D12867 九、發明說明： 【發明所屬之技術領域】 特別是指一 種用於探針 本發明係與懸臂式探針有關 卡上以傳遞高頻訊號的懸臂式探針 【先前技術】 請參閱第—圖所示習用之 路板10、複數個_傳輪“二作1包括有一電 臂式㈣η ^ ―探針座12及複數個懸 ιοί用以絲♦電路板1G上#近外圍處設有多個機台銲點 1用以接收電測機台所送出的 ’，” 線11僂破㈣遽’精由各同轴傳輪 俨雷/ϋ 對應紐連接之探針13上以對積 15 執行晶陳觀I程；其中探針座12具有一接 2!姑一座體122及多數個固定件123，接地面⑵電 户19至^探針卡1上的接地電位，該些探針13設於探針 上’分聰由各固定件123固定各探針η之身部， 十13於針尖130至固定件⑵之間的前端131部位 芯；米針座12 ’因此提供為各探針13點觸待測電子 :件時’承受來自針尖13〇反作用力的彈性緩衝力臂，各 才木針13之末端132則設於電路板1〇下方靠近中心處的各 探針銲點102上。 由於各同車由傳輸線U外圈具有一導電金屬111與接地 面121電性連接，可維持各同軸傳輸線11冑頻訊號傳輸的 特!生阻^但只際上各同轴傳輸線U至積體電路晶圓之間 尚有各探針13結構，且各探針13僅為一導電金屬，其外 層並無類似同轴傳輸線11之結構處理，故同軸傳輸線11 4 1312867 、的高頻訊號傳輸至探針13時，探針13周圍介電環境的 • 生電容效應則會造成高頻訊號傳輸的介電損耗，因此去 向頻電測的可靠性。 縱使有如第二圖所*為經改良之―懸f式探針卡a ,以 —5具有同軸傳輸線特性之各同軸探針2〇結構取代上述探斜 ~ 13之單一導電金屬結構’並將探針座12之座體122以具 導電性的金屬材質所製成；其中’各同轴探針2G以-金屬 • 針21為軸芯，並區分為前、後端20卜202部位，前端2〇1 位於固定件123至針尖之間，後端2〇2位於固定件123至 ⑴電路板10之間，金屬針21之後端2〇2周圍包覆一層介電 材料22，介電材料22之外層包覆一導電金屬23，導電金 屬23並與金屬材質之紐m減並電性連接至該探針卡 2上的接地電位，使各同軸探針2〇於後端2〇2部位可以維 持高頻訊賴輸的特性阻抗，但級各⑽探針2()之前端 丨5 2〇 1部位係用以承受來自針尖反作用力的彈性緩衝力臂需 ·- _有金屬針21本體之特定重量及其周圍所需之緩衝活動 S間’無法如其後端搬增加同軸傳輸線之設置結構，於 周圍同樣包覆有與紐m相接制外層導電金屬，故高 頻傳輸特性僅限於各同軸探針Μ之後# 2〇2部位無法及於 2〇前端201 ’同樣容易使探針20周圍介電環境的寄生電容效 應造成高頻訊號傳輸的介電損耗。 因捸針卡如何能以最有效的訊號傳輸結構，維持高 頻訊號傳輸的特性阻抗實為現今探針卡製造者所面臨的一 大考驗。 5 1312867 【發明内容】 二應===巧，_式 阻抗。 維持，電測訊號的特性 卡 ，發明之另一目的乃在於提供 ，係以減少_製作成本之 ^賴臂式探針 傳送品質，有效_於晶圓級電丨紅頻電測訊號的 為達成前揭目的，本發明所提次二 1〇針卡係具有一電路板、一針座、多^頻懸臂式探 屬針，該電路板佈設有電子電路， 輪線及多數個金 接地線電性連接該些傳輸線，因此可供=夕數個訊號線及 觸’以傳遞高頻測試訊號至該些傳輸線^機台電性接 各該金屬針具有一固定部、一針尖及該些金屬針； 15之一前臂，各該固定部設於該針座，各^部向針尖延伸 體電路晶圓，該此金屬針更區如十央用以點觸積 蚊部麟於各該傳輪線之金屬導線，該 ^也針之S1定部電性連接該傳輸線之同軸金屬，因此該些金 屬針可傳遞上述高頻測試訊號至對應點觸之電子元件，且 20該接地針之前臂與相鄰之該訊號針之前臂之間維持有特定 間距’可維持各該訊號針傳遞高頻測試訊號之特性阻抗。 【實施方式】 以下’兹配合圖示列舉若干較佳實施例，用以對本 6 1312867 务明之結構與功效作詳細說明，其中所用圖示之簡要說 明如下： 第二圖係本發明所提供第一較佳實施例之上視圖； 第四圖係上述第一較佳實施例所提供之結構示意圖； 5 第五圖係上述第一較佳實施例所提供探針卡之探針區底 視圖； 第八圖係上述第五圖之局部結構放大圖； 第七圖係本發明所提料二較佳實關之結構示意圖； 第八圖係上述第二較佳實施例所提讎針卡之探針區底 1〇 視圖； 第九圖係上述第八圖之局部結構放大圖； 第十圖係本發騎提料三難實_之騎卡之探針 區底視圖； 圖 15 第十一圖係上述第十圖之局部結構放大 請參閱如第三至第五圖所示本發明所提供之第一較 實施例’為用以量測積體電路晶圓m式探針卡3，勺土 -電路板30、一針座4〇、多數個傳輸線％及： 金屬針60，其中： 7默個 請=合第三及第四圖參照，該電路板3()可㈣出 上表面301及一下表面3〇2，以及内、外圍之 戸 3〇3及-測試區綱，該上表面則之測試區綱可 20 1312867 . 測機台（圖中未示）電性接觸，該電測機台可輸出電測訊 號至該探針卡3，以傳遞高頻測試訊號至内圍之探針區 303，該電路板30佈設有電子電路，包括有多數個訊號線 31及接地線32，係自該上表面3〇1延伸設置至下表面 5以電性連接該些傳輸線50,各該訊號線31用以傳遞上述高 _ 頻測試訊號，且相鄰特定間距上設有該接地線32，各該= 地線32可直接或間接與電測機台的接地電位電性連接，因 鲁 此維持各該訊號線31傳遞高頻測試訊號之特性阻抗。 請配合第四及第五圖參照，該針座4〇係環設於該電路 w板30下表面302之探針區3〇3上，為如環氧樹脂等具良好 絕緣特性的材質所製成，用以固定各該金屬針6〇並使相互 不電性導通。 請配合第四至第六圖參照，各該傳輸線5〇設於該針座 40之外圍，其一端接設於該電路板3〇上，另一端則接設於 15該金屬針60，各該傳輸線5〇為同軸結構，係於一金屬導線 • ' 51外依序包覆有一介電層52、一同軸金屬53及一保護層 =4’該金屬導線51電性連接該訊號線31以傳遞上述高頻測 試訊號，該同軸金屬53電性連接該接地線32，因此維持各 该金屬導線51傳遞高頻測試訊號之特性阻抗。 2〇 清配合第四及第六圖參照，各該金屬針60具有一固定 部601、一針尖602及自固定部601向針尖6〇2延伸之一前 煮603 ’各该固疋部6〇1設於該針座4〇，各該針尖602用 以點觸上述積體電路晶圓上之一測試銲塾71，該些金屬針 6〇更區分有相鄰之一訊號針61及一接地針62，該訊號針 8 !312867 61之固定部601接設於該金屬導線51，因此可傳遞上述高 頻測试sfl號至對應之測試銲墊71所連接之電子元件，該接 地針62之固定部601接設於該同軸金屬53，因此可以針尖 602點觸該電子元件之接地電位所對應之一接地銲墊72， 該接地針62之前臂603並與相鄰之該訊號針61之前臂6〇3 之間維持有特定間距，因此可維持該訊號針61傳遞高頻測 試訊號之特性阻抗。 15 20 ^綜合上述之結構可知，本發明所提供之該懸臂式探針卡3 係為以各該金屬針60與各該傳輸線％之組合結構取代習 用探針結構，使高頻測試訊號傳遞之路徑上皆設有鄰近之 接地電位’因此達到最佳阻抗匹配的效果以維持高頻測試 訊號之傳輸品質’有效彌補f用探針卡之探針結構的缺 點；再者，由於該探針卡3所提供之各該金屬針6〇在結構 上之長度僅有相當於該探針卡3中心至該針座4〇之距離， 因此有效節省較習用之探針結構近一半之製作成本。 另請參閱如第七及第八圖所示本發 所提供之—懸臂式探 實她例 ^ ^ 7下* 上述弟一較佳實施例所提供 者差異在^，該針座4G上更設有—接地面41， 各該傳輸線5〇之同軸金屬二 第域參照因此==_該接地面41，配合 電子電路可提供為該探針卡4中 電位，且—之=:=:=地 即可維持各該訊號針61傳遞高頻戦訊號之特性阻抗，可 9 1312867 ‘減少該些接地針62之設置數量，用以量測對應設置較少接 .