TWI302080B - - Google Patents

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Publication number
TWI302080B
TWI302080B TW094134841A TW94134841A TWI302080B TW I302080 B TWI302080 B TW I302080B TW 094134841 A TW094134841 A TW 094134841A TW 94134841 A TW94134841 A TW 94134841A TW I302080 B TWI302080 B TW I302080B
Authority
TW
Taiwan
Prior art keywords
layer
conductor layer
substrate
film
laminated
Prior art date
Application number
TW094134841A
Other languages
English (en)
Chinese (zh)
Other versions
TW200631483A (en
Inventor
Katsuhiko Takahashi
Koji Tsurusaki
Noriyuki Michiba
Hirotoshi Tanino
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200631483A publication Critical patent/TW200631483A/zh
Application granted granted Critical
Publication of TWI302080B publication Critical patent/TWI302080B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW094134841A 2004-10-28 2005-10-05 Printed wiring board and manufacturing method thereof TW200631483A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004313814A JP2006128360A (ja) 2004-10-28 2004-10-28 プリント配線板およびその製造方法

Publications (2)

Publication Number Publication Date
TW200631483A TW200631483A (en) 2006-09-01
TWI302080B true TWI302080B (ja) 2008-10-11

Family

ID=36722754

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134841A TW200631483A (en) 2004-10-28 2005-10-05 Printed wiring board and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP2006128360A (ja)
KR (1) KR100742679B1 (ja)
CN (1) CN1767720A (ja)
TW (1) TW200631483A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526179B2 (en) 2014-03-06 2016-12-20 Mutual-Tek Industries Co., Ltd. Printed circuit board and method thereof

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100754080B1 (ko) 2006-07-13 2007-08-31 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
KR100771310B1 (ko) 2006-08-22 2007-10-29 삼성전기주식회사 리지드-플렉서블 인쇄회로기판 및 그 제조방법
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
US7982135B2 (en) 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
CN101658081B (zh) 2008-03-10 2012-05-30 揖斐电株式会社 挠性线路板及其制造方法
JP2010232585A (ja) * 2009-03-30 2010-10-14 Toppan Printing Co Ltd 多層配線基板およびその製造方法
JP2011082317A (ja) * 2009-10-07 2011-04-21 Sumitomo Electric Printed Circuit Inc フレキシブルプリント配線板及びこれを備える電子機器
CN103327738B (zh) * 2012-03-22 2016-03-09 富葵精密组件(深圳)有限公司 软硬结合电路板及其制作方法
CN104602448B (zh) * 2013-10-30 2017-11-03 鹏鼎控股(深圳)股份有限公司 可挠式电路板及其制作方法
JP5913401B2 (ja) * 2014-02-26 2016-04-27 レノボ・シンガポール・プライベート・リミテッド 引出構造、キーボードユニット及び携帯用情報機器
CN105592638B (zh) * 2014-10-20 2018-10-30 鹏鼎控股(深圳)股份有限公司 刚挠结合板及其制作方法
TWI713420B (zh) * 2019-04-01 2020-12-11 新揚科技股份有限公司 電路板結構

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2841996B2 (ja) * 1992-01-13 1998-12-24 日立化成工業株式会社 リジッドフレックス配線板の製造方法
JPH0750455A (ja) * 1993-08-06 1995-02-21 Mitsui Toatsu Chem Inc リジッドフレックスプリント配線板およびその製造方法
JPH07193370A (ja) * 1993-12-25 1995-07-28 Ibiden Co Ltd フレックスリジッドプリント基板及びその製造方法
JPH0955562A (ja) * 1995-08-11 1997-02-25 Cmk Corp プリント配線板
US6350387B2 (en) 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9526179B2 (en) 2014-03-06 2016-12-20 Mutual-Tek Industries Co., Ltd. Printed circuit board and method thereof

Also Published As

Publication number Publication date
CN1767720A (zh) 2006-05-03
TW200631483A (en) 2006-09-01
KR100742679B1 (ko) 2007-07-25
KR20060052260A (ko) 2006-05-19
JP2006128360A (ja) 2006-05-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees