1310450 修正本 '九、發明說明： •【發明所屬之技術領域】 本發明係關於一種冷卻單元，尤指一種爲了使用於半 導體生產單元而溫度需嚴格控制之冷卻單元。 【先前技術】 用於半導體生產單元，諸如致冷器單元（chiller unit) 等之傳統式冷卻單元中，例如氫氟碳化物之一次冷媒係循 經冷凍回路循環，用以冷卻例如水之二次冷媒，被冷卻之 ® 二次冷媒再冷卻擬作冷卻之物體構件。此狀況中，物體構 件並非直接地由冷凍回路作冷卻，其係以二次冷媒，亦即 以冷凍回路作間接性地冷卻，故致冷器單元之冷卻效率即 變差。 爲了改善上述問題，日本尙未審查之第 2003-174016 號專利公開案所揭示之致冷器單元中，擬作冷卻之物體構 件係僅以在冷凍回路中循環，例如氫氟碳化物之冷媒加以 冷卻。此種致冷器單元中，由冷凍回路之壓縮機所壓縮之 ^ 冷媒係以冷凍回路中之凝結器作凝結，之後，凝結之冷媒 經可調整流量之調節閥被送入形成在真空處理單元之感受 器（susceptor)的冷媒通路內，因而可冷卻置於感受器上擬 作處理之物體。亦即，冷媒通路本身即作爲冷凍回路中所 謂的蒸發器。已冷卻物體後之冷媒即返回壓縮機而經冷凍 回路作再次的循環。 但是，當上述先前技術之致冷器單元應用於：冷卻之 物體希望可達冷媒沸點以上之溫度並保持在冷媒沸點以上 1310450 修正本 之恒溫的狀況時，傳統的冷卻方法中，因物體構件之溫度 .高於冷媒之沸點，故以致冷器單元之調節閥控制冷媒流量 ， 即無法令物體構件保持恒溫。亦即，即使物體構件有一部 分維持恒溫，但物體構件其他部分並無法維持恒溫。因此 ，物體構件中之溫度乃成不規則。特別者，當流經冷媒通 路之冷媒流量非常小時，即使冷媒可冷卻冷媒通路入口附 近的物體構件，但冷媒在冷媒通路的中途即完全蒸發或蒸 乾，故冷媒無法實行潛熱蒸發用以吸熱。此狀況中，鄰近 # 冷媒通路出口附近之物體構件，其一部分的溫度係上升而 比冷媒通路入口附近之物體構件該部分的溫·度還高。此即 ，物體構件中之溫度變成不規則。另一方面，當冷媒通路 中所流通的冷媒量過大時，冷媒通路入口附近之物體構件 ，其一部分將被過度冷卻，乃失去了溫度控制且物體構件 因而無法保持爲預定的溫度。 【發明內容】 本發明係關於一種冷卻單元，可用以將物體構件實質 ® 、均勻地冷卻至所希的溫度。 依本發明之觀點，含有和冷卻之物體構件作熱交換之 冷媒的冷卻單元包括冷媒通路及冷卻手段。冷媒通路供冷 媒作循環。冷卻手段和冷媒通路相連通’用以把冷媒供應 於冷媒通路。冷卻手段包括：冷凍回路；壓縮機；凝結器 :減壓手段；蒸發器；冷媒供應路徑；冷媒返回路徑：冷 媒控制手段；及第1壓力控制手段。冷凍回路可供冷媒經 由其內作循環。壓縮機配設在冷凍回路中。凝結器亦配設 -7- 1310450 修正本 在冷凍回路中。減壓手段亦配設在冷凍回路中。蒸發器亦 配設在冷凍回路中。冷媒供應路徑之一端係連接凝結器與 減壓手段間之冷凍回路的一部分，而另一端則係連接冷媒 通路之入口。冷媒返回路徑之一端連接冷媒通路之出口， 另一端則位在離開減壓手段之下游並連接減壓手段與壓縮 機間之冷凍回路的一部分。冷媒控制手段設在冷媒供應路 徑中，可令凝結器和冷媒通路相連通或防止凝結器和冷媒 通路相連通。第1壓力控制手段亦設在冷媒供應路徑中， ® 用以控制冷媒通路中之壓力。冷媒控制手段具有ON模式 ，藉由凝結器和冷媒通路連通，可令冷媒以一流量經冷媒 通路作循環，該流量可令冷媒保持氣-液兩相流而可令，並 具有OFF模式，藉由防止凝結器與冷媒通路相連通，可防 止冷媒在冷媒通路內作循環。 本發明並非僅如以上之扼要性說明，本發明之其他觀 點及優點將由以下配合附圖之詳細說明而更爲顯見。 【實施方式】 ® 以下，配合附圖說明本發明之實施例。 茲以第1圖說明本發明冷卻單元之第1實施例。第1 實施例中，致冷器單元10作用成冷卻手段，而冷媒通路3 形成冷卻單元。 真空處理單元1包含位於其中的真空室6。真空室6 中設有感受器4，其上則置有擬作處理之物體5。真空室6 之上部中，作用成冷卻之物體構件的簇射板（shower plate)2 係設置成面向感受器4。真空處理單元1之上壁7內側， 修正本 1310450 於簇射板2的附近，設有冷媒通路3。又’上壁7內側， 設有作用成溫度檢測手段的溫度感知器8，用以感測上壁7 在簇射板2附近的溫度。1310450 MODIFICATION [IX. INSTRUCTIONS: • Technical Field to Which the Invention Is A The present invention relates to a cooling unit, and more particularly to a cooling unit that requires strict temperature control for use in a semiconductor production unit. [Prior Art] In a conventional cooling unit for a semiconductor production unit such as a chiller unit, a primary refrigerant such as hydrofluorocarbon is circulated through a refrigeration circuit for cooling, for example, water twice. Refrigerant, cooled by the secondary refrigerant and then cooled to cool the object. In this case, the object member is not directly cooled by the refrigeration circuit, and is cooled indirectly by the secondary refrigerant, that is, by the refrigeration circuit, so that the cooling efficiency of the refrigerator unit is deteriorated. In order to improve the above problem, in the refrigerator unit disclosed in Japanese Laid-Open Patent Publication No. 2003-174016, the object member to be cooled is cooled only by circulating in a refrigeration circuit such as a refrigerant of hydrofluorocarbon. . In the refrigerator unit, the refrigerant compressed by the compressor of the refrigeration circuit is condensed by a condenser in the refrigeration circuit, and then the condensed refrigerant is sent to the vacuum processing unit via an adjustable flow regulating valve. Within the refrigerant path of the susceptor, the object placed on the susceptor to be processed can be cooled. That is, the refrigerant passage itself is used as an evaporator in the refrigeration circuit. The refrigerant after the object has been cooled is returned to the compressor and circulated through the refrigeration circuit again. However, when the above-described prior art refrigerator unit is applied to a condition in which a cooled object is desired to reach a temperature above the boiling point of the refrigerant and maintained at a constant temperature of 1310450 above the boiling point of the refrigerant, the conventional cooling method is due to the object member. The temperature is higher than the boiling point of the refrigerant, so that the regulator valve of the cooler unit controls the flow rate of the refrigerant, that is, the object member cannot be kept at a constant temperature. That is, even if a part of the object member is kept at a constant temperature, the other parts of the object member cannot maintain the constant temperature. Therefore, the temperature in the object member is irregular. In particular, when the flow rate of the refrigerant flowing through the refrigerant passage is very small, even if the refrigerant can cool the object member near the inlet of the refrigerant passage, the refrigerant completely evaporates or evaporates in the middle of the refrigerant passage, so that the refrigerant cannot perform latent heat evaporation to absorb heat. In this case, the temperature of a part of the object member adjacent to the outlet of the refrigerant passage is higher than that of the object member near the inlet of the refrigerant passage. That is, the temperature in the object member becomes irregular. On the other hand, when the amount of refrigerant flowing through the refrigerant passage is excessively large, a part of the object member near the inlet of the refrigerant passage is excessively cooled, and the temperature control is lost and the object member cannot be maintained at a predetermined temperature. SUMMARY OF THE INVENTION The present invention is directed to a cooling unit that can be used to substantially cool an object member to a desired temperature. According to the present invention, a cooling unit for a refrigerant containing heat exchange with a cooled object member includes a refrigerant passage and a cooling means. The refrigerant passage is used for circulation of the refrigerant. The cooling means is in communication with the refrigerant passage to supply the refrigerant to the refrigerant passage. The cooling means include: a refrigerating circuit; a compressor; a condenser: a decompression means; an evaporator; a refrigerant supply path; a refrigerant return path: a refrigerant control means; and a first pressure control means. The refrigeration circuit allows the refrigerant to circulate through it. The compressor is arranged in the refrigeration circuit. The condenser is also equipped with a -7- 1310450 correction in the