費製 外,就蒸鍍裝置1而言,由於使用基板21旋轉㊁:構, 故不但不易控制蒸鍍的量’且更限制了蒸鍍裝二 面積基板21的應用。 針對入 如何提供一種可提高有機材料之使用率,、 任何尺寸之基板,且易於控制有機材料之蒸 裝置及其方法,實屬當前重要課題之一。 又 【發明内容】 種可提高有 有鑑於上述課題’本發明之目的為提供— 1313570 機材料之使用率,且易於控制有機材料蒸鍍之雷射蒸鍍裝 置及其方法。 緣是,為達上述目的,依本發明之一種雷射蒸鍍裝 置’係蒸鍍一第一蒸鍍體與一第二蒸鍍體,而雷射蒸鍍裝 置包含一分光元件、一第一容置元件以及一第二容置元 件。分光元件係接收一雷射光源以將雷射光源分為一第一 “ 雷射光與一第二雷射光,而第一容置元件係容置第一蒸鍍 1 體,第一雷射光係照射第一蒸鍍體以蒸鍍第一蒸鍍體,而 • 第二容置元件係容置第二蒸鍍體,第二雷射光係照射第二 蒸鍍體以蒸鍍第二蒸鍍體。 另外,為達上述目的,依本發明之一種雷射蒸鍍方 法,係蒸鍍一第一蒸鍍體與一第二蒸鍍體,而雷射蒸鍍方 法係包含下列步驟:首先,將一雷射光源分為一第一雷射 光與一第二雷射光,其中第一雷射光和第二雷射光之能量 強度不同;然後,提供一第一蒸鍍體和一第二蒸鍍體,其 I 中第一蒸鍍體和第二蒸鍍體之加熱特性不同;最後,將第 一雷射光照射第一蒸鍍體以蒸鍍第一蒸鍍體;以及將第二 雷射光照射第二蒸鍍體以蒸鍍第二蒸鍍體。 另外,為達上述目的,依本發明之一種有機發光二極 體面板,其包括一第一電極、一有機發光層以及一第二電 極,有機發光層形成於第一電極上,第二電極形成於有機 發光層上。其中有機發光層係由以下方法製得:將一雷射 光源分為一第一雷射光與一第二雷射光,其中第一雷射光 和第二雷射光之能量強度不同;提供一第一蒸鍍體和一第 1313570 =蒸鑛體’其中第一蒸錄體和第二蒸鑛體之加熱特性不 =第:雷射光照射第一蒸鑛體以蒸鍍第一蒸鍍體;以 將第-雷射光照射第二蒸鍍體以蒸㈣二蒸鍵體。 义另外,為達上述目的,依本發明之一種電子裳置 :述之有機發光二極體面板以及一輸入單元,輸入單元盘 面_合並對面板提供輸人,使得面板顯示影像。-承上所述,因依據本發明之一種雷射蒸鍛裝置及其方 係利用分光元件將雷射光源分成第-雷射光及第I雷 =光^使第-f射光及第二雷射光分縣第—蒸鍛體及 第-錢體上,均勾蒸錢至—基板上。與f知技術相較, 由於雷射蒸㈣置僅需-台雷射光源產生器發射一雷射 光源,並湘分光元件,就可將#射光源分成多束雷射 光’以照射並蒸鍍所有蒸鍍體,故不僅可有效控制雷射光 之強度及提高雷射光之使科,更可節省使用成本,·此 外/7光元件可將雷射光源分成強度不同之雷射光或相同 強度但多权雷射光,使強度較小之#射光適肖於蒸錢率 較低或熱穩定性較差之蒸鑛體,而強度較大之雷射光則適 用蒸鍵率較高或穩定性較佳之蒸㈣,故不僅可輕易且有 效控制蒸鍍體之使用率,亦使製程之㈣之㈣性大大提 升。 【實施方式】 以下將參照相關圖式,說明依本發明較佳實施例之一 種雷射⑽裝置及其方法,其中相同的元件將以相同的參 1313570 照符號加以說明。 請參照圖2所示,本發明較佳實施例之一種雷射蒸鍍 裝置3 ’係蒸鍍一第一蒸鍍體41與一第二蒸鍍體42,而 雷射蒸鍍裝置3係包含一分光元件31、一第一容置元件 32以及一第二容置元件33。 就本實施例而言,分光元件31係接收自一雷射光源 — 產生器5發射出之一雷射光源L,以將雷射光源L分為一 ] 第一雷射光L1與一第二雷射光L2,而分光元件31係可為 ® —分光鏡或一光栅,故在此則以分光鏡為例,而倘若需要 將雷射光源L分為三束以上光束使用時,則分光元件31 係可改以使用光栅來達成。 第一容置元件32係容置第一蒸鍍體41,第二容置元 件33係容置第二蒸鍍體42,其中第一雷射光L1照射第一 蒸鍍體41以蒸鍍第一蒸鍍體41,第二雷射光L2照射第二 蒸鍍體42,以蒸鍍第二蒸鍍體42。於本實施例中,若第 $ —蒸鍍體41和第二蒸鍍體42之加熱特性(如昇華溫度) 係不相同,第一雷射光L1與第二雷射光L2之能量強度將 因應各蒸鍍體之加熱特性與材料蒸鍍比例而被設定為有 所不同,藉以均勻地蒸鍍第一蒸鍍體41和第二蒸鍍體42。 舉例來說,第二蒸鍍體42之熱穩定性、即以及昇華 溫度皆高於第一蒸鍍體41之熱穩定性以及昇華溫度為例 不相同,且第一蒸鍍體41為一客體,第二蒸鍍體42為一 主體。為了提高第二蒸鍍體42之鍍率,第二雷射光L2之 能量強度係可設定較第一雷射光L1之能量強度為高,係 1313570 分別藉以將第一蒸鍍體41和第二蒸鍍體42分別依照蒸鍍 比率蒸鍍到一基板上。 另外,第一蒸鍍體41和第二蒸鍍體42可為一有機材 料。例如,第一蒸鍍體41可為一主體有機材料,例如: Alq3 ’而第二蒸鍍體42可為一客體有機材料,例如: C545T。 _ 再者’雷射光源產生器5係鄰設於雷射蒸鍍裝置3, - 雷射蒸鍍裝置3更包含一反射鏡35、一第一聚焦鏡36以 • 及一第二聚焦鏡37,其中,第一聚焦鏡36係設置於分光 元件31與第一容置元件32之間,而第二聚焦鏡37係設 置於分光元件31與第二容置元件33之間。 請參照圖3所示,於本實施例中,雷射蒸鍍裝置3更 包含一基座34、一滑軌38及一滑車39,故分光元件31、 第一容置元件32以及第二容置元件33皆設置於基座34 上,而雷射光源L則可鄰設於基座34,以便於使用此雷射 $ 光源L,此外,基座34則滑設於滑車39上,滑車39則滑 設於滑軌38上,其中基座34之滑動方向係垂直於滑車39 之滑動方向。 本實施例之雷射蒸鍍裝置3作動如下:分光元件31 係接收雷射光源L,並分成第一雷射光L1及第二雷射光 > L2,而第一雷射光L1係穿過第一聚焦鏡36,並聚焦於第 一容置元件32中之第一蒸鍍體41;第二雷射光L2則藉由 反射鏡35,使反射鏡35反射第二雷射光L2以產生一反射 雷射光L2’,並使反射雷射光L2’與第一雷射光L1之照射 11 1313570 方向平行,反射雷射光L2’再穿過第二聚焦鏡37,並聚焦 於第二容置元件33中之第二蒸鍍體42 ;此時,由於第一 雷射光L1及第二雷射光L2同時並分別照射第一蒸鍍體41 及第二蒸鍍體42,故第一蒸鍍體41與第二蒸鍍體42係同 時受到照射而加熱,並藉由基座34之滑動與滑車之滑動 相配合,移動第一蒸鍍體41與第二蒸鍍體42,使第一蒸 鍍體41與第二蒸鍍體42均勻的蒸鍍於基板6上。 由於分光元件31將雷射光源L分成多束雷射光,而 各雷射光之能量及強度各不同,又因為不同蒸鍍體其加熱 特性各不同,故可依據各蒸鍍體之加熱特性,配合不同強 度之雷射光作為加熱源,以使各蒸鍍體受各雷射光照射, 並同時蒸鍍,故增加了蒸鍍材料之使用率;此外,以雷射 光源L作為加熱源,故僅於蒸鍍體有照射之部份才會受到 加熱,而蒸鍍體未被照射之部份因未加熱,故不會裂解或 變質,因此提升蒸鍍體之使用率;又,藉由基座34之滑 動與滑車39之滑動相配合,使蒸鍍裝置3皆可應用於任 何尺寸大小之基板6。 另外,於本實施例中,當使用二種以上蒸鍍體時,則 每增加一種蒸鍍體,則可再增加一反射鏡,而且每種蒸鍍 體亦需一個聚焦鏡;舉例而言:使用三種蒸鍍體41、42、 43時,雷射光源L藉由分光元件,例如:使用光柵71(如 圖4所示)或使用二分光鏡72(如圖5所示),皆可將雷射光 源L分成三束雷射光LI、L2、L3,第二雷射光L2及第三 雷射光L3皆藉由各反射鏡73,使第二雷射光L2之反射雷 12 1313570 射光L2’及第三束雷射光L3之反射雷射光L3’,皆與第一 雷射光L1之照射方向平行,而且雷射光LI、L2’、L3’並 同時且分別穿過各聚焦鏡74,以同時蒸鍍三種蒸鍍體41、 42、43。 除此之外,請參照圖6所示,本發明亦揭露一種應用 於上述雷射蒸鍍裝置(如圖2所示)之雷射蒸鍍方法,其係 ' 蒸鍍一第一蒸鍍體41與一第二蒸鍍體42。依本發明較佳 - 實施例之雷射蒸度方法包含以下步驟S01至步驟S04。 1 於步驟S01,將一雷射光源分為一第一雷射光與一第 二雷射光,其中第一雷射光和第二雷射光之能量強度不 同。 於步驟S02,提供一第一蒸鍍體和一第二蒸鍍體,其 中第一蒸鍍體和第二蒸鍍體之加熱特性不同。 於步驟S03,將第一雷射光照射第一蒸鍍體以蒸鍍第 一蒸鍍體。 於步驟S04,將第二雷射光照射第二蒸鍍體以蒸鍍第 ► 二蒸鍍體。 由於依本發明較佳實施例之雷射蒸鍍方法可應用於 前述之雷射蒸鍍裝置(如圖2所示),而且上述雷射蒸鍍方 法之可能實施方式與功效已於前述實施例之雷射蒸鍍裝 置中討論過,故於此不再贅述。 一般而言,上述實施例之雷射蒸鍵裝置及其蒸鍵方法 應用範圍十分廣泛,其係可應用於有機發光二極體面板之 製程步驟中。 13 1313570 有機發光二極體面板而言,有機發光二極體面板其係 包括一第一電極、一有機發光層以及一第二電極,第一電 極與第二電極係和外接電源構成一迴路以提供電子與電 洞至有機發光層,於此特別說明的是,第一電極與第二電 極並不特別限定為陰極或是陽極。其中有機發光層係形成 於第一電極上,而第二電極形成於有機發光層上。通常, ' 在製造有機發光二極體面板之有機發光層時,則是利用上 - 述實施例之雷射蒸鍍裝置及其蒸鍍方法加以製造完成,由 • 於使用上述實施例雷射蒸鍍裝置及其蒸鍍方法,故可提高 有機材料之使用率,並可應用於任何尺寸之基板,且易於 控制有機材料之蒸鍍,當然,亦提高了有機發光二極體面 板之品質。 由於科技時代進步,前述之有機發光二極體面板已被 廣泛應用於各種電子裝置,例如:移動式電話、數位照相 機、個人數位助理、筆記型電腦、桌上型電腦、電視機、 _ 車用顯示器、或可攜式DVD機等;通常,這些電子裝置 係包括一有機發光二極體面板以及一輸入單元,其中,輸 入單元與有機發光二極體面板耦合,並提供輸入至有機發 光二極體面板,以使有機發光二極體面板顯示輸入單元所 指定的影像或資料。 ' 綜上所述,因依據本發明之一種雷射蒸鍍裝置及其方 法,係利用分光元件將雷射光源分成第一雷射光及第二雷 射光,以使第一雷射光及第二雷射光分別將第一蒸鍍體及 第二蒸鍍體上,均勻蒸鍍至一基板上。與習知技術相較, 14 1313570 由於雷射蒸鍍裝置僅需一台雷射光源產生器發射一雷射 光源,並利用分光元件,就可將雷射光源分成多束雷射 光,以照射並蒸鍍所有蒸鍍體,故不僅可有效控制雷射光 之強度及提高雷射光之使用率,更可節省使用成本;此 外,分光元件可將雷射光源分成強度不同之雷射光或相同 強度但多束之雷射光,使強度較小之雷射光適用於蒸鍍速 ' 率較低或熱穩定性較差之蒸鍍體,而強度較大之雷射光則 - 適用蒸鑛率較高或穩定性較佳之蒸鑛體,故不僅可輕易且 • 有效控制蒸鍍體之使用率,亦使製程之控制之便利性大大 提升。 以上所述僅為舉例性,而非為限制性者。