1298787 18820twf.doc/e 九、發明說明： 【發明所屬之技術領域】 本#明是有關於一種半導體製程機台内的晶圓承接般 之使用壽命的預測方法，且特別是有關於一種靜電失般 (Electric Static Chuck, ESC)之使用壽命的預測方法。 皿 【先前技術】 在半導體業製程機台内常使用靜„1央擊作為晶圓的 承接盤。此靜電夾盤是利用靜電吸附原理來承接晶圓，然 而當靜電夾盤表面受損或有微塵污染時，則會發生電2 (Arcing)擊發。當電弧擊發時，輕則會造成晶圓損傷，並導 致良率降低或晶圓報廢；重則會造成晶圓破片、靜電夹般 損壞及其他零配件之損害而污染機台設備導致機台無法= 常運作，而需停機清理。由於停機清理會造成產能時間損 失，其與良率降低、晶片破裂以及零配件的損害，都將導 致重大的成本支出。 、 ^有鑑於此，現階段則有設備商發展出外掛式感應偵測 器來偵測電弧現象，以將電弧擊發時所造成的損害降至最 低:然而，此外掛式感應偵測器雖可有效偵測電弧現象， 但是部無法事先預測何時會產生電弧擊發，因此使用外掛 式感應_1仍無法完全聽電轉賴造摘傷害。而 且i使用外掛式感應偵測器需額外增加成本支出以及設備 維護成本。 【發明内容】 本發明之目的是提供一種靜電夹盤之使用壽命的預 1298787 18820twf.doc/e 圓的靜電夾盤之使用壽命。 為達上u或U目的，本發明提出 用^命=财法，咖麵載 :使用壽命。此靜電夾盤之使用壽命的預測方法包^^ ，驟:讀Lb靜電夾盤的電流值。接著，對所監測 到的電流值取移動平均值(M〇ving Average)，並分析移動平 均，之變傾勢。之後，減分析的結絲靖此靜電央 盤是否已達使用壽命。 在本發明之:實施例中，上述監測靜電夾盤的電流值 之方法包括監測靜電夾盤每承載—片晶圓時的電流值。 在明之一實施例中，上述監測靜電夾盤的電流值 之方法是藉由一缺陷偵測及分析的系統(Fault Detection and Classification，FDC)來監測靜電夾盤的電流值。 在本發明之一實施例中，上述對所監測到的電流值取 私動平均值的方法是藉由缺陷偵測及分析的系統來對所監 測到的電流值％務弟平^句值。 在本發明之一實施例中，上述之取移動平均值的方法 包括透過取平均、面積積分、標準差、最大值或最小值的 方式來取移動平均。 在本發明之一實施例中，上述根據分析的結果來判斷 此靜電夾盤是否已達使用壽命之方法包含當移動平均彳直高 於第一標準值或低於第二樣準值時，則判斷該靜電夾盤已 達使用壽命。 在本發明之一實施例中，在判斷靜電夾盤已達使用壽 1298787 18820twf.doc/e 命後，更包含根據移動钱值之變倾辨決定對此靜電 夾盤進行維護的方式。 一 在本發明之-實施例中，靜電夾盤具有一層介電層， 而決定對靜電缝進行轉的方式如下·· #移動平均值高 於此第-標準值時，則更換此靜電錢之介電層；當移動 平均值低於帛二標準辦，則清潔此靜電夾贱更換此 電夾盤的介電層。 本發明是監測靜電夾盤之電流，並分析所監測到的電 流變化趨勢來綱發生的可紐，如此可在較有可能 發生=的時咖前將靜電夾盤換下，㈣免電弧擊發^ 成的損害。此外，本發明不f加裝外掛式感應偵測器，因 此不需額外支iti外掛式感賴測H的賴及維護成本。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實闕，並配合所關式，作詳^ 明如下。 、 【實施方式】 圖1是本發明一實施例之靜電夾盤之使用壽命的預測 方法之流程圖，圖2是本發明一實施例中，依靜電夹盤之 電流值所綠製而成的曲線圖，而圖3是對圖2中靜電爽般 之電流值取移動平均後所繪製而成的曲線圖。請先參照圖 1與圖2,本實施例之靜電夾盤之使用壽命的預測方法 預測用以承載晶圓的一靜電夾盤之使用壽命。此靜電夾盤 之使用壽命的預測方法包括下列步驟：首先，如步驟Sl& 所示，監測靜電夾盤的電流值。其中，監測靜電夾盤的電 7 M值之方法例如是每隔一段時間測量並記錄靜電夾盤的電 流值、。在本實施例中例如是藉由一缺陷债測及分析系統來 監測記錄靜電錢每承載-片晶圓時的電流值，之後再 整理這些所記錄下來的電錄以得到如圖2所示之曲線 圖。需注意的是，因不同機台量測的回路不同，在此指的 ，測靜電夾盤的電流值可為監測靜電夾盤本身的電流值或 是監測其漏電流值。 ，者’如步驟S120所示，對所監測到的電流值取移 22值，並分析移動平均值之變化趨勢。具體而言，由 ^足圖2所示之曲線圖無法清楚觀察出電流值的變化趨 ^ ’因此需對所監測到的電流值之數據資料作進一步的處 交容易分析的數據資料。在本實施例中例如是 f由缺^貞測及分析系統對監測到的電流值取移動平均 值’以得到如圖3所干夕沾^ , 所不之曲線圖。其中，取移動平均值的 值的====猶、輸、㈣或最小 至第中日吾人可清楚的觀測到靜電夾盤在承載第411 〇 ,0 θθ圓之間，靜電夾盤之電流值的移動平均值大 ittin勢。此外，由於在移動平均值低於61,2 五人二，月’電夾盤即發生電弧擊發的現象。因此’ ft驗來定一個標準值（即第二標準值），如⑴ :第：俨準：：電夾盤之電流值的移動平均值下降至低於 -來了:人即Ί則判斷此靜電夾盤已達使用壽命。如此 口 "艮據分析移動平均值之變化趨勢的結果來 1298787 18820twf.doc/e ===達使用壽命(如步驟S13。所示)，而當 砰電火1已達使—命後’就將此靜電 電弧擊發所造成的損害。 乂避免 雖然在圖3中靜電夾盤在快達到使用壽命前， ^的移鮮職是呈下_聰，但實際上在靜電失盤^ 達到使用*命前，其電流值的移動平均值亦有可能呈現上 升的趨勢。以下將舉實施例配合圖式說明。 私工^是本發明另—實施例電夾盤之電流值取移 動平均後所繪製而成的曲線圖。請參照圖4，從圖4中吾 人Υ清楚的觀測到靜電夾盤在承載第32281至第32578片 曰曰圓之間㊄電夾盤之電流值的移動平均值大致上呈現上 升的赵勢。此外，由於在移動平均值高於61.5毫安培(mA) 後，靜電夾盤即發生電弧擊發的現象。因此，吾人可根據 經驗來定-個標準值(即第一標準值），如61·4毫安培。當 #電夾ϋ之電值的移動平均值上升至高於此第一標準值 後則判斷此靜電夾盤已達使用壽命，所以可將此靜電夹 盤換下，以避免電弧擊發所造成的損害。 一值得注意的是，上述之第一標準值與第二標準值為一 經驗值’且對不畔導體機台設備巾所使用的靜電夾盤可 旎會盯出不同的第一標準值與第二標準值。 由於本發明是根據所監測到的電流變化趨勢來預測電 弧發生的可能性，所以可在較有可能發生電弧的時間點前 將靜電夾㈣下’以避免電弧擊發造成的重大成本支出。1298787 18820twf.doc/e IX. Description of the invention: [Technical field to which the invention pertains] This #明 is a method for predicting the service life of a wafer in a semiconductor processing machine, and particularly relates to an electrostatic loss. The method of predicting the service life of Electric Static Chuck (ESC). [Previous Technology] In the semiconductor industry, the machine is often used as a receiving tray for the wafer. This electrostatic chuck uses the principle of electrostatic