地銲墊的晶圓電子電路結構。 當然本發明所提供之高頻測試訊號傳輸結構亦不限定為 上述同軸傳輸線50配合金屬針60之設置結構，若應用於 5 一般顯示器驅動晶片做高頻差動訊號之量測，則可如第十 及第十一圖所示本發明第三較佳實施例提供之一懸臂式探針 卡5 ’其差異在於具有多數個差動傳輸線8〇取代上述實施例 • 之傳輸線50以傳遞高頻差動訊號，各該差動傳輸線8〇為相 鄰有特定間距之雙軸心導線的結構，具有二金屬導線81、二 1〇介電層82、一同軸金屬83及一保護層84，各該差動傳輸線 8〇之各金屬導線81對應接設有該訊號針61，各該同軸金屬 83則電性連接至少一該接地針a,因此藉由該同軸金屬幻 及所對應接設之該接地針62，使該探針卡5傳遞高頻差動 訊號過程中可維持阻抗匹配的特性。 15 唯’以上所述者，僅為本發明之較佳可行實施例而已， • 故舉凡應用本發明說明書及申請專利範圍所為之等效结構 變化，理應包含在本發明之專利範圍内。 1312867 【圖式簡單說明】 第-圖係制懸臂式探針卡之結構示意圖； 第二圖係另-習用懸臂式探針卡之局部結構示意圖； 第三圖係本發明所提供第-較佳實施例之上視圖； 5第四圖係上述第—較佳實施例所提供之結構示意圖； 第五圖係上述第-較佳實施例所提供探針卡之探針區底 視圖； 第六圖係上述第五圖之局部結構放大圖； 第七圖係本發騎提供第二較佳實施例之結構示意圖； ίο 帛八關上述帛二較佳實補所提郷針卡之探針區底 視圖； 第九圖係上述第八圖之局部結構放大圖； 第十圖係本發明所提供第三較佳實施例之探針卡之探針 區底視圖； 15 第十一圖係上述第十圖之局部結構放大圖。 11 1312867 【主要元件符號說明】 3、4、5懸臂式探針卡 30電路板 302下表面 5 3 04測試區 32接地線 41接地面 51、81金屬導線 53、83同軸金屬 ίο 60金屬針 602針尖 61訊號針 71測試銲墊 301上表面 303探針區 31訊號線 40針座 50、80傳輸線 52、82介電層 54、84保護層 601固定部 603前臂 62接地針 72接地銲墊 12D12867 IX. Description of the invention: [Technical field to which the invention pertains] In particular, a cantilever probe for use in probes of the present invention and a cantilever probe for transmitting high frequency signals [Prior Art] Please refer to Figure shows the conventional road board 10, a plurality of _ transmission wheels "two for 1 including an arm type (four) η ^ - probe holder 12 and a plurality of suspensions for the wire ♦ circuit board 1G on the near the periphery The soldering point 1 of the machine is used to receive the ',' line 11 of the electric measuring machine. (4) 精 ' Fine by each coaxial transmission 俨 ϋ / ϋ Corresponding to the connection of the probe 13 to perform the crystal on the 15 Chen Guan I; wherein the probe base 12 has a connection 2; a body 122 and a plurality of fixing members 123, a grounding surface (2) electric household 19 to the ground potential of the probe card 1, the probes 13 are provided On the probe, the body of each probe η is fixed by each fixing member 123, the core of the front end 131 between the tip 130 and the fixing member (2) is 13; the needle holder 12' is thus provided for each probe 13 points. Touching the test electron: when the piece is 'receiving the elastic buffering force arm from the needle tip 13〇 reaction force, the end 132 of each wooden needle 13 1〇 provided on the circuit board below each probe 102 near the center of the pad. Since each of the same vehicles has a conductive metal 111 electrically connected to the ground plane 121 by the outer ring of the transmission line U, the special transmission resistance of the coaxial transmission line of the coaxial transmission line 11 can be maintained, but only the coaxial transmission lines U to the integrated body There are still probes 13 between the circuit wafers, and each probe 13 is only a conductive metal, and the outer layer has no structure similar to the coaxial transmission line 11, so the high frequency signal of the coaxial transmission line 11 4 1312867 is transmitted to In the case of the probe 13, the capacitive effect of the dielectric environment around the probe 13 causes a dielectric loss of the high-frequency signal transmission, and thus the reliability of the go-to-frequency measurement. Even if