任何未脫離 本發明之精神與範疇,而對其進行之等效修改或變更,均 應包含於後附之申請專利範圍中 【圖式簡單說明】 I 圖1為顯示習知蒸鍍裝置之示意圖; 圖2為顯示依本發明較佳實施例之一種雷射蒸鍍裝置 之示意圖; •圖3為顯示依本發明較佳實施例之一種雷射蒸鍍裝 置,係具有滑車及滑軌之示意圖; " 圖4為顯示依本發明較佳實施例之使用三蒸鍍體並以 光栅配合反射鏡分成三束雷射光之示意圖; 圖5為顯示依本發明較佳實施例之使用三蒸鍍體並以 分光鏡配合反射鏡分成三束雷射光之示意圖;以及 15 1313570 圖6為顯示依本發明較佳實施例之一種雷射蒸鍍方法 之流程圖。 元件符號說明: 1 蒸鍍裝置 11 坩堝 - 111 蓋子 - 112 小孔 1 113 加熱圈 21 基板 22 有機材料 3 雷射蒸鍍裝置 31 分光元件 32 第一容置元件 33 第二容置元件 | 34 基座 35 反射鏡 36 第一聚焦鏡 37 第二聚焦鏡 38 滑軌 39 滑車 41 第一蒸鍍體 42 第二蒸鍍體 43 第三蒸鍍體 16 1313570 5 雷射光源產生器 6 基板 L 雷射光源 LI 第一雷射光 L2 第二雷射光 L2y 雷射反射光 L3 第三雷射光 L3’ 雷射反射光 71 光柵 72 分光鏡 73 反射鏡 74 聚焦鏡 S01-S04 雷射蒸鍍方法之流程 171313570 IX. Description of the Invention: [Technical Field] The present invention relates to an evaporation apparatus and a method thereof, and more particularly to a laser evaporation apparatus and method thereof. [Prior Art] With the development of technology, among many display technologies, Organic Light Emitting Diode (LED) is mostly used in matrix display panels, so it is one of the important electronic components. The organic light-emitting diode itself is a current-driven component, and its light-emitting brightness is determined according to the magnitude of the passing current; compared to other small-sized liquid crystal display products, since the organic light-emitting diode has self-luminescence, no backlight is required. , no viewing angle limitation, high contrast, high brightness, high luminous efficiency, fast response, full color, wide operating temperature, low power consumption, low cost, and simple panel process and structure. Therefore, it has been widely used. It is used in electronic display products such as mobile phones and portable information terminals (PDAs). For the fabrication of the organic light-emitting diode of the prior art, two or more organic materials are vapor-deposited onto a substrate by vapor deposition, and two organic light-emitting diodes are formed; Providing a substrate 21 and a 7-steaming device 1, the substrate 21 is disposed above the steaming material, and the loading and unloading device is: (4) u above the solid, and the cover (1), the cover (1), There are a plurality of small holes 112 in the sub-section, and each of the four (4)^ valleys are provided with different organic materials 22, and in the outer cuff ring 113' of each _u, when the organic light-emitting diode is fabricated, the vapor deposition is sealed. The 1313570 is sublimated by the heating coil 113 while the sublimation temperatures of the respective crucibles 22 are different, and the organic material 22 is uniformly pure to the substrate due to the organic material 22 passing through the small holes 112埚11 of the cover hi. 22 _ 对 (4), so that when using the heating ring U3 to heat up the stack of the vapor-light diode, the sublimated organic material 2 fly to make organic hair 2 big bruises are adhered to the 暮 key device 1 and cause organic The use rate of the material 22 is reduced. = When the material is used, 'there is a large amount of organic material in the η η 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 22 It has even caused cracking and cannot be used. Because of the high content of organic materials 22, this type of evaporation not only reduces the cost of organic materials, but also makes it difficult to control the evaporation of organic materials. In addition, in the vapor deposition device 1, since the use of the substrate 21 is rotated, it is difficult to control the amount of vapor deposition, and the application of the vapor-deposited two-area substrate 21 is further limited. The use rate of the material, the substrate of any size, and the evaporation device and the method thereof for easily controlling the organic material are one of the current important issues. [Invention] The present invention can be improved in view of the above problems. Providing a laser evaporation device and method for the use of 1313570 machine material and easy to control evaporation of organic materials. The edge is a laser according to the invention for the above purpose The plating device is configured to evaporate a first vapor deposition body and a second vapor deposition body, and the laser evaporation device comprises a light splitting component, a first receiving component and a second receiving component. The light splitting component receives one The laser light source divides the laser light source into a first "laser light and a second laser light, and the first accommodating element receives the first vapor deposition body 1 and the first laser light system