TWI310086B - Mold-pressed testing apparatus adapted for electronic elements of testing area - Google Patents

Mold-pressed testing apparatus adapted for electronic elements of testing area Download PDF

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Publication number
TWI310086B
TWI310086B TW95137956A TW95137956A TWI310086B TW I310086 B TWI310086 B TW I310086B TW 95137956 A TW95137956 A TW 95137956A TW 95137956 A TW95137956 A TW 95137956A TW I310086 B TWI310086 B TW I310086B
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Taiwan
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test
tester
electronic component
test area
molded
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TW95137956A
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Chinese (zh)
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TW200817685A (en
Inventor
Rung-Yu Huang
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Hon Tech Inc
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Publication of TWI310086B publication Critical patent/TWI310086B/en

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  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Description

1310086 九、發明說明: 【發明所屬之技術領域】 本發明係提供-種以上、下合模方式,使_更加平整壓抵 電子兀件執行顧«,以有效提制試品#之測試區 電子元件測試器。 、 【先前技術】 在現今’電子元件於生產過程中係歷經多道加 i確保品質,於電子元件製作完錢,均會進行職健,Ξί 2電路U_mtedCirCuit ’簡稱j C )之電性測試=為例積 4 I C係具有眾多接腳,各接腳依設計而使〗^ 同、電 作,後,即會進行電性峨,以檢測! W製作過= 疋否遭受損壞’進而檢測出不良品。 中 請參閱第1、2、3圖,其係為台灣專利申請第 『I C檢測裝置(二)』專利案,該檢測裝置包含有測 ι 第;二二取料機構2 〇、3 0及入、出料機構4 〇二:二 ’該測試台上◦之兩侧設有第一、二取料機構2 〇、3^ 料機構均設有相互組裝之橫移結構及升降 ,取 螺桿22、32由馬達23、33驅動,:以向 34 1及綱座2 4 2、3 4 2之滑動件2::= 4上、 且螺合於橫向滑執21、31及橫向螺桿2 2 f ’係滑置 面設有縱向滑座2 4 3、3 4 3,而升降結_^_ 面具下麟嘴25 1、35 1之取料器25、π" '且底 滑軌2 5 2、3 5 2,以滑置於滑動件2 $ 有縱向 有一橫向滑座2 5 3、3 5 3,以滑置於fg;尸2面設 向滑軌26 1、36 1上,而升降結構並於 ^橫 另面設有二縱向滑座2 6 2、3 6 2及,套^ 6 3 ^之 1310086 上,而縱向螺j旱=縱向滑執2 7、3 7及縱向螺桿2 8、3 8 橫移結構之馬^ 8由一馬達2 9、3 9驅動’進而當各 滑動件2 4、u心3 3驅動橫向螺桿2 2、3 2時,即帶動 3 5之橫心丨m3 4 2、3 4 2及取料器2 5、 及支架b3、353,於機架之横向滑軌21、31 移,而當各升降!6 1、3 6 1上作X方向往復位 時,即帶動之=2 9、3 9驅動縱向螺桿2 8、3 8 2 5、3 5之縱向6 2、2 6 2及取料器 、3 7及滑動件L L5 2 3 5 2 ’於機架之縱向滑執27 台i 2人料機構4 ◦及出料機構5 0係分別設於測試 以有一具载台4 1、5 1之載台結構,用 Ϊ r i…及一具有吸嘴4 2、5 2之取放結構,用以取放 上,以ϊίΠϋΐ吸嘴4 2係將待測1 C放置於載台4 1 第一取料機構2 〇之取料器2 5下方,該 ==機構2 〇令取料器2 5之吸嘴1310086 IX. Description of the invention: [Technical field to which the invention pertains] The present invention provides a method for more than one type and a lower mold clamping method, so that the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Component tester. [Prior Art] In today's electronic components, the quality of the electronic components in the production process has been multi-channeled to ensure the quality, in the production of electronic components, the health will be carried out, Ξί 2 circuit U_mtedCirCuit 'abbreviated as j C) electrical test = For example, the IC 4 series has a large number of pins, and each pin is designed to make the same, electric, and then, the electrical 峨 will be performed to detect! W was made = 疋 No damage was detected' and the defective product was detected. Please refer to Figures 1, 2 and 3, which is the patent application of the IC application "IC detection device (2)". The detection device includes the measurement unit. The second and second reclaiming mechanism 2 〇, 30 and , the discharge mechanism 4 〇 2: 2 'the test bench on both sides of the first and second reclaiming mechanism 2 〇, 3 ^ material mechanism are equipped with a mutual assembly of the traverse structure and lifting, take the screw 22, 32 is driven by the motors 23, 33: on the slides 2::= 4 of the 34 1 and the brackets 2 4 2, 3 4 2, and screwed to the transverse slides 21, 31 and the transverse screw 2 2 f ' The sliding surface is provided with longitudinal sliding seats 2 4 3, 3 4 3, and the lifting knot _^_ masks the lower mouth 25 1 , 35 1 of the reclaimer 25, π " 'and the bottom slide 2 5 2, 3 5 2, to slide on the sliding member 2 $ has a horizontal slide 2 5 3, 3 5 3 in the longitudinal direction to slide on the fg; the body 2 is set on the slide rails 26 1 , 36 1 , and the lifting structure is ^The other side of the horizontal surface is provided with two longitudinal slides 2 6 2, 3 6 2 and , set ^ 6 3 ^ on 1310086, while the longitudinal screw j is dry = longitudinal slip 2 7 , 3 7 and longitudinal screw 2 8 , 3 8 The traverse structure of the horse 8 is driven by a motor 2 9, 3 9 'and then when each slider 2 4 , u 3 3 When driving the transverse screw 2 2, 3 2, the horizontal cross-section 丨m3 4 2, 3 4 2 and the reclaimer 2 5, and the brackets b3, 353 are driven to move on the lateral slide rails 21, 31 of the frame. And when the lifting and lowering! 