refrigeration circuit. The decompression means is also arranged in the refrigeration circuit. The evaporator is also located in the refrigeration circuit. One end of the refrigerant supply path is connected to a part of the refrigeration circuit between the condenser and the decompression means, and the other end is connected to the inlet of the refrigerant passage. One end of the refrigerant return path is connected to the outlet of the refrigerant passage, and the other end is located downstream of the decompression means and connected to a part of the refrigeration circuit between the decompression means and the compressor. The refrigerant control means is provided in the refrigerant supply path to allow the condenser to communicate with the refrigerant passage or to prevent the condenser and the refrigerant passage from communicating. The first pressure control means is also located in the refrigerant supply path, and ® is used to control the pressure in the refrigerant passage. The refrigerant control means has an ON mode, and the condenser and the refrigerant passage are connected to each other, so that the refrigerant can be circulated through the refrigerant passage at a flow rate, the flow rate allows the refrigerant to maintain the gas-liquid two-phase flow, and has an OFF mode. By preventing the condenser from communicating with the refrigerant passage, it is possible to prevent the refrigerant from circulating in the refrigerant passage. Other aspects and advantages of the present invention will be apparent from the description and appended claims. [Embodiment] ® Hereinafter, embodiments of the present invention will be described with reference to the drawings. The first embodiment of the cooling unit of the present invention will be described with reference to Fig. 1. In the first embodiment, the refrigerator unit 10 functions as a cooling means, and the refrigerant passage 3 forms a cooling unit. The vacuum processing unit 1 contains a vacuum chamber 6 located therein. A susceptor 4 is provided in the vacuum chamber 6, on which an object 5 to be treated is placed. In the upper portion of the vacuum chamber 6, a shower plate 2 acting as a cooled object member is disposed to face the susceptor 4. Inside the upper wall 7 of the vacuum processing unit 1, the 1310450 is corrected in the vicinity of the shower plate 2, and a refrigerant passage 3 is provided. Further, inside the upper wall 7, a temperature sensor 8 acting as a temperature detecting means is provided for sensing the temperature of the upper wall 7 in the vicinity of the shower plate 2.
致冷器單元10包括膜片型壓縮機11;凝結器12;作 用成減壓手段之膨脹閥14;蒸發器15;及冷凍回路18’ 作用成冷媒的氫氟碳化物R1 34a(下稱氫氟碳化物）可經該 冷凍回路作循環。壓縮機11、凝結器12、膨脹閥14、及 蒸發器15均設在冷凍回路18中。冷凍回路18包括冷卻水 # 循環之冷卻水路徑1 6。蒸發器1 5及凝結器1 2中，係實行 冷卻水路徑1 6中之冷卻水及冷凍回路1 8中之氫氟碳化物 間的熱交換。冷卻水路徑1 6中，於蒸發器1 5及凝結器1 2 間設有閥件17。冷凍回路18中，凝結器12與膨脹閥14 間具有一分岐點18a，冷凍回路18在該分岐點分成2個路 徑。一個路徑1 8b和作用成減壓手段之膨脹閥1 4相連通而 成爲冷凍回路18的一部分，另一個路徑18c則和冷媒通路 3之入口 3a相連通。路徑18c係形成冷媒供應路徑。路徑 ® 18c 中設有 ΟΝ/OFF 閥 21。打開 ΟΝ/OFF 閥 21 時，ON/OFF 閥21可令冷媒經路徑18c供應於冷媒通路3。而關閉 ΟΝ/OFF閥21時，ΟΝ/OFF閥21貝IJ防止冷媒經路徑18c供 應於冷媒通路> ΟΝ/OFF閥21形成冷媒控制手段。ON/OFF 閥2 1打開之狀態中，ΟΝ/OFF閥亦作用成膨脹閥，其爲冷 媒供應路徑中的第1壓力控制手段。ΟΝ/OFF閥21係和溫 度感知器8 —起電氣連接於控制器9。控制器9中，設定 有相關於溫度感知器8檢測値之上限値與下限値。上限値 1310450 修正本 作用成第1預定溫度，而下限値作用成第2預定溫度。又 -，膨脹閥1 4與蒸發器1 5間具有一會合點1 8 d，其係經形 •成爲冷媒返回路徑之路徑1 8 e和冷媒通路3的出口 3 b相連 通。路徑18e中，設有第1蓄壓器（accumulator) 22及恒壓閥23。蓄壓器22於其內蓄存液體氫氟碳化物。 恒壓閥2 3爲在冷媒返回路徑中的第2壓力控制手段，用以 把冷媒通路3中之壓力調整成恒定値。 茲以第1圖說明依第1實施例冷卻單元之動作。當真 ♦ 空處理單元1開始處理真空處理單元1之真空室6內的物 體5時，壓縮機1 1即被啓動，同時，冷卻水經冷卻水路徑 16開始循環，即開始了冷卻單元10之冷凍回路18的動作 。當氫氟碳化物和蒸發器15中之冷卻水作熱交換時，氣-液兩相流之氫氟碳化物乃蒸發，之後導入壓縮機11。氫氟 碳化物以壓縮機1 1壓縮並由壓縮機排出高壓、高溫之氫氟 碳化物氣體。當壓縮機1 1所排出之氫氟碳化物氣體和凝結 器1 2中以蒸發器1 5所冷卻之冷卻水作熱交換時，氣體之 ® 氫氟碳化物乃被冷卻因而把氣體之氫氟碳化物冷凝成液體 氫氟碳化物。在凝結器1 2中之氫氟碳化物冷凝後，液體氫 氟碳化物在分岐點1 8a分開，經路徑1 8b、1 8c作循環。將 於後述者，當打開ΟΝ/OFF閥21時，業已經路徑18c循環 之氫氟碳化物係被供應於冷媒通路3中。此時，已經由路 徑18c循環之氫氟碳化物係以作用成膨脹閥之ΟΝ/OFF閥 2 1作減壓，並以氣-液兩相流之形式供應於冷媒通路3中。 另一方面，經路徑1 8 b循環之氫氟碳化物係以膨脹閥1 4作 -10- -1310450 修正本 減壓以形成氣-液兩相流之氫氟碳化物，之後，在會合點1 8d -會合經路徑1 8 e循環之氫氟碳化物，將於後文詳述。嗣後 當氣-液兩相流之氫氟碳化物流入蒸發器1 5時，如上述 ’氣-液兩相流之氫氟碳化物和冷卻水路徑1 6中之冷卻水 作熱交換。之後，氫氟碳化物返回壓縮機11，而經冷凍回 路1 8作循環。 以下說明在分岐點1 8 a已分成路徑1 8 c之氫氟碳化物 〇 ^ 在氣-液兩相流中，冷媒之溫度係以冷媒之壓力而決定 。亦即，氣-液兩相流之氫氟碳化物溫度係藉由調整經冷媒 通路3作循環之氫氟碳化物的壓力而控制。因此，ON/OFF 閥21及恒壓閥23間的壓力係以ΟΝ/OFF閥21及恒壓閥23 調整，以便符合氣-液兩相流之氫氟碳化物的溫度。 當處理真空處理單元1之真空室6內的物體5時’如 果溫度感知器8之感測値升至或高於上限値，則控制器9 即打開ΟΝ/OFF閥21令ΟΝ/OFF閥21成ON模式，因而可 ^ 令氣-液兩相流之氫氟碳化物流入冷媒通路3。此時’氣-液兩相流之氫氟碳化物係以一流量由入口 3 a經過出口 3 b 而不會在冷媒通路3中蒸乾，該流量可令氫氟碳化物由入 口 3a至出口 3b保持其氣-液兩相流。/4冷媒通路3中之氫 氟碳化物保持氣-液兩相流，故氣-液混合體之平均溫度由 入口 3a至出口 3b均保持爲一定値。業經出口 3b作循環並 成氣-液兩相流形式之氫氟碳化物藉由位於出口 3 b下游之 第1蓄壓器22分離成氣體與液體氫氟碳化物，因而可防止 -11- 1310450 修正本 液體氫氟碳化物在第1蓄壓器22下游作循環。即使出口 3b附近之氫氟碳化物成爲近乎蒸乾，因液體氫氟碳化物被 蓄積在第1蓄壓器22內，故蓄積在蓄壓器22中之液體氫 氟碳化物可防止氫氟碳化物在出口 3b附近蒸乾。 當氣-液兩相流之氫氟碳化物循環經冷媒通路3冷卻簇 射板2時，溫度感知器8之感測値下降。而當溫度感知器 8之感測値下降至或低於下限値時，控制器9即把ON/OFF 閥21關閉以令ΟΝ/OFF閥成爲OFF模式，故可防止氫氟碳 # 化物供應於冷媒通路3。因之，ΟΝ/OFF閥21之開及閉係 取決於溫度感知器8之檢測値，且如第2圖所示，重複ON 模式及OFF模式，在ON模式中，冷媒係以流量M。^經冷 媒通路3作循環，而在OFF模式中，冷媒並不經冷媒通路 3作循環。亦即，實行了 ΟΝ/OFF的控制。 以下說明循經冷媒通路3之氫氟碳化物的流量iVUpt。 爲了查驗可令氫氟碳化物經冷媒通路3循環以保持氣-液兩 相流之氫氟碳化物流量IVUpt，乃將ΟΝ/OFF閥21在每一個 ® ON模式的打開時間加以改變，以改變每一個ON模式之氫 氟碳化物流量，因而量測簇射板2中，最大溫度與最小溫 度間之溫度差的溫度變動。第3圖爲量測結果之槪圖。 當氫氟碳化物之流量Μ小於氫氟碳化物之流量M!時，即 造成大於所希溫度差的溫度差。此一結果顯示，因爲小流 量Μ，故在冷媒通路3中循環之氫氟碳化物在冷媒通路3 鄰近出口 3b的部分發生了蒸乾。易言之，此係因爲全部的 氫氟碳化物在冷媒通路3中已蒸發，且未實行利用氫氟碳 -12- 1310450 修正本 '化物之潛熱自簇射板2吸收熱量，結果，蒸發後之氫氟碳 _ 化物的溫度乃升高。 另一方面，當氫氟碳化物之流量Μ提高至或大於流量 1^1時，氫氟碳化物可保持一定的吸熱率而在入口 3a與出 口 3b間用不會蒸乾方式冷卻簇射板2，因而可將溫度差最 小化至At 〇。 當氫氟碳化物之流量Μ大於氫氟碳化物之流量M2時 ，溫差係依流量Μ之增加而增加。此狀況中，氫氟碳化物 φ 冷卻簇射板2在入口 3a與出口 3b間雖然不會蒸乾，但相 較於在每一個ON模式預定溫度過大的流量Μ會過度冷卻 簇射板2。結果，導致了溫差的增大。 因此，每一個ON模式之氫氟碳化物流量Μ係調整 在由流量Μ〗至流量M2的範圍。流量Μ。^係相當於可令氫 氟碳化物保持氣-液兩相流之氫氟碳化物的流量。此外，流 量Μ—亦可令簇射板2中之溫度變動最小化。注意的是， 流量Μ !及Μ 2非僅取決於冷媒的種類，亦取決於真空處理 Φ 單元1之簇射板2及氫氟碳化物間的熱交換量。因此，氫 氟碳化物之最適當流量須就各物體構件作相同測試方得決 定。