illuminates the first vapor deposition body The first vapor deposition body is vapor-deposited, and the second accommodating element receives the second vapor deposition body, and the second laser light illuminates the second vapor deposition body to evaporate the second vapor deposition body. In addition, in order to achieve the above object, according to a laser evaporation method of the present invention, a first vapor deposition body and a second vapor deposition body are vapor deposited, and the laser evaporation method comprises the following steps: First, a The laser light source is divided into a first laser light and a second laser light, wherein the first laser light and the second laser light have different energy intensities; then, a first vapor deposition body and a second vapor deposition body are provided, The heating characteristics of the first vapor deposition body and the second vapor deposition body are different; finally, the first laser light is irradiated to the first vapor deposition body to evaporate the first vapor deposition body; and the second laser light is irradiated to the second evaporation The plated body is vapor-deposited with a second vapor-deposited body. In addition, in order to achieve the above object, an organic light emitting diode panel according to the present invention includes a first electrode, an organic light emitting layer and a second electrode. The organic light emitting layer is formed on the first electrode, and the second electrode is formed. On the organic light-emitting layer. The organic light-emitting layer is obtained by dividing a laser light source into a first laser light and a second laser light, wherein the first laser light and the second laser light have different energy intensities; providing a first steaming The plating body and a 1313570 = steamed ore body 'the heating characteristics of the first vapor recorded body and the second steamed ore body are not =: the laser light irradiates the first steamed ore body to evaporate the first vapor-deposited body; - The laser beam illuminates the second vapor deposition body to evaporate the (four) distillate bond. In addition, in order to achieve the above object, according to an electronic skirt of the present invention: the organic light-emitting diode panel and an input unit, the input unit panel _ merges and provides input to the panel, so that the panel displays an image. In view of the above, a laser steaming apparatus and a method thereof according to the present invention use a beam splitting element to split a laser light source into a first laser light and a first light light to make a first-f light and a second laser light. On the county-steamed forging body and the first-money body, the money is steamed to the substrate. Compared with the f-knowledge technology, since the laser steaming (four) set only needs a laser light source generator to emit a laser light source, and the Xiang light splitting element, the #射 light source can be divided into multiple laser light rays to illuminate and evaporate. All the vapor-deposited bodies can not only effectively control the intensity of the laser light and improve the laser light, but also save the cost of use. In addition, the /7-light component can divide the laser light source into laser light of different intensity or the same intensity but more The right laser light makes the light with less intensity suitable for steamed ore bodies with lower steaming rate or poor thermal stability, while the laser light with higher intensity is suitable for steaming with higher steaming rate or better stability (4) Therefore, not only can the use rate of the vapor-deposited body be easily and effectively controlled, but also the (four) nature of the process (4) is greatly improved. [Embodiment] Hereinafter, a laser (10) device and a method thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, in which the same elements will be described with the same reference numeral 1313570. Referring to FIG. 2, a laser vapor deposition device 3' of the preferred embodiment of the present invention vaporizes a first vapor deposition body 41 and a second vapor deposition body 42, and the laser evaporation device 3 includes A splitting element 31, a first receiving element 32 and a second receiving element 33. For the present embodiment, the spectroscopic element 31 receives a laser light source L emitted from a laser source-generator 5 to divide the laser source L into a first laser light L1 and a second laser. The light-emitting element 31 can be a ®-beam splitter or a grating. Therefore, the beam splitter is taken as an example. If the laser light source L needs to be divided into three or more beams, the light-splitting element 31 is used. Can be changed to use a grating to achieve. The first accommodating member 32 receives the first evaporating body 41, and the second accommodating member 33 receives the second evaporating body 42. The first laser beam L1 illuminates the first evaporating body 41 to evaporate the first portion. The vapor deposition body 41 and the second laser light L2 irradiate the second vapor deposition body 42 to vapor-deposit the second vapor deposition body 42. In this embodiment, if the heating characteristics (such as the sublimation temperature) of the first vapor-deposited body 41 and the second vapor-deposited body 42 are different, the energy intensity of the first laser light L1 and the second laser light L2 will be different. The heating characteristics of the vapor-deposited body and the material vapor deposition ratio are set to be different, whereby the first vapor-deposited body 41 and the second vapor-deposited body 42 are uniformly vapor-deposited. For example, the thermal stability of the second vapor deposition body 42 and the sublimation temperature are both higher than the thermal stability and the sublimation temperature of the first vapor deposition body 41, and the first vapor deposition body 41 is an object. The second vapor deposition body 42 is a main body. In order to increase the plating rate of the second vapor deposition body 42, the energy intensity of the second laser light L2 can be set higher than the energy intensity of the first laser light L1, and the 1313570 is used to respectively melt the first vapor deposition body 41 and the second evaporation body 41. The plating bodies 42 are respectively evaporated onto a substrate in accordance with the vapor deposition ratio. Further, the first vapor deposition body 41 and the second vapor deposition body 42 may be an organic material. For example, the first vapor-deposited body 41 may be a host organic material such as Alq3' and the second vapor-deposited body 42 may be a guest organic material such as C545T. Further, the laser light source generator 5 is disposed adjacent to the laser vapor deposition device 3, and the laser vapor deposition device 3 further includes a mirror 35, a first focusing mirror 36, and a second focusing mirror 37. The first focusing mirror 36 is disposed between the beam splitting element 31 and the first receiving component 32 , and the second focusing mirror 37 is disposed between the beam splitting component 31 and the second receiving component 33 . Referring to FIG. 3, in the embodiment, the laser vapor deposition device 3 further includes a base 34, a slide rail 38 and a pulley 39. Therefore, the light splitting element 31, the first receiving component 32 and the second capacitor are included. The components 33 are all disposed on the base 34, and the laser light source L can be disposed adjacent to the base 34 to facilitate the use of the laser light source L. In addition, the base 34 is slidably disposed on the trolley 39, and the trolley 39 Then, it is slidably disposed on the slide rail 38, wherein the sliding direction of the base 34 is perpendicular to the sliding direction of the trolley 39. The laser vapor deposition device 3 of the present embodiment operates as follows: the spectroscopic element 31 receives the laser light source L and is divided into a first laser light L1 and a second laser light > L2, and the first laser light L1 passes through the first The focusing mirror 36 is focused on the first vapor deposition body 41 in the first accommodating member 32; the second laser light L2 is caused by the mirror 35 to reflect the second laser light L2 to generate a reflected laser light. L2', and the reflected laser light L2' is parallel to the direction of the illumination 11 1313570 of the first laser light L1, the reflected laser light L2' is passed through the second focusing mirror 37, and is focused on the second of the second accommodating elements 33. The vapor deposition body 42; at this time, since the first laser light L1 and the second laser light L2 simultaneously illuminate the first vapor deposition body 41 and the second vapor deposition body 42, respectively, the first vapor deposition body 41 and the second vapor deposition body 41 The body 42 is heated by irradiation at the same time, and