1301572 柒、指定代表圖： (一） 本案指定代表圖為··第（3 )圖。 (二) 本代表圖之元件代表符號簡單說明： 11·熱導管（heatpipe) 12·散熱片（fms) 13 ·導熱塊（copper/ aluminum block ) 14·冷卻水喷頭（spray nozzles ) - 15·風扇（co〇Hng fan) • 16·冷卻室（cooling chamber ) 17·冷卻水循環系統（cooling water circulation system ) 17-1 冷卻水泵（waterpump) 17-2 冷卻水進水管（cooling water inlet) 17-3 冷卻水槽（watertank) 17-4排水口（drain) 19·氣液分離器（gas-iiqUid separator) 2〇·多孔板（perforated plate ) 拥、本案若有化學式時，請揭示最能顯示發明特徵的化學式： 玖、發明說明： 【發明所屬之技術領域】 本發明係利用喷霧水膜熱傳係數（Spray film- transfer c〇efflcient)遠高於空氣對流之熱傳係數（heattransferc〇efficient)的原 理’以改善傳統個人電腦(PC)、筆記型電腦（姻）之中央微處理器(cpu) 散熱模組的散熱效率，可以提高散熱效率達百分之三十上恭 中央微處理器運算時產生的大量熱能得以迅速排除速度，因此可=改 善電腦中央微處理器因運算速度日益增快所產生的散熱問題。 4 1301572 【先前技射ί】1301572 柒, designated representative map: (1) The representative representative of the case is the picture of (3). (2) The symbol of the representative figure of this representative figure is simple: 11·heatpipe 12 heat sink (fms) 13 ·copper/aluminum block 14·spray nozzles - 15· Fan (co〇Hng fan) • 16·cooling chamber 17·cooling water circulation system 17-1 cooling water pump 17-2 cooling water inlet 17-3 Cooling water tank (watertank) 17-4 drain (drain) 19·gas-ion separator (gas-iiqUid separator) 2〇·perforated plate (perforated plate), if there is a chemical formula in this case, please reveal the best display of the characteristics of the invention. Chemical formula: 玖, invention description: [Technical field to which the invention pertains] The present invention utilizes the principle that the spray film-transfer c〇efflcient is much higher than the heat transfer coefficient (heattransferc〇efficient) of air convection. 'Improve the heat dissipation efficiency of the central microprocessor (cpu) cooling module of traditional personal computer (PC) and notebook computer (marriage), can improve the heat dissipation efficiency by 30%. The large amount of thermal energy generated during the operation of the device can quickly eliminate the speed, so it can be used to improve the heat dissipation problem caused by the increasing speed of the computer central microprocessor. 4 1301572 [Previous Technical Shooting]
Ik著電腦科技精進’巾央微處理辦cpu)算 ==日益輕薄短小，中央微處萄(CPU)運算時所產 =除射視。巾央微處釋(CPU)運算時所產生之熱能如果 ΐίΓ21’ΓΓ腦内部的溫度上升，以咖L中央微處理月= 卿叫㈣為例，最高使用溫度上限為7。。。，如果電腦散 二 使電腦内部的溫度超過最高使用溫度上限，將容易導致電腦故障。^ 此，如何設計電腦的散熱模組使t腦的散熱效率提高 『 技發展重要的一環。 ⑴电細种 目前電腦用散熱模組設計主要有下列方式： 直接利用heat pipe(如美國專例肥，88〇,524、，，必），Ik with computer technology intensive 'small central micro-processing cpu' count == increasingly thin and short, the central micro-small (CPU) calculations produced = in addition to shooting. If the temperature inside the ΐ Γ Γ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ ΓΓ . . If the computer's internal temperature exceeds the maximum operating temperature limit, it will easily lead to computer malfunction. ^ This, how to design the computer's thermal module to improve the heat dissipation efficiency of the t brain "an important part of the development of technology. (1) Electric fine-graining At present, the design of heat-dissipating modules for computers mainly has the following methods: Direct use of heat pipe (such as US special fertilizer, 88〇, 524,,, must),
