TWI311819B - Substrate for mounting light emitting element, light emitting element package body, display apparatus, and illumination apparatus - Google Patents
Substrate for mounting light emitting element, light emitting element package body, display apparatus, and illumination apparatus Download PDFInfo
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- TWI311819B TWI311819B TW95119607A TW95119607A TWI311819B TW I311819 B TWI311819 B TW I311819B TW 95119607 A TW95119607 A TW 95119607A TW 95119607 A TW95119607 A TW 95119607A TW I311819 B TWI311819 B TW I311819B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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'I3ll8l9 九、發明說明： t發明所屬之技術領域3 發明領域 本發明係有關用以安裝發光二極體等發光元件之發光 元件安裝基板、前述基板上安裝發光元件封裝而成之發光 元件封裝體、裝用該前述發光元件封襞體而成之顯示裝置 及照明裝置。The present invention relates to a light-emitting element mounting substrate for mounting a light-emitting element such as a light-emitting diode, and a light-emitting element package in which the light-emitting element package is mounted on the substrate. And a display device and an illumination device in which the light-emitting element is sealed.
1515
2〇 發明背景 發光元件就以對於來自外力之保護、控制發光之指向 角、供應電力於發光70件等之觀點而言，崎裝化為一般 情形(例如參照專利文獻1)。 Μ固诉賴的發光兀件封裝構造之—例之顯示圖，該 封裝構造係由設村自已絲之發光元件丨發出之光有效 ^射向前方之傾斜面之反射凹部’與—對發光㈣通電用 極4構成之封裝5,及安裝於該封裝5内之發光二極體等發 另:件i，及固定於前述一側之電極4上之前述發光元件泣 隔力充Γ一細線2’以及用以發光元件1 、卜乳而充填於封裝5之反射凹部之透明密封樹脂缚 法係將於白色發光二極體之情形時，通常採取的方 元件，血⑽H類之氮化⑽化合物铸體之藍色發光 發光鸯光體 Μ晴紐1之藍色光激發之黃色 切先體心後絲。第之構造 5 1311819 在密封樹脂3中分散前述螢光體後安装。2. RELATED ART BACKGROUND OF THE INVENTION The light-emitting element is in a general case from the viewpoint of protection from an external force, control of a directivity angle of light emission, supply of electric power to 70 pieces of light, and the like (see, for example, Patent Document 1).显示 诉 的 的 的 的 的 的 的 的 的 的 的 的 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀 兀The package 5 composed of the current-carrying electrode 4, the light-emitting diode mounted in the package 5, and the like, and the light-emitting element fixed to the electrode 4 on the one side are filled with a thin line 2 'and the transparent sealing resin binding method for the light-emitting element 1 and the milk-filled reflective recess of the package 5 in the case of a white light-emitting diode, usually a square element, a blood (10) H-type nitride (10) compound The blue illuminating illuminating body of the casting body is illuminating the yellow light of the yellow light. First Structure 5 1311819 The phosphor is dispersed in the sealing resin 3 and then mounted.
另一方面，為要提高發光二極體等發光元件之發光強 度，提高封裝之散熱性為有效之方法。發光元件之每單位 消費電力之發光效率，在技術水準仍低之現狀，對於發光 5無助力之電力轉換成熱，反而使發光元件本身發熱。發光 元件係半導體之一種，隨著溫度上昇發光效率降低。因此， 由於提高安裝該發光元件之基板等之封裝之散熱性，可將 更大的電流應用於發光元件，其結果每個發光元件的發光 強度可k南。散熱性高之基板可舉例如氮化鋁基板、在核 10 心使用金屬之金屬基板等。On the other hand, in order to improve the light-emitting intensity of a light-emitting element such as a light-emitting diode, it is effective to improve the heat dissipation of the package. The luminous efficiency per unit of power consumption of the light-emitting element is at a low level of technical level, and the power that is not assisted by the light-emitting element is converted into heat, and the light-emitting element itself is heated. The light-emitting element is a type of semiconductor, and the luminous efficiency is lowered as the temperature rises. Therefore, by increasing the heat dissipation of the package of the substrate or the like on which the light-emitting element is mounted, a larger current can be applied to the light-emitting element, with the result that the light-emitting intensity of each of the light-emitting elements can be made south. Examples of the substrate having high heat dissipation properties include an aluminum nitride substrate, a metal substrate using a metal in the core 10, and the like.
【專利文獻1】特開昭62-224986號公報 【專利文獻2】特許第3511987號公報 t 明内 J 發明概要 15發明所要解決之課題 在於藍色發光元件組合藍色激發之黃色發光螢光體之 方式而成之白色發光二極體，如前述傳統之構造於密封樹 脂添加螢光體的情形下，當安裝之螢光體之添加量不固定 時’或相對於樹脂之添加量雖是固定，由於含螢光體之樹 20知之安裝量參差不一’故發自發光元件之藍色光與螢光體 發出之黃色光失去平衡，其結果為色度呈顯不穩定。另螢 光體沈降於樹脂中，仍然會發生發光色之不均。由於此類 之色度不均，對於大量生產時不符目標規格者作為不良 品’或以色度之不同而區分作為出售品等，須有採取對策 6 1311819 之必要，故引起製程增加之問題，另也對於所期望之色度 範圍之白色發光二極體，造成難於大量生產之問題。[Patent Document 1] JP-A-62-224986 [Patent Document 2] Japanese Patent Laid-Open No. 3511987 No. 3511987 No. PCT Publication No. 351 1987. SUMMARY OF THE INVENTION The object of the invention is to combine a blue light-emitting element with a blue-emitting yellow-emitting phosphor. The white light-emitting diode formed by the method is as follows. In the case of the conventional structure in which the phosphor is added to the sealing resin, when the amount of the phosphor to be mounted is not fixed, or the amount of the resin added is fixed. Since the installation of the phosphor-containing tree 20 is different, the blue light emitted from the light-emitting element is out of balance with the yellow light emitted by the phosphor, and as a result, the chromaticity is unstable. In addition, the phosphor settles in the resin, and unevenness in luminescent color still occurs. Since such chromaticity is not uniform, it is necessary to take countermeasures 6 1311819 for those who do not conform to the target specifications in mass production as a defective product or to distinguish them as smear. Therefore, the process is increased. It also poses a problem that is difficult to mass produce for a white light-emitting diode of a desired chromaticity range.