the first vapor deposition body 41 and the second vapor deposition body 42 are moved by the sliding of the susceptor 34 in cooperation with the sliding of the pulley, so that the first vapor deposition body 41 and the second vapor deposition body 41 are steamed. The plating body 42 is uniformly vapor-deposited on the substrate 6. Since the beam splitting element 31 divides the laser light source L into multiple beams of laser light, and the energy and intensity of each of the laser light beams are different, and the heating characteristics of the different vapor-deposited bodies are different, the heating characteristics of the respective vapor-deposited bodies can be matched according to the heating characteristics of the respective vapor-deposited bodies. Laser light of different intensities is used as a heating source, so that each vapor deposition body is irradiated by each laser light and simultaneously vapor-deposited, so that the use rate of the vapor deposition material is increased; further, the laser light source L is used as a heating source, so only The portion of the vapor-deposited body that is irradiated is heated, and the portion of the vapor-deposited body that is not irradiated is not heated, so it is not cracked or deteriorated, thereby increasing the utilization rate of the vapor-deposited body; and, by the susceptor 34 The sliding cooperates with the sliding of the trolley 39 so that the vapor deposition device 3 can be applied to the substrate 6 of any size. In addition, in the present embodiment, when two or more vapor deposition bodies are used, each additional vapor deposition body may be further provided with a mirror, and each of the vapor deposition bodies also requires a focusing mirror; for example: When three kinds of vapor deposition bodies 41, 42, 43 are used, the laser light source L can be separated by a light splitting element, for example, using a grating 71 (as shown in FIG. 4) or using a dichroic mirror 72 (as shown in FIG. 5). The laser light source L is divided into three beams of laser light LI, L2, L3, and the second laser light L2 and the third laser light L3 are caused by the respective mirrors 73, so that the second laser light L2 reflects the light 12 1313570 and emits light L2' and The reflected laser light L3' of the three laser beams L3 is parallel to the illumination direction of the first laser light L1, and the laser light LI, L2', L3' are simultaneously and separately passed through the respective focusing mirrors 74 to simultaneously evaporate three kinds of light. The vapor deposition bodies 41, 42, and 43 are formed. In addition, please refer to FIG. 6 , the present invention also discloses a laser evaporation method applied to the above-mentioned laser evaporation device (shown in FIG. 2 ), which is 'vapor-plating a first vapor-deposited body. 41 and a second vapor deposition body 42. Preferably, the laser steaming method according to the present invention comprises the following steps S01 to S04. 1 In step S01, a laser light source is divided into a first laser light and a second laser light, wherein the first laser light and the second laser light have different energy intensities. In step S02, a first vapor-deposited body and a second vapor-deposited body are provided, wherein the first vapor-deposited body and the second vapor-deposited body have different heating characteristics. In step S03, the first laser beam is irradiated onto the first vapor deposition body to evaporate the first vapor deposition body. In step S04, the second laser beam is irradiated onto the second vapor deposition body to evaporate the second vapor deposition body. The laser evaporation method according to the preferred embodiment of the present invention can be applied to the foregoing laser evaporation apparatus (as shown in FIG. 2), and possible implementation manners and effects of the above laser evaporation method are in the foregoing embodiments. The laser evaporation device has been discussed, so it will not be described here. In general, the laser steaming device of the above embodiment and its steaming method have a wide range of applications, and can be applied to the process steps of the organic light emitting diode panel. 