1304760 九、發明說明： 【發明所屬之技術領域】 :發明，有關一種吸附裝置，尤其是指一種利用具有 附固定，以防止工件丄程中工件可以被吸 .. 產生之作用力而導致偏 私之一種負壓真空吸附褒置及使用該裝置之磨邊裝置。 【先前技術】 不論是在半導體製程或者是面板後段製程 =:疋重要的-個階段。在加工的製財，如何能夠固 ’使得製程得以順利進行，在目前之技術中係透過 真工吸附的方式達到固定工件的目的。 然而在這些習用技術中，如中華 089205317所揭露之一稀曰只观府勒古 玉寻才彳甲明號 種曰曰片研磨墊真空定位裝置之結構 良’如圖-Α所示’該圖係為習用具有真空吸附裝置之 ^乍台俯視示意圖。其中在該承載台1G上可承載待研磨之 :片在°亥承載台10上具有複數個溝槽12，在溝槽12之 =界中心具有—負觀u。透過該負壓孔U提供之， ^旱該複數個溝槽12亦具有負壓之吸力。透過前述之方 式’達到增加真空錢吸力之面積，以提供 利加工。 Λ u 又如中華民國專利申請號〇882〇6373所揭露之—種 孔機之結構’其所利用之工作台亦具有真空吸附之夺士置， 該真空吸附裝置係與前述中華民國新型專利申、浐 089205317所揭露之技術相同，在此不做贅述。 ； l3〇4760 綜合上述之技術，哕办 功效，然而在加工之過：：工吸附之裝置雖然具有吸附之 定的問題。因為，前述=還是會有工件與工作台貼合穩 吸附裝置，其係與=技術屬於溝式以及硬質式之 度較差之工件。因此，：接觸面積有限，且無法適用平坦 受較大與瞬間之加lH"：工時二該真空吸力並無法承 工件所造成之變形而使彳及7止加工過程卜 枝 :而使仔真空吸附失效之問題。 μ 所示，該圖係為習用直*吸附… 工件示意圖。在該實施例中，研磨刀？ f ::附，付 行測邊研磨，工件15 、一 17對於工件π進 凹槽16係藉由真空管路^f載台13上，承載台上之 磨過程中，刀呈n針 ’、負壓吸力。不過由於在研 形。由於凹槽造成作用力使得工件15變 形而提供吸力此並無法隨著工件15變 之誤差盥龜f破合易 過程令產生幾何尺寸 u 破片之問題。除此之外，習用之、 貝式吸附裝置在受損之後工 體更換，更增加了成本的支出设再使用，所以必須整 用之::亟需-種負壓真空吸附裝置來解決習 【發明内容】 用节==t要目的是提供-種負壓真空吸附裝置及使 附^磨邊裝置，其係利用具有撓性之軟質吸盤以吸 衝擊二Γ達到增加負壓真空吸附力與抵抗加工作用力 ^04760 本發明之次要目的是提供一種 用該裝置之磨邊裝置，利用具有換性之於Γ及附裝置及使 件，透過撓性吸盤之軟質吸面盘=吸盤以吸附工 固定工件，達到避免加工件進而 何尺寸誤差以及工件龜裂之目的。纟用力而產生加工幾 本發明之另-目的，係透以挽性吸 吸盤’達到提高《使料命以及降低成本之^更式 為了達到上述之目的，本發明提供一種負壓直 衣置’包括：一吸盤座以及至少一般：复 内部開設有至少-負壓管路，該吸盤座上更開設;2 凹子衫讀部，其係設置於該凹孔上，該吸盤部 係以-管路與該隸管路相連通，該管路° 性吸盤。 ^ ^ 較佳的是，該吸盤座上更具有複數個開孔，該複 開孔係與垓至少一負壓管路相連通。 較佳的是，該吸盤座上更具有複數個溝槽與該複數 開孔相連通。 車父佳的是，該吸盤部係設置於該吸盤座之中心位置。 較佳的是，該吸盤部係設置於該吸盤座之邊緣位置。 為了達到上述之目的，本發明更提供一種負壓真空吸 附裝置，其係設置於一研磨裝置上以吸附一工件，使該工 件可以穩定進行研磨製程，該負壓真空吸附裝置，包括. 一吸盤座以及至少一吸盤部。該吸盤座，其係用以承载該 工件’ 5亥吸盤座内部開設有至少一負廢管路，該吸盤座上 !304760 更開設有至少-凹孔。該至少—讀部，其係設置於該凹 孔上，該吸盤部係以-管路與該貞壓管路相連通，該管路 外圍設置有一撓性吸盤。 較佳的是，該吸盤部係設置於該吸盤座之中心位置以 及設置於該吸盤座之邊緣位置。 為：達到上述目的，本發明更提供一種負壓真空吸附 衣置、、係设置於一研磨裝置上以吸附一工件，使該工件 可以穩^進行研磨製程，該負壓真空吸附裝置，包括.一 矩形吸盤座，其係用以承載該工件，該吸盤座内 f少一負壓管路，該吸盤座上更開設有複數個凹孔；2 稷數個吸盤部’其係分別設置於該複數個凹孔上，該吸般 :係以路與㈣壓管路相連通，該管路外圍設置有Γ 撓性吸盤。 $ 為：,:!上述之目的，本發明更提供一種磨邊裝置， L :, ί少一第—軸向驅動部，其係設置於該座 至少-第二軸向_1-以;二向：運動; _ 八你°又置於该弟一軸向驅動部 上’ β弟—軸向驅動部可提佴— ，部，其係設置於該二:動一動: ::進::磨二第;抽向驅動部’其係設置於該座體之 一菊」轴動部可提供—第三軸向之線性運動； :二係設置於該第三袖向驅動部上且可進行-旋 升降運動，該載台部更包括有·· 承，亥工件，該吸盤座之内部開設有至少一紐路係J 及』上更開設有至少—凹孔；以及至少一吸盤部，其係 ^ 1304760 管路與該負壓管路相連 设置於該凹孔上，該吸盤部係以— 通，該管路外園設置有一撓性吸盤 【實施方式】 更谁ί:沾貴審查委員能對本發明之特徵、目的及功能有 更進-y的認知與瞭解，下文特將本 及設計的理念原由進行說明，以使= 以了解本發明之特點，詳細說明陳述如下： 、 凊芩閱圖二所示，該圖係為本發明之 置：實施例示意圖。該負壓真空吸附裝置、包二= 一以及至少―吸盤部22。該吸盤錢，其内部開設有 乂 一負壓官路201，該吸盤座2〇上更開設有至少一凹孔 21。該至少一吸盤部22，其係設置於該凹孔2ι上， 盤部22係以-管路221與該負壓管路2〇1相 ⑵外圍設置有-撓性吸盤220，例如：軟性材質之吸吕般路 由於該管4 221與該負壓管路2〇1相連通，因此該吸^部 22具有真空吸附之能力。一但工件放置於該吸盤座別上， 該撓性吸盤220可與該工件緊密吸附，達到固定工件之目 的。該吸盤部22之設置位置，可以視需要而定，較佳的是， 遠吸盤部22可以設置於吸盤座2〇之中心或者是吸般座2〇 之周圍。 i β凊芩閱圖三Α以及圖三Β所示，該圖係為本發明之負 壓真空裝置之另一較佳實施例示意圖。在本實施例中，該 吸盤座3係設置於一加工裝置上，用以固定待加工之工 件，§亥加工裝置可以為一研磨機台、切割機台等但不在此 1304760 5一 "f工件可以是晶圓或者是玻璃基板，但不在此限。如 3^0以及t 4負壓真空吸附裝置3包括有—矩形吸盤座 =以及稷數個吸盤部33。該吸盤座3Μ系用以承載該工件， §亥吸盤座30内邱ρ”π·古z；, . 般邱Μ夕牡 有少一負壓管路（圖中未示）。該吸 」寸徵係與前述之圖二相@，在此不作贅述。 奸庄to本貫施财，該複數個吸㈣3 3係設置於該矩形吸 =二之四個角落。除此之外，也可以如圖三B所示在 :庄3〇H座30之中心位置設置至少一吸盤部33。該吸 Γ32 孔&以及複數個溝槽31。該開 效。