6 1 , 3 6 1 is in the X direction reciprocating position, that is, driving = 2 9 , 3 9 driving the longitudinal screw 2 8 , 3 8 2 5 , 3 5 longitudinal 6 2 , 2 6 2 and Reclaimer, 3 7 and slide L L5 2 3 5 2 'slide in the longitudinal direction of the frame 27 sets i 2 human body mechanism 4 出 and discharge mechanism 5 0 are respectively set in the test to have a loading table 4 1 , 5 1 carrier structure, with Ϊ ri... and a pick-and-place structure with nozzles 4 2, 5 2 for picking up and placing, to ΠϋΐίΠϋΐ nozzle 4 2 system to be placed on the stage 4 1 The first reclaiming mechanism 2 is below the reclaimer 2 5 , the == mechanism 2 is the nozzle of the reclaimer 2 5

並置入於測試台1 〇中,且 丄上及取i L =式台1 0之接點確實接觸’以進行: ,另-待測I C至測試台i 〇之側方時 =, 取料器3 5作X方向位移,令取料以。j一取科機構3 0之 台4 1上吸取料、m Γ a:料3 5位於入料機構4 〇之載 丄上及取待則C ’虽第-取料機構2 〇之 J,:帶動取料器2 5橫向位移至出料機 :^ : 方,並令取料器2 5下降將1C放置於载上^ 時,第二取料機構3 〇之取料器3 5作又口 、出,在同 器3 5上位移,將取料 I c ’使〗c之接腳與職台丨 時下壓 作業,Μ 1觀m η τ 賴確實接觸,以進行測試 乍業“一取機構3 OUC作測試時,該第—取料機構 1310086 料II 2 5即励位移作動,_:欠於 口 41上吸附又一待測j c,當饿構4 0之载 將測試完之I C放置於出料機構:;之0之取料器3 5 取料機構2 0即可將待測ϊ c置二二:=送出時’第- 藉由第-、二取料機構2 〇 依序迅】 進饤測試’而 業。 U依序迅速载送IC進行測試作 由於取料器2 5、3 5之各下壓吸嘴? R ^ Q c ^ I C之下壓力會直接影響測 、3 5 1壓抵 3 5 i必須保持在相同的壓吸嘴2 5 i、 架置於測試台i ◦之兩側,其3«,的型態 之I c,可能產生較差之水平声,3 5 1壓抵待測 壓I C,進而影響測試品質。*而/去確保以相同之下壓力下 續有人遂以其多年從事相關行業的研發轉作 壓件更加平整壓抵電子元件“ t i m方式,使 【發明内容】 質此即為本發明之設計宗旨。 器,供區之顚式電,測試 機構,其中,該模^測試器係4上具;模f式測試器及移料 構可將供料板;測試座’進而該移料機 測試器即控制壓件配合導移敏=銘測试^測試座中’該 模壓式測試器係料載具處;藉此,該 卜口杈方式,令壓件保持較佳之水平度以 7 1310086 平整壓抵電子元件,使電子- 、 均财接觸,以精禮執行測試座相對應之各接腳與接點 益。 、4作業,達到提升測試品質之實用效 本發明之目的二,該模壓式 π 供置入電子元件,並以上、14态可設置複數個測試座,以 度壓抵各電子元剌步執行式,令壓件保持較佳之水平 之下壓力,祕_條件下=各電子元件可獲致相同 效益。 選订別5式’達到提升測試品質之實用 【實施方式】 為使貴審查委員對本發明作 實施例並配合圖式,詳述如后聊更進—步之瞭解’鱗一較佳 »月參閱苐4圖’本發明配署於丨4、丄 麵包括有供料機構6 用時,該測試分 輸出端輸送機構9 〇及收料機構賴區8 0、 將供料機構6 Q上酬試之電子 輸送機構7 〇係 載具8 1,測試區8 〇收料H 區⑽内之供料 測試結果由輸出端輪送機構子元件,則依據 。 爾糾ϋ輸运錄料機構1 Q Q分類放置 器8 3 ^位^本=明之測試區8 0包括有模壓式測試 料載具8/^^^二:82==器85;該供 之=件,試器8以上收 座8 3 2,並於壓件8 3工麵 =麼件W 1及承 8 3 1平穩升降位移,本實 =補,祕件 導孔導柱組係於壓件8 3 1 、導孔導柱組,該 座8 3 2頂1古並於* 彈黃833之導柱8 3 2 1,該導以 1310086 ,孔8 311套置,另該壓件8 3 8 3 1 2,而頂面則設有壓桿8 μ -係凸設有壓抵部 動源驅動而帶動刪3 ,,桿8 3 1 3可由驅 元件,而承座8 3=有3 i 2壓抵 二:8 3 4,_跑8 3 4係用 ^=板5之 動式第-移料器84係用以移 =以電子7L件,而擺 id ? 3之測試座8 3 4中以執ί*;勒4之 =8 5則係將測試座8 3 4中之完測電子 凊參閱第7圖,於測試區8 〇勃杆、、目丨卜+ 之電子元件u 〇SS^:8=入f 移^ 8 4係於供料载具8 !處取出待 1上’弟― 轉位移將待測電子元件1 1 0移載至^^二1 ^,並旋 子元件11Q置人於測試座8 3二^f 3處’且將待測電 器8 3 ’並復位至供料载具8丄處;請皋:退出= ^ 8 3之測試座8 3 4已置人待測之電子3 f 3 ’於, 器8 3即以驅動源驅動壓桿8 3工3 =,δ亥測试 壓件8 3 1係以導孔8 3工!沿承座8 3 1 子S上使=3 Ux壓抵部8 312胸二電 8 3 4之接點確S ;====中執 之f柱8 3 21位移’而可受限於導柱8 3 2工,並不 斜情況〗使壓件8 31可獲得較佳之水平度,進而以堡抵^ 8 312平整壓抵各電子元件工丄〇,使各電子元件丄 ^ Α Ϊ?"11 8 3之驅動源即驅動壓桿 8 3 1 3及>1件8 3 1反向作動,令屋件8 3丄以導孔8 3工丄 沿導柱8 3 21平穩位移復位,而脫離電子元件丄丄〇,以供取 !310086 青參閱第]_ ◦圖,於完成測試作業後,該 則試器8 3處’而取出顺3 4中== ί ^同日夺,由於輸入端輸送機構已將待檢測之電子ίί ϊ 待測之電子树111;請參^巧圖ΐ 8 5取出完測之電子元件χ工〇後,該:於 LJ:反向旋轉將電子元件1 1 0移载至收料载具㈡ 上完測之電子元件11 =ί ϊ輸送至收料機構分類放置,同時,該第-移料以 ,並隨即反向旋轉退出=以= 件1已將待檢測之電子元 載且8 iti料载81該第—移料器8 4則可於供料 S81上取出下-待測之電子元件1 1 2,進而依 間之第三移料。i f 3二供料載具8 1、收料載具8 2三者 :料載具1 2則供承置,And placed in the test stand 1 ,, and the contact point on the 及 and i l = the table 10 does contact 'to:: 、, the IC to be tested to the side of the test bench i = =, reclaim The device 3 5 is displaced in the X direction, so that the material is taken. j 一取科机构3 0台4 1上上取取,m Γ a:料3 5 is located on the loading mechanism of the feeding mechanism 4及 and takes the C' although the first - reclaiming mechanism 2 〇J,: Drive the retractor 2 5 laterally to the discharge machine: ^ : square, and let the reclaimer 2 5 descend and place 1C on the loading ^, the second reclaiming mechanism 3 取 the reclaimer 3 5 as a re-mouth And out, shifting on the same device 3 5, will take the material I c 'make the pin of the 〗 〖c and press the job when the job is Μ, Μ 1 view m η τ Lai really contact, to test the industry When the mechanism 3 OUC is tested, the first-recovery mechanism 1310086 material II 2 5 is the excitation displacement actuation, _: the lower end of the mouth 41 is adsorbed another jc to be tested, and when the hungry 40 load is placed, the tested IC is placed. For the discharge mechanism:; 0 of the reclaimer 3 5 Reclaiming mechanism 2 0 can be set to be tested ϊ c 2: = when sent out - the first - and second reclaiming mechanism 2 〇 迅】Into the test] and the industry. U quickly carry the IC for testing because of the suction nozzle of the reclaimer 2 5, 3 5 ? 