adsorption to accept the wafer, but when the surface of the electrostatic chuck is damaged or When dust is polluted, an arcing will occur. When the arc is fired, the wafer will be damaged and the yield will be reduced or the wafer will be scrapped; the wafer will be fragmented, the electrostatic chuck will be damaged and other Damage to spare parts and contamination of the machine equipment can cause the machine to fail to operate normally, but need to be shut down for cleaning. As the shutdown cleaning will cause loss of production time, it will lead to significant loss of yield, wafer breakage and damage to spare parts. Costs. ^ In view of this, at this stage, equipment manufacturers have developed external proximity detectors to detect arcing to minimize the damage caused by arc firing: however, in addition to hanging sensor detection Although the arc can effectively detect the arc phenomenon, but the Ministry can not predict in advance when the arc will be generated, so the use of the external sensor_1 can not fully listen to the electric damage. Moreover, the use of the external inductive detector requires additional cost and equipment maintenance costs. SUMMARY OF THE INVENTION The object of the present invention is to provide a pre-1298787 18820twf.doc/e round electrostatic chuck for the life of an electrostatic chuck. For the purpose of up to u or U, the present invention proposes the use of ^ life = financial method, coffee surface loading: service life. The prediction method of the service life of the electrostatic chuck ^^, step: read the Lb electrostatic chuck Current value. Then, take the moving average value (M〇ving Average) and analyze the moving average, and change the potential. After that, the analysis of the knot is closed. In an embodiment of the invention, the method for monitoring the current value of the electrostatic chuck includes monitoring the current value of each of the electrostatic chucks when the wafer is carried. In one embodiment, the current of the electrostatic chuck is monitored. The method of value is to monitor the current value of the electrostatic chuck by a fault detection and classification system (FDC). In one embodiment of the invention, the pair of monitored current values The method of taking the moving average is to use the system of defect detection and analysis to calculate the value of the monitored current value. In one embodiment of the present invention, the method for taking the moving average The method comprises: taking a moving average by means of averaging, area integral, standard deviation, maximum value or minimum value. In an embodiment of the invention, the method for determining whether the electrostatic chuck has reached the service life according to the result of the analysis Including, when the moving average is higher than the first standard value or lower than the second standard value, it is judged that the electrostatic chuck has reached the service life. In an embodiment of the invention, it is judged that the electrostatic chuck has been used. Life 1298787 18820twf.doc/e After the death, it also includes the way to maintain the electrostatic chuck according to the change of the mobile money value. In the embodiment of the present invention, the electrostatic chuck has