為愿管路相連接’以提供辅助之負壓吸附功 1 32相：、广：負壓:及附之面積’利用該溝槽31與該開 I，虽負壓官路之提供負壓時，該開孔32之直1304760 IX. Description of the invention: [Technical field to which the invention pertains]: The invention relates to an adsorption device, in particular to a method of using an attachment to prevent the workpiece from being sucked by the workpiece during the process of the workpiece. A vacuum vacuum adsorption device and an edging device using the same. [Prior Art] Whether it is in the semiconductor process or the back-end process of the panel =: 疋 important - one stage. In the process of making money, how can it be solidified to make the process go smoothly. In the current technology, the purpose of fixing the workpiece is achieved by means of real-life adsorption. However, in these conventional techniques, such as the one disclosed in Zhonghua 089205317, the structure of the vacuum positioning device of the polishing pad of the shovel is only good as shown in Figure Α. It is a schematic view of a conventional table with a vacuum adsorption device. Wherein the carrier 1G can carry the to-be-polished: the sheet has a plurality of grooves 12 on the stage 10 and a negative view at the center of the groove 12. Provided through the negative pressure hole U, the plurality of grooves 12 also have a suction force of a negative pressure. Through the above-mentioned method, the area of increasing vacuum suction can be increased to provide advantageous processing. Λ u Another example is the structure of the hole machine disclosed in the Republic of China Patent Application No. 〇882〇6373. The workbench used by it also has the vacuum adsorption of the 士士, the vacuum adsorption device and the aforementioned new patent application of the Republic of China. The technology disclosed in 浐 089205317 is the same and will not be described here. ; l3〇4760 Combine the above techniques to achieve efficiency, but in the process of processing:: The device for adsorption has the problem of adsorption. Because the above = there will still be a workpiece and the workbench attached to the stable adsorption device, which is the same as the = technology is a ditch type and a hard type of workpiece. Therefore, the contact area is limited, and it is not applicable to the flatness of the larger and the moment of the addition of lH": the second vacuum of the vacuum can not bear the deformation caused by the workpiece, so that the processing and the process of the process: The problem of adsorption failure. As shown by μ, this figure is a schematic diagram of the workpiece used in the conventional direct* adsorption... In this embodiment, the grinding knife? f: Attachment, paying for edge grinding, workpieces 15, 17 for the workpiece π into the groove 16 by the vacuum line ^f on the stage 13, during the grinding process on the stage, the knife is n needle ', negative Pressure suction. However, due to research. Due to the force exerted by the groove, the workpiece 15 is deformed to provide suction. This does not cause the error of the workpiece 15 to be broken. In addition, the conventional and shell-type adsorption devices are replaced after the damage, and the cost is increased. Therefore, it must be used in the following ways:: Need a vacuum suction device to solve the problem SUMMARY OF THE INVENTION The purpose of the section ==t is to provide a vacuum suctioning