1 pressed against 3 5 i must be kept in the same pressure nozzle 2 5 i, frame On both sides of the test bench i ,, its 3«, the type I c, may produce a poor horizontal sound, 3 5 1 pressure against the pressure measurement IC, which affects the test quality. * and / to ensure the same Under the pressure, there are people who have been engaged in the research and development of related industries for many years and turned into pressure parts to flatten the electronic components. The tim method makes the quality of the invention. , the test unit of the supply area, wherein the mold tester system 4; the mold f type tester and the material transfer structure can supply the feed plate; the test seat 'and the loader tester Control pressure fitting with guide shift sensitivity = Ming test ^ test seat 'the molded tester system material carrier; thereby, the way of the mouth, so that the pressure piece maintains a good level to 7 1310086 flat pressure Electronic components, so that the electronic -, the financial contact, with the fine test of the corresponding test pin and the contact benefits. And 4 work, to achieve the practical effect of improving the test quality. The second purpose of the invention is that the molded type π is placed in the electronic component, and the plurality of test seats can be set in the above 14 states, and the voltage is pressed against each electronic element. To keep the pressure parts under a good level of pressure, under the condition _ conditions = the same benefits can be obtained for each electronic component. Selecting the 5th type to achieve the purpose of improving the quality of the test [Embodiment] In order to enable the review board to make an embodiment of the present invention and cooperate with the drawing, the details of the following is a step-by-step understanding.苐4图 'When the invention is deployed in 丨4, when the surface includes the feeding mechanism 6, the test is divided into the delivery mechanism 9 〇 and the receiving mechanism lag area 80, and the feeding mechanism 6 Q is rewarded The electronic transport mechanism 7 〇 series vehicle 8 1, test area 8 供 receiving material H area (10) feeding test results from the output end of the mechanism sub-component, then based. Erzheng transport and recording organization 1 QQ classification placer 8 3 ^ position ^ Ben = Ming test area 8 0 including molded test material carrier 8 / ^ ^ ^ two: 82 = = 85; Piece, the tester 8 above the seat 8 3 2, and the pressure piece 8 3 work surface = the piece W 1 and the bearing 8 3 1 smooth lifting displacement, the real = complement, the secret guide hole guide column group is pressed 8 3 1 , Guide hole guide column group, the base 8 3 2 top 1 ancient and the * bullet yellow 833 guide column 8 3 2 1, the guide is 1310086, the hole 8 311 is placed, and the pressure piece 8 3 8 3 1 2, while the top surface is provided with a pressure bar 8 μ - is convexly provided with a pressing part driven by a moving source to drive 3, the rod 8 3 1 3 can be driven by the component, and the socket 8 3 = 3 i 2 Pressing two: 8 3 4, _ running 8 3 4 using ^ = plate 5 of the moving type - the shifter 84 is used to move = 7L pieces of electrons, and the test seat 8 3 4 of the id ? 3 In order to carry out ί*; Le 4 = 8 5, the test electronics in the test socket 8 3 4 凊 refer to Figure 7, in the test area 8 〇勃杆, 目丨卜 + electronic components u 〇 SS^ :8=入f shift^ 8 4 is attached to the feeding carrier 8 ! Take out the 1 'different' - the displacement shifts the electronic component 1 1 0 to be tested to ^^2 1 ^, and the spinner element 11Q is placed For testing 8 3 2 ^ f 3 'and the electrical equipment to be tested 8 3 ' and reset to the feeding vehicle 8 ;; please 皋: exit = ^ 8 3 test seat 8 3 4 has been placed electronic to be tested 3 f 3 ',, 8 3 is driven by the drive source 8 3 3, δ hai test press 8 3 1 is guided by the hole 8 3! Along the seat 8 3 1 sub-S, make =3 Ux pressure to the 8 312 chest 2 electric 8 3 4 joints S; ==== middle of the f column 8 3 21 displacement 'can be limited by the guide column 8 3 2 work, not inclined situation〗 The pressure piece 8 31 can obtain a better level, and then the bucking of the 8 312 flat pressure against the various electronic components, so that the electronic components 丄 ^ Α & & & & & & & & & & & & & & & & & 11 8 3 drive source is the drive pressure rod 8 3 1 3 and > 1 piece 8 3 1 reverse action, so that the roof 8 3 丄 with the guide hole 8 3 work 丄 along the guide post 8 3 21 smooth displacement reset, and Remove from the electronic component 丄丄〇, for the supply! 