The refrigerator unit 10 includes a diaphragm type compressor 11; a condenser 12; an expansion valve 14 acting as a decompression means; an evaporator 15; and a hydrofluorocarbon R1 34a (hereinafter referred to as hydrogen) acting as a refrigerant in the refrigeration circuit 18' The fluorocarbon) can be circulated through the refrigeration circuit. The compressor 11, the condenser 12, the expansion valve 14, and the evaporator 15 are all disposed in the refrigeration circuit 18. The refrigeration circuit 18 includes a cooling water path 16 of the cooling water #cycle. In the evaporator 15 and the condenser 12, heat exchange between the cooling water in the cooling water path 16 and the hydrofluorocarbon in the refrigeration circuit 18 is performed. In the cooling water path 16 , a valve member 17 is provided between the evaporator 15 and the condenser 1 2 . In the refrigeration circuit 18, a branch point 18a is formed between the condenser 12 and the expansion valve 14, and the refrigeration circuit 18 is divided into two paths at the branching point. One path 18b communicates with the expansion valve 14 acting as a decompression means to form part of the refrigeration circuit 18, and the other path 18c communicates with the inlet 3a of the refrigerant passage 3. The path 18c forms a refrigerant supply path. The ®/OFF valve 21 is provided in the path ® 18c. When the ΟΝ/OFF valve 21 is opened, the ON/OFF valve 21 allows the refrigerant to be supplied to the refrigerant passage 3 via the path 18c. When the ΟΝ/OFF valve 21 is closed, the ΟΝ/OFF valve 21 prevents the refrigerant from being supplied to the refrigerant passage via the path 18c. The ΟΝ/OFF valve 21 forms a refrigerant control means. In the state where the ON/OFF valve 2 1 is open, the ΟΝ/OFF valve also functions as an expansion valve which is the first pressure control means in the refrigerant supply path. The ΟΝ/OFF valve 21 is electrically connected to the controller 9 in conjunction with the temperature sensor 8. In the controller 9, an upper limit 値 and a lower limit 値 associated with the detection of the 値 by the temperature sensor 8 are set. The upper limit 値 1310450 corrects the action to the first predetermined temperature, and the lower limit 値 acts to the second predetermined temperature. Further, the expansion valve 14 and the evaporator 15 have a meeting point of 18 d, which is connected to the path 13 8 e which is the refrigerant return path and the outlet 3 b of the refrigerant passage 3. In the path 18e, a first accumulator 22 and a constant pressure valve 23 are provided. The accumulator 22 stores liquid hydrofluorocarbons therein. The constant pressure valve 23 is a second pressure control means in the refrigerant return path for adjusting the pressure in the refrigerant passage 3 to a constant enthalpy. The operation of the cooling unit according to the first embodiment will be described with reference to Fig. 1. When the virtual processing unit 1 starts to process the object 5 in the vacuum chamber 6 of the vacuum processing unit 1, the compressor 11 is activated, and at the same time, the cooling water starts to circulate through the cooling water path 16, that is, the freezing of the cooling unit 10 is started. The action of the loop 18. When the hydrofluorocarbon and the cooling water in the evaporator 15 are heat-exchanged, the hydrofluorocarbon of the gas-liquid two-phase flow is evaporated and then introduced into the compressor 11. The hydrofluorocarbon is compressed by the compressor 11 and discharged by the compressor to a high-pressure, high-temperature hydrofluorocarbon gas. When the hydrofluorocarbon gas discharged from the compressor 11 and the cooling water cooled by the evaporator 15 in the condenser 12 are exchanged for heat, the hydrogen fluorocarbon of the gas is cooled and the hydrogen fluoride of the gas is supplied. The carbides condense into liquid hydrofluorocarbons. After the hydrofluorocarbons in the condenser 12 are condensed, the liquid hydrofluorocarbons are separated at the branching point 18a and circulated through the paths 18b, 18c. As will be described later, when the ΟΝ/OFF valve 21 is opened, the hydrofluorocarbon which has been circulated through the path 18c is supplied to the refrigerant passage 3. At this time, the hydrofluorocarbon which has been circulated by the path 18c is depressurized by the ΟΝ/OFF valve 21 acting as an expansion valve, and is supplied to the refrigerant passage 3 in the form of a gas-liquid two-phase flow. On the other hand, the hydrofluorocarbon which is circulated through the path 1 8 b is modified by the expansion valve 14 as -10- 1310450 to form a hydro-carbonized carbide of the gas-liquid two-phase flow, and then at the meeting point. 1 8d - Hydrofluorocarbons that meet the path of 18 e cycles, as detailed below. Thereafter, when the hydrofluorocarbon of the gas-liquid two-phase flow flows into the evaporator 15, the hydrofluorocarbon of the above-mentioned "gas-liquid two-phase flow" and the cooling water in the cooling water path 16 are heat-exchanged. Thereafter, the hydrofluorocarbons are returned to the compressor 11 and circulated through the refrigeration circuit 18. The following describes the hydrofluorocarbons which have been divided into the paths of 18 c at the branching point of 1 8 a. In the gas-liquid two-phase flow, the temperature of the refrigerant is determined by the pressure of the refrigerant. That is, the temperature of the hydrofluorocarbon of the gas-liquid two-phase flow is controlled by adjusting the pressure of the hydrofluorocarbon which is circulated through the refrigerant passage 3. Therefore, the pressure between the ON/OFF valve 21 and the constant pressure valve 23 is adjusted by the ΟΝ/OFF valve 21 and the constant pressure valve 23 so as to conform to the temperature of the hydrofluorocarbon of the gas-liquid two-phase flow. When the object 5 in the vacuum chamber 6 of the vacuum processing unit 1 is processed 'If the sense of the temperature sensor 8 rises to or above the upper limit 値, the controller 9 opens the ΟΝ/OFF valve 21 to cause the ΟΝ/OFF valve 21 In the ON mode, the hydrofluorocarbon of the gas-liquid two-phase flow can flow into the refrigerant passage 3. At this time, the hydrofluorocarbon of the gas-liquid two-phase flow is discharged from the inlet 3 a through the outlet 3 b at a flow rate without being evaporated in the refrigerant passage 3, and the flow rate allows the hydrofluorocarbon to pass from the inlet 3a to the outlet. 