另一方面，對於樹脂中設法混合螢光體之方法，亦曾被 提案（例如參照專利文獻2)。該專利文獻2中記載為要抑制色 5 度之偏差，以輪磨（Rollmill)等之裝置將螢光體均勻混合於 樹脂，由於此過程樹脂中螢光體之分散狀體穩定，結果色 度之偏差大幅降低。該方法中雖說是可謀求降低色度之偏 差，但於該傳統方式中混練所需之時間長，由於製造時間 延長，製品製造之加工費用增加，且須購置混合含有螢光 10 體樹脂之混練用裝置。 本發明鑑於前述情形加緊進行研討，目的在於提供當 於製造白色發光二極體時之色度偏差少，而易於製造高品 質之發光元件封裝體之發光元件安裝用基板、前述基板上 安裝發光元件封裝而成之發光元件封裝體、裝用前述該發 15 光元件封裝體而成之顯示裝置及照明裝置。 解決課題之方法 為要達成前述目的，本發明提供一種發光元件安裝用 基板，其中至少於核心金屬表面之發光元件安裝部分，被 覆有由含螢光體玻璃構成之螢光琺瑯層。 20 在本發明之發光元件安裝用基板中，前述發射凹部以 設置設有傾斜面可反射已安裝的發光元件發出之光者為 佳。 在本發明之發光元件安裝用基板中，前述螢光琺瑯層 上，以設有延伸至發光元件安裝位置之發光元件通電用電 7 極為佳。 在^發明之發一光元件安襄用基板中，前述榮光⑽層以 3有"色激發之黃色發先榮光體者為隹。 以八本^月之發光轉安裝用基板中，前錢光缺瑯層 佳:有以鈽激活之⑽石權石㈣體15f量。/。〜65質量％為 基板=:::有::述本發明一安裝用 t 而則述發光元件係以透明填封樹 月曰所填封之發光元件封裝體。 發光二i»發k發光π件封裝體中’前述發光元件係藍色 光發=體’而前述螢光_層以含有藍色激發之黃色發 先肇先體，且發出白色光者為佳。 用Μ ^之發光70件封裝射，以前述發光元件安裝 土反上安裝有多數個發光元件為佳。 關於本發明之發光轉安㈣基板絲少於核心金 2之發光元件絲部分，被覆有由含㈣體玻璃而成 光先_層’而使該發光元件安裝用基板上所安裝之發 直:續等發光元件發光，因此-部分發光元件發出之光 於和卜4⑨餘之光觸及發絲瑯基板而使該營光照射 而成\故對㈣得有發光元件發&之光與前述螢光混合 色菸之光之發光70件封裝體，可簡單地構成。特別是將藍 下X光—極體與藍色激發之黃色發光螢光體組合之情形 適且於製作白色發光二極體封裝體。 在。亥白色發光二極體封裝體製作時，傳統方法係於密 1311819 封樹脂中混合螢光體後安裝的關係，由於安裝不規則等所 製成之封裝體，雖易於產生色度之偏差，但本發明中由於 基板表面上設有含螢光體之螢光琺瑯層之構成，故螢光體 之分散在一批號間之螢光體不均勻之情形少，與傳統者比 5 較色度之偏差可大幅度降低。 再者，基板所用之核心金屬與陶瓷等比較，前者易於 機械加工，故對於可安裝複數個發光元件之基板構造物件 亦易於製作。On the other hand, a method of trying to mix a phosphor in a resin has also been proposed (for example, refer to Patent Document 2). Patent Document 2 describes that the phosphor is uniformly mixed with the resin by a device such as a roller mill, and the dispersion of the phosphor in the resin is stabilized, and the result is chromaticity. The deviation is greatly reduced. Although the method can reduce the variation of the chromaticity, the time required for the kneading in the conventional method is long, the processing cost is increased due to the prolonged manufacturing time, and the kneading of the mixed fluorescent resin is required. Use the device. The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a light-emitting element mounting substrate which is easy to manufacture a high-quality light-emitting element package when the white light-emitting diode is manufactured, and a light-emitting element mounted on the substrate. A packaged light-emitting device package, a display device and an illumination device comprising the above-described light-emitting device package. Means for Solving the Problems In order to achieve the above object, the present invention provides a substrate for mounting a light-emitting element, wherein a light-emitting element mounting portion of at least a core metal surface is covered with a phosphor layer comprising phosphor-containing glass. In the substrate for mounting a light-emitting element of the present invention, it is preferable that the emission concave portion is provided with an inclined surface to reflect light emitted from the mounted light-emitting element. In the light-emitting element mounting substrate of the present invention, it is preferable that the fluorescent layer is provided with a light-emitting element that is extended to the light-emitting element mounting position. In the substrate for illuminating an illuminating element of the invention, the glory (10) layer is 隹 3 3 3 & 色 激发 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹 隹In the base plate of the light-emitting installation of eight copies of the moon, the front of the light-deficient layer is good: there is a quantity of 15f of the stone (4) stone activated by 钸. /. ～65 mass% is a substrate=::: There is: a light-emitting device package in which the light-emitting element is filled with a transparent sealing tree. In the light-emitting diode package, the light-emitting element is blue light-emitting body=body, and the fluorescent layer is preferably a yellow-emitting precursor containing blue light, and white light is emitted. It is preferable to mount a plurality of light-emitting elements on the reverse side of the light-emitting element mounting body by using a light-emitting package of 70 pieces. The light-emitting device (4) of the present invention has a light-emitting element wire portion having less than the core gold 2, and is covered with a light-first layer formed of a (four)-form glass to directly mount the light-emitting element mounting substrate: After the illuminating element emits light, the light emitted by the part of the illuminating element touches the hair of the illuminating substrate and the illuminating light of the illuminating element is made. Thus, (4) the light of the illuminating element is emitted and the arsenal is The light-emitting color light-emitting light 70-piece package can be easily constructed. In particular, a combination of a blue X-ray body and a blue-excited yellow-emitting phosphor is suitable for producing a white light-emitting diode package. in. When the white light-emitting diode package is fabricated, the conventional method is to install the phosphor after mixing the phosphor in the 1311819 resin. The package made by irregular mounting is easy to produce chromaticity deviation, but In the present invention, since the phosphor layer containing the phosphor is provided on the surface of the substrate, the phosphor is dispersed in a plurality of phosphors in a non-uniform manner, and the color is smaller than that of the conventional one. The deviation can be greatly reduced. Further, since the core metal used for the substrate is easier to machine than the ceramic or the like, it is easy to manufacture a substrate structure in which a plurality of light-emitting elements can be mounted.