device and an edging device, which utilizes a flexible soft suction cup to absorb the impact enthalpy to increase the vacuum suction force and resistance. Processing Force ^04760 A secondary object of the present invention is to provide an edging device using the device, using a flexible suction plate with a flexible suction cup for the squeezing device and the splicing device The workpiece is fixed to avoid the problem of the workpiece and the size of the workpiece and the crack of the workpiece.纟 纟 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽 挽a suction cup holder and at least generally: the inner part is provided with at least a negative pressure line, and the suction cup base is further opened; 2 a concave shirt reading part is disposed on the concave hole, and the suction cup part is connected with a pipeline It is connected with the pipeline, which is a suction cup. Preferably, the suction cup holder further has a plurality of openings, the reaming holes being in communication with at least one negative pressure line of the crucible. Preferably, the suction cup holder further has a plurality of grooves communicating with the plurality of openings. It is preferred by the father of the vehicle that the suction cup is disposed at the center of the suction cup. Preferably, the suction cup portion is disposed at an edge position of the suction cup holder. In order to achieve the above object, the present invention further provides a vacuum suction device for vacuum suction, which is disposed on a polishing device to adsorb a workpiece, so that the workpiece can stably perform a grinding process, and the vacuum suction device includes: a suction cup a seat and at least one suction cup. The suction cup holder is configured to carry the workpiece. The interior of the suction cup holder is provided with at least one negative waste pipeline, and the suction tray holder is further provided with at least a concave hole. The at least-reading portion is disposed on the recess, and the chuck portion is connected to the rolling line by a pipe, and a flexible suction cup is disposed around the pipe. Preferably, the suction cup portion is disposed at a center position of the suction cup holder and at an edge position of the suction cup holder. In order to achieve the above object, the present invention further provides a vacuum suction coating device, which is disposed on a polishing device to adsorb a workpiece, so that the workpiece can be stably subjected to a grinding process, and the vacuum vacuum adsorption device comprises: a rectangular suction cup holder for carrying the workpiece, wherein the suction cup holder has a negative pressure pipeline, and the suction cup holder is further provided with a plurality of concave holes; 2 a plurality of suction cup portions are respectively disposed on the suction cup holder On a plurality of recessed holes, the suction is connected to the (four) pressure pipeline by means of a road, and a flexible suction cup is arranged around the pipeline. $为为:,:! For the above purpose, the present invention further provides an edging