Chamber(UP6,550,531 ^ UP6,490,160) ^ Loop Heat Pipe(UP6,478,258 ^ UP6,382,309)，不使用外加的風扇等來協助散熱。 或是利用散熱片（Heat Sink)搭配風扇（Fan)(如美國專利 UP6,570,763) ’·中央微處理器(CPU)在運轉時所產生的熱量，傳導至具 有較大熱料面_金壯，再經由風扇職生的關空氣對流，將 這些熱罝傳導至空氣中，以達到散熱的目的。 、 因為身又的政熱模組無法負荷更高功率的中央微處理器(cpu)的 散熱茜求’新的散熱模組設計(如美國專利Up6，189,6〇l、现6,41〇,982) 遂將熱導管(HeatPipe)引入，協助熱量快速導離熱源，而熱導管引進散 熱模組裡，扮演將模組内部能量快速傳導至另一端的媒介，再經由散 熱片或風扇等方式將熱傳導至空氣中。 為進一步長:南散熱模組之散熱效率，美國專利（Up5,6〇6,341 ; UP6,519，146，UP6,519，148)等，利用水與金屬間熱傳係數較高的特性 1301572 (水與金屬間的熱傳係數約為300〜20,000暫1112-。〇，以水為媒介將熱 帶走。然而因為該發明採用封閉式的水冷循環系統，將熱能先傳至乙^^ 面板外殼，再散至環境中，乃至於仍然受限於面板與環境的熱傳係數 低，因而無法提高熱處理量。 ’' 一另。外一種設計則是將壓縮機與冷媒的冷凍系統引入作為降低發熱 兀件操作溫度之帛（UP6,543,246 ; UP6,526,768)。此類設計可以將發 熱元件冷卻至零下3〇度，以提高元件運轉效率。但是有成本昂貴、^ 積不易縮小及在高濕環境中水氣凝結的問題。 此外致;令日日片（thermoelectric cooling element)亦被引逸作為帝 腦中發熱元件冷卻1 (娜，机354)，侧錄熱树的運轉= 更進-步崎JL室溫以下，體積可⑽傳統散熱模組降低許多，也可 降低風散產生的噪音。但是致冷晶片的散熱端不只要處理料發熱元 件所產生彳τ齡且彡聽理致冷晶#材運觸產生的能量，反而提高 了散熱的需求。因此，若無法改善致冷晶片散熱端熱傳係數低的問題， 將限制致冷晶片在電腦上的應用。 喷霧冷卻純（SprayeGGlingsystem)也翻解件的 ^Π，554 B2; _77,453 m; _98,725)。喷霧系統提高了 …傳係數，但疋此线所產生的熱量移_需要—有效㈣交換哭或 使用壓縮機與膨脹間系統，這些系統都將使電腦冷卻系統獅化了也 會限制了此系統在電腦中的應用。 圖1的散熱模組簡圖中，利用散熱片013搭配風扇〇14將經導熱介 材012與散熱片013接觸的發熱元件oil的熱量傳至環境中。 由在運轉時會產生南熱，熱量經由散熱片Gi3傳至環境 中，此日守正個散熱系統的總括熱阻R可以用下式表示： 6 1301572 d_ 1 1 Δχ^ 1 =Rb + Rm + Ra 其中如總括熱阻（overall thermal resistance ) 仏總括熱傳係數（overall heat transfer coefficient) 總括熱傳面積（overall heat transfer area ) 毛、熱、冷端之熱傳面積 熱端熱傳係數 冷端熱傳係數 △^?r~金屬的厚度 金屬的熱傳導係數（thermal conductivity) 金屬的熱傳面積 冷端熱阻。 Κιϊ^ΔΧμ / d尤)；金屬熱阻。Chamber (UP6, 550, 531 ^ UP6, 490, 160) ^ Loop Heat Pipe (UP6, 478, 258 ^ UP6, 382, 309), without the use of an additional fan or the like to assist in heat dissipation. Or use a heat sink (Fan) with a fan (such as US patent UP6, 570, 763) '· The heat generated by the central microprocessor (CPU) during operation is transmitted to a larger hot surface _ Jin Zhuang Then, through the fan convection of the fan's occupation, the enthalpy is transmitted to the air to achieve the purpose of heat dissipation. Because the body's political thermal module can't load the higher-power central microprocessor (cpu)'s heat dissipation request 'new thermal module design (such as US patents Up6, 189, 6〇l, now 6,41〇) , 982) 引入 Introducing a heat pipe (HeatPipe) to assist the rapid transfer of heat away from the heat source, and the heat pipe is introduced into the heat dissipation module to act as a medium for quickly transferring the internal energy of the module to the other end, and then through a heat sink or a fan. Heat is conducted to the air. To further increase the heat dissipation efficiency of the South Thermal Module, US Patent (Up5,6〇6,341; UP6, 519, 146, UP6, 519, 148), etc., utilizing the characteristic of high heat transfer coefficient between water and metal 1301572 (water The heat transfer coefficient between the metal and the metal is about 300~20,000 for the time of 1102. 