再者，由於設置可安裝發光元件之反射凹部作為安裝 10 發光元件之基板之構造，因此構成反射杯之基材無須於基 板上重複製作之必要，故基板構造簡單且可抑制組裝相關 之成本，同時對密封樹脂之基板與構成反射杯之基材之間 隙所發生之氣泡，可防止其混入。 圖式簡單說明 15 第1圖係顯示有關本發明之發光元件安裝用基板與發 光元件封裝體之一實施態樣之截面圖。Furthermore, since the reflective concave portion on which the light-emitting element can be mounted is provided as a structure for mounting the substrate of the light-emitting element, the substrate constituting the reflective cup does not need to be repeatedly fabricated on the substrate, so that the substrate structure is simple and the cost associated with assembly can be suppressed. At the same time, the bubbles generated in the gap between the substrate of the sealing resin and the substrate constituting the reflecting cup can be prevented from entering. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an embodiment of a light-emitting element mounting substrate and a light-emitting element package according to the present invention.
第2圖係顯示有關本發明之發光元件安裝用基板與發 光元件封裝體之另一實施態樣之截面圖。 第3圖係顯示實施例5製作之白色發光二極體之波長光 20 譜之曲線圖。 第4圖係顯示傳統的發光元件封裝構造之一例之截面 圖。Fig. 2 is a cross-sectional view showing another embodiment of the light-emitting element mounting substrate and the light-emitting element package of the present invention. Fig. 3 is a graph showing the wavelength spectrum of the white light-emitting diode produced in Example 5. Fig. 4 is a cross-sectional view showing an example of a conventional light-emitting element package structure.
【實方式J 較佳實施例之詳細說明 9 1311819 第1圖係顯示本發明於 3 光7G件安裝用基板及裝用前[Details of the preferred embodiment of the present invention 9 1311819 FIG. 1 shows the substrate for mounting the 3G and 7G parts of the present invention and before use.
者之發光元件封裝體之一實雜能H 耳她態樣之截面圖；第1圖中，符 號10為發光元件封裳體，丨丨故I， 體11為發光元件安裝用基板，12為 核心13騎光躁瑯層，14為電極，15為發光元件， 16為金屬細線’ 17為反射凹部，叫紐於反射凹部17之 密封樹脂。In the first embodiment, the symbol 10 is a light-emitting device, and the body 11 is a substrate for mounting the light-emitting device, 12 is a light-emitting device package. The core 13 rides on the pupil layer, 14 is an electrode, 15 is a light-emitting element, and 16 is a thin metal wire '17 is a reflective concave portion, which is called a sealing resin of the reflective concave portion 17.
10 1510 15
本實施態樣之發光元件安裝用基板n，係由具備設有 形成傾斜狀壁面之反射凹部17而呈擂钵狀凹部之核心金屬 二被覆於前述核心金屬12表面之榮綱扣，及前 述榮光_層U上設有延伸至發“件安裝位置上之發光 兀件通電用電極14等構成本實施態樣之發光元件封 裝體10:前逃發光元件安裝用基板U上安裝有發光元件 15而則述發光讀15以透明密封樹脂18密封構成者。 被覆於核心金屬12之珠瑯層13，具有接受發光元件15 發出之光而反射時，激發所含之螢光體而發出轉換波長之 螢光之機此。構成該螢光琺瑯層13之含螢光體玻璃，係微 細的螢光體粉末因玻璃質（琺瑯）成為固定於核心金屬12表 面之構造，而螢光體粉末可在於玻螭質至少有一部分固 溶’或不固溶於玻璃質而被玻璃質包圍之狀態存在。 該螢光琺螂層13所含之螢光體，因應該發光元件封裝 體10所要求之發色光，從傳統公認之各種螢光體之中，可 選擇1種或2種以上混合使用。本發明適宜之實施態樣中， 在構成白色發光二極體封裝體時，發光元件15係使用藍色 發光二極體，而螢光體則使用藍色激發之黃色發光螢光 1311819 胃。該黃色發光螢光體可舉以鈽激活之釔鋁石榴石螢光體 (以下記載為YAG · Ce)為例。 本發明適宜之實《射’料如❹前述YAG: 5The light-emitting element mounting substrate n of the present embodiment is a glory button which is covered with a core metal 2 having a concave-shaped recessed portion 17 and having a concave-shaped recessed portion, and is covered with the core metal 12, and the glory The light-emitting element package 10 of the embodiment in which the light-emitting element current-carrying electrode 14 and the like are extended to the "mounting position" is provided on the layer U: the light-emitting element 15 is mounted on the front-emission light-emitting element mounting substrate U. The illuminating reading 15 is sealed by a transparent sealing resin 18. The bead layer 13 coated on the core metal 12 has a fluorescent body that is excited by the light emitted from the light-emitting element 15 and is excited to emit a converted wavelength. The phosphor-containing glass constituting the phosphor layer 13 is a structure in which fine phosphor powder is fixed to the surface of the core metal 12 by the glassy substance, and the phosphor powder may be in the glass. The enamel is at least partially solid-solved or is not dissolved in the vitreous and is surrounded by the vitreous. The phosphor contained in the phosphor layer 13 is required for the color of the light-emitting device package 10. Among the various conventionally recognized phosphors, one or a mixture of two or more may be used. In a preferred embodiment of the present invention, when the white light-emitting diode package is formed, the light-emitting element 15 is blue. The light-emitting diode is a phosphor, and the blue-emitting yellow-emitting fluorescent 1311819 stomach is used. The yellow-emitting phosphor can be exemplified by a ytterbium-activated yttrium aluminum garnet phosphor (hereinafter referred to as YAG · Ce). The present invention is suitable for the actual "shooting" material such as the aforementioned YAG: 5