13 1313570 The organic light emitting diode panel comprises a first electrode, an organic light emitting layer and a second electrode, wherein the first electrode and the second electrode system and the external power source form a circuit Electrons and holes are provided to the organic light-emitting layer. Specifically, the first electrode and the second electrode are not particularly limited to a cathode or an anode. The organic light emitting layer is formed on the first electrode, and the second electrode is formed on the organic light emitting layer. In general, when manufacturing an organic light-emitting layer of an organic light-emitting diode panel, it is manufactured by using the laser vapor deposition apparatus of the above-described embodiment and its vapor deposition method, and using the above-described embodiment of the laser steaming The plating apparatus and the evaporation method thereof can improve the utilization rate of the organic material, can be applied to a substrate of any size, and can easily control the evaporation of the organic material, and of course, improve the quality of the organic light-emitting diode panel. Due to advances in the technological era, the aforementioned organic light-emitting diode panels have been widely used in various electronic devices, such as mobile phones, digital cameras, personal digital assistants, notebook computers, desktop computers, televisions, and _ cars. a display, or a portable DVD player, etc.; generally, the electronic device includes an organic light emitting diode panel and an input unit, wherein the input unit is coupled to the organic light emitting diode panel and provides an input to the organic light emitting diode The body panel is such that the organic light emitting diode panel displays the image or data specified by the input unit. In summary, a laser evaporation device and a method thereof according to the present invention divide a laser light source into a first laser light and a second laser light by using a beam splitting element to make the first laser light and the second laser light The first vapor deposition body and the second vapor deposition body are uniformly vapor-deposited onto a substrate. Compared with the prior art, 14 1313570, because the laser evaporation device only needs one laser light source to emit a laser light source, and the light splitting component is used, the laser light source can be divided into multiple beams of laser light to illuminate and Evaporating all vapor-deposited bodies, not only can effectively control the intensity of laser light and increase the utilization rate of laser light, but also save the use cost; in addition, the spectroscopic component can divide the laser light source into laser light of different intensity or the same intensity but more The laser light of the beam makes the laser light with less intensity suitable for the vapor deposition body with lower evaporation rate or poor thermal stability, and the laser light with higher intensity is suitable for higher steaming rate or stability. The good steaming ore body can not only easily and effectively control the utilization rate of the vapor-deposited body, but also greatly improve the convenience of the control of the process. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention should be included in the scope of the appended claims. [FIG. 1 is a schematic diagram showing a conventional vapor deposition apparatus. 2 is a schematic view showing a laser evaporation device according to a preferred embodiment of the present invention; and FIG. 3 is a schematic view showing a laser evaporation device according to a preferred embodiment of the present invention, which has a schematic view of a pulley and a slide rail. Figure 4 is a schematic view showing the use of a triple vapor-deposited body and divided into three beams of laser light by a grating-fitted mirror in accordance with a preferred embodiment of the present invention; Figure 5 is a view showing the use of three-evaporation in accordance with a preferred embodiment of the present invention; FIG. 6 is a flow chart showing a laser evaporation method according to a preferred embodiment of the present invention. FIG. 6 is a flow chart showing a laser beam splitting lens with a beam splitter and a mirror; Description of component symbols: 1 evaporation apparatus 11 坩埚- 111 cover - 112 small hole 1 113 heating coil 21 substrate 22 organic material 3 laser evaporation device 31 beam splitter 32 first accommodating element 33 second accommodating element | 34 base Seat 35 mirror 36 first focusing mirror 37 second focusing mirror 38 slide rail 39 pulley 41 first vapor deposition body 42 second vapor deposition body 43 third vapor deposition body 16 1313570 5 laser light source generator 6 substrate L laser Light source LI First laser light L2 Second laser light L2y Laser light L3 Third laser light L3' Laser light 71 Light beam 72 Beam splitter 73 Mirror 74 Focusing mirror S01-S04 Flow of laser evaporation method 17