a dielectric layer, and the manner of determining the rotation of the electrostatic slit is as follows: · When the moving average is higher than the first standard value, the electrostatic money is replaced. Dielectric layer; when the moving average is lower than the standard, clean the electrostatic chuck and replace the dielectric layer of the electric chuck. The invention is to monitor the current of the electrostatic chuck and analyze the trend of the monitored current change to make the electrostatic chuck, so that the electrostatic chuck can be replaced before the coffee is more likely to occur, (4) arc-free firing ^ Damage. In addition, the present invention does not add an external inductive detector, so that it does not require additional support. The above and other objects, features, and advantages of the present invention will become more apparent and understood. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a method for predicting the service life of an electrostatic chuck according to an embodiment of the present invention, and FIG. 2 is a view showing a green value of an electrostatic chuck according to an embodiment of the present invention. The graph, and FIG. 3 is a graph obtained by taking a moving average of the static current values in FIG. Referring first to FIG. 1 and FIG. 2, the method for predicting the service life of the electrostatic chuck of the present embodiment predicts the service life of an electrostatic chuck for carrying the wafer. The method of predicting the service life of the electrostatic chuck includes the following steps: First, the current value of the electrostatic chuck is monitored as shown in steps S1 & Among them, the method of monitoring the electric 7 M value of the electrostatic chuck is, for example, measuring and recording the current value of the electrostatic chuck at intervals. In this embodiment, for example, a defect debt measurement and analysis system is used to monitor the current value when recording static electricity per carrier-chip wafer, and then the recorded electrical records are sorted to obtain the same as shown in FIG. 2. Graph. It should be noted that the current value measured by the different chucks can be used to monitor the current value of the electrostatic chuck itself or to monitor the leakage current value. , as shown in step S120, the value of the monitored current is shifted by 22, and the trend of the moving average is analyzed. Specifically, it is not possible to clearly observe the change in the current value from the graph shown in Fig. 2, and therefore it is necessary to further analyze the data of the monitored current value for further analysis of the data. In the present embodiment, for example, f is taken from the measured current value by the lack of measurement and analysis system to obtain a moving average value as shown in Fig. 3. Among them, taking the value of the moving average ====Just, losing, (4) or the smallest to the middle of the day, we can clearly observe the electrostatic chuck between the 411 〇, 0 θθ circle, the current of the electrostatic chuck The moving average of the values is large and ittinin potential. In addition, since the moving average is lower than 61, 2 five people, the month 'electric chuck is the phenomenon of arc