Ce時，相對於螢光接瑯層之原料（固體原料)全量，參a 前述YAG:Ce為15質量％〜65質量％， 里 ./+ , 0貝ϊ0/〇〜60質量％ 為佳，較佳為35質量％〜60質量。/悬 、 〇/ ^ , ^ ^^^45ft〇/〇^6〇ff /〇虽YAG . Ce少於J 5質量％，則鉉洛獻, 換困難。何AG.〜 色發光二極體之色度變 而陳: 超過65質量％，«光_層！3脆化 而焙燒後產生龜裂等之虞。 s U脆化 10 15 20 可燒材質’雖未特予限制，以螢光珠瑯· 碳鋼、不銹鋼等^且易於加工之域材料為佳，可舉低 含螢光體破璃之密接另’為要提高構成螢光瑞瑯層13之 屬12之形狀亦未特予㈣金屬表面亦可酸化處理。核心金 各種形狀之金屬板： < ，例如可作成圓板狀、角板狀等 反射凹部17之四^或具有凹凸之形狀。在核心金屬12形成 加工法、研磨枓之方决亦未限制，可採用鑽頭等之切削 JLf. "之研磨加工等开> $。 核心金屬12表 寺幵7成 方法之一例說明破覆螢光琏螂層13之琺瑯基板之製作 等切削加工或冲:加:將低碳鋼板等核心金屬12，以鑽頭 面似插鉢狀之四部 製作作為反射凹部Π之設有傾斜 破螭粉末及普也° 。另—方面，適當地在分散介質中混合 液。其次，該分a 。禾，製作螢光琺瑯層形成用之分散 結製作含替 夜塗布於前述核心金屬12表面，高溫燒 毒成之螢光琺瑯層13。在核心金屬12 1311819 形成之C3部亦以螢光珠瑯層U積層，形成平滑且具含營光 體之傾斜面之反射凹部17。 鑽頭加工等機械性切削製作設有傾斜面之反射凹部17 時’如前述雖然難於保持表面之平滑度，由於低碳鋼一類 - 5之金屬易於加工，另雖無法確保表面之平滑度，不過由於 - 縣㈣層13之積層，有凹凸之部分補正了凹凸，故燒結 後所得之螢光琺瑯層13表面之平滑度，通常都很高。因此， 反射凹部17之傾斜面之平滑度隨之提高，易於獲得光反射 _ 帛高之反射凹部17。 10 本發明中所用之發光元件15雖未特予限制，可適用於 發光二極體、雷射光二極體等之半導體發光元件、有機場 致發光(EL)元件等。如前述構成白色發光二極體封裝體之 本發明適宜之實施態樣中，係使用氮化物系化合物半導體 構成之藍色發光二極體。 15 提供電力於發光元件15之電極14及金屬細線16，例如 __ 可由以下（1)〜(3)之方法形成。 (1)在反射凹部17内，以厚膜銀漿糊層製作電氣迴路， 藉介缝隙於對面一側之電極14安裝發光元件15，在另—側 之電極14以金線等之金屬細線16連接。 - 20 (2)以金屬箔等作為電極14，將其連接於螢光琺螂層13 - 上’將發光元件15與前述（1)方式同樣安裝、連接電力。 (3)作為在反射凹部π外之電極，與安裝於反射凹部 内之螢光琺瑯層13上之發光元件15，以金線等之金屬細線 16連接電力。 12 1311819 在本實施態樣之發光元件封裝體ίο中，因在反射凹部 17表面形成螢光琺瑯層π之關係上，前述電極14希望是^ 成小尺寸者。該電極14以銀形成時，藍色發光二極體等發 光元件15發出之光，在該電極14強烈反射，而該電極㈣ 5於不含螢光體，故外觀上在電極14之部分成為僅有藍色光 之發光’當電極Μ之寬幅擴大時，無法獲得混色美麗之白 色。因此，電極Μ的寬幅為〇.8mm以下，而以期望成為〇5酿 以下較佳。 .纟反射凹部17内安裝發光元件15後，在反射凹部17充 10填有密封樹脂18 ’將密封發光元件隔絕於外氣。該密封樹 脂18例如可使用熱硬化型環氧樹脂等。 本發明態樣之發光元件安裝用基板u，係至少於核心 金屬12表面之發光元件安裝部分，被覆有由含螢光體玻璃 Μ所=成之螢光_層13，而使該發光元件安裝用基板收 光7L件15發光，因此_部分發光元件15發出之光直接 > 切於外。卩殘餘之光踫觸到螢総瑯基板13，而使該螢 光混；外’故對於獲有發光元件15發出之光與前述螢 合於^光之發光元件封裳體1〇 ’可簡單地構成。特別適 20之名作由監色發光二極體與藍色激發之黃色發光體組成 色發光二極體。 合於密白色發光二極體封裝體製作時，傳統係將螢光體混 封楚f叫脂後安裝的關係，由於安裝參差不一等製作之 基板^雖易於產生色度偏差，但本實施態樣中，由於在 面作成設有含榮光體之榮光鱗層13之構成，故榮 13 光體之分散在一批號中之螢光體不均勻之情形少，與傳統 者比較，白色發光二極體之色度偏差可大幅降低。 再者，用為基板之核心金屬12與陶瓷等比較，前者易 於機械加工，對於可安裝複數個發光元件15之基板構造之 物件’亦可易於製作。 再者’由於設有安裝發光元件15之反射凹部Π ’作為 女裝發光元件15之基板之構造，因於基板上無必要重複製 作構成反射凹部之基材，故基板構造單純且可抑制組裝有 關之成本’同時可防止氣泡混入於密封樹脂。 再者’在前述之構造中，在發光面一側由樹脂等所成 型之光學的鏡頭體’亦可進行指向角之控制等。另，前述 (3)的構造時’將金屬細線16如模具樣配置樹脂’則從信賴 性的觀點言，可說是期望的構造。 苐2圖係顯示有關本發明之發光元件安裝用基板及事 用該基板之發光元件封裝體之其他實施態樣之截面圖，第2 圖中，符號20係發光元件封裝體、21係發光元件安震用基 板、22係核心金屬、23係螢光琺瑯層、24係電極' 25係發 光元件、26係金屬細線、27係反射凹部、28係透明密封樹 脂。 在本實施態樣係例示在於一個基板上可安裝複數個發 光元件25之發光元件安裝用基板21，與該發光元件安裴用 基板21上安裝複數個發光元件25，各以密封樹脂28密封而 成之發光元件封裝體20。本實施態樣中，核心金屬22、螢 光琺瑯層23、電極24、發光元件25、金屬細線26、反射凹 Ι3Π819 部27及密封樹脂28等各構成要件，其形狀或發光元件安裝 個數雖異，但與前述第1圖顯示之核心金屬12、螢光琺瑯層 13、電極14、發光元件15、金屬細線16、反射凹部17及密 封樹月旨18相同者亦可使用。 【實施例】In the case of Ce, the total amount of the raw material (solid raw material) of the fluorescent contact layer is preferably from 15% by mass to 65% by mass of the YAG:Ce, and is preferably ./+, 0 ϊ0/〇 to 60% by mass. It is preferably 35 mass% to 60 mass. / 挂 , 〇 / ^ , ^ ^^^45ft〇 / 〇 ^6〇ff / 〇 Although YAG. Ce is less than J 5 mass%, it is difficult to change. He AG. ~ The color of the color LED is changed and Chen: More than 65 mass%, «Light_layer! 3 embrittlement and the occurrence of cracks and the like after baking. s U embrittlement 10 15 20 The material that can be burned is not particularly limited. It is preferably made of fluorescent beads, carbon steel, stainless steel, etc., and is easy to process. It can be used as a low-density glass-filled glass. 'The shape of the genus 12 which constitutes the fluorescing layer 13 is also not specified. (4) The metal surface may also be acidified. Core gold Metal plate of various shapes: <, for example, may be formed into a circular plate shape, a gusset shape or the like, or a shape having irregularities. The method of forming the core metal 12 and the method of grinding the ruthenium are not limited, and the cutting of the drill bit or the like may be performed by the cutting of the drill such as JLf. " An example of a method for forming a core metal 12 table 幵 幵 说明 说明 说明 说明 说明 说明 切削 萤 萤 萤 萤 萤 萤 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : The four parts are made as a reflective concave part, which is provided with a sloping powder and a Pu-erh. On the other hand, the liquid is appropriately mixed in the dispersion