there is a modified "suspended-type probe card a" as shown in the second figure, the coaxial conductive probe 2〇 structure with the characteristics of the coaxial transmission line is replaced by the above-mentioned single conductive metal structure of the above-mentioned probe~13 and will be explored. The base 122 of the hub 12 is made of a conductive metal material; wherein the 'coaxial probes 2G' are made of a metal core 21 and are divided into front and rear ends 20 and 202, and the front end 2 〇1 is located between the fixing member 123 and the tip of the needle, and the rear end 2〇2 is located between the fixing member 123 to the circuit board 10 of the (1). The rear end 2〇2 of the metal needle 21 is covered with a dielectric material 22, and the dielectric material 22 is The outer layer is covered with a conductive metal 23, and the conductive metal 23 is electrically connected to the ground potential of the probe card 2, and the coaxial probe 2 is maintained at the rear end 2〇2. The characteristic impedance of the high-frequency signal is transmitted, but each stage (10) probe 2 () front end 丨 5 2 〇 1 part is used to withstand the elastic buffer force arm from the needle tip reaction force · - _ with the metal needle 21 body specific The weight and the buffering activity required around it can't be increased as the rear end of the coaxial transmission line. The outer layer is also coated with the outer layer of the conductive metal, so the high-frequency transmission characteristics are limited to the respective coaxial probes. The #2〇2 part cannot be connected to the 2〇 front end 201'. The parasitic capacitance effect of the electrical environment causes the dielectric loss of high frequency signal transmission. Because the pin card can transmit the structure with the most efficient signal, maintaining the characteristic impedance of high-frequency signal transmission is a big challenge for today's probe card manufacturers. 5 1312867 [Summary of the Invention] Two should be === skill, _ type impedance. Maintaining the characteristic card of the electrical test signal, another purpose of the invention is to provide the quality of the transmission of the arm-type probe to reduce the manufacturing cost, and to effectively achieve the achievement of the wafer-level electronic red-frequency electrical signal. The purpose of the present invention is to provide a circuit board, a pin holder, and a multi-frequency cantilever type probe. The circuit board is provided with an electronic circuit, a wheel line and a plurality of gold grounding wires. Sexually connecting the transmission lines, so that the number of signal lines and touches can be transmitted to the transmission lines to the transmission lines, and the metal pins have a fixing portion, a needle tip and the metal pins; a forearm, each of the fixing portions is disposed on the needle holder, and each of the portions extends to the tip of the circuit chip, and the metal needle is further used to touch the mosquito net to the respective roller lines. The metal wire, the S1 portion of the pin is electrically connected to the coaxial metal of the transmission line, so the metal pins can transmit the high frequency test signal to the corresponding touched electronic component, and the ground pin has the front arm adjacent to The signal pin maintains a specific spacing between the arms before the ' The characteristic impedance of each of the signal pins for transmitting the high frequency test signal can be maintained. [Embodiment] The following is a detailed description of several preferred embodiments for the detailed description of the structure and function of the present invention. The following is a brief description of the drawings: The second figure is the first provided by the present invention. 4 is a schematic view of the structure of the probe card provided by the first preferred embodiment; 5 is a bottom view of the probe region of the probe card provided by the first preferred embodiment; 8 is an enlarged view of a partial structure of the fifth embodiment; the seventh diagram is a schematic diagram of a preferred embodiment of the present invention; and the eighth diagram is a probe for the needle card of the second preferred embodiment. The ninth figure is an enlarged view of the partial structure of the above eighth figure; the tenth figure is the bottom view of the probe area of the riding card which is difficult to implement; Figure 15 For the enlargement of the partial structure of the above tenth embodiment, please refer to the first comparative example provided by the present invention as shown in the third to fifth figures for measuring the integrated circuit wafer m-type probe card 3, scoop- Circuit board 30, one pin holder 4〇, a plurality of transmission lines % and: metal 60, wherein: 7 silent = please refer to the third and fourth figures, the circuit board 3 () can (4) the upper surface 301 and the lower surface 3 〇 2, and the inner and outer 戸 3 〇 3 and - test area In the upper surface, the test area can be 20 1312867. The measuring machine (not shown) is electrically contacted, and the measuring machine can output an electrical measuring signal to the probe card 3 to transmit the high frequency test signal. The circuit board 30 is provided with an electronic circuit, and includes a plurality of signal lines 31 and a grounding line 32 extending from the upper surface 3〇1 to the lower surface 5 to electrically connect the plurality of signal lines 31 and the grounding line 32. The transmission line 50, each of the signal lines 31 is configured to transmit the high-frequency test signal, and the ground line 32 is disposed adjacent to a specific interval, and each of the ground lines 32 can directly or indirectly be electrically connected to the ground potential of the electric measuring machine. The connection is made to maintain the characteristic impedance of the high frequency test signal transmitted by each of the signal lines 31. Referring to the fourth and fifth figures, the socket 4 is provided on the probe area 3〇3 of the lower surface 302 of the circuit w, and is made of a material having good insulating properties such as epoxy resin. In order to fix each of the metal pins 6 〇 and make them electrically non-conductive. Referring to the fourth to sixth figures, each of the transmission lines 5 is disposed on the periphery of the hub 40, one end of which is connected to the circuit board 3, and the other end is connected to the metal pin 60. The transmission line 5 is a coaxial structure, and is connected to a metal wire. The '51 outer layer is sequentially covered with a dielectric layer 52, a coaxial metal 53 and a protective layer=4'. The metal wire 51 is electrically connected to the signal line 31 for transmission. In the high frequency test signal, the coaxial metal 53 is electrically connected to the ground line 32, thereby maintaining the characteristic impedance of each of the metal wires 51 to transmit the high frequency test signal. Referring to the fourth and sixth figures, each of the metal needles 60 has a fixing portion 601, a needle tip 602, and a self-fixing portion 601 extending to the needle tip 6〇2 to boil 603' each of the solid portion 6〇 1 is disposed in the needle holder 4, each of the needle tips 602 is used to touch one of the test pads 71 on the integrated circuit wafer, and the metal pins 6 are further distinguished by an adjacent one of the signal pins 61 and a ground. The pin 62, the fixing portion 601 of the signal pin 8 !312867 61 is connected to the metal wire 51, so that the high frequency test sfl can be transmitted to the electronic component connected to the corresponding test pad 71, the ground pin 62 The fixing portion 601 is connected to the coaxial metal 53. Therefore, the tip 602 can touch the grounding pad 72 corresponding to the ground potential of the electronic component. The grounding pin 62 is adjacent to the front arm 603 and the adjacent arm of the signal pin 61. A certain spacing is maintained between 6 and 3, so that the characteristic impedance of the high frequency test signal transmitted by the signal pin 61 can be maintained. 15 20 ^ In summary of the above structure, the cantilever probe card 3 provided by the present invention replaces the conventional probe structure with a combination of the metal pins 60 and each of the transmission lines, so that the high frequency test signal is transmitted. The path is provided with an adjacent ground potential 'so that the best impedance matching effect is achieved to maintain the transmission quality of the high frequency test signal' effectively compensates for the shortcomings of the probe structure of the probe card for the probe card; further, due to the probe card Each of the metal pins 6 provided in the structure has a length equivalent to the distance from the center of the probe card 3 to the socket 4, thereby effectively saving the manufacturing cost of the conventional probe structure by half. Please also refer to the example provided in the present invention as shown in the seventh and eighth figures - the cantilever type of the invention is based on the following example. ^ The difference is provided in the above-mentioned preferred embodiment of the present invention, and the needle holder 4G is further provided. There is a ground plane 41, and the coaxial metal of each of the transmission lines 5 is referenced. Therefore, the ground plane 41 can be provided as a potential in the probe card 4, and the ===:= ground The characteristic impedance of each of the signal pins 61 for transmitting the high frequency chirp signal