device, L:, ί, a first-axial driving portion, which is disposed at at least the second axial direction _1- To: exercise; _ 八 八 ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° The second driving unit is provided in the one of the seat body. The shafting portion can provide a linear motion of the third axial direction; the second system is disposed on the third sleeve driving portion and can be carried out - The hoisting and lowering movement further comprises: a holing workpiece, the inside of the suction cup holder is provided with at least one ridge system J and at least one recessed hole is provided, and at least one suction cup portion is ^ 1304760 The pipeline is connected to the negative pressure pipeline and is disposed on the concave hole. The suction cup is connected to the outside, and the outer casing of the pipeline is provided with a flexible suction cup. [Embodiment] More: The inspection committee can The characteristics, purpose and function of the company have a more in- y recognition and understanding. The following is a description of the original idea of the design and the original design, so that = to understand this Ming characteristics detailed description set forth below: As shown in Figure II chill baicalensis read, the system of the present invention FIG set: a schematic diagram of embodiment. The vacuum suction device, the package 2 = one, and at least the "sucker portion 22". The suction cup has a negative pressure official road 201 inside, and at least one concave hole 21 is further opened on the suction cup base 2 . The at least one suction cup portion 22 is disposed on the recessed hole 2, and the disk portion 22 is provided with a flexible suction cup 220, such as a soft material, by a pipe 221 and a periphery of the negative pressure pipe 2〇1 (2). The suction-like route is connected to the negative pressure line 2〇1 in the tube 4221, so that the suction portion 22 has the capability of vacuum adsorption. Once the workpiece is placed on the suction cup holder, the flexible suction cup 220 can be closely attracted to the workpiece to achieve the purpose of fixing the workpiece. The position of the suction cup portion 22 can be determined as needed. Preferably, the distal suction cup portion 22 can be disposed at the center of the suction cup holder 2 or around the suction holder 2'. This figure is a schematic view of another preferred embodiment of the vacuum chamber of the present invention as shown in Figure 3 and Figure 3B. In this embodiment, the chuck holder 3 is disposed on a processing device for fixing the workpiece to be processed, and the processing device can be a grinding machine, a cutting machine, etc., but not in the 1304760 5"f The workpiece can be a wafer or a glass substrate, but not limited to this. For example, the 3^0 and t4 vacuum suction devices 3 include a rectangular suction cup holder and a plurality of suction cup portions 33. The suction cup holder 3 is used to carry the workpiece, and the inside of the suction cup holder 30 is qi π · ancient z;, . Qiu Yu Xi Yu has a negative pressure pipeline (not shown). The