3b maintains its gas-liquid two-phase flow. The hydrogen fluorocarbon in the /4 refrigerant passage 3 maintains the gas-liquid two-phase flow, so the average temperature of the gas-liquid mixture is kept constant from the inlet 3a to the outlet 3b. The hydrofluorocarbon in the form of a gas-liquid two-phase flow through the outlet 3b is separated into a gas and a liquid hydrofluorocarbon by a first accumulator 22 located downstream of the outlet 3b, thereby preventing -11-1341050 The liquid hydrofluorocarbon is corrected to circulate downstream of the first accumulator 22. Even if the hydrofluorocarbon in the vicinity of the outlet 3b is nearly evaporated, since the liquid hydrofluorocarbon is accumulated in the first accumulator 22, the liquid hydrofluorocarbon accumulated in the accumulator 22 can prevent hydrofluorocarbonization. The product was evaporated to dryness near the outlet 3b. When the hydrofluorocarbon of the gas-liquid two-phase flow circulates through the refrigerant passage 3 to cool the shower plate 2, the sense enthalpy of the temperature sensor 8 drops. When the sense 値 of the temperature sensor 8 drops to or falls below the lower limit ,, the controller 9 turns off the ON/OFF valve 21 to turn the ΟΝ/OFF valve into the OFF mode, thereby preventing the supply of the hydrofluorocarbon Refrigerant passage 3. Therefore, the opening/closing of the ΟΝ/OFF valve 21 depends on the detection of the temperature sensor 8, and as shown in Fig. 2, the ON mode and the OFF mode are repeated, and in the ON mode, the refrigerant is at the flow rate M. ^ is circulated through the refrigerant passage 3, and in the OFF mode, the refrigerant is not circulated through the refrigerant passage 3. That is, the control of ΟΝ/OFF is implemented. The flow rate iVUpt of the hydrofluorocarbons passing through the refrigerant passage 3 will be described below. In order to check the hydrofluorocarbon flow rate IVUpt which allows the HFC to circulate through the refrigerant passage 3 to maintain the gas-liquid two-phase flow, the opening time of the ΟΝ/OFF valve 21 in each of the ® ON modes is changed to change The hydrofluorocarbon flow rate of each of the ON modes, thus measuring the temperature variation of the temperature difference between the maximum temperature and the minimum temperature in the shower plate 2. Figure 3 is a map of the measurement results. When the flow rate of the hydrofluorocarbon is less than the flow rate M! of the hydrofluorocarbon, a temperature difference greater than the difference in temperature is caused. This result shows that the hydrofluorocarbon circulating in the refrigerant passage 3 is evaporated to the portion of the refrigerant passage 3 adjacent to the outlet 3b because of the small flow rate. In other words, since all of the hydrofluorocarbons have evaporated in the refrigerant passage 3, and the latent heat of the present compound is not modified by hydrofluorocarbon-12-1310450, heat is absorbed from the shower plate 2, and as a result, after evaporation The temperature of the hydrofluorocarbon _ compound is increased. On the other hand, when the flow rate of the hydrofluorocarbon is increased to or greater than the flow rate of 1^1, the hydrofluorocarbon can maintain a certain heat absorption rate and the shower plate is cooled between the inlet 3a and the outlet 3b without evaporation. 2, thus minimizing the temperature difference to At 〇. When the flow rate of the hydrofluorocarbon is greater than the flow rate M2 of the hydrofluorocarbon, the temperature difference increases as the flow rate increases. In this case, the hydrofluorocarbon φ cooling shower plate 2 does not evaporate between the inlet 3a and the outlet 3b, but excessively cools the shower plate 2 as compared with a flow rate which is excessively large at a predetermined temperature in each of the ON modes. As a result, an increase in the temperature difference is caused. Therefore, the HFC flow rate for each ON mode is adjusted from the flow rate to the flow rate M2. Traffic Μ. ^ is equivalent to the flow rate of hydrofluorocarbons that allow the hydrofluorocarbons to maintain a gas-liquid two-phase flow. In addition, the flow rate Μ can also minimize temperature variations in the shower plate 2. Note that the flow rate Μ ! and Μ 2 are not only dependent on the type of refrigerant, but also on the amount of heat exchange between the shower plate 2 and the hydrofluorocarbon of the vacuum treatment Φ unit 1. Therefore, the most appropriate flow rate of hydrofluorocarbons must be determined by the same test for each component.
如上述，ΟΝ/OFF閥21具有ON模式，可令凝結器12 和冷媒通路3相連通，並具有0 F F模式，可防止凝結器1 2 和冷媒通路3相連通。當使ΟΝ/OFF閥21成ON模式時， 氫氟碳化物即迅速地以流量M。^供應於冷媒通路3，則在 冷媒通路3中即難以發生氫氟碳化物蒸乾現象。當ON/OFF -13· -1310450 修正本 閥21在ON模式時，氫氟碳化物係以氣-液兩相流在冷媒通 路3中循環，故在氫氟碳化物經冷媒通路3作循環期間， 在實質上可依相同方式和簇射板2的任何位置實行熱交換 。又，因ΟΝ/OFF閥21係由ON模式切換爲OFF模式，故 氣-液兩相流之氫氟碳化物並不經入口 3 a連續地循環，這 避免氫氟碳化物僅對入口 3a過度冷卻。 本實施例中，依溫度感知器8之感測値實行ON模式 及OFF模式間的切換，故可實行簇射板2之嚴格溫度控制 本實施例中，因爲冷卻單元包括除了作用成第1控制 手段之ΟΝ/OFF閥21以外，尙有作用成第2壓力控制手段 的恒壓閥2 3，故冷媒通路3中之壓力可被嚴格的控制。 蒸發器1 5中，冷卻水路徑1 6內用以冷卻凝結器1 2之 冷卻水係被冷卻。因此，具有超冷卻能力之氣-液兩相流的 氫氟碳化物乃被有效地利用。 茲以第4圖說明依本發明冷卻單元之第2實施例。本 ® 實施例中，第1圖之相同之元件符號係應用於第4圖之相 同或相似的元件，並省略其說明。 第2實施例之冷卻單元與第1實施例不同之處在於藉 由在第1實施例之分岐點18a處設置三通閥實行ON/OFF 的控制。 第2實施例中，作用成冷卻手段之致冷器單元30及冷 媒通路3形成冷卻單元。30具有設置於冷媒回路18之分 岐點18a的三通閥13，可令凝結器12和冷媒通路3及膨 -14- 修正本 1310450 脹閥1 4任何一者相連通。三通閥1 3係和溫度感知器8 — 起電氣連接於控制器9。注意的是，三通閥1 3形成設置於 冷媒供應路徑中的冷媒控制手段及第1壓力控制手段。亦 即，三通閥1 3係控制冷媒進入路徑1 8 c的循環’以使冷媒 在路徑1 8 c中減壓。第2實施例之其他構造實質上與第1 實施例相同。 第2實施例中，當不須冷卻簇射板2時，控制器9係 把三通閥13之方向設定成凝結器12和膨脹閥14相連通。 • 當物體5在真空處理單元1之真空室6內被處理時，如果 溫度感知器8之感測値升至或高於上限値，則控制器9即 切換三通閥1 3的方向，令凝結器1 2和冷媒通路3相連通 ，藉以將氫氟碳化物供應於冷媒通路3。此際，氫氟碳化 物係以一流量供應於冷媒通路3，該流量係可使氫氟碳化 物自入口 3a至出口 3b保持氣-液兩相流，如同第1實施例 。如果簇射板2被冷卻，使得溫度感知器8之感測値下降 至或低於下限値，則控制器9切換三通閥1 3的方向以令凝 ® 結器1 2再度和膨脹閥1 4相連通。至於其他的動作，實質 上與第1實施例相同。 如上述，依據溫度感知器8之感測値切換三通閥13之 方向而實行ΟΝ/OFF控制。因此，在實質上可獲得和第1 實施例相同的功效。 依本發明冷卻單元之第3實施例將以第5圖加以說明 。本實施例中，第1圖之相同之元件符號係應用於第5圖 之相同或相似的元件，並省略其說明。依第3實施例之冷 -15- 1310450 修正本 卻單元和第1實施例不同處在於在第1實施例之路徑1 8 c -中設置了氣-液分離器。 -本實施例中，作用成冷卻手段之致冷器單元5 0及冷媒 通路3形成冷卻單元。致冷器單元5 0包括貯液器4丨，其 係作用成氣-液分離手段，並係設在ΟΝ/OFF閥21及分岐 點1 8 a之間。貯液器4 1具有：桶體4 1 a，其內可蓄積具有 氣-液兩相流之氫氟碳化物；氣相配管4 1 b，係在桶體4 1 a 中與氣相連通；液相配管4 1 b，係在桶體4 1 a中液相相連 ® 通。氣相配管4 1 b係連接於路徑1 8 c 1之一端，其另一端則 爲分岐點18a。另一方面，液相配管41c係連接於路徑18c2 之一端，其另一端則連接冷媒通路3之入口 3a。路徑18c 1 與1 8 c2形成冷媒供應路徑。第3實施例之其他構造實質上 與第1實施例相同。 本實施例中，當ΟΝ/OFF閥21被打開時，經冷凍回路 1 8循環之氫氟碳化物至少有一部分係由分岐點1 8a循環至 路徑！ 8 c 1。經路徑1 8 c 1循環之氫氟碳化物係由貯液器4 1 ^ 之氣相配管41b在桶體41a內被解放成氣相。 