can be maintained, and the number of the grounding pins 62 can be reduced by 9 1312867 to measure the electronic circuit structure of the wafer corresponding to the ground pad. . The high-frequency test signal transmission structure provided by the present invention is not limited to the configuration of the coaxial transmission line 50 and the metal pin 60. If the general-purpose display driver chip is used for the measurement of the high-frequency differential signal, the A third preferred embodiment of the present invention, shown in the tenth and eleventh aspects, provides a cantilever probe card 5' which differs in that a plurality of differential transmission lines 8 are provided in place of the transmission line 50 of the above embodiment to transmit a high frequency difference. The signal, each of the differential transmission lines 8 is a structure of a double-axis conductor adjacent to a specific spacing, and has two metal wires 81, two dielectric layers 82, a coaxial metal 83, and a protective layer 84. Each of the metal wires 81 of the differential transmission line 8 is connected to the signal pin 61, and each of the coaxial wires 83 is electrically connected to at least one of the ground pins a. Therefore, the grounding is connected by the coaxial metal The needle 62 allows the probe card 5 to maintain impedance matching characteristics during the transmission of the high frequency differential signal. The above is only the preferred embodiment of the present invention, and the equivalent structural changes of the present invention and the scope of the patent application are intended to be included in the scope of the present invention. 1312867 [Simple description of the drawings] The structure of the cantilever type probe card of the first figure is shown in the figure; the second figure is a partial structure diagram of the cantilever type probe card of the conventional one; the third figure is the first preferred embodiment provided by the present invention. 5 is a schematic view of the structure of the probe card provided by the above-mentioned first preferred embodiment; FIG. 5 is a bottom view of the probe region of the probe card provided by the above-described first preferred embodiment; FIG. 7 is a schematic view showing the structure of the second preferred embodiment of the present invention; FIG. 7 is a schematic view showing the structure of the second preferred embodiment of the present invention; ίο 帛 关 关 帛 较佳 较佳 较佳 较佳 较佳 较佳 较佳 较佳The ninth drawing is an enlarged view of a partial structure of the eighth embodiment; the tenth drawing is a bottom view of the probe area of the probe card of the third preferred embodiment provided by the present invention; An enlarged view of the partial structure of the figure. 11 1312867 [Description of main components] 3, 4, 5 cantilever probe card 30 circuit board 302 lower surface 5 3 04 test area 32 grounding wire 41 ground plane 51, 81 metal wire 53, 83 coaxial metal ίο 60 metal pin 602 Tip 61 Signal Needle 71 Test Pad 301 Upper Surface 303 Probe Area 31 Signal Line 40 Needle 50, 80 Transmission Line 52, 82 Dielectric Layer 54, 84 Protective Layer 601 Fixing Port 603 Forearm 62 Grounding Pin 72 Grounding Pad 12