〇, the water is used as the medium to take the tropics. However, because the invention uses a closed water-cooled circulation system, the heat is first transmitted to the outer casing of the panel. Dissipated into the environment, and is still limited by the low heat transfer coefficient of the panel and the environment, so the heat treatment amount cannot be increased. '' Another. The other design is to introduce the compressor and refrigerant refrigeration system as a heating element. Operating temperature (UP6, 543, 246; UP6, 526, 768). This type of design can cool the heating element to minus 3 degrees to improve the efficiency of the component operation. However, it is expensive, difficult to shrink and water in high humidity environment. The problem of gas condensation. In addition, the thermoelectric cooling element is also taken as the heating element cooling element 1 (Na, machine 354), the operation of the side-recording hot tree = more-in-steps JL room Below the temperature, the volume can be (10) The cooling module is reduced a lot, and the noise generated by the wind dispersion can also be reduced. However, the heat dissipating end of the cooling chip is not only required to process the energy generated by the heating element of the material, but the energy generated by the operation of the cold crystal. The need for heat dissipation is increased. Therefore, if the problem of low heat transfer coefficient of the heat sink of the cold chip cannot be improved, the application of the cooled wafer on the computer will be limited. Spray cooling pure (SprayeGGlingsystem) also solves the problem, 554 B2; _77, 453 m; _98, 725). The spray system increases the coefficient of transmission, but the heat generated by this line moves _ needs - effective (four) exchange crying or using the compressor and expansion system, these systems will make the computer cooling system lions will also limit the system Application in the computer. In the heat dissipation module diagram of Fig. 1, the heat sink 013 is used in conjunction with the fan 〇 14 to transfer the heat of the heat generating element oil that is in contact with the heat sink 013 via the heat conducting material 012 to the environment. The south heat is generated during operation, and the heat is transferred to the environment via the heat sink Gi3. The total thermal resistance R of the current heat dissipation system can be expressed by the following formula: 6 1301572 d_ 1 1 Δχ^ 1 =Rb + Rm + Ra For example, the overall thermal resistance over the overall heat transfer coefficient, the overall heat transfer area, the heat transfer area, the heat transfer area, the heat transfer coefficient, the cold end heat transfer. The coefficient Δ^?r~ the thickness of the metal. The thermal conductivity of the metal. The heat transfer area of the metal is the cold junction thermal resistance. Κιϊ^ΔΧμ / d especially); metal thermal resistance.
Ra=1/(/^44);熱端熱阻。 省/目前處理電腦的散熱問題多是考慮降低金屬熱阻^，即改用熱傳 導係數係數u高的金屬㈣；S增加冷端之鋪_ 4或以提高風 速的方式提高冷端熱傳係數知從而降低冷端熱阻％值，但是忽略了 < 1:>孟屬熱阻Rm不疋瓶頸，即便以匕較高的銅（約36〇w/m?C)來取 代鋁（約230W/m-t：)，所能降低的總括熱阻R值仍屬有限；<2>以 提高熱傳面積來降低總括熱阻R值雖財效，但大量的提高熱傳面積 ▲，除了是加工上的困難外，也會使風阻增加而降低冷端熱傳係數心 <3 >以提高贿來提高冷端祕魏&效果仍屬有限，提高_倍的風 速僅可將冷端之熱傳係數知提高約6〇%〜75%，還會增加噪音。 如圖2所示的散熱模組中，發熱元件纽在運曰轉曰時會產曰敎， 利用導熱塊〇23搭配熱導管〇24、散熱片Ο%搭配風扇將經導齡 封022與導熱塊023接觸的發熱元件〇21支熱量傳至環境中。 7 1301572 【發明内容】 本發明的作法利用喷霧冷卻水膜之熱傳係數（約大於2000 w/m2-C)遠高於空氣熱傳係數（約1〜5〇 w/m2-°C)的現象，大幅提高散熱 端熱傳係數知，再以風扇送入或排出空氣進一步提高熱傳係數，並直 接將含有大量潛熱（latent heat)氣體排入環境中。改善冷凝端之熱傳 效率，從而降低散熱模組之熱阻值，達到大幅度改善熱傳效率的目的。 喷務水膜的作用原理在於將傳統使用低熱傳係數之空氣對流冷卻系統 改為熱傳係數較南的贺務冷卻糸統（Spray c〇〇ling SyStem )，再利用送入 或排出的空氣使得水對金屬及水對空氣的熱傳係數進一步提高，最後 部份汽化的水汽進入氣液分離器回收空氣中所含的水，氣液分離器分 離出的水隨後經下方之多孔板（perforated plate)匯回冷卻水槽，空 氣則帶走水汽與熱量排入環境中，同時也減少了系統熱量的累本 發明中使用氣液分離器以進一步回收被空氣帶走的水汽，以 補充的水量。 本發明之-實施烟作改善解管冷凝端之散熱池如圖3所Ra = 1 / (/ ^ 44); hot end thermal resistance. The heat dissipation problem of the province/current processing computer is mostly to reduce the metal thermal resistance ^, that is, to use the metal with high thermal conductivity coefficient u (4); S to increase the cold end of the shop _ 4 or to increase the wind speed to improve the cold end heat transfer coefficient Thereby reducing the cold junction thermal resistance % value, but ignoring the <1:> Meng thermal resistance Rm is not a bottleneck, even if the copper is replaced by a higher copper (about 36 〇 w / m? C) (about 230W) /mt:), the total thermal resistance R value that can be reduced is still limited; <2> to increase the heat transfer area to reduce the total thermal resistance R value, although the financial effect, but a large increase in heat transfer area ▲, in addition to processing In addition to the difficulties, it will also increase the wind resistance and reduce the cold end heat transfer coefficient heart <3 > to improve the bribe to improve the cold end secret Wei & the effect is still limited, improve the wind speed can only be cold end The heat transfer coefficient is known to increase by about 6〇% to 75%, which also increases noise. As shown in the heat dissipation module shown in Figure 2, the heating element will be produced during the transfer, using the thermal block 〇23 with the heat pipe 〇24, the heat sink Ο% with the fan will lead the seal 022 and heat conduction The heating element that is in contact with block 023, 21 heat is transferred to the environment. 7 1301572 SUMMARY OF THE INVENTION The heat transfer coefficient (about greater than 2000 w/m2-C) of the spray-cooled water film is much higher than the air heat transfer coefficient (about 1 to 5 〇w/m2-°C) by the method of the present invention. The phenomenon, the heat transfer coefficient of the heat-dissipating end is greatly improved, and the heat transfer coefficient is further increased by the fan feeding or discharging air, and the large amount of latent heat gas is directly discharged into the environment. The heat transfer efficiency of the condensing end is improved, thereby reducing the thermal resistance value of the heat dissipation module, thereby achieving the purpose of greatly improving the heat transfer efficiency. The principle of the spray water film is to change the air convection cooling system that uses the traditional low heat transfer coefficient to the Spray c〇〇ling SyStem with the south heat transfer coefficient, and then use the air sent or discharged. The water-to-metal and water-to-air heat transfer coefficient is further increased. Finally, the vaporized water vapor enters the gas-liquid separator to recover the water contained in the air, and the water separated by the gas-liquid separator is then passed through the perforated plate. Remitted to the cooling water tank, the air takes away the water vapor and heat into the environment, and also reduces the heat of the system. The gas-liquid separator is used in the invention to further recover the water vapor taken away by the air to supplement the amount of water. The heat-dissipating tank of the invention for implementing the smoke-making to improve the condensing end of the tube is as shown in FIG.
i如圖3所 四、風扇； 汽化的冷卻水則在冷卻室匯入冷卻水循環系統 中。其中之冷卻水循環系統中含有冷卻水泵、冷 卻水出水营、冷浴p水槽。 W赞熱7G件產生的熱量經由熱導管而傳至散熱片後，錢以本發明採 用的喷霧賴麟的方式散从氣巾。噴霧水難傳係伽冷卻水果 將冷卻水槽中的冷卻水送入冷卻水喷頭，經冷卻村頭變成小水滴喷 ，於散熱片上，再用風扇送人或排出空氣以提高喷霧水膜熱傳係數。 霧ft的冷卻水部份汽化並帶走熱量，隨著風扇送入的空氣進入氣液 分離器回收空氣中所含的水，氣液分離器分離出的水隨後經下方之多 ，板（perforated plate)匯回冷卻水槽，空氣則排入環境中。其餘未 ;、統，最終流回冷卻水槽 、冷卻水進水管、回收冷 8 1301572 【實施方式】 本發明的作法利用喷霧冷卻水膜之熱傳係數（約大於2〇〇〇 w/m、 。0遠高於空氣熱傳餘（約㈣W/m2?c)的現象，大幅提高散敎 端熱傳係數知，再以風扇送入或排出空氣進一步提高熱傳係數，並直 接將含有大量賴（latent heat)氣體排人環境巾。改善冷凝端之熱傳 效率，=罐低散賴組之熱喊，_大财改善熱傳效率的目的。 ^喷霧水膜的作用原理在於將傳統使用低熱傳係數之空氣對流冷卻 系、、先改為熱傳係數車父咼的喷霧冷卻系統（s讲町c⑽Ihg)，再利用 ，入或排出的空氣使得水對金屬及水對空氣的熱傳係數進一步提高， ，後部份汽化的水汽進人氣液分_回收空氣巾所含的水，氣液分離 xm刀#出的水P返後經下方之多孔板（per1：〇rated ρΙ^)匯回冷卻水槽， 空氣則帶走水汽與缝排人魏巾，同時也減少了祕缝的累積曰。 本發明中使用氣液分離器以進―步回收被空氣帶走的水汽，以減少所 需補充的水量。 第-實施例如圖3所示，其中圖3⑻為俯視圖，圖3(b)為前視圖， 含有-熱導管11 ’·-散熱片12 ; 一導熱塊13 ;—冷卻水喷頭14 ; 一 風扇I5,冷部t I6;-冷卻水循環***17;及一氣液分離器（gadiquid separator) 19。其中之冷卻水循環系統p中含有一冷卻水泵i7_i、一 冷部水水官17-2、-排水口 17-4、及—冷卻水槽17-3。 $,、、、鬼13係|馬接於一熱源（圖中未示）連接，例如中央處理單元 cpu，片所產生的熱，或熱產生模擬器所產生的熱。導熱塊13在藉由 熱$官11將熱傳導至（複數個）散熱片12。其中熱源除了電腦中之發 熱元件，如^處理科，也可以是介面卡、北橋、及電源供應器。 上述之熱導㈣可以是傳統熱導f或其侧用讀流體賴的各式設 計，如環狀熱導管、蒸發器等其中之一種。 當發熱兀件產生的熱量經由熱導管^而傳至散熱片U後，熱量以 本發明減的喊水賴傳的方式狀大氣巾。儒賴熱傳係使用 冷卻水泵m將冷卻水槽阳中的冷卻水送人冷卻水喷頭M，經冷卻 1301572 水喷頭14變成小水滴喷灑於散熱片12上，再用風扇送入或排出空氣 以提高喷霧水膜熱傳係數。霧化後的冷卻水部份汽化並帶走熱量，隨 著風扇送入的空氣進入氣液分離器19回收空氣中所含的水，氣液分離 器19分離出的水隨後經下方之一多孔板2〇 (perforated p丨ate)匯回冷 卻水槽17-3，空氣則排入環境中。其餘未汽化的冷卻水則在冷卻室 最終流回冷卻水槽17-3中。 為比較本實施例之散熱效果，使用一加熱模擬器來模擬熱源運作 時的發熱情形’以IntelP4-1.8G的中央微處理器(CPU)為例，在全速運 轉日守’其發熱罝約為66.1W，在本實施例中，將加熱模擬器的功率設定 為68W與150W。為了確保熱源所產生的熱可以傳導至散熱片12上， 於加熱模擬☆與熱導管11目’採帛ThermagGn公§]所生產的導熱介材 (TIM)，型號為T-Gr_4(n。熱傳導至散熱片上再藉由本發明之養 冷卻水喷頭Μ»帶走，由加誠擬騎作的溫度與環境溫度之溫差 求得散熱模_熱阻值。本實施协χ㈤碰偷公销生產 為HHC-001之含熱導管散熱器作為對照例。 ) 測試結果如表-所示，未使用本發明之含熱導管散熱模組（即對昭 ^之齢觀）’加熱模擬器功率為卿，經過 衡 後，加熱模擬器溫度約49你，熱 _lRe 本發=喷霧水膜於散熱片12上形成水薄膜，協 放熱，可以壤加_疑器的温度降至耽，熱阻值降低至〇·2。⑽:、 表一 散熱方式 迦且值(。c/w) _ 功準 " ' — 模擬器溫度(°c)i, as shown in Figure 3, the fan; vaporized cooling water is transferred into the cooling water circulation system in the cooling room. Among them, the cooling water circulation system includes a cooling water pump, a cooling water outlet dam, and a cold bath p-water tank. After the heat generated by the WG 7G piece is transferred to the heat sink via the heat pipe, the money is scattered from the air towel in the manner of the spray Rylin used in the present invention. The spray water is difficult to pass, and the cooling water in the cooling water tank is sent to the cooling water nozzle. After cooling, the village head becomes a small water droplet spray on the heat sink, and then the fan is used to send or discharge air to improve the spray water film heat transfer. coefficient. The cooling water of the mist ft partially vaporizes and takes away the heat. As the air sent by the fan enters the gas-liquid separator to recover the water contained in the air, the water separated by the gas-liquid separator is then passed through the plate (perforated). Plate) is returned to the cooling water tank, and the air is discharged into the environment. The rest is not; the system finally flows back to the cooling water tank, the cooling water inlet pipe, and the recovery cold 8 1301572. [Embodiment] The method of the present invention utilizes the heat transfer coefficient of the spray cooling water film (about more than 2 〇〇〇 w/m, 0 is much higher than the air heat transfer (about (four) W / m2? c) phenomenon, greatly improve the heat transfer coefficient of the heat transfer end, and then send the fan into or out of the air to further improve the heat transfer coefficient, and will directly contain a large number of (latent heat) gas discharge human environmental towel. Improve the heat transfer efficiency of the condensation end, = the heat of the low-distribution group, _ Dacai to improve the efficiency of heat transfer. ^ The principle of spray water film is to use the traditional The air convection cooling system with low heat transfer coefficient, the spray cooling system (speaking c (10) Ihg), which is first changed to the heat transfer coefficient, is reused, and the air that is injected or discharged makes the water and the heat transfer of metal and water to the air. The coefficient is further increased, and the latter part of the vaporized water vapor enters the human gas and liquid fraction_recovering the water contained in the air towel, and the water and liquid separation xm knife# out of the water P returns to the perforated plate (per1:〇rated ρΙ^) Back to the cooling sink, the air takes away the water vapor and the seams The towel also reduces the accumulation of secret seams. In the present invention, a gas-liquid separator is used to further recover the water vapor taken away by the air to reduce the amount of water required to be replenished. The first embodiment is shown in Fig. 3, wherein Figure 3 (8) is a plan view, Figure 3 (b) is a front view, containing - heat pipe 11 '·- heat sink 12; a heat-conducting block 13; - cooling water nozzle 14; a fan I5, cold part t I6; - cooling water circulation System 17; and a gasdiquid separator 19. The cooling water circulation system p includes a cooling water pump i7_i, a cold water water official 17-2, a drain port 17-4, and a cooling water tank 17- 3. $,,,,Ghost 13 Series|The horse is connected to a heat source (not shown), such as the central processing unit cpu, the heat generated by the sheet, or the heat generated by the heat generator. The heat conducting block 13 is The heat is transmitted to (multiple) heat sinks 12 by heat. The heat source can be an interface card, a north bridge, and a power supply in addition to the heating elements in the computer. The above thermal guide (4) can It is a traditional heat guide f or its various types of read fluids, such as annular heat pipes, One of the hair dryers, etc. When the heat generated by the heat generating element is transmitted to the heat sink U via the heat pipe ^, the heat is in the form of a water-repellent method according to the invention. The Julian heat transfer system uses a cooling water pump. m sends the cooling water in the cooling tank to