冷凍回路18中，當由於冷卻不足致凝結器12中的氫氟 碳化物未能完全地冷凝爲液體氫氟碳化物時，則在分岐點 18a處，諸如蒸發的氫氟碳化物氣體成分或空氣將和液體 氫氟碳化物相混合。當含有氣體成分之該液體氫氟碳化物 被釋放入桶體41a內時，液體氫氟碳化物乃由氣體成分中 被分離。經液相配管4 1 c供應於路徑1 8 c2之氫氟碳化物爲 不含氣體成分的液體氫氟碳化物。當不含氣體成分之該種 -16- 修正本 1310450 液體氫氟碳化物以氣-液兩相流形式經冷媒通路3循環時’ 氫氟碳化物並不會受所含氣體成分影響。因之’氫氟碳化 . 物可在完全地恒溫下經由冷媒通路3作循環，藉以防止冷 卻效率之劣化。因此’簇射板2之溫度更可作嚴格地控制 。其他的動作實質上與第1實施例相同，故其亦可獲得與 第1實施例同樣的功效。 茲以第6圖說明本發明冷卻單元之第4實施例。本實 施例中，第1圖之相同元件符號係應用於第6圖之相同或 • 相似的元件，並省略其說明。第4實施例之冷卻單元與第 1實施例不同之處在於，第1實施例位於路徑1 8 e與冷凍 回路1 8間的會合點1 8 d係位在蒸發器1 5及壓縮機1 1之間 〇 第4實施例中，作用成冷卻手段之致冷器單元70與冷 媒通路3形成冷卻單元。致冷器單元70中，路徑18e及冷 凍回路1 8間的會合點1 8d係位在蒸發器1 5及壓縮機1 1之 間。致冷器單元70包括設在會合點18d與壓縮機11間的 ^ 第2蓄壓器24，用以防止液體氫氟碳化物流入壓縮機1 1 。第4實施例之其他構造與第1實施例相同。 本例中，已冷卻簇射板2後之氫氟碳化物，如同第1 實施例，係以ΟΝ/OFF閥21控制，以在入口 3a與出口 3b 間保持其氣-液兩相流。氫氟碳化物通過第1蓄壓器22後 ，氫氟碳化物正常地蒸發並和經冷凍回路1 8循環之氫氟碳 化物在會合點18d混合而可被抽入壓縮器11內。但是，當 經路徑1 8e循環之氫氟碳化物流量太大或當致冷器單元70 -17- 1310450 修正本 之溫度太低時，液體氫氟碳化物可能自第1蓄壓器22朝下 游流動。如果液體氫氟碳化物和經冷凍回路1 8循環之氫氟 碳化物在會合點1 8 d相混合後，液體氫氟碳化物仍被吸入 壓縮機11時，壓縮機11恐有無法運作之虞。基此理由， 乃將液體氫氟碳化物蓄積在第2蓄壓器24內，用以把氫氟 碳化物在第2蓄壓器24下游可完全地蒸發，因而可保護壓 縮機1 1。其他的動作則和第1實施例相同，故可獲得和第 1實施例相同在實質上的功效。 第4實施例中，雖然把第1實施例中路徑1 8 e及冷凍 回路1 8間的會合點1 8d改位於蒸發器1 5及壓縮機1 1間， 但依第2及第3實施例之冷卻單元的各會合點1 8 d之位置 亦可應用於第4實施例。於此狀況中，第2蓄壓器24係設 在蒸發器1 5及壓縮機1 1間。 以下說明本發明冷卻單元之第5實施例。依第5實施 例之冷卻單元與第1實施例之不同處在於，表示ON模式 時間對ON模式時間與OFF模式時間兩者合計時間之比率 的負荷比（duty ratio)，可依據溫度感知器8之感測値加以 調整，故可控制冷媒通路3內氫氟碳化物的循環。本說明 書中’ ON模式時間爲ON模式期間的時間之意，而OFF模 式時間爲0 F F模式期間之時間之意。第5實施例冷卻單元 之構造與第〗實施例實質上相同。 如第1圖所示，亦如第1實施例之狀況，物體5係在 真空處理單元1之真空室6內作處理。在物體5之處理期 間，控制器9係打開及關閉〇n/〇FF閥2 1以交替地使 -18- 1310450 修正本 ΟΝ/OFF閥21成爲氫氟碳化物以流量Mcpt作循環之〇N模 - 式及成爲氫氟碳化物不作循環之OFF模式，如第7圖所示 . 者，故可令氫氟碳化物循環進入冷媒通路3中。注意的是 ，乃ON模式時間與在ON模式時間之後的OFF模式時間 兩者的合計時間係恒定地設定爲一恒定時間ΔΤ。例如，冷 媒通路3中之氫氟碳化物的循環控制在負荷比R〇，且ON 模式時間爲Ah而OFF模式時間爲At2時，負荷比Rq係以 △ ti/(Ati + At2)表示，式中，AT = Ati + At2。儘管冷媒通路3中 • 之氫氟碳化物的循環控制在負荷比Rg，如果溫度感知器8 之感測値上升超過了作用成第1預定溫度的上限値，則控 制器9即依據溫度感知器8之感測値及上限値間的溫差而 把負荷比Rg提高至Ri(>R〇)。控制器9根據負荷比R!打開 及關閉ΟΝ/OFF閥21，因而可令冷媒通路3和凝結器12 相連通或防止該兩者的相連通。因之，用於簇射板2的冷 卻能力即提高，而可降低簇射板2的溫度。之後，儘管冷 媒通路3中之氫氟碳化物的循環被控制在負荷比R!時，如 • 果溫度感知器8之感測値下降至作用成第2預定溫度的低 限値以下，則控制器9即依據溫度感知器8之感測値及低 限値間的溫度差而把負荷比由Ri降爲R2(<Rc)。控制器9 係依負荷比R2打開及關閉ΟΝ/OFF閥21，故可令冷媒通路 3和凝結器12相連通或防止該兩者之連通。因此，用於簇 射板2之冷卻能力即下降，簇射板2之溫度隨之上升。其 他動作則與第1實施例實質相同。 注意的是，乃控制器9具有地圖（map)，用於表示負荷 -19- 1310450 '比依據溫度感知器8之檢測値與上限値或下限値間 • 之增減量，用以改變負荷比。 . 如上述，控制器9係依據溫度感知器8之感測 負荷比而依負荷比打開及關閉ΟΝ/OFF閥21，故可 通路3和凝結器1 2相連通或防止該兩者的連通。因 制器9係控制冷媒通路3內之氫氟碳化物的循環。 於簇射板2之冷卻能力可靈敏地加以控制。此外， 能力作靈敏地控制，乃可減少簇射板2溫度之分散 # 第5實施例爲第1實施例之修改例，故將第1 之負荷比依據溫度感知器8的感測値加以改變，俾 後之負荷比控制ΟΝ/OFF閥21，乃可令冷媒通路3 器1 2相連通或防止該兩者的連通，其係控制冷媒通 之氫氟碳化物的循環者。但是，第5實施例非局限 1實施例之修改而已，第5實施例亦可來自第2〜4 的修改，故可依負荷比控制三通閥13或ON/OFF m 雖然，第1〜5實施例中使用氫氟碳化物作爲冷 ® 冷媒不限於氫氟碳化物。亦可使用例如丙烷、或異 碳氫化合物。亦可利用氫氟碳化物及碳氫化合物以 合性冷媒，例如可利用冷媒407C作爲混合冷媒。 雖然，第1〜5實施例中，冷卻單元係用於半導 單元，但該等冷卻單元不限制僅作上述用途。每個 元可用作用於冷卻每一個冷卻物體構件單元’特別 作溫度須嚴格控制之冷卻單元。 第1〜5實施例中，壓縮機1 1雖例示爲膜片型 修正本 溫度差 値改變 令冷媒 此，控 故，用 因冷卻 〇 實施例 依更改 與凝結 路3內 僅爲第 實施例 21 ° 媒，但 丁烷等 外的混 體製造 冷卻單 是適用 ，但壓 -20- 1310450 修正本 縮機不限此種型式。例如，當壓縮機係用於供半導體生產 -單元所用的冷卻單元時，最好是使用機油不和冷媒相混合 .之膜片式無油壓縮機。而當壓縮機係用於供其他物體構件 所用的冷卻單元時，則壓縮機即不限制爲無油式壓縮機， 此時可用習知活塞型壓縮機或渦卷式壓縮機。 第1〜5實施例中，雖係依據溫度感知器8之感測値把 ON模式切換爲OFF模式及把OFF模式切換成ON模式， 但該兩種切換不限僅以上述方式進行。該ΟΝ/OFF閥21可 # 被作用成經歷一段預定時間的ON模式時間，之後，於該 段預定時間後，自動地由ON模式時間切換成OFF模式。 此狀況中，ΟΝ/OFF閥21係以預定時間確實地由ON 模式時間切換爲OFF模式。和依據溫度感知器8之感測値 將ΟΝ/OFF閥21由ON模式時間切換爲OFF模式的狀況相 比較，可避免因溫度感知器8之反應延遲所致的控制延遲 ，亦即，可避免所謂的峰突（overshoot)。 第2實施例中，雖然把膨脹閥14設在冷凍回路18中 ® ，但三通閥13可具有膨脹閥14之減壓功能。此狀況中， 經蒸發器1 5循環之氫氟碳化物係以三通閥1 3減壓。此可 使冷卻單元減少元件數量，而可防止冷凍回路複雜化。 第1〜5實施例中，雖把恒壓閥23設在路徑18e中’ 但亦可僅用ΟΝ/OFF閥2 1及三通閥1 3控制冷媒通路3內 的壓力而不須恒壓閥2 3。 雖已配合附圖詳述說明本發明之示範實施例及·其各種 修改例，但應了解的是’本發明並非限於這些精準的實施 -21- 1310450 修正本 例及所述的修改例’此道行家自可作各種的變化及進一步 -的修改而不背離如隨附申請專利範圍中所定義的本發明之 . 範圍或精神。 【圖式簡單說明】 第1圖爲本發明冷卻單元第1實施例之槪圖。 第2圖爲本發明冷卻單元第1實施例之〇n/OFF控制 說明曲線圖。 第3圖爲依本發明第1實施例冷卻單元之簇射板2中 ® ，經冷媒通路3循環之氫氟碳化物流量、及最高溫度與最 低溫度間之溫度差的溫度變動、兩者之關係曲線圖。 第4圖爲依本發明冷卻單元第2實施例之槪圖。 第5圖爲依本發明冷卻單元第3實施例之槪圖。 第6圖爲依本發明冷卻單元第4實施例之槪圖。 第7圖爲依本發明冷卻裝置第5實施例中，負荷比與 氫氟碳化物之循環兩者的關係曲線圖。 【主要元件符號說明】 1 真空處理單元 2 簇射板 3 冷媒通路 3 a 入口 3b 出口 4 感受器 5 物體 6 真空室 -22- -1310450 修正本 7 上壁 8 溫度感知器 9 控制器 10, 30，50, 70 致冷器單元 11 壓縮機 12 凝結器 13 三通閥（冷 制手段） 14 膨脹閥（減 15 蒸發器 16 冷卻水路徑 17 閥 18 冷凍回路 18a, 1 8d 會合點 18b, 18c, 1 8c 1 , 1 8c2, 1 8e 2 1 ΟΝ/OFF 閥（ 控制手段） 22 第1蓄壓器 23 恒壓閥（第 24 第2蓄壓器 4 1 貯液器（氣 4 1a 桶體 4 1b 氣相配管 4 1c 液相配管As described above, the ΟΝ/OFF valve 21 has an ON mode to allow the condenser 12 to communicate with the refrigerant passage 3 and has an FF mode to prevent the condenser 1 2 from communicating with the refrigerant passage 3. When the ΟΝ/OFF valve 21 is brought into the ON mode, the hydrofluorocarbon rapidly flows at a flow rate M. When it is supplied to the refrigerant passage 3, the hydrofluorocarbon evaporation phenomenon is hard to occur in the refrigerant passage 3. When the ON/OFF -13· -1310450 correction valve 21 is in the ON mode, the hydrofluorocarbon is circulated in the refrigerant passage 3 by the gas-liquid two-phase flow, so that the HFC is circulated through the refrigerant passage 3 The heat exchange can be carried out in substantially the same manner and in any position of the shower plate 2 in the same manner. Further, since the ΟΝ/OFF valve 21 is switched from the ON mode to the OFF mode, the hydrofluorocarbon of the gas-liquid two-phase flow is not continuously circulated through the inlet 3a, which prevents the hydrofluorocarbon from being excessive only to the inlet 3a. cool down. In this embodiment, the switching between the ON mode and the OFF mode is performed according to the sensing 値 of the temperature sensor 8, so that the strict temperature control of the shower plate 2 can be performed in the embodiment, because the cooling unit includes the first control except for the first control. The pressure/pressure valve 23 acting as the second pressure control means is provided in addition to the OFF/OFF valve 21, so that the pressure in the refrigerant passage 3 can be strictly controlled. In the evaporator 15, the cooling water system for cooling the condenser 12 in the cooling water path 16 is cooled. Therefore, a hydrofluorocarbon having a gas-liquid two-phase flow having supercooling ability is effectively utilized. A second embodiment of the cooling unit according to the present invention will be described with reference to Fig. 4. In the present embodiment, the same reference numerals are used for the same or similar elements in Fig. 4, and the description thereof will be omitted. The cooling unit of the second embodiment is different from the first embodiment in that ON/OFF control is performed by providing a three-way valve at the branching point 18a of the first embodiment. In the second embodiment, the refrigerator unit 30 and the refrigerant passage 3 which function as cooling means form a cooling unit. 30 has a three-way valve 13 disposed at a branch point 18a of the refrigerant circuit 18 to allow the condenser 12 to communicate with either the refrigerant passage 3 and the expansion valve 13104. The three-way valve 13 and the temperature sensor 8 are electrically connected to the controller 9. Note that the three-way valve 13 forms a refrigerant control means and a first pressure control means provided in the refrigerant supply path. That is, the three-way valve 13 controls the circulation of the refrigerant into the path 18c to make the refrigerant decompress in the path 18c. The other structure of the second embodiment is substantially the same as that of the first embodiment. In the second embodiment, when it is not necessary to cool the shower plate 2, the controller 9 sets the direction of the three-way valve 13 so that the condenser 12 and the expansion valve 14 are in communication. • When the object 5 is processed in the vacuum chamber 6 of the vacuum processing unit 1, if the sensing of the temperature sensor 8 is raised to or above the upper limit 则, the controller 9 switches the direction of the three-way valve 13 The condenser 12 is in communication with the refrigerant passage 3 to supply the hydrofluorocarbon to the refrigerant passage 3. At this time, the hydrofluorocarbon is supplied to the refrigerant passage 3 at a flow rate which allows the hydrofluorocarbon to maintain the gas-liquid two-phase flow from the inlet 3a to the outlet 3b, as in the first embodiment. If the shower plate 2 is cooled such that the sense 値 of the temperature sensor 8 drops to or below the lower limit 値, the controller 9 switches the direction of the three-way valve 13 to cause the condensate 1 2 to re-expand and expand the valve 1 4 phases are connected. The other operations are substantially the same as those of the first embodiment. As described above, the ΟΝ/OFF control is performed in accordance with the direction in which the temperature sensor 8 senses the direction in which the three-way valve 13 is switched. Therefore, the same effects as those of the first embodiment can be obtained substantially. The third embodiment of the cooling unit according to the present invention will be described with reference to Fig. 5. In the present embodiment, the same component symbols as in Fig. 1 are applied to the same or similar elements of Fig. 5, and the description thereof will be omitted. The cold -15- 1310450 according to the third embodiment is different from the first embodiment in that a gas-liquid separator is provided in the path 1 8 c - of the first embodiment. In the present embodiment, the refrigerator unit 50 and the refrigerant passage 3 acting as cooling means form a cooling unit. The refrigerator unit 50 includes a reservoir 4, which functions as a gas-liquid separation means, and is disposed between the ΟΝ/OFF valve 21 and the branch point 18a. The liquid reservoir 4 1 has a barrel body 4 1 a in which a hydrofluorocarbon having a gas-liquid two-phase flow can be accumulated, and a gas phase pipe 4 1 b is connected to the gas phase in the barrel body 4 1 a; The liquid phase piping 4 1 b is connected to the liquid phase in the barrel 4 1 a. The gas phase piping 4 1 b is connected to one end of the path 18 c 1 and the other end is a branch point 18a. On the other hand, the liquid phase piping 41c is connected to one end of the path 18c2, and the other end is connected to the inlet 3a of the refrigerant passage 3. The paths 18c 1 and 1 8 c2 form a refrigerant supply path. The other structure of the third embodiment is substantially the same as that of the first embodiment. In the present embodiment, when the ΟΝ/OFF valve 21 is opened, at least a portion of the hydrofluorocarbon circulating through the refrigeration circuit 18 is circulated to the path by the branch point 18a! 8 c 1. The hydrofluorocarbon which is circulated through the path 1 8 c 1 is liberated into the gas phase in the barrel 41a by the gas phase piping 41b of the reservoir 4 1 ^. In the refrigeration circuit 18, when the hydrofluorocarbons in the condenser 12 are not completely condensed into liquid hydrofluorocarbons due to insufficient cooling, then at the branching point 18a, such as an evaporated hydrofluorocarbon gas component or air It will be mixed with liquid hydrofluorocarbon. When the liquid hydrofluorocarbon containing a gas component is released into the barrel 41a, the liquid hydrofluorocarbon is separated from the gas component. The hydrofluorocarbon supplied to the path 18c2 via the liquid phase piping 4 1 c is a liquid hydrofluorocarbon containing no gas component. When the gas-free component is not used, the 1312550 liquid hydrofluorocarbon is circulated through the refrigerant passage 3 in the form of a gas-liquid two-phase flow. The hydrofluorocarbon is not affected by the contained gas component. Because of the 'hydrofluorocarbonization', the material can be circulated through the refrigerant passage 3 at a completely constant temperature to prevent deterioration of the cooling efficiency. Therefore, the temperature of the shower plate 2 can be strictly controlled. The other operations are substantially the same as those of the first embodiment, and therefore the same effects as those of the first embodiment can be obtained. A fourth embodiment of the cooling unit of the present invention will be described with reference to Fig. 6. In the present embodiment, the same component symbols as in Fig. 1 are applied to the same or similar elements of Fig. 6, and the description thereof is omitted. The cooling unit of the fourth embodiment is different from the first embodiment in that the first embodiment is located at the meeting point 18 8 between the path 18 e and the freezing circuit 1 8 in the evaporator 15 and the compressor 1 1 In the fourth embodiment, the refrigerator unit 70 acting as a cooling