levy is in phase with the above-mentioned figure II, and will not be described here. The sinister to the perennial wealth, the multiple suction (four) 3 3 series is set in the rectangular suction = two corners. In addition to this, as shown in Fig. 3B, at least one suction cup portion 33 may be provided at a center position of the H-seat 30. The suction 32 holes & and a plurality of grooves 31. It works. In order to connect the pipelines to provide auxiliary vacuum suction work 1 32 phase: wide: negative pressure: and the attached area 'utilize the groove 31 and the open I, although the negative pressure provides negative pressure The opening 32 is straight
;;咖過_工件相作用，以增加真空吸S 社奋請參閱圖四A以及圖四β所示’該圖係為本發明之較 二二：動作不意圖。在本實施例中係將該負壓真空吸附 於研磨機台上來作動作說明，在本實施例 = 放置於吸盤座3。上。如圖四Α所示，當研磨 朗基板6之侧邊進行研磨的日核，研磨^ 5會產生作用力pi、π太兮* + 刀丹 .. π ^ 在忒破螭基板6之側邊，此時玻璃 ==該作用力以，而會產生變勸曲。如】 技=中之吸盤，因為破璃基板與習用技術之吸盤 為變形編而產生加工上尺失，：該玻：基板可能因 題。但是在本發明之實施例中，' i龜裂等問 ψ 由於该撓性吸盤330為軟 1304760 性材質，因此可藉由負壓管路301提供真空吸力藉由管路 331之傳遞與作用於該玻璃基板6上，使該換性吸盤挪 與該玻璃基板6緊密吸附，進而產生向下之拉力維持玻璃 基板、6於定位，如圖四8所示，使得加工過程順利進行， 而解決習用技術所造成之問題。 請參閱圖五所示，該圖係為本發明之磨邊装置之較佳 貫施例不意圖。該磨邊裝置8包括有一龍門座體8〇，在龍 門座體80之下方開口處設置有一第三軸向驅動部81，該 第三軸向驅動部81可進行—2方向之線性位移運動。在^ =三軸向驅動部81上之滑座811上設置有一旋轉升降: 方向旋轉與升降運動。該旋轉升降部812 又置有一載台85，載台85上承載有待加工之工件，在 本貫施利中’該卫件為裂片後玻璃基板6 如前述圖三八以及圖三B所述之結構，在此不構 動部別設置有-對第-軸向驅 …女及對弟-軸向驅動部83。該第一軸向驅動部 、係匕括有一驅動馬達娜，-滑座821以及-對第一軌 座821係套設於該對第一軌道822上，該驅 第'\ / 透過傳動件’如螺桿帶動該滑座821於該 軌這822上進行Χ方向之線性位移運動。 83係勺括右订一之線性位移運動，該第二軸向驅動部 鈾有 滑軌纽830以及一滑座83卜該驅動滑 ‘ 3 = 馬達 '螺桿以及轨道之組合。在 口又有研磨部84。該研磨部84包括有一驅 1304760 動馬達840、一轉軸841以及一研磨刀具842。該驅動馬達 840可透過傳動件，如：皮帶，帶動該轉軸gw轉動。該 轉轴841之前端連接有研磨刀具842。 該第一軸向驅動部82可以控制該研磨刀具842之進 、’、δ而忒第一軸向驅動部83可透過γ方向之線性位移運動 以進行更換研磨刀具842。在研磨過程中，本發明提供之 載台部85可以提供真空吸附力給該工件，以固定工件。由 於5亥載台部85上之吸盤為軟性具有撓性之吸盤，因此可以 對該工件作氣密性之吸附，防止因為研磨過程中，刀具對 工件推移而導致工件加工過程中幾何尺寸之誤差與龜裂破 片的不良情況產生。 唯以上所述者，僅為本發明之較佳實施例，當不能以 之限制本％明範圍。即大凡依本發明申請專利範圍所做之 句等义化及修飾，仍將不失本發明之要義所在，故都應視 為本表月的進一步貫施狀況。例如前述雖以矩形吸盤座來 進订α兄明’但是其他形狀，如：圓形等之吸盤座也可以利 用本發明之精神來應用。 本發明提供之負壓真空吸附裝置，其係具有增加負壓 真工吸附挾持力與抵抗加工作用力之衝擊以及防止加工中 件產生U ’又形之優點。此外，盤面加工便宜並可以提供 吸盤座之使用壽命。因此^以滿足業界之需求，進而提高 f產業之競爭力’誠已符合發明專利法所規定申請發明所 需具備之要件，故爰依法呈提發明專利之申請，謹請貴 審查委員允撥時間惠予審視，並賜準專利為禱。 、 1304760 【圖式簡單說明】 圖A係為習用具有真空吸附裝置之工作台俯視示意圖。 圖β係為習用真空吸附裝置吸附工件示意圖。 之負屢真空吸附裝置較佳實施例示意圖。 β係為本發明之負壓真空裝置之另一較佳 # Α以及圖四Β係為本發;; _ over the workpiece phase to increase the vacuum suction S. Please refer to Figure 4A and Figure 4 β. This figure is the second of the present invention: action is not intended. In the present embodiment, the vacuum is adsorbed on the grinding machine table for the operation description, and in the present embodiment, it is placed on the suction cup holder 3. on. As shown in Fig. 4B, when the side of the slab is polished, the grinding nucleus will produce a force pi, π too 兮* + 刀丹.. π ^ on the side of the ruthenium substrate 6 At this time, the glass == the force is applied, and the change is made. For example, the suction cup in the technology = because the glass substrate and the suction cup of the conventional technology are deformed by the processing, and the processing is lost. The glass: the substrate may be a problem. However, in the embodiment of the present invention, the 'i