medium. Second, the point is a. For the production of a luminescent layer for the formation of a fluorescent enamel layer, a fluorescent enamel layer 13 which is coated on the surface of the core metal 12 and fired at a high temperature is prepared. The C3 portion formed in the core metal 12 1311819 is also laminated with a fluorescent bead layer U to form a reflective concave portion 17 which is smooth and has an inclined surface including a camping body. When mechanical cutting such as drill machining is performed to provide the reflecting concave portion 17 of the inclined surface, it is difficult to maintain the smoothness of the surface as described above, since the metal of the low carbon steel type-5 is easy to process, and the smoothness of the surface cannot be ensured, but - The layer of the (four) layer 13 of the prefecture has a concavity and convexity to correct the unevenness, so the smoothness of the surface of the phosphor layer 13 obtained after sintering is usually high. Therefore, the smoothness of the inclined surface of the reflecting concave portion 17 is improved, and the reflecting concave portion 17 having the light reflection _ 帛 is easily obtained. The light-emitting element 15 used in the present invention is not particularly limited, and can be applied to a semiconductor light-emitting element such as a light-emitting diode or a laser diode or an organic electroluminescence (EL) element. In a preferred embodiment of the invention constituting the white light-emitting diode package as described above, a blue light-emitting diode composed of a nitride-based compound semiconductor is used. 15 The electrode 14 and the thin metal wire 16 of the light-emitting element 15 are supplied with electric power, for example, __ can be formed by the following methods (1) to (3). (1) An electric circuit is formed in the reflective concave portion 17 by a thick film silver paste layer, and the light-emitting element 15 is attached to the electrode 14 on the opposite side by the slit, and the metal thin wire 16 such as a gold wire is formed on the other side electrode 14. connection. - 20 (2) A metal foil or the like is used as the electrode 14 and is connected to the fluorescent iridium layer 13 -. The light-emitting element 15 is mounted and connected to the electric power in the same manner as in the above (1). (3) As the electrode outside the reflection concave portion π, and the light-emitting element 15 attached to the fluorescent layer 13 in the reflection concave portion, electric power is connected by a thin metal wire 16 such as a gold wire. 12 1311819 In the light-emitting element package of the present embodiment, the electrode 14 is desirably formed in a small size due to the formation of the phosphor layer π on the surface of the reflection concave portion 17. When the electrode 14 is formed of silver, the light emitted from the light-emitting element 15 such as a blue light-emitting diode is strongly reflected by the electrode 14, and the electrode (4) 5 is free of the phosphor, so that the appearance is in the portion of the electrode 14. Only the blue light illuminates 'When the width of the electrode 扩大 is enlarged, the beautiful white color cannot be obtained. Therefore, the width of the electrode crucible is 〇.8 mm or less, and it is preferable to be 〇5 or less. After the light-emitting element 15 is mounted in the reflection concave portion 17, the sealing concave portion 17 is filled with a sealing resin 18' to insulate the sealed light-emitting element from the outside air. As the sealing resin 18, for example, a thermosetting epoxy resin or the like can be used. The light-emitting element mounting substrate u according to the aspect of the present invention is a light-emitting element mounting portion at least on the surface of the core metal 12, and is covered with a fluorescent layer _ layer 13 made of a phosphor-containing glass crucible, and the light-emitting element is mounted. The light-receiving 7L member 15 is illuminated by the substrate, so that the light emitted from the partial light-emitting element 15 is directly > The remaining light 踫 touches the fluorescing substrate 13 to mix the fluorescing light; the external light is simple for the light emitted from the light-emitting element 15 and the luminescent element fluorescing the light-emitting