firing. Therefore, the ft test sets a standard value (ie, the second standard value), such as (1): the first: the standard: the moving average of the current value of the electric chuck drops below - to come: the person is Ί then judge this The electrostatic chuck has reached the end of its life. Such a mouth " according to the analysis of the trend of the trend of the moving average to 1298787 18820twf.doc / e == = up to the service life (as shown in step S13), and when the electric fire 1 has reached - after the death' The damage caused by firing this static arc.乂 Avoid the fact that although the electrostatic chuck in Figure 3 is fast before it reaches the end of its useful life, the shifting job of the electrostatic chuck is _ 聪, but in fact, before the static loss of the disk is reached, the moving average of the current value is also It is possible to show an upward trend. The embodiments will be described below in conjunction with the drawings. The private worker ^ is a graph obtained by taking the current value of the electric chuck of the present invention as a moving average. Referring to Fig. 4, it is apparent from Fig. 4 that the moving average of the current values of the electrostatic chucks carrying the five electric chucks between the 32281th and the thirty-seventh rounds is substantially increased. In addition, since the moving average is higher than 61.5 milliamperes (mA), the electrostatic chuck is subjected to arc firing. Therefore, we can determine a standard value (ie, the first standard value) based on experience, such as 61.4 mA. When the moving average value of the electric value of the electric clamp rises above the first standard value, it is judged that the electrostatic chuck has reached the service life, so the electrostatic chuck can be replaced to avoid the damage caused by the arc firing. . It is worth noting that the above-mentioned first standard value and the second standard value are an empirical value' and the electrostatic chuck used for the non-conducting conductor machine towel can be marked with different first standard values and Two standard values. Since the present invention predicts the likelihood of arc occurrence based on the monitored trend of current flow, the electrostatic clamp (4) can be lowered to avoid significant cost expense caused by arc firing before the point when the arc is more likely to occur.
1298787 18820twf.doc/e 明中不需加裴外掛式感應偵測器，因此不需 卜=外掛式感應偵測器的採購及維護成本。 斯等雷中’除了可，據移動平均值之變化趨勢來判 ‘趨:ίϊϊ已達使用壽命外，還可根據移動平均值之 ::疋對換下來的靜電夾盤進行維護的方式。舉 ㈣越之電流值的軸平均值 標準值時，分析其原因可能是靜電夾盤表面之^ ^ee㈣賴而逐漸㈣或是介制有裂痕，而使得靜 電央盤的阻抗變小，導致靜電夾盤的電流變大。在此情況1298787 18820twf.doc/e There is no need to add an external proximity detector in the Ming Dynasty, so there is no need to purchase and maintain the cost of the external proximity detector. In addition to the trend of the moving average, it is judged by the trend of the moving average. In addition to the service life, the electrostatic chuck can be maintained according to the moving average. When the standard value of the axial average value of the current value is (4), the reason may be that the surface of the electrostatic chuck is ^^ee (four) and gradually (four) or the crack is formed, so that the impedance of the electrostatic central disk becomes small, resulting in static electricity. The current of the chuck becomes large. In this case