cracking and the like is because the flexible suction cup 330 is made of a soft material 1304760, so that the vacuum suction can be provided by the negative pressure line 301 through the transmission and action of the line 331. On the glass substrate 6, the flexible suction cup is moved to the glass substrate 6 to be closely adsorbed, thereby generating a downward pulling force to maintain the glass substrate and the positioning of the glass substrate, as shown in FIG. 4, so that the processing progresses smoothly, and the application is solved. Problems caused by technology. Referring to Figure 5, this figure is not intended to be a preferred embodiment of the edging apparatus of the present invention. The edging device 8 includes a gantry body 8 〇. A third axial driving portion 81 is disposed at a lower opening of the gantry body 80. The third axial driving portion 81 can perform a linear displacement movement in the -2 direction. A rotary lift is provided on the slide 811 on the ^=three-axis drive portion 81: a direction rotation and a lifting movement. The rotating lifting portion 812 is further provided with a loading table 85 on which the workpiece to be processed is carried. In the present embodiment, the glass substrate 6 is formed as shown in the above-mentioned FIG. 38 and FIG. In the structure, the non-mechanical part is provided with a pair of first-axis drive and a female-to-shaft drive unit 83. The first axial driving portion, the system includes a driving motor, a slider 821, and a first rail seat 821 is sleeved on the pair of first rails 822, the drive '\ / transmission transmission member' The slider 821 drives the slider 821 to perform a linear displacement motion in the x-direction on the rail 822. The 83 series scoop includes a linear displacement motion of the right one, and the second axial drive portion uranium has a combination of the slide rail 830 and a slide 83, the drive slide ‘3 = motor' screw and the track. There is a grinding portion 84 at the mouth. The grinding portion 84 includes a drive 1304760 motor 840, a shaft 841, and a grinding tool 842. The drive motor 840 can drive the rotating shaft gw to rotate through a transmission member such as a belt. A grinding tool 842 is attached to the front end of the rotating shaft 841. The first axial driving portion 82 can control the advancement of the grinding tool 842, δ, and the linear displacement movement of the first axial driving portion 83 through the γ direction to perform the replacement of the grinding tool 842. During the grinding process, the stage portion 85 provided by the present invention can provide a vacuum suction force to the workpiece to fix the workpiece. Since the suction cup on the 5th stage platform 85 is a flexible and flexible suction cup, the workpiece can be airtightly adsorbed, and the geometrical error during the processing of the workpiece during the grinding process can be prevented. Bad conditions with cracked fragments. The above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is to say, the equivalents and modifications of the sentences made in accordance