element Ground composition. The special 20 is composed of a color-emitting diode and a yellow-excited yellow illuminator. When combined with a dense white light-emitting diode package, the conventional system combines the phosphors with a grease and seals them. Since the substrate is not suitable for color difference, the present embodiment is easy to produce color deviation. In the aspect, since the composition of the phoenix scale 13 containing the glory body is formed on the surface, the phosphor of the Rong 13 light body is dispersed in a batch of the number of the unevenness of the phosphor, and the white light is compared with the conventional one. The chromaticity deviation of the polar body can be greatly reduced. Further, the core metal 12 used as the substrate is easier to machine than the ceramic or the like, and the substrate structure in which the plurality of light-emitting elements 15 can be mounted can be easily fabricated. Furthermore, since the reflective concave portion 安装 having the light-emitting element 15 is provided as the substrate of the female light-emitting element 15, it is not necessary to repeatedly fabricate the substrate constituting the reflective concave portion on the substrate, so that the substrate structure is simple and the assembly can be suppressed. The cost 'at the same time prevents bubbles from entering the sealing resin. Further, in the above-described configuration, the optical lens body 'formed by resin or the like on the light-emitting surface side can also control the directivity angle or the like. Further, in the structure of the above (3), 'the metal thin wire 16 is disposed as a mold-like resin', and it can be said that it is a desired structure from the viewpoint of reliability. FIG. 2 is a cross-sectional view showing another embodiment of the light-emitting element mounting substrate of the present invention and the light-emitting element package in which the substrate is used. In FIG. 2, reference numeral 20 is a light-emitting element package and a 21-type light-emitting element. Anzhen substrate, 22-series core metal, 23-system fluorescent layer, 24-series electrode 25-type light-emitting element, 26-series metal thin wire, 27-system reflective concave portion, and 28-series transparent sealing resin. In the present embodiment, a light-emitting element mounting substrate 21 in which a plurality of light-emitting elements 25 can be mounted on one substrate is illustrated, and a plurality of light-emitting elements 25 are mounted on the light-emitting element mounting substrate 21, and each is sealed by a sealing resin 28. The light-emitting element package 20 is formed. In the present embodiment, the core metal 22, the fluorescent iridium layer 23, the electrode 24, the light-emitting element 25, the metal thin wire 26, the reflective concave portion Π 819 portion 27, and the sealing resin 28 are each a constituent element, and the shape or the number of the light-emitting elements mounted is The core metal 12, the fluorescent iridium layer 13, the electrode 14, the light-emitting element 15, the thin metal wire 16, the reflective concave portion 17, and the sealing tree 18 shown in Fig. 1 can be used. [Examples]
核心金屬使用長度5mm、寬度5mm、厚度lmm之低礙 鋼板。要擂鉢狀之反射凹部形成樣以鑽頭形成凹部。凹部 底面之尺寸係以反射凹部底面形成直徑lmin、深度 0.5mm、角度45。之傾斜。 螢光珠瑯層之原料使用玻璃粉末與以鈽激活之紀|呂石 榴石螢光體。該兩種粉末混合均勻，分散於2_丙醇與水所 成之分散介質。將其塗布於核心金屬表面。然後於大氣中 85〇°C鍛燒，形成含螢光體玻璃構成之螢光琺瑯層。螢光琺 螂層之厚度，以可形成100μηι為目標製作供試樣品。電極係The core metal uses a steel plate with a length of 5 mm, a width of 5 mm, and a thickness of 1 mm. The reflective concave portion is formed into a concave shape by a drill bit. The bottom surface of the recess has a diameter lmin, a depth of 0.5 mm, and an angle 45 formed by the bottom surface of the reflective recess. Tilt. The raw material of the fluorescent bead layer is made of glass powder and activated with yttrium | Lushi garnet phosphor. The two powders are uniformly mixed and dispersed in a dispersion medium composed of 2-propanol and water. Apply it to the core metal surface. Then, it is calcined at 85 ° C in the atmosphere to form a fluorescent ruthenium layer containing phosphor glass. Fluorescent 厚度 The thickness of the enamel layer was prepared for the purpose of forming 100 μηι. Electrode system