the cooling water nozzle M, and after the cooling 1301572 water nozzle 14 becomes small water droplets sprayed on the heat sink 12, the fan sends or discharges air to improve the spray water film heat. Passing coefficient. The atomized cooling water partially vaporizes and removes heat, and the air sent by the fan enters the gas-liquid separator 19 to recover the water contained in the air, and the water separated by the gas-liquid separator 19 passes through the lower portion. One perforated p丨ate is returned to the cooling water tank 17-3, and the air is discharged into the environment. The remaining unvaporized cooling water is finally returned to the cooling water tank 17-3 in the cooling chamber. In order to compare the heat dissipation effect of the present embodiment, a heating simulator is used to simulate the heat generation condition when the heat source operates. Taking the Intel P4-1.8G central microprocessor (CPU) as an example, the full-speed operation of the day's Guardian's fever is about 66.1W, in this embodiment, the power of the heating simulator is set to 68W and 150W. In order to ensure that the heat generated by the heat source can be conducted to the heat sink 12, the heat conduction material (TIM) produced by the heating simulation ☆ and the heat pipe 11 ' 'ThermagGn § §, model T-Gr_4 (n. heat conduction) The heat sink is then taken away by the cooling water jet Μ» of the present invention, and the temperature difference between the temperature and the ambient temperature is calculated by the temperature difference between the temperature and the ambient temperature. The implementation agreement (5) is smuggled into public sales. The heat pipe radiator of HHC-001 is used as a comparative example.) The test results are shown in Table--, without using the heat-conducting heat-dissipating module of the present invention (ie, the view of the ^^之齢), the heating simulator power is Qing, After the balance, the temperature of the heating simulator is about 49, hot _lRe this hair = spray water film forms a water film on the heat sink 12, and the heat is released, the temperature of the suspected device can be lowered to 耽, and the thermal resistance value is lowered. To 〇·2. (10):, Table 1 Heat Dissipation Method Jiahe Value (.c/w) _ Mighty " ' — Simulator Temperature (°c)
1301572 將加紙擬II神設為丨5·以確認較冑功果 二6-5C ’且其熱阻值高達㈣代解。經由喷霧水 ΐΐ^ί：^熱喊可以降低至α245ΐ·且加熱模擬器 座-ΐϊ^Γ姐減姑關轉速下林㈣之讀水膜散熱 二、又政…、的熱阻值如表二所示，在風扇轉速為7280RPM時，熱阻值 辦0熱模擬器的溫度為Μ，若採用本發明之喷霧水膜散 =組，可以有效的降低熱阻值至㈣。c/w，加熱模_的溫度也可 ，反之，採时霧水膜韻额，可以使用較低轉速 ( )的風扇配合喷霧水膜散熱，便可以達到散熱模組在風扇高轉 速_黄》效果，除了可以降低噪音外，更可以減少耗電量。 一_π—，个⑺屈轉逯下，喷霧 違查聲盒备夢管之散熱模組的效果比翁〇 _風散轉速（RPM) 一——~— 0 1673 3485 4950 6210 7280 實施例1-加熱模擬器溫度(t) 71.6 54.1 _47.9 45.4 44.0 43.5 實施例1-熱阻 0.67 0：HJ 0.32 0.29 0.27 0.26 對照例1-加熱模擬器溫廣ΓΓΛ 107 72.3 ---~— 61.6 56.7 55.0 54.4 對照例1-熱阻(°c/w) 1.08 0.68 0.53 0.45 1 0.43 0.42 # f外，如表二所示，在未使用風扇時，熱阻值為0.67<t/W，加熱 权擬為溫度為。71.7C ;使用風扇後，即可將喷霧水膜散熱模組織熱阻 值降低至0.26t：/W，加熱模擬器溫度降為43·5χ：。因此，風扇的使用， 比起未使用風扇之喷霧水膜散熱純可以得到更低的執阻值。 11 1301572 【圖式簡單說明】 圖1、傳統散熱模組 圖2、含熱導管之散熱模組 圖3、改良冷凝端散熱之熱導管散熱模組，其中圖3⑻為俯視圖，圖 3(b)為前視圖 011.發熱元件 012·導熱介材（thermal interface material) 013·散熱片（fins) 014·風扇（cooling fan) 021.