means forms a cooling unit with the refrigerant passage 3. In the refrigerator unit 70, the meeting point 18d between the path 18e and the freezing circuit 18 is between the evaporator 15 and the compressor 11. The refrigerator unit 70 includes a second accumulator 24 disposed between the meeting point 18d and the compressor 11 to prevent liquid hydrofluorocarbon from flowing into the compressor 1 1 . The other structure of the fourth embodiment is the same as that of the first embodiment. In this example, the hydrofluorocarbon after cooling the shower plate 2, as in the first embodiment, is controlled by the ΟΝ/OFF valve 21 to maintain its gas-liquid two-phase flow between the inlet 3a and the outlet 3b. After the hydrofluorocarbons pass through the first accumulator 22, the hydrofluorocarbons are normally evaporated and mixed with the hydrofluorocarbons circulated through the refrigeration circuit 18 at the meeting point 18d to be drawn into the compressor 11. However, when the flow rate of the hydrofluorocarbon circulating through the path 18e is too large or when the temperature of the refrigerator unit 70-17-1310450 is too low, the liquid hydrofluorocarbon may be downstream from the first accumulator 22. flow. If the liquid hydrofluorocarbon and the hydrofluorocarbon circulating through the refrigeration circuit 18 are mixed at the meeting point for 18 d, and the liquid hydrofluorocarbon is still sucked into the compressor 11, the compressor 11 may be inoperable. . For this reason, the liquid hydrofluorocarbon is accumulated in the second accumulator 24 to completely evaporate the hydrofluorocarbon downstream of the second accumulator 24, thereby protecting the compressor 11. The other operations are the same as those of the first embodiment, so that the same effects as those of the first embodiment can be obtained. In the fourth embodiment, the distance between the path 18 e and the refrigerating circuit 18 in the first embodiment is changed between the evaporator 15 and the compressor 1 1 , but according to the second and third embodiments. The position of each meeting point of the cooling unit of 18 d can also be applied to the fourth embodiment. In this case, the second accumulator 24 is provided between the evaporator 15 and the compressor 11. Next, a fifth embodiment of the cooling unit of the present invention will be described. The difference between the cooling unit according to the fifth embodiment and the first embodiment is that the duty ratio indicating the ratio of the ON mode time to the total time of the ON mode time and the OFF mode time can be determined according to the temperature sensor 8 The sense 値 is adjusted so that the circulation of the hydrofluorocarbons in the refrigerant passage 3 can be controlled. In this manual, the 'ON mode time is the meaning of the time during the ON mode, and the OFF mode time is the time during the 0 F F mode. The configuration of the cooling unit of the fifth embodiment is substantially the same as that of the first embodiment. As shown in Fig. 1, as in the case of the first embodiment, the object 5 is processed in the vacuum chamber 6 of the vacuum processing unit 1. During the processing of the object 5, the controller 9 opens and closes the 〇n/〇FF valve 2 1 to alternately make the -18-1310450 correction ΟΝ/OFF valve 21 into a hydrofluorocarbon with a flow rate Mcpt. The mode is the OFF mode in which the hydrofluorocarbon does not circulate, as shown in Fig. 7, so that the hydrofluorocarbon can be circulated into the refrigerant passage 3. Note that the total time between the ON mode time and the OFF mode time after the ON mode time is constantly set to a constant time ΔΤ. For example, when the circulation of the hydrofluorocarbon in the refrigerant passage 3 is controlled at the load ratio R〇, and the ON mode time is Ah and the OFF mode time is At2, the load ratio Rq is expressed by Δ ti / (Ati + At2). Medium, AT = Ati + At2. Although the circulation of the hydrofluorocarbon in the refrigerant passage 3 is controlled at the load ratio Rg, if the sense enthalpy of the temperature sensor 8 rises above the upper limit 作用 acting as the first predetermined temperature, the controller 9 is based on the temperature sensor The sense of temperature between the 値 and the upper limit is increased by 8 and the load ratio Rg is increased to Ri (> R 〇). The controller 9 opens and closes the ΟΝ/OFF valve 21 in accordance with the duty ratio R!, thereby allowing the refrigerant passage 3 and the condenser 12 to communicate or prevent the two from communicating. Therefore, the cooling capacity for the shower plate 2 is increased, and the temperature of the shower plate 2 can be lowered. Thereafter, although the cycle of the hydrofluorocarbon in the refrigerant passage 3 is controlled at the load ratio R!, if the sense 値 of the temperature sensor 8 falls below the lower limit 作用 which acts as the second predetermined temperature, then control The device 9 reduces the duty ratio from Ri to R2 (<Rc) according to the temperature difference between the sense 値 and the low limit 温度 of the temperature sensor 8. The controller 9 opens and closes the ΟΝ/OFF valve 21 in accordance with the load ratio R2, so that the refrigerant passage 3 and the condenser 12 can be connected or prevented from communicating. Therefore, the cooling capacity for the shower plate 2 is lowered, and the temperature of the shower plate 2 is increased. Other actions are substantially the same as in the first embodiment. Note that the controller 9 has a map for indicating the load -19-1341050's increase or decrease according to the detection 値 and the upper limit 値 or the lower limit 依据 according to the temperature sensor 8 to change the duty ratio. As described above, the controller 9 opens and closes the ΟΝ/OFF valve 21 in accordance with the load ratio according to the sensed load ratio of the temperature sensor 8, so that the passage 3 and the condenser 12 can be connected or prevented from communicating. The controller 9 controls the circulation of the hydrofluorocarbons in the refrigerant passage 3. The cooling capacity of the shower plate 2 can be controlled with sensitivity. Further, the ability to control