5將鋼漿糊塗布於規定之電極圖案而鍛燒製作。其尺寸為可 製作成厚度0.1mm、寬度〇.5mm。 有關發光二極體之安裝顯示如次。將榮光玉法鄉層原料 中之登光體量變更，製作第味顯示之實施例㈤及比較例 20 1之發光元件絲用基板，在各個發統件絲錄板上安 裝作為發光細之藍色發光二極體，以製作白色發光二極 體封裝體。 首先將氮化物系化合物半導體所成之藍色發光二極體 電極上。藍色發光二極體則選擇發光波長之 穴峰波wnm錢狀。较肖料輪 15 1311819 發光二極體與另一側之電極。再將透光性之環氧樹脂充填 於安裝有發光元件之反射凹部内，加熱硬化製作樣品、評 價。 第1表中顯示實施例1至6及比較例1之各個白色發光二 5極體封裝體之色度、基板外觀及熱傳導率之測定結果。測 定係以供試樣品數10個之平均值表示（第1表）。另，第2表中 顯示有關在實施例1至6之各個白色發光二極體封裝體之色 度偏差之實驗值。 φ 第1表中表示玻璃粉末添加量與螢光體粉末添加量之 10數值係質量°/°。另色度、基板外觀及熱傳導率如下述方式 測定。 【色度】 製成之白色發光二極體之色度，以色度計【橫濱電機 公司製，多媒體顯示測試器（Multimedia display tester 15 3298)】測定之。 【基板外觀】 Φ 實施例1至6及比較例1之各個發光元件安裝用基板，以 目視調查確認有無破損等之異常。外觀上無異常之供試樣 品判為良好’而目視可確認破損者判為部分破損評價之。 20 【熱傳導率】 以實施例1至6及比較例1之各個發光元件安裝用基板 之玻璃組成’製作各個別之玻璃片並以雷射閃光法測定之 (單位：W/mK)。使用Melvac理工公司製之雷射閃光法熱定 數測定裝置（TC-7000)測定，製成琺瑯玻璃材料之大小為 16 1311819 . 泠lOxlmm厚之物件並於真空中測定之。試驗方法係根據JIS R1611-1991 進行。 第1表 玻璃粉末 添加量 螢光體粉末 添加量 色度 (X，y) 基板外觀 熱傳導率 (W/mK) 實施例1 85 ί 16 (0.20，0_14) 良好 0.40 實施例2 75 25 (0.24 - 0.21) 良好 0.40 實施例3 65 35 (0.26 > 0.27) 良好 0.39 實施例4 55 45 (0.32，0.32) 良好 0.42 實施例5 45 55 (0.34 - 0.36) 良好 0.37 實施例6 40 60 (0.35 - 0.37) 良好 0.39 比較例1 30 70 未測定 部分破損 0.38 第2表 玻璃粉末 添加量 螢光無粉末 添加量 色度 (X，y) 實施例1 85 15 (0.20 Ό. 14)' (0.20 Ό. 14)'(0.20 >0.15)' (0.21，0.14)、（0.20,0.14)、（0.20’0.14)、 (0_19,0_14)、（0·20,0.14)、（0·21，0.13)、 (0.20，0.14) 實施例2 75 25 (0.24，0.21)、（0_23，0_21)、（0.24,0_21)、 (0.24，0.21)、（0_24，0_20)、（0.24，0.21)、 (0_24，0_21)、（0.24，0.21)、（0.24，0.20)、 (0.24，0.21) 實施例3 65 35 (0.26 > 0.28)' (0.26 > 0.27)' (0.26 > 0.27) ' (0.26，0.27)、（0_26，0.27)、（0_26，27)、 (0.26，0_26)、（0.26，0.27)、（0_25，0.26)、 (0.26 > 0.27) 實施例4 實施例5 55 45 (0.32,0.32)、（0.32,0.32)、（0.32,0.32)、 (0.32，0_32)、（0.31，0.31)、（0.32,0.32)、 (0.31，0_31)、（0.32,0.32)、（0_32,0_32)、 (0.32 - 0.32) 45 55 (0.35，0.36)、（0_34，0.36)、（0_34，0.36)、 (0.34，0_36)、（0_34，0.36)、（0.34，0.36)、 (0.34,0.37)、（0.34,0.36)、（0.34,0.35)、 (0.34 ' 0.36) 實施例6 40 60 (0.35，0.37)、（0.25，0.37)、（0.35，0.37)、 (0.35,0.37)、（0_35,0.37)、（0,35,0_37)、 (0.35，0.37)、（0.35，0.38)、（0.35，0_37)、 (0.35 - 0.37)5 The steel paste is applied to a predetermined electrode pattern and calcined. Its dimensions are made to a thickness of 0.1 mm and a width of 55 mm. The installation display of the light-emitting diode is as follows. The amount of the light-receiving body in the raw material of the glory jade method was changed, and the substrate for the light-emitting element wire of the first embodiment (5) and the comparative example 20 1 was produced, and the light-emitting blue was mounted on each of the hairline boards. A color LED is used to make a white LED package. First, a blue light-emitting diode electrode formed of a nitride-based compound semiconductor is used. The blue light-emitting diode selects the peak wavelength of the light-emitting wavelength wnm money. More than the material wheel 15 1311819 LED and the other side of the electrode. Further, the light-transmitting epoxy resin was filled in a reflecting concave portion in which the light-emitting element was mounted, and heat-hardened to prepare a sample and evaluated. The measurement results of the chromaticity, the substrate appearance, and the thermal conductivity of each of the white light-emitting pentadipole packages of Examples 1 to 6 and Comparative Example 1 are shown in Table 1. The measurement system is expressed by the average of 10 test samples (Table 1). Further, the experimental values regarding the chromaticity deviation of each of the white light-emitting diode packages of Examples 1 to 6 are shown in the second table. φ Table 1 shows the numerical value of the glass powder addition amount and the amount of the phosphor powder added in the amount of °/°. The other color, substrate appearance and thermal conductivity were measured as follows. [Chroma] The chromaticity of the white light-emitting diode produced was measured by a colorimeter [manufactured by Yokohama Electric Co., Ltd., Multimedia display tester 15 3298]. [Substrate appearance] Φ Each of the light-emitting element mounting substrates of Examples 1 to 6 and Comparative Example 1 was visually inspected for abnormality such as breakage. The sample for which the appearance was not abnormal was judged to be good, and the damage was visually confirmed to be a partial damage evaluation. 20 [Thermal Conductivity] Each of the glass sheets of each of the light-emitting element mounting substrates of Examples 1 to 6 and Comparative Example 1 was produced and measured by a laser flash method (unit: W/mK). The size of the bismuth glass material was determined to be 16 1311819. 