發熱元件 022·導熱介材（thermal interface material) 023·導熱塊（copper/aluminum block) 〇24·熱導管（heatpipe) 025.散熱片（fins) 026·風扇（cooling fan) 11·熱導管（^^1口丨卩6) 12·散熱片（fins) 13. 導熱塊（copper/aluminum block) 14. 冷卻水喷頭（spray nozzles ) 15. 風扇（coolingfan) 16. 冷卻室（cooling chamber ) 17. 冷卻水循環系統（cooling water circulation system ) 17-1 冷卻水栗（waterpump) 17-2 冷卻水水管（cooling water tube ) 17-3 冷卻水槽（watertank) 17-4 排水口（ drain ) 19·氣液分離器（gas liquid separator ) 20.多孔板（perforated plate ) 121301572 Set the paper-added II god to 丨5· to confirm that it is more than 6-5C' and its thermal resistance is as high as (4). Via spray water ΐΐ ^ί: ^ hot shout can be reduced to α245 ΐ · and heating simulator seat - ΐϊ ^ Γ 减 减 姑 关 关 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林 林As shown in the second, when the fan speed is 7280RPM, the temperature of the thermal resistance value of the thermal simulator is Μ. If the spray water film dispersion group of the present invention is used, the thermal resistance value can be effectively reduced to (4). c / w, the temperature of the heating mode _ can also be, on the contrary, the fogging film film rhyme, can use the lower speed () fan with the spray water film to dissipate heat, you can reach the heat module in the fan high speed _ yellow The effect, in addition to reducing noise, can also reduce power consumption. A _π-, a (7) squat under the armpit, the effect of the spray module on the sound box of the dream tube is better than the Weng _ _ wind speed (RPM) one - ~ - 0 1673 3485 4950 6210 7280 1-heating simulator temperature (t) 71.6 54.1 _47.9 45.4 44.0 43.5 Example 1 - Thermal resistance 0.67 0: HJ 0.32 0.29 0.27 0.26 Comparative Example 1 - Heating Simulator Wen Guangyi 107 72.3 ---~— 61.6 56.7 55.0 54.4 Comparative Example 1 - Thermal resistance (°c/w) 1.08 0.68 0.53 0.45 1 0.43 0.42 # f Outside, as shown in Table 2, when no fan is used, the thermal resistance is 0.67 < t / W, heating right The temperature is intended to be. 71.7C; After using the fan, the thermal resistance of the spray water film heat dissipation structure can be reduced to 0.26t:/W, and the temperature of the heating simulator is reduced to 43·5χ:. Therefore, the use of the fan can achieve a lower resistance value than the cooling of the spray water film of the unused fan. 11 1301572 [Simple diagram of the diagram] Figure 1. Traditional heat dissipation module Figure 2. Heat dissipation module with heat pipe. Figure 3. Heat pipe cooling module with improved condensation end heat dissipation. Figure 3 (8) is a top view, Figure 3 (b) For front view 011. Heating element 012 · Thermal interface material 013 · Heat sink (fins) 014 · Cooling fan 021. Heating element 022 · Thermal interface material 023 · Thermal block ( Copper/aluminum block) 〇24·heatpipe 025. heat sink (fins) 026·cooling fan 11·heat pipe (^^1 port 丨卩6) 12·heat sink (fins) 13. heat conduction (copper/aluminum block) 14. cooling nozzles (cooling fans) 16. cooling chamber (cooling chamber) 17. cooling water circulation system (cooling water circulation system) 17-1 cooling water chestnut (waterpump 17-2 Cooling water tube 17-3 Cooling water tank 17-4 Drainage port 19·gas liquid separator 20. Perforated plate 12