310086 青 Refer to the first _ ◦ map, after the completion of the test operation, the tester 8 3 ' and take out 顺 3 4 == ί ^ the same day, due to the input The transport mechanism has set the electronic ίί 待 to be tested to the electronic tree 111 to be tested. Please refer to 巧 巧 5 5 5 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 取出 于 于 于 于 于 于 于 于 于 于 于 于 于Transfer to the receiving vehicle (2) The finished electronic component 11 = ί ϊ is transported to the receiving mechanism for sorting, and at the same time, the first moving material is, and then reversely rotated to exit = to = 1 is already to be detected The electronic component and 8 iti feed 81 - The feeder 8 4 can take out the lower-to-be-tested electronic component 1 1 2 on the supply S81, and then move the third material. i f 3 two-feed carrier 8 1 , receiving vehicle 8 2 three: material carrier 1 2 for mounting,

3 3ΐΙίίΠ|:!5^ ^ 3 1;:L 組,而用哺助帶紐件8 3 Ί 導孔雜組或線性滑軌 10 1 3 i i位置設有四件1 3 1各導孔 8 3 2 1可供壓件8 3 導3 2 1,該導柱 之底面係凸設有愿抵部8 !310086 ^壓桿8 3 1 3可由驅祕驅動而帶動壓件心 •=抵部8 3 i 2壓抵待測之電子树,m3,降位移」 ^連結測試板8 3 5之測試座8 3 4, j上則配设 76 iS電:ίΓ而第三移料器8 6係;動二驅動 料臂862f於S:=:;=62A、第:移 Z動第一移料臂8 6 2 A、第二移料J = 8 6 2 D,俾 8 6, 2 C、第四移料臂8 6 2 D旋轉作^ 弟三移料臂 、測=8 3及收料載具8 2間移载供:载具8 i 睛參閱第1 4圖,於測讀電子疋件。 輪送機構可將待測電件^ 作業時’該輪入端 =器8 6係以二載具8 !上,而 枓臂8 6 2 A、第二移料臂8 6干=1作動’以帶動第一移 刺將待測電子元件11 ◦移由供料 2子兀件11 Q置人於測試座8 3 ^ 8 3處’並將待 ί = B則位於供料載具8 ^ 5^時該第二 器8 6之驅動源係驅試座8 3 4中後, 、第;6 2A、第二移料臂8 6 2B 旋轉,以帶動第3 3ΐΙίίΠ|:!5^ ^ 3 1;:L group, with feeding belts 8 3 Ί Guide hole group or linear slide 10 1 3 ii position with four pieces 1 3 1 each guide hole 8 3 2 1 Available pressure piece 8 3 Guide 3 2 1, the bottom surface of the guide post is convexly provided with the wishing part 8 !310086 ^The pressure bar 8 3 1 3 can be driven by the drive to drive the press piece heart•=Abutment part 8 3 i 2 is pressed against the electronic tree to be tested, m3, drop displacement" ^ test test board 8 3 5 test seat 8 3 4, j is equipped with 76 iS electricity: Γ 第三 and the third shifter 8 6 system; The two driving material arms 862f are at S:=:;=62A, the first: shift Z moves the first moving arm 8 6 2 A, the second moving material J = 8 6 2 D, 俾8 6, 2 C, the fourth shift The arm 8 6 2 D rotates for the third shift arm, the test = 8 3 and the receiving carrier 8 2 transfer: the carrier 8 i see the picture in Figure 14 for reading the electronic components. The wheeling mechanism can operate the electric component to be tested ^ the wheel end = 8 6 is connected to the second carrier 8 !, while the arm 8 6 2 A and the second moving arm 8 6 dry = 1 To drive the first transfer, the electronic component 11 to be tested is moved by the feed 2 sub-assembly 11 Q to be placed at the test stand 8 3 ^ 8 3 'and the ί = B is located at the supply carrier 8 ^ 5 ^ When the driving source of the second device 86 is driven in the locomotive 8 3 4, the second; the second moving arm 8 6 2B is rotated to drive the

山弟四移料臂8 6 2D同步反向作叙、第二移料臂8 6 2 C ί測3 ’而位移至等待ί置二二:移料臂8 6 2a退 供料端輸送觸已將待檢挪之電·Ϊ= ί f f挪試作 8 6亦可採取不同移料作黑:^:料’然本發明之第 =3 ’使測試器8 3之盖件8 ?,座8〒4中,毋須“測 2A上之電子元件11 1直接壓抵第一移料臂 1 7圖’於測試器8 3之測試座8 待=第工6、 4匕置入待測之電子元件 1310086 j1〇後,該測試器8 3即以驅動源驅動壓桿8 313及壓件 ’該壓件8 3 1係以導孔8 3 1 1沿承座8 3 2 部位移’並下壓彈菁8 3 3 ’使壓件8 3 1以壓抵 之接腳血㈣jf子70件1 1 〇之獅上’使電子元件1 1 0 測接點確實接觸,而令電子元件11 〇於 p q f f 3 4中執仃測試作業,由於產件8 31係利用導孔 3 G Ί2之_8 3 2 1位移,而可受限於各_ 平ί i而ίΐΐίί偏斜情況’使壓件8 31可獲得較佳之水 3元=318 312平整雜各電子元件11 〇,使各 掌,以提升,同之下壓力’而於相同條件下進行測試作 精確度’於測試作業完畢後,該測試器8 3之驅 =;,8 3 1 3及刪3 i反向作動,二= 1 1 0,以ϋί導^、位移復位,而脫離電子元件 業完畢後,第三移料』8 轉桿執行測試作 8 6 2Α、第二移料臂8 6 2 ::工移J臂 測試器8 3中,以取出完測之奸^ f Π ^ A旋轉至 f 6 2 B則位於供料載具8工上以取 I t移料臂 U 1 ;請參閱第1 9圖,於第一移:臂8 件 子元件110後,該第三移料器8 6 凡測之電 f料臂8 6 2 A、第二移料臂8 6 2 B ;=、:帶動第-弟四移料臂8 6 2D同步旋轉作動 8 6 2 C、 測之電子元件1 1 〇移載至收料 ^移㈣8 6 2 A將完 完测之電子元件1 i⑽依據檢二而收料载具8 2上 收料麵分敝置,輸㈣輪送機構輸送至 元件1 1 1移載至測試器8“'=#862 3係將待測電子 請參閱第2〇、21圖3!4==行測試作業。 構之配置圖,該測試區8 〇包含有模4:以㈡: 12 I3_86 2^=:23四移料器:7’該第四移料器8 7上 元件,而測試,祿料載具8 1絲置待測之電子 2,並於有上、下配合之壓件8 3 1及承座8 3 為—導孔導3 2間設有一導移組,該導移組可 升降位移,本發=^:二用導=^動=8 3 i平穩 _件8 3 1上開設有四個柱=導孔導柱組係 相對應壓件8 3丄各導 並^承座8 3 2頂面 導柱8巧===冗 而承座8 3 2上則/己」ΐί ί:!” 1 2壓抵待測之電子元件, 試座8 3 4係用測試板8 3 5,該測 一直立式或横式之環狀於、1 件Μ第四移料器8 7係可為 言,其可橫向穿越於測狀輪送機構而 且由驅動源驅動作橫Λ 垄件8 31及承座8 3 2間, 子元件。動私向直進式移載供料載具8 1及其上之待測電 輸送=行測試作業時,該輸入端 二供料载具8 1 B,而將承t具8 1 A及第 具8 1 A由供料位置橫向移-供料載 8 3 2間,該測試器8 3之;;3 1及承座 110,令電子元件7 1 n ^8 31即壓抵待測之電子元件 而執行測試健,料评^與峨座8 3 4之接點相接觸 元件H 已將下—待檢測之電子 2 3圖,於測試器8 3執行:試J以:待『;請參閱第 將承載完測電子元件i i Ω 乍業70畢後,第四移料器8 7即 千丄ίο之第-供料載具81Α横向移載出測 ί3ι〇〇86 :=於出料位1,而第—供料载具8 1Α上完测之電 分_^ 13依據檢挪結果由輸出端輪送機構輸送至收料機構 測試作業品質③: JJ升 品及珊公開,從而允符發日_帽要件,爰依法= 【圖式簡單說明】 專 第1圖:係為台灣專利申請第9311〇783號『Ic檢測裝置 利案之配置示意圖。 專 第2圖.係為台灣專利申請第931順3號『IC檢測裝 利案第一取料機構之示意圖。 ·)』專 第4圖 第5圖 第6圖 第7圖 第8圖 苐9圖 第3圖·係為台灣專利申請第931 i〇783號『ic檢測裝置 利案第二取料機構之示意圖。 本發明配置於測試分類機之配置示意圖。 本發明配置於測試區之架構圖。 本發明模壓式測試器之示意圖。 本發明測試電子元件之動作示意圖(一)。 本發明測試電子元件之動作示意圖(二)。 二^β,本發明測試電子元件之動作示意圖(三)。 ,1 0圖·本發彻j試電子元件之動作示賴(四)。 =1 1圖:本發明測試電子元件之動作示意圖(五)。 j12圖:本發明另一實施例之架構圖。 ^1,:本發明另—實施例模壓式測試器之示意圖。 G二$明另一實施例測試電子元件之動作示 L 3: t,另一實施例測試電子元件之動作示意圖-。 $16圖.本發明另一實施例測試電子元件之動作示旁二)。 弟17圖:本發明另—實施例測試電子^件之動作示“(ς“ 14 1310086 第18圖:本發明另一實施例測試電子元 第i 9圖:本發明另-實施例測試圖(五)。 第2 0圖:本發明又—實施例之架構^件之動作示意圖(六)。 Ϊ ^ 明又—ΐ施例模壓式測試11之示意®。 第2 3圖:本發明又一實施例測試電示 【主要元件符號說明】 動作不思圖(二)。 習式部份: 10:測試台 2 0 :第一取料機構 21:橫向滑執 2 2 :橫向螺桿 2 4 :滑動件 2 4 1 :螺套 2 4 2 :橫向滑座 2 5 :取料器 2 5 1·下壓吸^嘴 2 5 2 :縱向滑執 2 6 :支架 2 61 :橫向滑執 2 6 2 :縱向滑座 2 7 :縱向滑軌 2 8 :縱向螺桿 3 0 .第一取料機構 31:橫向滑軌 3 2 :橫向螺桿 3 4 .滑動件 3 41 :螺套 3 4 2 .橫向滑座 3 5 :取料器 3 51 :下屋吸嘴 3 5 2 :縱向滑軌 3 6 :支架 3 61 .橫向滑軌 3 6 2 :縱向滑座 3 7 ·縱向滑幸九 3 8 :縱向螺桿 4 0 :入料機構 4 1 :載台 5 0 ·出料機構 5 1 :載台 2 3 ·馬達 2 4: 3 ·縱向滑座 2 5 3 .橫向滑座 2 6 3 :螺套 2 9 :馬達 3 3 :馬達 3 4 3 .縱向滑座 3 5 3 :橫向滑座 3 6 3 :螺套 3 9 ·馬達 4 2 :吸嘴 5 2 :吸嘴 15 1310086 本發明部份: 6 0 :供料機構 8 0 .檢測區 81:供料載具 82 8 3 :測試器 8 3 8 31 1 :導孔 8 3 8 313 :壓桿 8 3 8 3 2 1 :導柱 8 3 8 3 4 :測試座 8 3 8 4 :第一移料器 8 5 8 6 :第三移料器 8 6 8 6 2A :第一移料臂 8 6 2 B :第二移料臂 8 6 2 C :第三移料臂 8 6 2D :第四移料臂 8 7 :第四移料器 8 1 81B:第二供料載具 9 0 :輸出端輸送機構 10 0 :收料機構 110:電子元件 112:電子元件 7 0 :輸入端輸送機構 :收料載具 1 :壓件 12:壓抵部 2 :承座 3 :彈簧 5 :電路板 :第二移料器 1 :轉桿 A:第一供料載具 111:電子元件 16The younger brother of the four shifting arm 8 6 2D synchronous reverse reversal, the second transfer arm 8 6 2 C ί test 3 'and the displacement to wait ί 2 2: the transfer arm 8 6 2a return feed end delivery touch Move the power to be detected, Ϊ= ί ff, try to make 8 6 or use different materials for blacking: ^: material 'the third part of the invention = 3' to make the tester 8 3 cover 8?, seat 8〒 4, it is not necessary to "measure that the electronic component 11 1 on 2A is directly pressed against the first transfer arm 1 7 diagram" in the test socket of the tester 8 3 to be = the sixth work, 4, 4 into the electronic component 1310086 to be tested After j1〇, the tester 8 3 drives the pressing rod 8 313 with the driving source and the pressing member 'the pressing piece 8 3 1 is displaced along the bearing hole 8 3 2 by the guiding hole 8 3 1 1 ' and presses the elastic 8 3 3 'Let the pressure piece 8 3 1 to press the pin blood (4) jf 70 pieces 1 1 〇 lion's 'The electronic component 1 1 0 test contact is indeed contact, and the electronic component 11 〇 pqff 3 4 In the test operation, because the production part 8 31 is displaced by _8 3 2 1 of the guide hole 3 G Ί 2, it can be limited by the _ ί i i ΐΐ 而 ' ' ' ' ' ' ' ' ' ' ' ' Water 3 yuan = 318 312 flat and various electronic components 11 〇, so that each palm, to mention , under the same pressure 'and test under the same conditions for accuracy' after the test operation is completed, the tester 8 3 drive =;, 8 3 1 3 and delete 3 i reverse action, two = 1 1 0 After the electronic component industry is completed, the third transfer material 8 tester performs the test for 8 6 2Α, the second transfer arm 8 6 2 :: the work shift J arm tester 8 3 In the process of taking out the test, ^ f Π ^ A is rotated to f 6 2 B, which is located on the feeding carrier 8 to take the I t moving arm U 1 ; see Figure 19, in the first shift: After the arm 8 element 110, the third feeder 8 6 measures the electric f arm 8 6 2 A, the second moving arm 8 6 2 B; =, : drives the first-fourth shifting arm 8 6 2D synchronous rotation 8 6 2 C, measured electronic components 1 1 〇 transferred to receiving ^ shift (four) 8 6 2 A will complete the measurement of the electronic components 1 i (10) according to the second inspection and receive the carrier 8 2 on the receipt The surface is divided, the input (4) is sent to the component 1 1 1 and transferred to the tester 8 "' = #862 3 is the electronic to be tested, please refer to the second, 21, Figure 3! 4 == line test operation. Configuration diagram, the test area 8 〇 contains modulo 4: (2): 12 I3_86 2^=: 23 four shifters: 7' the fourth shifter 8 7 upper components, and test, Lu material carrier 8 1 wire is placed on the electronic 2 to be tested, and the pressing member 8 3 1 and the bearing 8 3 having the upper and lower sides are provided with a guiding group between the guiding hole guides 32, and the guiding group can be moved up and down. The hair =^: two guides = ^ move = 8 3 i steady _ pieces 8 3 1 open with four columns = guide hole guide column group corresponding pressure parts 8 3 丄 each guide and ^ bearing 8 3 2 Top guide column 8 === redundant and seated 8 3 2 on / has "ΐί ί:!" 1 2 pressed against the electronic component to be tested, test stand 8 3 4 with test board 8 3 5, the Measure the vertical or horizontal ring shape, and the one piece of the fourth type of shifter 8 7 can be said to be transversely traversed by the measuring wheel transfer mechanism and driven by the driving source as the transverse ridge member 8 31 and 8 3 2 sockets, sub-components, mobile private direct-transfer loading carrier 8 1 and the electrical transmission to be tested = line test operation, the input two feeding vehicle 8 1 B, and The bearing 8 1 A and the 8 1 A are laterally moved from the feeding position - the feeding load 8 3 2, the tester 8 3;; 3 1 and 110, the electronic component 7 1 n ^ 8 31 is pressed against the electronic component to be tested to perform the test, and the contact with the contact point of the shackle 8 3 4 contacts the component H has been down - the electron to be detected 2 3 Figure, executed in the tester 8 3: test J to: "to be"; please refer to the first will carry the electronic component ii Ω after 70 years of completion, the fourth feeder 8 7 is the first - supply With 81 Α lateral transfer test ί3ι〇〇86 := at the discharge level 1, and the first - supply carrier 8 1 Α on the measured electrical score _ ^ 13 according to the detection results from the output end of the delivery mechanism to the collection Material testing test quality 3: JJ Shengpin and Shan open, so that the delivery date _ cap requirements, 爰 law = [schematic description] Special 1: Taiwan patent application No. 9311〇783 "Ic detection Schematic diagram of the configuration of the device. The second picture is the Taiwan Patent Application No. 931 Shun No. 3 "schematic diagram of the first reclaiming mechanism for IC testing and loading. ·) "Special 4th Figure 5th Figure 6" 7Fig. 8苐9Fig. 3Fig. is a schematic diagram of the second reclaiming mechanism of the ic detection device in Taiwan Patent Application No. 931 i〇783. The invention is configured in the measurement Schematic diagram of the configuration of the tester. The schematic diagram of the invention is arranged in the test area. The schematic diagram of the molded tester of the present invention. The schematic diagram of the operation of the test electronic component of the present invention (1). 2^β, the schematic diagram of the operation of the test electronic component of the present invention (3). 10Fig. The action of the test electronic component of the present invention (4) =1 1 picture: the action diagram of the test electronic component of the present invention ( Fives). Figure j12 is an architectural diagram of another embodiment of the present invention. ^1,: A schematic view of another embodiment of the present invention. G 2 shows the action of the electronic component in another embodiment. L 3: t, another embodiment tests the action of the electronic component. $16. Another embodiment of the present invention detects the action of the electronic component. Figure 17: The operation of the test electronic component of the present invention is further described as "(" 14 1310086 Figure 18: Test embodiment of another embodiment of the present invention. Figure 9: Test image of another embodiment of the present invention ( V) Fig. 20: Schematic diagram of the operation of the structure of the present invention - (6) Ϊ ^ 明又—ΐ ΐ 示意 示意 示意 示意 。 。 。 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第Example test electric indication [main component symbol description] Action is not considered (2). Part of the formula: 10: Test bench 2 0: First reclaim mechanism 21: Lateral slipper 2 2: Transverse screw 2 4: Sliding Piece 2 4 1 : Screw sleeve 2 4 2 : Lateral slide 2 5 : Reclaimer 2 5 1· Lower pressure suction nozzle 2 5 2 : Longitudinal slip 2 6 : Bracket 2 61 : Lateral slip 2 6 2 : Longitudinal slide 2 7 : Longitudinal slide 2 8 : Longitudinal screw 3 0 . First take-up mechanism 31 : Horizontal slide 3 2 : Lateral screw 3 4 . Slide 3 41 : Screw sleeve 3 4 2 . 