Claims (1)

1313570 98·| a修(更)正本 ' , _98年04月03日補充修正修正頁 十、申請專利範圍: 1、 一種雷射蒸鍍裝置,係蒸鍍一第一蒸鍍體與一第二蒸 鍍體,該雷射蒸鍍裝置包含: 一分光元件,係接收一雷射光源以將該雷射光源分為 一第一雷射光與一第二雷射光; 一第一容置元件,係容置該第一蒸鍍體,其中該第一 雷射光係照射該第一蒸鍍體以蒸鍍該第一蒸鍍體; 一第二容置元件,係容置該第二蒸鍍體,其中該第二 雷射光係照射該第二蒸鍍體以蒸鍍該第二蒸鍍體; 以及 一基座,該分光元件、該第一容置元件及該第二容置 元件係設置於該基座,該雷射光源係鄰設於該基座。 2、 如申請專利範圍第1項所述之雷射蒸鍍裝置,其中該 雷射光源係由一雷射光源產生器產生,該雷射光源產 ►生器係鄰設於該雷射蒸鍍裝置。 3、 如申請專利範圍第1項所述之雷射蒸鍍裝置,其中該 分光元件係為一分光鏡。 4、 如申請專利範圍第1項所述之雷射蒸鍍裝置,其中該 分光元件係為一光柵。 5、 如申請專利範圍第1項所述之雷射蒸鍍裝置,更包含: 18 1313570 98年04月03日補充修正修正頁 一反射鏡,係反射該第二雷射光以產生一反射雷射 光,其中該反射雷射光與該第一雷射光之照射方向 係平行。 6、 如申請專利範圍第1項所述之雷射蒸鍍裝置,更包含: 一第一聚焦鏡,係設置於該分光元件與該第一容置元 件之間,其中該第一雷射光穿過該第一聚焦鏡後聚 焦於該第一蒸鍍體;以及 一第二聚焦鏡,係設置於該分光元件及該第二容置元 件之間,其中該第二雷射光穿過該第二聚焦鏡後聚 焦於該第二蒸鍍體。 7、 如申請專利範圍第1項所述之雷射蒸鍍裝置,其中該 第一雷射光及該第二雷射光係同時分別照射至該第一 蒸鍍體及該第二蒸鍍體以同時將該第一蒸鍍體及該第 二蒸鍍體加熱且蒸鍍至一基板上。 8、 如申請專利範圍第1項所述之雷射蒸鍍裝置,更包含: 一滑軌及一滑車,其中該基座係滑設於該滑車,該滑 車滑設該滑軌上,該基座之滑動方向係垂直於該滑 車之滑動方向。 9、 一種雷射蒸鍍方法,係蒸鍍一第一蒸鍍體與一第二蒸 鍍體,該第一蒸鍍體容置於該第一容置元件,該第二 19 1313570 ,' 98年04月03日補充修正修正頁 蒸鍍體容置於該第二容置元件,該雷射蒸鍍方法係包 含下列步驟: 將該雷射光源分為一第一雷射光與一第二雷射光; 提供一第一蒸鍍體和一第二蒸鍍體,其中該第一蒸鍍 體和第二蒸鍍體之加熱特性不同; 將該第一雷射光照射該第一蒸鍍體以蒸鍍該第一蒸鍍 體;以及 將該第二雷射光照射該第二蒸鍍體以蒸鍍該第二蒸鍍 體, 其中,將該第一容置元件及該第二容置元件設置於一 基座,將該雷射光源鄰設於該基座。 10、如申請專利範圍第9項所述之雷射蒸鍍方法,其中該 第二雷射光之能量強度比該第一雷射光之能量強度 為南。 11、 如申請專利範圍第10項所述之雷射蒸鍍方法,其中 該第二蒸鍍體之熱穩定性比該第一蒸鍍體之熱穩定 性為局。 12、 如申請專利範圍第10項所述之雷射蒸鍍方法,其中 該第二蒸鍍體之昇華溫度比該第一蒸鍍體之昇華溫 度為南。 20 1313570 98年04月03曰補充修正修正頁. 13、 如申請專利範圍第10項所述之雷射蒸鍍方法,其中 該第二蒸鍍體之鍍率比該第一蒸鍍體之鍍率為高。 14、 如申請專利範圍第9項所述之雷射蒸鍍方法,更包含: 反射該第二雷射光以產生一反射雷射光,其中該反射 雷射光係與該第一雷射光之照射方向平行。 15、 如申請專利範圍第9項所述之雷射蒸鍍方法,其中該 第一雷射光與該第二雷射光係分別聚焦於該第一蒸 鍍體與該第二蒸鍍體。 16、 如申請專利範圍第9項所述之雷射蒸鍍方法,更包括: 將該第一蒸鍍體蒸鍍到一基板上;以及 將該第二蒸鍍體蒸鍍到該基板上。 17、 如申請專利範圍第9項所述之雷射蒸鍍方法,其中該 第一蒸鐘·體和該第二蒸鍛體為一有機材料。 18、 如申請專利範圍第17項所述之雷射蒸鍍方法,其中 該第一蒸鍍體為一客體,該第二蒸鍍體為一主體。 19、 一種有機發光二極體面板,其包括: 一第一電極; 一有機發光層,形成於該第一電極上,其中該有機發 21 1313570 .' 98年04月03日補充修正修正頁 光層係由如申請專利範圍第9項所述之雷射蒸鍍方 法製得;以及 一第二電極,形成於該有機發光層上。 20、 一種電子裝置,其包括: 如申請專利範圍第19項所述之有機發光二極體面 板;以及 I 一輸入單元,與面板搞合並對面板提供輸入,使得該 面板顯示影像。 21、 如申請專利範圍第20項所述之電子裝置,其中該電 子裝置為移動式電話、數位照相機、個人數位助理、 筆記型電腦、桌上型電腦、電視機、車用顯不斋、或 可攜式DVD機。1313570 98·| a repair (more) original ', _98, April 03, supplementary amendments page 10, the scope of application for patents: 1, a laser evaporation device, is a vapor deposition of a first vapor deposition body and a second The vapor deposition device comprises: a light splitting component, configured to receive a laser light source to divide the laser light source into a first laser light and a second laser light; and a first receiving component The first evaporating body is disposed, wherein the first ejecting light is irradiated to the first evaporating body to evaporate the first evaporating body; and a second accommodating member is configured to receive the second evaporating body, The second laser light is irradiated to the second vapor deposition body to evaporate the second vapor deposition body; and a susceptor, the light splitting element, the first accommodating element and the second accommodating element are disposed on the a pedestal, the laser light source is adjacent to the pedestal. 2. The laser evaporation device according to claim 1, wherein the laser light source is generated by a laser light source generator, and the laser light source is adjacent to the laser evaporation device. Device. 3. The laser vapor deposition device of claim 1, wherein the beam splitting element is a beam splitter. 4. The laser vapor deposition device of claim 1, wherein the beam splitting element is a grating. 5. The laser evaporation device according to claim 1, further comprising: 18 1313570 Supplementary correction page of April 3, 1998, a mirror that reflects the second laser light to generate a reflected laser light. The reflected laser light is parallel to the illumination direction of the first laser light. 6. The laser evaporation device of claim 1, further comprising: a first focusing mirror disposed between the beam splitting element and the first receiving component, wherein the first laser light passes through After the first focusing mirror is focused on the first vapor-depositing body; and a second focusing mirror is disposed between the beam splitting element and the second receiving component, wherein the second laser light passes through the second The focusing mirror is focused on the second vapor deposition body. 7. The laser vapor deposition device of claim 1, wherein the first laser light and the second laser light are simultaneously irradiated to the first vapor deposition body and the second vapor deposition body simultaneously. The first vapor-deposited body and the second vapor-deposited body are heated and vapor-deposited onto a substrate. 