下:可將換下來的靜電夾盤之介電層更新，而不需更換敕 個靜電夾盤，因此可節省材料成本。 I 另一方面，當靜電夾盤之電流值的移動平均值逐漸下 降至低於帛二鮮斜，分析其原因可能錢靜電夾盤表 面沉澱物(deposition)增加而變厚，使得介電層阻抗變大， ，流經靜電夾盤的電流變小。在此情況下，可將換下來的 靜電夾盤作表面清潔即可，以節省更換整個靜電夾盤所需 的材料成本。當然，在此情況下亦可更換靜電夾盤之介電 層0 綜上所述，本發明之靜電夾盤之使用壽命的預測方法 至少包括下列優點： 1·藉由監測靜電夾盤之電流的異常趨勢，而判斷是否 更換靜電夾盤，以避免因電弧擊發所導致的重大成本支出。 1298787 18820twf.doc/e 的維盤之電流的異常趨勢來決定靜電夾盤 成本。 不⑸更換整個靜電夾盤，因此可節省材料 不裝物式錢侧器來彳貞測1弧現象，所以 而卜支出外掛式感應偵測器的採購成本及維護成本。 雖然本發明已以較佳實施例揭露如上，然其 t口耗圍内，當可作些許之更動與潤飾，因此本發明之伽 粑圍當視_之申請專利範圍所界定者為準。 … 【圖式簡單說明】 囷疋本务明一貫施例之靜電夾盤之使用壽命的預測 方法之流程圖。 ' 圖2是本發明一實施例中，依靜電夾盤之電流值所繪 製而成的曲線圖。 曰 圖3是對圖2中靜電夾盤之電流值取移動平均後所繪 製而成的曲線圖。 圖4是本發明另一實施例中對靜電夾盤之電流值取移 動平均後所繪製而成的曲線圖。 【主要元件符號說明】 S110 :監測靜電夾盤的電流值 S120 :對所監測到的電流值取移動平均值，並分析移 動平均值之變化趨勢 S130 :根據分析的結果來判斷靜電夾盤是否已達使用 哥命 11Bottom: The dielectric layer of the replaced electrostatic chuck can be renewed without replacing one electrostatic chuck, thus saving material costs. On the other hand, when the moving average value of the current value of the electrostatic chuck gradually drops below the 帛二鲜 oblique, the reason may be that the deposition on the surface of the electrostatic chuck increases and becomes thicker, so that the dielectric layer impedance When it becomes larger, the current flowing through the electrostatic chuck becomes smaller. In this case, the replaced electrostatic chuck can be cleaned to save the material cost of replacing the entire electrostatic chuck. Of course, in this case, the dielectric layer of the electrostatic chuck can also be replaced. In summary, the method for predicting the service life of the electrostatic chuck of the present invention includes at least the following advantages: 1. By monitoring the current of the electrostatic chuck Abnormal trend, and determine whether to replace the electrostatic chuck to avoid significant cost due to arc firing. The abnormal trend of the current of the disk of 1298787 18820twf.doc/e determines the cost of the electrostatic chuck. No (5) Replace the entire electrostatic chuck, so it can save material. The non-loaded side device measures the 1 arc phenomenon, so the purchase cost and maintenance cost of the external proximity detector are paid. Although the present invention has been disclosed in the above preferred embodiments, the present invention is not limited to the extent that it can be modified and modified. Therefore, the glyph of the present invention is defined by the scope of the patent application. ... [Simple description of the diagram] A flow chart of the method for predicting the service life of the electrostatic chuck that has been consistently applied. Figure 2 is a graph of a current value of an electrostatic chuck in an embodiment of the present invention.曰 Figure 3 is a graph plotting the moving average of the current value of the electrostatic chuck of Figure 2. Fig. 4 is a graph obtained by taking a moving average of the current value of the electrostatic chuck in another embodiment of the present invention. [Main component symbol description] S110: Monitor the current value of the electrostatic chuck S120: Take the moving average value of the monitored current value, and analyze the trend of the moving average S130: According to the analysis result, judge whether the electrostatic chuck has Up to use my life 11