sensitively reduces the dispersion of the temperature of the shower plate 2. The fifth embodiment is a modification of the first embodiment, so that the first load ratio is changed in accordance with the sense 値 of the temperature sensor 8. The rear load ratio is controlled by the ΟΝ/OFF valve 21 to allow the refrigerant passage 3 to communicate with or prevent the communication between the two, which is a circulator for controlling the flow of the refrigerant to the hydrofluorocarbon. However, the fifth embodiment is not limited to the modification of the first embodiment. The fifth embodiment can also be modified from the second to fourth embodiments, so that the three-way valve 13 or the ON/OFF m can be controlled according to the duty ratio. The use of hydrofluorocarbons as cold® refrigerant in the examples is not limited to hydrofluorocarbons. For example, propane or an isohydrocarbon can also be used. It is also possible to use a hydrofluorocarbon and a hydrocarbon as a condensing refrigerant. For example, a refrigerant 407C can be used as a mixed refrigerant. In the first to fifth embodiments, the cooling unit is used for the semi-conductive unit, but the cooling units are not limited to the above-mentioned uses. Each element can be used as a cooling unit for cooling each of the cooled object member units, particularly for temperature control. In the first to fifth embodiments, the compressor 1 1 is exemplified as a diaphragm type correction temperature difference 値 change to the refrigerant, and the control is changed by the cooling enthalpy embodiment and the condensation path 3 is only the first embodiment 21 ° Medium, but butane and other hybrid manufacturing cooling sheets are applicable, but the pressure -20-1341050 is not limited to this type. For example, when the compressor is used for a cooling unit for a semiconductor production unit, it is preferable to use a diaphragm type oil-free compressor in which the oil is not mixed with the refrigerant. When the compressor is used for a cooling unit for other object members, the compressor is not limited to an oil-free compressor, and a conventional piston type compressor or a scroll compressor may be used at this time. In the first to fifth embodiments, the ON mode is switched to the OFF mode and the OFF mode is switched to the ON mode in accordance with the sensing of the temperature sensor 8, but the two types of switching are not limited to the above. The ΟΝ/OFF valve 21 can be activated to undergo an ON mode time for a predetermined period of time, after which it is automatically switched from the ON mode time to the OFF mode after the predetermined time period. In this case, the ΟΝ/OFF valve 21 is surely switched from the ON mode time to the OFF mode for a predetermined time. Compared with the sensing of the temperature sensor 8 and the switching of the ΟΝ/OFF valve 21 from the ON mode time to the OFF mode, the control delay due to the reaction delay of the temperature sensor 8 can be avoided, that is, it can be avoided. The so-called overshoot. In the second embodiment, although the expansion valve 14 is provided in the refrigeration circuit 18, the three-way valve 13 may have a pressure reducing function of the expansion valve 14. In this case, the hydrofluorocarbon circulating through the evaporator 15 is depressurized by the three-way valve 13. This allows the cooling unit to reduce the number of components while preventing the refrigeration circuit from becoming complicated. In the first to fifth embodiments, the constant pressure valve 23 is provided in the path 18e', but the pressure in the refrigerant passage 3 can be controlled only by the ΟΝ/OFF valve 21 and the three-way valve 13 without the constant pressure valve. twenty three. Although the exemplary embodiments of the present invention and various modifications thereof have been described in detail with reference to the drawings, it should be understood that 'the invention is not limited to these precise implementations. 21-1310450. Amend this example and the modifications described. The versatile variations and further modifications may be made without departing from the scope or spirit of the invention as defined in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a first embodiment of a cooling unit of the present invention. Fig. 2 is a graph showing the 〇n/OFF control of the first embodiment of the cooling unit of the present invention. Figure 3 is a diagram showing the temperature fluctuation of the hydrofluorocarbon flow rate circulated by the refrigerant passage 3 and the temperature difference between the highest temperature and the lowest temperature in the shower plate 2 of the cooling unit according to the first embodiment of the present invention. Relationship graph. Figure 4 is a plan view showing a second embodiment of the cooling unit according to the present invention. Fig. 5 is a perspective view showing a third embodiment of the cooling unit according to the present invention. Figure 6 is a plan view showing a fourth embodiment of the cooling unit according to the present invention. Fig. 7 is a graph showing the relationship between the load ratio and the cycle of hydrofluorocarbons in the fifth embodiment of the cooling apparatus according to the present invention. [Main component symbol description] 1 Vacuum processing unit 2 Shower plate 3 Refrigerant path 3 a Entrance 3b Exit 4 Receptor 5 Object 6 Vacuum chamber -22- -1310450 Correction 7 Upper wall 8 Temperature sensor 9 Controller 10, 30, 50, 70 chiller unit 11 compressor 12 condenser 13 three-way valve (cold means) 14 expansion valve (minus 15 evaporator 16 cooling water path 17 valve 18 refrigeration circuit 18a, 1 8d meeting point 18b, 18c, 1 8c 1 , 1 8c2, 1 8e 2 1 ΟΝ/OFF valve (control means) 22 1st accumulator 23 constant pressure valve (24th second accumulator 4 1 reservoir (gas 4 1a barrel 4 1b gas) Matching tube 4 1c liquid phase piping
(溫度檢測手段） (冷卻手段） 媒控制手段及第1壓力控 壓手段） 路徑 冷媒控制手段及第1壓力 2壓力控制手段） -液分離手段） -23-(temperature detecting means) (cooling means) medium control means and first pressure control means) path refrigerant control means and first pressure 2 pressure control means) - liquid separation means) -23-