with the scope of the patent application of the present invention will remain without losing the essence of the present invention, and therefore should be regarded as further implementation status of the present month. For example, although the above-mentioned rectangular suction cup holder is used to order the α brother's but other shapes, such as a circular or the like, can also be applied by the spirit of the present invention. The vacuum vacuum adsorption device provided by the present invention has the advantages of increasing the negative pressure and the resistance to the processing force and preventing the U ′ from being formed in the processing medium. In addition, the disk surface processing is inexpensive and provides the life of the suction cup holder. Therefore, to meet the needs of the industry, and to improve the competitiveness of the f industry, 'Sen has met the requirements for applying for inventions as stipulated by the invention patent law. Therefore, the application for invention patents is submitted according to law. Please ask the review committee to allow time. I will review it and give the patent a prayer. 1304760 [Simple description of the drawing] Figure A is a schematic plan view of a workbench with a vacuum adsorption device. Figure β is a schematic diagram of a workpiece adsorbed by a conventional vacuum adsorption device. A schematic diagram of a preferred embodiment of the negative vacuum adsorption device. β is another preferred vacuum vacuum device of the present invention.
圖五係為本發明之磨邊裝置較佳;作示意圖 【主要元件符號說明】 10 -承載台 11 -負壓孔 12- 溝槽 13- 承載台Figure 5 is a preferred embodiment of the edging device of the present invention; schematic diagram of the main components: 10 - carrier 11 - negative pressure hole 12 - groove 13 - carrier
圖二係為本發明 圖三Α以及圖三 實施例示意圖。 14- 真空管路 15- 工件 16- 凹槽 17- 刀具 2〜負壓真空吸附裝置 20-吸盤座 201 一負壓管路 21 -凹孔 22-吸盤部 1304760 220- 撓性吸盤 221- 管路 3-負壓真空吸附裝置 30- 吸盤座 301- 負壓管路 302- 凹孔 31- 溝槽 32- 開孔 33- 吸盤部 330- 撓性吸盤 331- 管路 5-研磨刀具 6 -玻璃基板 FI、F2-作用力 8-磨邊裝置 80- 龍門座體 81- 第三軸向驅動部 810-第三執道 811 -滑座 812-旋轉升降部 82- 第一軸向驅動部 820-驅動馬達 8 21 -滑座 1304760 822-第一軌道 83- 第二轴向驅動部 830-驅動滑軌組 8 31 -滑座 84- 研磨部 840- 驅動馬達 841- 轉轴 842- 研磨刀具 85- 載台Figure 2 is a schematic view of an embodiment of the present invention and Figure 3 of the present invention. 14- Vacuum line 15--Workpiece 16- Groove 17- Tool 2~ Negative pressure vacuum adsorption unit 20-Sucker holder 201 A negative pressure line 21 - Recessed hole 22 - Suction cup part 1304760 220- Flexible suction cup 221 - Line 3 - Negative pressure vacuum adsorption device 30 - Suction cup holder 301 - Negative pressure line 302 - Recessed hole 31 - Groove 32 - Opening 33 - Suction cup part 330 - Flexible suction cup 331 - Line 5 - Grinding tool 6 - Glass substrate FI , F2-force 8-edge grinding device 80-gantry body 81-third axial driving portion 810-third lane 811-slider 812-rotating lifting portion 82-first axial driving portion 820-driving motor 8 21 - Slider 1304760 822 - First rail 83 - Second axial drive 830 - Drive rail set 8 31 - Slide 84 - Grinding section 840 - Drive motor 841 - Shaft 842 - Grinding tool 85 - Stage