泠lOxlmm thick and measured in a vacuum using a laser flash thermal number measuring device (TC-7000) manufactured by Melvac. The test method was carried out in accordance with JIS R1611-1991. 1st table glass powder addition amount phosphor powder addition amount chromaticity (X, y) substrate appearance thermal conductivity (W/mK) Example 1 85 ί 16 (0.20, 0_14) Good 0.40 Example 2 75 25 (0.24 - 0.21) Good 0.40 Example 3 65 35 (0.26 > 0.27) Good 0.39 Example 4 55 45 (0.32, 0.32) Good 0.42 Example 5 45 55 (0.34 - 0.36) Good 0.37 Example 6 40 60 (0.35 - 0.37 ) Good 0.39 Comparative Example 1 30 70 Unmeasured partial damage 0.38 Second glass powder addition amount Fluorescence No powder added amount Color (X, y) Example 1 85 15 (0.20 Ό. 14)' (0.20 Ό. 14 ) '(0.20 > 0.15)' (0.21, 0.14), (0.20, 0.14), (0.20'0.14), (0_19, 0_14), (0·20, 0.14), (0·21, 0.13), ( 0.20, 0.14) Example 2 75 25 (0.24, 0.21), (0_23, 0_21), (0.24, 0_21), (0.24, 0.21), (0_24, 0_20), (0.24, 0.21), (0_24, 0_21) (0.24, 0.21), (0.24, 0.20), (0.24, 0.21) Example 3 65 35 (0.26 > 0.28)' (0.26 > 0.27)' (0.26 > 0.27) ' (0.26, 0.27), (0_26, 0.27), (0_26, 27), (0.26, 0_26) (0.26, 0.27), (0_25, 0.26), (0.26 > 0.27) Example 4 Example 5 55 45 (0.32, 0.32), (0.32, 0.32), (0.32, 0.32), (0.32, 0_32), (0.31, 0.31), (0.32, 0.32), (0.31, 0_31), (0.32, 0.32), (0_32, 0_32), (0.32 - 0.32) 45 55 (0.35, 0.36), (0_34, 0.36), ( 0_34, 0.36), (0.34, 0_36), (0_34, 0.36), (0.34, 0.36), (0.34, 0.37), (0.34, 0.36), (0.34, 0.35), (0.34 '0.36) Example 6 40 60 (0.35, 0.37), (0.25, 0.37), (0.35, 0.37), (0.35, 0.37), (0_35, 0.37), (0, 35, 0_37), (0.35, 0.37), (0.35, 0.38) , (0.35, 0_37), (0.35 - 0.37)
從以上的試驗結果，可了解當添加15質量％以上的螢 17 1311819 光體粉末以形成螢光琺瑯層時，發光二極體之色度發生變 化。另可了解在實施例4至6之範圍内者，顯示CIE(Comission Internationale de l'Eclairage)所規定之晝白色之發光色。 另，確認螢光體之添加對於基板的散熱性幾乎無影響。 5 【產業上之利用可能性】From the above test results, it is understood that when 15% by mass or more of the phosphor 17 1311819 powder is added to form a phosphor layer, the chromaticity of the light-emitting diode changes. It is also understood that within the range of Examples 4 to 6, the luminescent color of the white color specified by CIE (Comission Internationale de l'Eclairage) is displayed. Further, it was confirmed that the addition of the phosphor has little effect on the heat dissipation of the substrate. 5 [Industrial use possibilities]
根據本發明可提供當於製造白色發光二極體時色度之 偏差少，而易於製造高品質之發光元件封裝體之發光元件 安裝用基板、前述基板上安裝發光元件封裝而成之發光元 件封裝體、裝用該發光元件封裝體而成之顯示裝置及照明 10 裝置。 【圖式簡單說明3 第1圖係顯示有關本發明之發光元件安裝用基板與發 光元件封裝體之一實施態樣之截面圖。 第2圖係顯示有關本發明之發光元件安裝用基板與發 15 光元件封裝體之另一實施態樣之截面圖。 第3圖係顯示實施例5製作之白色發光二極體之波長光 譜之曲線圖。 第4圖係顯示傳統的發光元件封裝構造之一例之截面 圖。 20 【主要元件符號說明】 10，20…發光元件封裝體 15，25...發光元件 11，21…發光元件安裝用基板 16，26...金屬細線 12，22...核心金屬 17，27··.反射凹部 13，23...螢光琺瑯層 18，28.··密封樹月旨 14，24...電極 18According to the present invention, it is possible to provide a light-emitting element mounting substrate which is easy to manufacture a high-quality light-emitting element package when the white light-emitting diode is manufactured, and a light-emitting element package in which the light-emitting element is mounted on the substrate. A display device and an illumination 10 device in which the light-emitting element package is mounted. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an embodiment of a light-emitting element mounting substrate and a light-emitting element package according to the present invention. Fig. 2 is a cross-sectional view showing another embodiment of the light-emitting element mounting substrate and the light-emitting element package of the present invention. Fig. 3 is a graph showing the wavelength spectrum of the white light-emitting diode produced in Example 5. Fig. 4 is a cross-sectional view showing an example of a conventional light-emitting element package structure. 20 [Description of main component symbols] 10, 20... Light-emitting element packages 15, 25... Light-emitting elements 11, 21... Light-emitting element mounting substrates 16, 26... Metal thin wires 12, 22... Core metal 17, 27··. Reflecting recesses 13, 23... Fluorescent enamel layers 18, 28. Sealing trees, 14, 24... Electrodes 18
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| JP5368809B2 (en) * | 2009-01-19 | 2013-12-18 | ローム株式会社 | LED module manufacturing method and LED module |
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