5: Reclaimer 3 51: Lower house suction nozzle 3 5 2 : Longitudinal slide rail 3 6 : Bracket 3 61. Lateral slide rail 3 6 2 : Longitudinal slide 3 7 · Longitudinal slide slippery 9 3 8 : Longitudinal screw 4 0 : into Material mechanism 4 1 : Stage 5 0 · Discharge mechanism 5 1 : Stage 2 3 · Motor 2 4: 3 · Longitudinal slide 2 5 3 . Horizontal slide 2 6 3 : Screw sleeve 2 9 : Motor 3 3 : Motor 3 4 3 . Longitudinal slide 3 5 3 : Lateral slide 3 6 3 : Screw sleeve 3 9 · Motor 4 2 : Nozzle 5 2 : Nozzle 15 1310086 Part of the invention: 6 0 : Feeding mechanism 8 0 Detection zone 81: Feeding carrier 82 8 3 : Tester 8 3 8 31 1 : Guide hole 8 3 8 313 : Pressure bar 8 3 8 3 2 1 : Guide post 8 3 8 3 4 : Test stand 8 3 8 4: First shifter 8 5 8 6 : Third shifter 8 6 8 6 2A : First transfer arm 8 6 2 B : Second transfer arm 8 6 2 C : Third transfer arm 8 6 2D: fourth transfer arm 8 7 : fourth feeder 8 1 81B: second supply carrier 90: output delivery mechanism 10 0: receiving mechanism 110: electronic component 112: electronic component 7 0: input End conveying mechanism: receiving vehicle 1 : pressing member 12 : pressing portion 2 : bearing 3 : spring 5 : circuit board: second shifting device 1: rotating rod A: first feeding carrier 111: electronic components 16

Claims (1)

1310086 竹年丨丨月,Ι/R修⑵ί·:..本 十、申請專利範圍: — 1 ·一種測試區之模壓式電子元件測試器,該測試區包含: 模壓式測试器.係設有上、下配合之壓件及承座,並於壓件 與承座間設有相互配合之導移組,另該壓件 係由驅動源驅動作升降位移,而承座則配設 有至少一連結於測試板之測試座; 供料載具:係用以承置待測之電子元件; 收料載具:係用以承置完測之電子元件;1310086 竹年丨丨月,Ι/R修(2)ί·:..10, the scope of application patent: — 1 · A molded electronic component tester in the test area, the test area includes: Molded tester. There is a pressing member and a bearing seat which are matched with the upper and lower sides, and a guiding and guiding group is arranged between the pressing member and the bearing seat, and the pressing member is driven by the driving source for lifting and lowering, and the bearing seat is provided with at least one Test stand connected to the test board; supply vehicle: used to mount the electronic components to be tested; receiving vehicle: used to hold the tested electronic components; 擺動式第一移料器:係於供料載具及測試器間移載待測電子 元件; 擺動式第二移料器:係於測試器及收料載具間移載完測 元件。 2 ·巧申請專纖圍第1項所述之測試區之觀式電子树測試 器,其中,該測試器之導移組係為一導孔導柱組, ===&設註彡'-私,胁驗购縣 位·置δ又有暮孔。 4 3 ·依申料纖圍第2項所叙測試區之模駐電托件 器,更包含於測試器承座之導柱上套置彈簧。 、 • ΐ申ΐί概’ 1顿述之峨區之模壓式電子元件測試 5 =古1,該測試器壓件之底面係凸設有壓抵部,而頂面則 s又有一由驅動源驅動之壓桿。 6 m利_第!項所述之測試區之模壓式電子 器,其中,該測試器之導移組係為一線性滑軌組。 •二巧試區之觀式電子元伽mil,制試區包含: 吴聖式測試器:係設有上、下配合之壓件及承座,並於壓件 與承座間設有相互配合之導移組,另該壓件 係由驅動源驅動作升降位移,而承座則配設 有至少一連結於測試板之測試座; 仏料载具:係用以承置待測之電子元件; 17 1310086 收料载具:係用以承置完測之電子元件; 7 旋轉式移料器··係於供料载具、測試器及收料载具間移载 待/完測電子元件。 '、 • 利翻第6項所述之測試區之模麼式電子元件測試 ^ ’其中’該測試器之導移組係為—導孔導柱組,該導孔^ 8 9 ^申=利朗第7項所述之測舰之模壓式電子元件測試 ,更已含於測試器承座之導柱上套置彈簧。 、 Hi利範圍第6項所述之測試區之模壓式電子元件測試 二有壓件之底面係凸設有壓抵部’而頂面則 否又有一由驅動源驅動之壓桿。 、j 申圍第6項所述之測試區之模壓式電子元件測 1 了二中,該測試器之導移組係為一線性滑執組。 ★式二ΐί利?圍第6項所述之測試區之模壓式電子元件測 轉“ 器係設有一由驅動源驅動之轉桿,並於 ?轉衣:又有複數個移料臂,用以移载待/完測電子元件。 測,試區之模壓式電子元件測試器,該測試區包含: 果式測試器:係設有上、下配合之壓件及承座,並於壓件 與承座間設有相互配合之導移組,另該壓件 係由驅動源驅動作升降位移,而承座則配設 供%目〆有至少一連結於測試板之測試座; 又 /、枓载具.係用以承置待測之電子元件; ^料载具:承置制之電子元件; 祿輸送,構式移料器:係橫向貫穿測試器,並配設有至少 元=料載具,以直進式移载供料載具及其上之電子 3測ϊί請i:範圍第12項所述之測試區之模壓式電子元件 、以器,其中,該測試器之導移組係為—導孔導柱組,該導 18 1310086 孔導柱組係於承座上設有至少一導柱’並於壓件相對應承座 導柱位置設有導孔。 4.依申請專利範圍第13項所述之測試區之模壓式電子元件 測试器,更包含於測試器承座之導柱上套置彈簧。 5測晴第12項所述之測試區之模壓式電子元件 面則§又有一由驅動源驅動之壓桿。 貝 6測2睛f項ΐ述之測試區之模壓式電子元件The oscillating first shifter is for transferring the electronic component to be tested between the feeding carrier and the tester; and the oscillating second shifting device is for transferring the measuring component between the tester and the receiving carrier. 2·Apply for the observational electronic tree tester of the test area mentioned in item 1 of the special fiber, wherein the guide group of the tester is a guide hole guide group, ===& - Private, threatening to purchase the county level · Set δ and have pupils. 4 3 · According to the model of the test area in the second section of the project, it is included in the test column of the tester socket. • ΐ ΐ 概 概 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 The pressure bar. 6 m profit _ the first! The molded electronic device of the test zone of the item, wherein the pilot set of the tester is a linear slide set. • The view type electronic gamma of the dexterity test area includes: Wu Sheng type tester: it is equipped with upper and lower pressing parts and sockets, and has a mutual cooperation between the pressing parts and the bearing seat. a guiding group, wherein the pressing member is driven by a driving source for lifting displacement, and the bearing seat is provided with at least one test seat coupled to the test board; the material carrier is for holding the electronic component to be tested; 17 1310086 Receiving Vehicle: It is used to carry out the electronic components that have been tested. 7 Rotary Feeder·············································································· ', • The model of the test area of the test area described in item 6 is tested ^ 'where the guide set of the tester is the guide hole guide set, the guide hole ^ 8 9 ^ Shen = Lilang The molded electronic component test of the test ship described in item 7 is further included in the guide post of the tester socket. The molded electronic component of the test zone described in item 6 of the Hi-li range is provided with a pressing portion on the bottom surface of the pressing member and a pressing bar driven by the driving source on the top surface. j. In the test area of the test area mentioned in item 6 of the second paragraph, the test group is a linear slip group. ★式二ΐί利? The molded electronic component measuring and measuring device of the test area mentioned in item 6 is provided with a rotating rod driven by a driving source, and is turned around: there are a plurality of moving arms for transferring/waiting/finishing Measuring electronic components. Testing, the molded electronic component tester of the test area, the test area comprises: a fruit type tester: a press member and a seat with upper and lower joints, and a mutual joint between the press member and the socket In conjunction with the guiding group, the pressing member is driven by the driving source for lifting and lowering, and the bearing is provided with at least one test seat for connecting to the test board; and/or the carrier is used for The electronic components to be tested are placed; ^Materials: electronic components for mounting; Lu transport, construction type shifter: transversely through the tester, and equipped with at least yuan = material carrier for straight-moving The load-carrying carrier and the electronic measuring device on the same, please i: the molded electronic component of the test zone described in the scope of item 12, wherein the guiding group of the testing device is a guiding pillar Group, the guide 13 1310086 hole guide column group is provided with at least one guide post on the bearing seat and is corresponding to the bearing member of the pressing member The position is provided with a guide hole. 4. The molded electronic component tester of the test zone according to the application scope of claim 13 is further included on the guide post of the tester socket. The molded electronic component surface of the test area has a pressure bar driven by a driving source. The molded electronic component of the test area described in the item 依申請專利範圍第丄^> ,、、且係為一線性滑軌組 測試器,其中,誃援壯^項所述之測試區之模壓式電子元件 送機構。 狀輪送機構式移料器係為直立式環狀輸 8依申晴專利範園第1 D = 測試器,其中,社ΙΒ2, 2項所述之測試區 7 機構 其中,該環狀 模壓式電子元件 輸送 二二”丨則試區之模壓式電子 剧送機構式轉H係為橫式環狀According to the scope of the patent application, 线性^>, and is a linear slide group tester, wherein the molded electronic component feeding mechanism of the test zone described in the above is supported. The wheel-type mechanism type shifter is an upright type ring-shaped 8 according to the Shenqing Patent Fan Park No. 1 D = tester, wherein, in the test area 7 of the 2, 2 items, the ring-molded type Electronic components are transported in the second and second 丨 丨 test area of the molded electronic drama system to the H system is a horizontal ring 1919
TW95137956A 2006-10-14 2006-10-14 Mold-pressed testing apparatus adapted for electronic elements of testing area TWI310086B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103487606A (en) * 2013-10-08 2014-01-01 上海新世纪机器人有限公司 Test fixture for wireless receiver board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575644B (en) * 2015-12-18 2017-03-21 Hon Tech Inc Electronic device moving mechanism and its application equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103487606A (en) * 2013-10-08 2014-01-01 上海新世纪机器人有限公司 Test fixture for wireless receiver board

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