8. The laser evaporation device according to claim 1, further comprising: a slide rail and a pulley, wherein the base is slidably disposed on the trolley, and the trolley slides on the slide rail, the base The sliding direction of the seat is perpendicular to the sliding direction of the trolley. 9. A laser evaporation method, wherein a first vapor deposition body and a second vapor deposition body are vapor deposited, the first vapor deposition body being housed in the first accommodating member, the second 19 1313570, '98 The supplemental correction page of the year of April 03 is placed in the second accommodating element, and the laser evaporation method comprises the following steps: dividing the laser light source into a first laser light and a second ray Providing a first vapor deposition body and a second vapor deposition body, wherein the first vapor deposition body and the second vapor deposition body have different heating characteristics; and the first laser light is irradiated to the first vapor deposition body to be steamed Plating the first vapor deposition body; and irradiating the second vapor deposition body to the second vapor deposition body to evaporate the second vapor deposition body, wherein the first accommodating member and the second accommodating member are disposed on a pedestal, the laser source is adjacent to the pedestal. 10. The laser evaporation method of claim 9, wherein the energy intensity of the second laser light is greater than the energy intensity of the first laser light. 11. The laser evaporation method according to claim 10, wherein the thermal stability of the second vapor-deposited body is greater than the thermal stability of the first vapor-deposited body. 12. The laser evaporation method according to claim 10, wherein the sublimation temperature of the second vapor deposition body is souther than the sublimation temperature of the first vapor deposition body. The method of claim 10, wherein the plating rate of the second vapor-deposited body is higher than that of the first vapor-deposited body. The rate is high. 14. The laser evaporation method of claim 9, further comprising: reflecting the second laser light to generate a reflected laser light, wherein the reflected laser light is parallel to the illumination direction of the first laser light. . 15. The laser evaporation method of claim 9, wherein the first laser light and the second laser light system are respectively focused on the first vapor-deposited body and the second vapor-deposited body. The laser evaporation method according to claim 9, further comprising: depositing the first vapor deposition body onto a substrate; and depositing the second vapor deposition body onto the substrate. 17. The laser evaporation method according to claim 9, wherein the first vapor body and the second steam body are an organic material. 18. The laser evaporation method according to claim 17, wherein the first vapor deposition body is a guest body, and the second vapor deposition body is a body. 19. An organic light-emitting diode panel, comprising: a first electrode; an organic light-emitting layer formed on the first electrode, wherein the organic hair 21 1313570. 'April 03, 1998 supplementary correction correction page light The layer is obtained by a laser evaporation method as described in claim 9; and a second electrode is formed on the organic light-emitting layer. An electronic device comprising: the organic light emitting diode panel according to claim 19; and an input unit, which is combined with the panel to provide input to the panel, so that the panel displays an image. 21. The electronic device of claim 20, wherein the electronic device is a mobile phone, a digital camera, a personal digital assistant, a notebook computer, a desktop computer, a television, a car, or Portable DVD player.
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Publication number Priority date Publication date Assignee Title
TWI472635B (en) * 2013-09-13 2015-02-11 Univ Nat Taiwan Pulsed laser deposition system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472635B (en) * 2013-09-13 2015-02-11 Univ Nat Taiwan Pulsed laser deposition system

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